Flux application condition testing apparatus and flux application condition testing procedure

Abstract

For example, a flux application condition investigation device is provided that achieves high accuracy of the investigation while allowing an investigation area to be defined through a relatively simple process.A flux application condition inspection device 12 comprises an illumination device 321 configured to irradiate a printed circuit board with ultraviolet rays; a camera 322 configured to capture an image of the ultraviolet rays emitted onto the printed circuit board; an inspection area defining section 335 configured to define an inspection area in the printed circuit board 1 with respect to each component using a reference section provided in the printed circuit board as a reference, the inspection area corresponding to each component to be mounted on the printed circuit board and including a plurality of electrodes on which the component is mounted; and a determination section 336 configured to determine faulty / non-faulty with respect to a flux application condition based on a luminance image.The luminance image obtained by camera 322, which captures an image of the ultraviolet rays irradiating the area under investigation, is to be performed. The determination section 336 calculates the area within each area of ​​investigation where the luminance is equal to or greater than a predetermined luminance threshold and performs a determination of the flux application condition based on the calculated area.

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