Housing architectures with vertically stacked dies and voltage converters

Abstract

Embodiments of a microelectronic assembly can include a first IC die with a first surface, a second surface opposite the first surface, and a third surface orthogonal to the first and second surfaces, wherein the first IC die comprises a substrate and a metallization stack with an interface parallel to the first and second surfaces, the substrate comprising a voltage converter circuit (VC) and a computing circuit; and a second IC die with a fourth surface, wherein the third surface of the first IC die is electrically coupled to the fourth surface of the second IC die by an interconnect.