Radiant impact cooling for high-performance semiconductor devices using monolithic microstructures

Abstract

A beam impact cooling arrangement for semiconductor devices includes an inlet chamber configured to receive an inlet fluid flow and a beam plate having at least one beam nozzle formed therein, coupled to the inlet chamber, and positioned to direct the inlet fluid flow from the inlet chamber through the at least one beam nozzle to provide an impact fluid flow. The beam impact cooling arrangement includes a heat exchange base configured to receive at least one semiconductor device with a front facing away from the inlet chamber and a rear facing the beam plate.The jet impact cooling arrangement includes an impact layer with impact surface structures formed on it and an outlet chamber positioned to receive the impacting fluid flow after the impacting fluid flow strikes the impact layer and the impact surface structures, thereby providing an outlet fluid flow.