Device package with a cavity with inclined side walls

Abstract

A semiconductor device package (100, 200a, 200b) can enclose a conductive element (101, 201) with a cavity (102, 202) formed therein, the cavity (102, 202) having at least one side wall (104, 204, 218) with an angled section (104a, 204a, 218) angled away from a central section of the cavity (102, 202). The semiconductor device package (100, 200a, 200b) can include a semiconductor device (203) positioned within the cavity (102, 202) and surrounded by an encapsulation material (506, 508, 510, 512). The at least one side wall (104) can have a chamfered (104a, 104b, 204a, 204b) or beveled (218) edge.