Power electronic module, submodule and modular system for a power electronic module

Abstract

Power electronic component (1), comprising a first submodule (6, 6a, 6b) which has at least one semiconductor module (2) and one or more capacitors (5), and comprising a second submodule (11) which has one or more electronic devices (14) for controlling the power electronic component (1), wherein the second submodule (11) is detachably connected to the first submodule (6, 6a, 6b).

Description

[0001] The present disclosure relates to a power electronic building block (PEBB) that can be used in a modular power converter system. The PEBB can be configured to be mounted together with several other PEBBs in a rack or cabinet. The PEBB can be a cell for a modular multilevel converter (MMC).

[0002] Such a PEBB comprises a capacitor cell and a semiconductor switch for charging and discharging the capacitor cell. The PEBB is controlled by electronic devices typically located in a section of the PEBB where the semiconductor switch is located. In a modular power converter system, maintenance and replacement of an individual PEBB can be performed by removing the PEBB from the rack or cabinet.

[0003] US 2016 219 743 A2 is a modular multilevel converter that has a capacitor bank and a power electronics module connected to the capacitor bank.

[0004] Embodiments of the disclosure relate to an improved power electronic device, a submodule, and a modular system for a power electronic device.

[0005] A power electronic component (PEBB) comprises a first submodule comprising at least one semiconductor module and one or more power capacitors, and a second submodule comprising one or more electronic devices for controlling the power electronic component, wherein the second submodule is detachably connected to the first submodule.

[0006] Such a detachable connection allows for separate replacement of the second submodule in the event of failure or maintenance. For example, the PEBB can be positioned in a rack or cabinet, allowing the second submodule to be withdrawn while the first submodule remains positioned in the rack or cabinet. A second submodule that is in stock can be mounted with the first submodule. Furthermore, the electronics in the second submodule are positioned at a distance from the semiconductor module during operation, thus being protected in the event of a failure, e.g., an explosion of the semiconductor module.

[0007] The second submodule can be slidably connected to the first submodule. For example, the first submodule can include one or more guide rails, wherein the second submodule is configured to be coupled to the guide rails. The guide rails provide guided movement for mounting the second submodule to the first submodule.

[0008] The second submodule can be connectable to a lateral side of the first submodule. The lateral side is a side of the first submodule located between a front side of the PEBB, which is directly accessible when the PEBB is positioned in a rack or cabinet, and a bottom side of the PEBB opposite the front side. The lateral side can extend along a first section where the semiconductor module is located and a second section where the power capacitors are located. The second submodule can form a side plate of the PEBB.

[0009] By providing the second submodule on a lateral side, a first section of the PEBB, in which the semiconductor module is located, is still accessible from the front, allowing separate maintenance of the first section as well. It is also possible for the first section to be detachably connected to the second section.

[0010] The one or more electronic devices of the second submodule may include at least one of a power supply, a controller, a bypass control unit, a gate unit, and a fuse board. The second submodule may include all of these components. It is also possible for one or more of these components to be located in the first submodule.

[0011] The electronic devices of the second submodule are mounted on a carrier plate located on a lateral side of the first submodule. The carrier plate may also provide shielding and protection for the electronic devices from the semiconductor module and the power capacitors during operation and in the event of a failure. The carrier plate may extend along the entire lateral side of the PEBB. The carrier plate may be oriented perpendicular to a compartment of a rack or cabinet. The second submodule may have a cover that can be removed from the rest of the second submodule.

[0012] In addition to the at least one semiconductor module, the first submodule may include a gate driver and / or a bypass circuit. The first submodule may include multiple semiconductor modules. The semiconductor modules may be arranged on opposite sides of a heat sink.

[0013] The first submodule may have a box-shaped frame. Guide rails may be attached to the frame. The first submodule may have a base plate that supports components of the first submodule.

[0014] The second submodule may have one or more connectors for detachably connecting the electronic devices. One or more of the connectors may be accessible for connection on a front panel of the PEBB. All connectors that must be removed from the first submodule when disassembling the second submodule may be accessible for connection on the front panel. For example, the connectors may comprise plug-in or quick-connect connectors located on the front panel. This enables simple and quick assembly and disassembly of the second submodule.

[0015] As an example, some of the detachable connectors may be connected to the outside of the PEBB and others may be connected to the first submodule of the PEBB.

[0016] According to a further aspect, a submodule for a power electronic component is disclosed. The power electronic component has a first submodule comprising at least one semiconductor module and one or more power capacitors, wherein the electronic submodule has at least one electronic device for controlling the power electronic component, wherein the electronic submodule is designed for a slidable and detachable connection to the first submodule.

[0017] The submodule may include any of the structural and functional features of the second submodule disclosed above. The submodule may also be referred to as an electronics submodule. The PEBB and the first submodule may include any of the structural and functional features of the PEBB and the first submodule disclosed above.

[0018] The submodule can be manufactured in stock. The submodule can be used to replace failed submodules of a PEBB.

[0019] According to another aspect, a modular system for a power electronic component comprises two first submodules and a second submodule. Each of the first submodules contains at least one semiconductor module and one or more power capacitors. The second submodule comprises one or more electronic devices for controlling the power electronic component. The two first submodules have different sizes, and the second submodule can be selectively and detachably connected to the first submodule and the second submodule.

[0020] Each of the first submodules and the second submodule may have the structural and functional features as described above for a first submodule and a second submodule.

[0021] The first two submodules can have different widths but the same lengths and heights. In particular, the extension of one lateral side can be the same. The second submodule can be selectively connectable to the lateral side of one of the first submodules. This system allows the use of the same electronics submodule for PEBB cells of different sizes, e.g., with a different number of capacitors in the PEBB cells.

[0022] In a method for assembling a first submodule with a second submodule of a PEBB, as disclosed above, the second submodule is connected to the first submodule. For example, a connection is made via guide rails of the first submodules and coupling elements of the second submodule, or vice versa. The second submodule is then guided into the assembled position with the first submodule by a sliding movement in a first direction. The second submodule can be releasably fixed in this position, for example by a snap mechanism or the like. The connections of the second submodule can be connected via plug-in or quick-connect connectors when the second submodule is almost or completely assembled with the first submodule.

[0023] The second submodule can be mounted and removed from the first submodule while the first submodule is located in a rack or cabinet. It is also possible to mount the second submodule while the first submodule is located outside of a rack or cabinet. In this case, the mounted PEBB can be positioned inside the rack or cabinet. In the event of a failure, the second submodule can be removed and replaced by pulling it out in a second direction opposite to the first direction.

[0024] The present disclosure has multiple aspects and embodiments. Any feature described with respect to one of the aspects and embodiments is also disclosed herein with respect to the other aspects and embodiments, even if the respective feature is not explicitly mentioned in this context.

[0025] Further features, developments, and advantages will become apparent from the following description of the exemplary embodiments in conjunction with the figures. In the figures, elements with the same structure and / or functionality may be designated by the same reference numerals. It is understood that the embodiments shown in the figures are illustrative representations and are not necessarily drawn to scale. Fig. 1A shows an embodiment of a power electronic component in perspective view, Fig. 1B shows the embodiment of the power electronic component of Fig. 1A without cover, Fig. 1C shows the embodiment of the power electronic component of Fig. 1A in a view of the front, Fig. 1D shows the embodiment of the power electronic component of Fig. 1A without cover in a view of the front, Fig. 2A shows an embodiment of a submodule in perspective view, Fig. Figure 2B shows the submodule of Fig. 2A without cover, Fig. 2C shows the submodule of Fig. 2A without cover in a view of a carrier plate, Fig. 3A-3D show another embodiment of a power electronic component in different views with and without a cover, Fig. 4A-4D show another embodiment of a power electronic component in different views with and without a cover, Fig. 5A-5D show a method for assembling an embodiment of a power electronic component, Fig. 6A-6C show an embodiment of a modular system of a power electronic device in perspective views.

[0026] Fig. Figure 1A shows a power electronic building block (PEBB) 1. The PEBB 1 can be used in a modular power converter system in which multiple PEBBs 1 are connected for higher power. As an example, the PEBB 1 can be used in a modular multilevel converter (MMC) and can also be referred to as an MMC cell.

[0027] Multiple PEBBs 1 in a modular system can be connected in parallel or in series. The PEBBs 1 can be designed for insertion into a rack or cabinet. In particular, the PEBB 1 can be designed to be inserted into the rack or cabinet in a first direction D1 perpendicular to the front side 9 and can be removed from the rack in an opposite second direction D2.

[0028] The PEBB 1 comprises at least one semiconductor module 2, such as an IGBT half-bridge, for controlling and / or switching electrical energy. The semiconductor module 2 is located in a first section 3 of the PEBB, which is the active part of the PEBB 1.

[0029] The PEBB 1 further comprises a second section 4, in which one or more capacitors 5, in particular power capacitors, are located. The capacitors 5 are box capacitors. The box capacitors can be film capacitors. The capacitors 5 operate with the DC voltage, which is converted by the switches from the incoming AC voltage and converted back again. It is also possible for the power capacitors 5 to be of a different type, such as cylindrical capacitors.

[0030] The first section 3 and the second section 4 are parts of a first submodule 6 of the PEBB 1. The first submodule 6 has a frame 7 that supports the components of the first section 3 and the second section 4. The frame 7 has the geometry of a rectangular block. The frame 7 can be a metallic frame. The frame 7 has lateral rails 8 that form the edges of the frame 7. The frame 7 can have a base plate on which components of the first section 3 and / or the second section 4 are positioned.

[0031] The PEBB 1 has a front panel 9, accessible from one front of the rack or cabinet, and an opposite rear panel 10. The first section 3 is located at the front panel 9, and the second section 4 is located behind the first section 3 and at the rear panel 10.

[0032] The PEBB 1 has a second submodule 11 located on a lateral side 12 of the PEBB 1. The lateral side 12 is a side of the PEBB 1 that connects the front side 9 and the rear side 10. The lateral side 12 is arranged perpendicular to the front side 9 and the rear side 9. The lateral side 12 is arranged perpendicular to a compartment of a rack or cabinet in which the PEBB 1 is positioned.

[0033] The second submodule 11 has the shape of a plate. The second submodule 11 can cover the entire lateral side of the first submodule 6 and forms the lateral side 12 of the PEBB 1. It is also possible for the second submodule 11 to cover only part of the lateral side of the first submodule 6.

[0034] The second submodule 11 is detachably connected to the first submodule 6, in particular to a lateral side of the first submodule 6. The second submodule 11 is designed to be disassembled from the first submodule 6 by moving the second submodule 11 in the second direction D2, and can be assembled to the first submodule 6 by moving the same in the first direction D1.

[0035] A guided connection of the second submodule 11 to the first submodule 6 can be achieved by guide rails of the first submodule 6, which interact with coupling elements of the second submodule 11, or vice versa. The guide rails extend in the insertion direction and can be provided on a lateral side of the first submodule 6. Accordingly, the second submodule 11 is in the form of removable cell electronics.

[0036] The second submodule 11 comprises at least one electronic device for controlling the PEBB 1. In Fig. 1A, the electronic devices are covered by a cover 13.

[0037] Fig. 1B shows the PEBB 1 without the cover 13 of the second submodule 11. The second submodule 11 includes a plurality of electronic devices 14 positioned on a carrier plate 15. The carrier plate 15 is removably connected to a lateral side of the first submodule 6, for example, via guide rails and a locking mechanism for locking the first submodule 6 in position.

[0038] The electronic devices 14 have a power supply 16 which supplies power to the PEBB 1, in particular for supplying the control circuitry of the PEBB 1. The power supply 16 is provided as a printed circuit board assembly (PCBA).

[0039] Furthermore, the electronic devices 14 have a controller 17 for controlling the operation of the electronic power components, in particular the semiconductor module 2. The controller 17 is provided as a PCBA.

[0040] Furthermore, the electronic devices 14 include a bypass control unit 18 for controlling bypass switching of the PEBB, e.g., during malfunctions of the PEBB 1. The bypass control unit 18 can disconnect the PEBB 1 from the system. The bypass control unit 18 is provided as a PCBA.

[0041] Furthermore, the electronic devices 14 have gate units 19 for controlling the semiconductor modules 2 and a fuse board 20 for protecting sensitive components of the PEBB 1 from overcurrent.

[0042] The detachable connection of the second submodule 11 to the first submodule 6 enables the removal of the second submodule 11 independently of the first submodule 6 in the event of failure or maintenance. The second submodule 11 can be replaced with an additional second submodule 11 that is in stock. This allows for a separate replacement of the second submodule 11 from the other components of the PEBB 1, such as the semiconductor module 2 and the power capacitors 5. The replacement can be carried out quickly, and the PEBB 1 can be quickly put back into operation.

[0043] Compared to PEBBs known from the prior art, the electronic devices 14 are separated from the first section 3 of the PEBB 1, i.e., from a chamber in which the semiconductor module 2 is located. In addition to the advantages of separate maintenance, occupied space in the first section 3 is freed up, thereby expanding the design possibilities in the first section 3. For example, the overall width of the PEBB 1 can be narrowed if smaller capacitors are used in the second section 4, allowing a narrowing of the width of the second section 4.

[0044] Furthermore, the electronic devices 14, in particular PCBAs, are shielded from the semiconductor module 2, i.e., from the EMC (Electromagnetic Compatibility) source, by the increased distance and by the carrier plate 15 located between the semiconductor module 2 and the electronic devices 14. Furthermore, the electronic devices 14 are protected in the event of a failure, e.g., an explosion of the semiconductor module 2. Accordingly, the electronic devices 14 are not positioned in a high-risk area, such as the first section 3.

[0045] Furthermore, a separation of the electronic devices 14 provides more degrees of freedom for the development of the electronic devices 14, provides sufficient space for the electronic devices 14, and enables the replacement of electronic devices 14 independently of the first submodule 6.

[0046] The overall width of the PEBB 1 may increase slightly due to the positioning of the second submodule 11 on a lateral side 12 of the PEBB 1. However, it is also possible that the width of the entire PEBB 1 may be reduced due to the available free space in the first section 3 and if the second section 4 can be reduced in width. Accordingly, the footprint of the PEBB 1 may not be increased.

[0047] Providing the electronic devices 14 in a pre-assembled manner via the second submodule 11 enables stock production and rapid replacement in the event of a failure. Furthermore, the wiring of the electronic devices 14 can be located outside the first submodule 6, allowing for easy connection and disconnection.

[0048] Furthermore, connecting the second submodule 11 to a lateral side of the first submodule 6 enables the selective use of the second submodule 11 with first submodules 6 of different sizes, provided that the lateral sides of the different first submodules 6 allow the connection of the second submodule 11.

[0049] The first section 3 and the second section 4 of the PEBB 1 can be permanently connected to one another. It is also possible for the first section 3 and the second section 4 to be detachably connected to one another. In this case, the frame 6 can have a first frame part for the first part 4 and a second frame part for the second part 4, which are detachably connected to one another. In this way, maintenance and replacement of components of the first part 3 can be carried out without affecting the second part 4. For example, the first section 3 can be detached from the second section 4 by impulses in the second direction D2. However, even in such a case, the second submodule 11 is detachably connected to the first submodule 6.

[0050] Fig. 1C and Fig. 1D show the PEBB 1 of the Fig. 1A and Fig. 1B in a view of the front 9, where in Fig. 1D a cover of the second submodule 11 is removed.

[0051] As in the Fig. 1C and Fig. As can be seen in Figure 1D, the first section 3 of the first submodule 6 comprises a plurality of semiconductor modules 2 located on opposite sides of a heat sink 21. A gate driver 22 is mounted on the semiconductor modules 2, in particular screwed to the top side of an IGBT. Furthermore, a bypass circuit 23a for protecting the semiconductor modules 2 in the event of a fault is installed in the first section 3 of the first submodule 6. The bypass circuit 23a is a DC bypass. The first section 3 comprises a further bypass circuit 23b for an AC bypass. Accordingly, the first section 3 can comprise some electronic components in addition to the semiconductor modules 2.

[0052] Fig. 2A shows an electronic submodule 11, which contains the Fig. 1A to 1D, in a state separated from the first submodule 6. Fig. 2A shows the submodule 11 in a perspective view. Fig. 2B shows the second submodule 11 in a perspective view, and Fig. 2C shows the second submodule 11 in a view of the carrier plate 15 without cover.

[0053] The second submodule 11, as in Fig. 2A, can be kept in stock for the replacement of a defective second submodule of a PEBB. The electronics submodule 11 can be replaced as a whole, or only individual components can be replaced. In any case, it is not necessary to replace the entire PEBB 1 or the entire first section 3 of the PEBB 1.

[0054] In Fig. 2C schematically shows connectors 24-30 for transmitting signals and / or electrical power. The electronic devices 14 of submodule 11 are connected within submodule 11 via power connectors 24 (solid lines) and auxiliary power connectors 25 (dashed lines).

[0055] Several connectors 26-30 connect the electronic devices 14 to the first submodule 6 or the outside of the PEBB 1 and are detachable.

[0056] A signal connector 26 connects the controller 17 to the outside of the PEBB 1. As an example, the signal connector 26 may be a fiber optic quick connect to the distribution line in a rack of a converter system.

[0057] Cable connectors 27 connect the gate units 19 via a connector to the local gate driver 22 in the first section 3 of the PEBB 1.

[0058] A cable connection 28 connects the bypass control unit 18 via a plug to the bypass circuits 23a, 23b, in particular to an AC bypass and a DC bypass in the first section 3 of the PEBB 1.

[0059] A cable connection 29 connects the bypass control unit 18 to a di / dt detection at a bushing or a connection of the capacitors 5.

[0060] A cable connector 30 is connected via a connector to a DC busbar within the PEBB 1.

[0061] All detachable connections 26-30, i.e., connections to the outside of the PEBB 1 and to the first submodule 6, are accessible from the front of the PEBB 1, i.e., on the left side of the electronics submodule 11, as shown here. This allows for easy and quick connection and disconnection of the electronics submodule 11, and thus easy replacement.

[0062] The second submodule 11 has an interface 32 for connecting to the detachable connections 26-30. The interface 32 is arranged in a front cover 33 of the second submodule 11. The interface 32 provides access for a control cable to the PEBB 1, which can be connected to one or more connectors of the detachable connections 26-30. The arrangement of the interface 32 on the front panel 9 of the PEBB 1 enables easy connection by plugging and unplugging a control cable.

[0063] The Fig. 3A to 3D show another embodiment of a PEBB 1, which differs from the embodiment of Fig. 1A to 1D by the smaller width w of the first submodule 6. The second section 4 has fewer capacitors 5 than in the Fig. 1A to 1D. The height h and the length l are the same as for the first submodule 6 in the Fig. 1A to 1D.

[0064] The second submodule 11 is identical to the second submodule 11 in the Fig. 1A to 1D, which is possible due to the identical dimensions of the lateral side of the first submodule 6. However, the same second submodule 11 could also be used with slightly different dimensions.

[0065] This demonstrates the modularity of the system, in which the same electronic submodule 11 can be used for first submodules 6 of different sizes, in particular different widths.

[0066] The Fig. 4A to 4D show another embodiment of a PEBB 1, which differs from the embodiment of Fig. 3A to 3D by the even smaller width w of the first submodule 6. The second section 4 has fewer capacitors 5 than in the Fig. 3A to 3D. The height h and the length l are the same as for the first submodule 6 in the Fig. 1A to 1D. The same electronic submodule 11 can also be used in this embodiment.

[0067] Fig. 5A-5D show a method for assembling an embodiment of a PEBB 1.

[0068] As in Fig. As shown in Figure 5A, a first submodule 6 is provided, comprising power capacitors 5 and semiconductor modules 2 located in a frame 7. The first submodule 6 can be positioned in a rack or cabinet. The first submodule 6 can be as disclosed in the previous embodiments.

[0069] In Fig. 5B, a second submodule 11 is provided that includes electronics. The second submodule 11 may be as disclosed in the previous embodiments.

[0070] In Fig. 5C, the second submodule 11 is connected to guide rails 31 of the first submodule 6 and mounted to the first submodule 6 by sliding in the first direction D1.

[0071] In Fig. 5D, the second submodule 11 is fully assembled with the first submodule 6 to form a PEBB 1. The second submodule 11 can be releasably fixed in this position by a snap mechanism or the like.

[0072] The detachable connectors 26-30 of the second submodule 11 can be connected via plug-in or quick-connectors when the second submodule 11 is almost or completely assembled with the first submodule 6. In particular, a control cable for connecting the detachable connectors 26-30 can be plugged into an interface 32 from the outside. The interface 32 can be designed as a socket.

[0073] The second submodule 11 can be mounted and removed from the first submodule 6 while the first submodule 6 is located in a rack or cabinet. It is also possible for the second submodule 11 to be mounted outside a rack or cabinet with the first submodule 6 and then positioned in the rack or cabinet in the mounted state. In the event of a failure, the second submodule 11 can be removed and replaced by pulling it out in a second direction opposite to the first direction D1.

[0074] The Fig. 6A-6C show an embodiment of a modular system 100 for a PEBB 1 in a perspective view. The modular system 100 comprises two first submodules 6a, 6b of different sizes and a second submodule 11. In particular, the two first submodules 6a, 6b have different widths w, but the same lengths l and heights h. The first submodules 6a, 6b and the second submodule 11 can be as disclosed in the previous embodiments.

[0075] The second submodule 11 can optionally be detachably connected to the first submodule 6a, as in Fig. 6B, or with the second submodule 6b, as shown in Fig. 6C is shown. Reference symbol 1 power electronic component (PEBB) 2 semiconductor modules 3 first section 4 second section 5 Capacitor 6, 6a, 6b first submodule 7 frames 8 rail 9 Front 10 Back 11 second submodule (electronics submodule) 12 lateral side 13 Cover 14 electronic device 15 Carrier plate 16 Power supply 17 Control 18 Bypass control unit 19 Gate Unit 20 fuse board 21 heat sinks 22 Gate driver board 23a, 23b Bypass circuit 24 Power connection (inside) 25 Additional power connection (inside) 26 Control connection (PEBB outside) 27 27, 28, 29, 30 Connections to the first submodule 31 Guide rail 32 interface 33 front cover 100 modular system D1 first (insertion) direction D2 second (pull-out) direction w width H Height l length QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] US 2016 219 743 A2

[0003]

Claims

[1] Power electronic component (1), comprising a first submodule (6, 6a, 6b) which has at least one semiconductor module (2) and one or more capacitors (5), and comprising a second submodule (11) which has one or more electronic devices (14) for controlling the power electronic component (1), wherein the second submodule (11) is detachably connected to the first submodule (6, 6a, 6b). [2] Power electronic component (1) according to claim 1, wherein the second submodule (11) is slidably connectable to the first submodule (6, 6a, 6b). [3] Power electronic component (1) according to claim 2, wherein the first submodule (6, 6a, 6b) has at least one guide rail (31) for guiding a sliding movement of the second submodule (11). [4] Power electronic component (1) according to one of the preceding claims, wherein the semiconductor module (2) is located in a first section (3) of the PEBB (1) and the capacitors (5) are located in a second section (4) of the PEBB (1), wherein the first section (3) forms a front side (9) of the PEBB (1) and the second section forms a rear side (10) of the PEBB (1), wherein the second submodule (6, 6a, 6b) is located on a lateral side (12) of the PEBB (1) connecting the front side (9) and the back side (10). [5] Power electronic component (1) according to one of the preceding claims, wherein the one or more electronic devices (14) of the second submodule (11) comprise at least one of the following: - a power supply (16), - a control system (17), - a bypass control unit (18), - a gate unit (19), and - a fuse board (20). [6] Power electronic component (1) according to one of the preceding claims, wherein the first submodule (6, 6a, 6b) comprises, in addition to the at least one semiconductor module (2), at least one of the following: - a gate electrode (22), - a bypass circuit (23a, 23b). [7] Power electronic component (1) according to one of the preceding claims, wherein electronic devices (14) of the second submodule (11) are mounted on a carrier plate (15) positioned on a lateral side of the first submodule (6, 6a, 6b). [8] Power electronic component (1) according to one of the preceding claims, wherein the second submodule (11) has a detachable cover (13) for covering the electronic devices (14). [9] Power electronic component (1) according to one of the preceding claims, wherein the first submodule (6, 6a, 6b) has a box-shaped frame (7). [10] Power electronic component (1) according to one of the preceding claims, wherein the second submodule (11) has one or more terminals (26-30) for detachably connecting the electronic devices (14), wherein the terminals (26-30) are accessible for connection on a front side (9) of the power electronic component (1). [11] Power electronic component (1) according to claim 10, wherein the second submodule (11) comprises an interface (32) for enabling the connection of a control cable to the one or more terminals (26-30), the interface (32) comprising a hole in a front cover (33) of the second submodule (11). [12] Power electronic component (1) according to claim 10 or 11, wherein the terminals (26-30) connect the electronic devices (14) to the first submodule (6) and / or to the outside. [13] Electronic submodule (11) for a power electronic component (1), wherein the power electronic component (1) has a first submodule (6) which has at least one semiconductor module (2) and one or more power capacitors (5), wherein the electronic submodule (11) has at least one electronic device (14) for controlling the power electronic component (1), wherein the electronic submodule (11) is designed for a displaceable, detachable connection to the first submodule (6). [14] Modular system (100) for a power electronic component (1), wherein the modular system (100) comprises two first submodules (6a, 6b) and a second submodule (11), wherein each of the first submodules (6a, 6b) comprises at least one semiconductor module (2) and one or more power capacitors (5), wherein the two first submodules (6a, 6b) have different sizes, and wherein the second submodule (11) comprises one or more electronic devices (14) for controlling the power electronic component (1), wherein the second submodule (11) is selectively detachably connectable to the first submodule (6a) and the second submodule (6b).

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