Galvanic enclosure structure for a copper-coated ceramic substrate plate

Abstract

A galvanic enclosure structure for a copper-coated ceramic substrate plate, comprising a ceramic substrate plate (1), characterized in that a first enclosure (2) is attached to the upper end of the ceramic substrate plate (1), wherein a connecting plate (3) is located on one side of the first enclosure (2), wherein a second enclosure (4) is arranged on one side of the connecting plate (3), wherein insertion openings (5) are provided on both sides of the first enclosure (2) and the second enclosure (4), wherein insertion plates (6) compatible with the insertion openings (5) are firmly connected to both sides of the connecting plate (3), wherein an adhesive layer (7) is arranged between the first enclosure (2) and the ceramic substrate plate (1), between the connecting plate (3) and the ceramic substrate plate (1), and between the second enclosure (4) and the ceramic substrate plate (1).

Description

Technical area

[0001] The present utility model relates to a galvanic enclosure structure for a copper-coated ceramic substrate plate and belongs to the field of manufacturing ceramic substrate plates. Background technology

[0002] AMB (Active Metal Brazing Ceramic Substrate) refers to a ceramic substrate plate with active metallic solder paste, based on the DBC technique. The bond is achieved through a chemical reaction between the ceramic and the active metallic solder paste at high temperatures, resulting in higher joint strength and improved reliability. This technique is particularly suitable for connectors or applications with high current flow and high heat dissipation requirements. The containment is a ring-shaped protective structure in the precision electroplating process. Its primary function is to isolate specific areas during the electroplating process and limit the flow of the plating solution. This ensures that metal (such as nickel or gold) is deposited only in the targeted areas, preventing short circuits or overflow of the plating.

[0003] In the current state of the art, due to the common use of a fixed-size frame for the enclosure, it is difficult to adjust its size according to the actual requirements, which limits the applicability of the enclosure. Content of the utility model

[0004] In view of the deficiencies in the prior art, the purpose of this utility model is to provide a galvanic enclosure structure for a copper-clad ceramic substrate plate to solve the problem presented in the above background art that, due to the conventional use of a fixed-size frame for the enclosure, it is difficult to adjust its size according to actual requirements, which limits the applicability of the enclosure.

[0005] To achieve the aforementioned purpose, the present utility model solution is realized by the following technical concept: Galvanic housing structure for a copper-coated ceramic substrate plate, which comprises a ceramic substrate plate, wherein a first housing is attached to the upper end of the ceramic substrate plate, wherein a connecting plate is located on one side of the first housing, wherein a second housing is arranged on one side of the connecting plate, wherein insertion openings are provided on both sides of the first housing and the second housing, wherein both sides of the connecting plate insert plates that are compatible with the insertion openings are firmly connected, wherein an adhesive layer is arranged between the first housing and the ceramic substrate plate, between the connecting plate and the ceramic substrate plate and between the second housing and the ceramic substrate plate.

[0006] Furthermore, the height of the first housing corresponds to the height of the second housing, wherein the height of the insertion opening is smaller than the height of the first housing, wherein both the insertion opening and the insertion plate have an “L” shape.

[0007] Furthermore, the height of the connecting plate corresponds to the height of the first enclosure and the connecting plate is made of a material with good elasticity and temperature resistance.

[0008] Furthermore, a plurality of first positioning holes are arranged on the surface of the ceramic substrate plate, wherein a first positioning plate is firmly connected to one side of the second housing, wherein a second positioning plate is nested on the surface of the first positioning plate, wherein second positioning holes are arranged on the surface of the second positioning plate, wherein locking bolts are inserted through each of the first positioning holes and the second positioning holes, wherein locking nuts are placed on the surface of the locking bolts.

[0009] Furthermore, the first positioning plate has an “L” shape and the second positioning hole has a “T” shape.

[0010] Furthermore, the first positioning hole is elongated, wherein the width of the first positioning hole corresponds to the minimum width of the second positioning hole, wherein the maximum diameter of the locking bolt and the diameter of the locking nut are each larger than the width of the first positioning hole.

[0011] The present utility model thus has the following advantageous effects: The first enclosure is attached to both sides of the connecting plate, and the second enclosure is positioned at the corners of the first enclosure. In combination with insertion plates and insertion openings, multiple first enclosures, connecting plates, and second enclosures can form a sealed enclosure. Applying adhesive between this enclosure and the ceramic substrate plate creates an adhesive layer that establishes the bond between the enclosure and the ceramic substrate plate. Since the enclosure is realized by assembling, its size can be flexibly adjusted according to actual requirements, effectively expanding the application range of the enclosure.The use of a connecting plate made of a material with good elasticity and temperature resistance makes it possible to absorb stresses due to thermal expansion and contraction of the enclosure and thus prevent cracks in the enclosure.

[0012] The second positioning plate is placed on the surface of the first positioning plate. The housing is pre-attached to the upper end of the ceramic substrate plate using the locking bolts, the first positioning hole, the second positioning hole, and the locking nut. This prevents the housing from shifting during the bonding process with the ceramic substrate plate. Illustration of the attached drawings

[0013] By examining the following figures and the detailed description of the non-limiting embodiments, further features, purposes and advantages of this utility model will become more apparent. Fig. 1 shows a schematic diagram of the overall structure of the galvanic enclosure structure for a copper-clad ceramic substrate plate according to the present utility model; Fig. 2 is a schematic diagram showing the mounting structure of the first enclosure, the second enclosure, and the connecting block of the electroplating enclosure structure for a copper-clad ceramic substrate plate according to the present utility model; Fig. 3 shows a schematic diagram of the fixing structure of the second enclosure of the electroplating enclosure structure for a copper-clad ceramic substrate plate according to the present utility model.

[0014] In the figures: 1. ceramic substrate plate; 2. first housing; 3. connecting plate; 4. second housing; 5. insertion opening; 6. insertion plate; 7. adhesive layer; 8. first positioning hole; 9. first positioning plate; 10. second positioning plate; 11. second positioning hole; 12. locking bolt; 13. locking nut. Specific embodiments

[0015] In order to better understand the technical means implemented by the present utility model, the design features as well as the objectives and effects achieved, a further explanation of the utility model is given below in conjunction with concrete examples of implementation.

[0016] With reference to Fig. 1 to Fig. 2, this utility model provides a technical concept: a galvanic housing structure for a copper-coated ceramic substrate plate, which comprises a ceramic substrate plate 1, wherein a first housing 2 is attached to the upper end of the ceramic substrate plate 1, wherein a connecting plate 3 is located on one side of the first housing 2, wherein a second housing 4 is arranged on one side of the connecting plate 3, wherein insertion openings 5 are provided on both sides of the first housing 2 and the second housing 4, wherein both sides of the connecting plate 3 insert plates 6, which are compatible with the insertion openings 5, are firmly connected, wherein an adhesive layer 7 is arranged between the first housing 2 and the ceramic substrate plate 1, between the connecting plate 3 and the ceramic substrate plate 1 and between the second housing 4 and the ceramic substrate plate 1.

[0017] The first enclosure 2 is attached to both sides of the connecting plate 3, and the second enclosure 4 is positioned at the corners of the first enclosure 2. In combination with insertion plates 6 and insertion openings 5, a plurality of first enclosures 2, connecting plates 3, and second enclosures 4 can form a sealed enclosure. Applying adhesive between this enclosure and the ceramic substrate plate 1 creates an adhesive layer 7, which establishes the bond between the enclosure and the ceramic substrate plate 1. Since the enclosure is realized by assembling, its size can be flexibly adjusted according to actual requirements, effectively expanding the application range of the enclosure.The use of a connecting plate 3 made of a material with good elasticity and temperature resistance makes it possible to absorb stresses due to thermal expansion and contraction of the enclosure and thus prevent cracks in the enclosure;.

[0018] With reference to Fig. 1 to Fig. 3, the utility model provides a technical concept: the height of the first housing 2 corresponds to the height of the second housing 4, the height of the insertion opening 5 being smaller than the height of the first housing 2, and both the insertion opening 5 and the insertion plate 6 having an "L" shape. After the housings are assembled, the "L"-shaped insertion plate 6 is inserted into the insertion opening 5, thereby increasing the strength of the connection between the first housing 2 and the connecting plate 3, as well as between the connecting plate 3 and the second housing 4.

[0019] Thus, the height of the connecting plate 3 corresponds to the height of the first housing 2, and the connecting plate 3 is made of a material with good elasticity and temperature resistance. Using a connecting plate 3 made of a material with good elasticity and temperature resistance makes it possible to absorb stresses resulting from thermal expansion and contraction of the housing, thus preventing cracks from forming in the housing.

[0020] A plurality of first positioning holes 8 are arranged on the surface of the ceramic substrate plate 1, wherein a first positioning plate 9 is firmly connected to one side of the second housing 4, wherein a second positioning plate 10 is nested on the surface of the first positioning plate 9, wherein second positioning holes 11 are arranged on the surface of the second positioning plate 10, wherein locking bolts 12 are inserted through the first positioning holes 8 and the second positioning holes 11, wherein locking nuts 13 are placed on the surface of the locking bolts 12. The second positioning plate 10 is placed onto the surface of the first positioning plate 9. The housing is fastened in advance to the upper end of the ceramic substrate plate 1 using the locking bolts 12, the first positioning hole 8, the second positioning hole 11, and the locking nut 13.This prevents the housing from shifting during the bonding process with the ceramic substrate plate 1.

[0021] Thus, the first positioning plate 9 has an "L" shape, while the second positioning hole 11 has a "T" shape. After the second positioning plate 10 has been placed on the surface of the first positioning plate 9, the second housing 4 can be fixed to the upper end of the ceramic substrate plate 1 through the interaction of the "L"-shaped first positioning plate 9 and the "T"-shaped second positioning hole 11. This secures the housing to the upper end of the ceramic substrate plate 1 before the adhesive is applied.

[0022] Thus, the first positioning hole 8 is elongated, wherein the width of the first positioning hole 8 corresponds to the minimum width of the second positioning hole 11, wherein the maximum diameter of the locking bolt 12 and the diameter of the locking nut 13 are each larger than the width of the first positioning hole 8. This arrangement can ensure a limitation for the second housing 4 in different positions.

[0023] Concrete implementation: Depending on the size of the area to be insulated, a suitable number of first enclosures 2, connecting plates 3, and second enclosures 4 are selected. Two first enclosures 2 are then attached to each of the connecting plates 3. Insertion plates 6, which are attached to each of the connecting plates 3, are inserted into the insertion openings 5 provided on the sides of the first enclosures 2. This process is repeated to connect several first enclosures 2 together. Second enclosures 4 are placed at the corners of the first enclosures 2, and the insertion plates 6 are inserted into the insertion openings 5 provided on the sides of the second enclosures 4 to establish a connection between the first enclosures 2 and the second enclosures 4.This process is repeated until a plurality of first enclosures 2, connecting plates 3, and second enclosures 4 form a sealed enclosure. This enclosure is then positioned on the upper edge of the area of the ceramic substrate plate 1 to be insulated, and an adhesive layer 7 is formed between the enclosure and the ceramic substrate plate 1 by applying a high-temperature and chemically corrosion-resistant adhesive, thereby bonding the enclosure to the ceramic substrate plate 1. Since the first enclosures 2, connecting plates 3, and second enclosures 4 are assembled, the size of the enclosure can be flexibly adjusted according to actual requirements, effectively expanding the application range of the enclosure.In combination with connecting plates 3 made of materials with good elasticity and temperature resistance (e.g. silicone rubber), the resulting stress can be absorbed during thermal expansion or contraction of the enclosure, thereby preventing cracking of the enclosure.

[0024] Before applying the adhesive between the housing and the ceramic substrate plate 1, the second positioning plate 10 is placed on the surface of the first positioning plate 9, which is attached to one side of the second housing 4. The locking bolts 12 are then successively inserted through the first positioning hole 8 in the surface of the ceramic substrate plate 1 and the second positioning hole 11 in the surface of the second positioning plate 10. Finally, the locking nuts 13 are placed on the surface of the locking bolts 12 and rotated until the locking bolt 12 rests firmly against the second positioning plate 10 and the ceramic substrate plate 1. This allows pre-positioning of the housing to prevent displacement between the housing and the ceramic substrate plate 1 during the bonding process.

[0025] During the manufacturing process, the ceramic substrate plate 1 undergoes a three-stage improvement process consisting of grinding, copper plating, and brush polishing. A precise circuit diagram is then etched on its surface. Finally, a silver foil and a chip are successively applied to the surface and each is hardened by heating. These measures effectively eliminate the irregular, polycrystalline appearance of the copper foil, resulting in a smoother and denser copper surface, which further leads to a significant improvement in the adhesion between the enclosure and the ceramic substrate plate 1.

[0026] Furthermore, it should be understood that although this description is presented using exemplary embodiments, not each embodiment exclusively comprises a standalone technical solution. This presentation is for clarity only. Those skilled in the art should consider the description as a whole, and the technical solutions of the individual embodiments may also be appropriately combined to form further embodiments that are understandable to those skilled in the art.

[0027] The present utility model provides a galvanic enclosure structure for a copper-clad ceramic substrate plate, comprising a ceramic substrate plate, a first enclosure mounted on the upper end of the ceramic substrate plate, a connecting plate located on one side of the first enclosure, and a second enclosure disposed on one side of the connecting plate. Compared with the prior art, the present utility model has the following advantageous effects: The first enclosure is mounted on both sides of the connecting plate, and the second enclosure is positioned at the corners of the first enclosure. In combination with insertion plates and insertion openings, a plurality of first enclosures, connecting plates, and second enclosures can form a sealed enclosure.Applying adhesive between this enclosure and the ceramic substrate plate creates an adhesive layer that establishes the bond between the enclosure and the ceramic substrate plate. Since the enclosure is assembled by assembling, its size can be flexibly adjusted according to actual requirements, effectively expanding the enclosure's application range. Using a connecting plate made of a material with good elasticity and temperature resistance makes it possible to absorb stresses resulting from thermal expansion and contraction of the enclosure, thus preventing cracks in the enclosure.

Claims

[1] Galvanic enclosure structure for a copper-coated ceramic substrate plate, comprising a ceramic substrate plate (1), characterized by that a first housing (2) is attached to the upper end of the ceramic substrate plate (1), wherein a connecting plate (3) is located on one side of the first housing (2), wherein a second housing (4) is arranged on one side of the connecting plate (3), wherein insertion openings (5) are provided on both sides of the first housing (2) and the second housing (4), wherein insertion plates (6) which are compatible with the insertion openings (5) are firmly connected to both sides of the connecting plate (3), wherein an adhesive layer (7) is arranged between the first housing (2) and the ceramic substrate plate (1), between the connecting plate (3) and the ceramic substrate plate (1) and between the second housing (4) and the ceramic substrate plate (1). [2] Galvanic enclosure structure for a copper-coated ceramic substrate plate according to claim 1, characterized by that the height of the first housing (2) corresponds to the height of the second housing (4), wherein the height of the insertion opening (5) is smaller than the height of the first housing (2), wherein both the insertion opening (5) and the insertion plate (6) have an "L" shape. [3] Galvanic enclosure structure for a copper-coated ceramic substrate plate according to claim 1, characterized by that the height of the connecting plate (3) corresponds to the height of the first housing (2) and that the connecting plate (3) is made of a material with good elasticity and temperature resistance. [4] Galvanic enclosure structure for a copper-coated ceramic substrate plate according to claim 1, characterized byin that a plurality of first positioning holes (8) are arranged on the surface of the ceramic substrate plate (1), wherein a first positioning plate (9) is firmly connected to one side of the second housing (4), wherein a second positioning plate (10) is nested on the surface of the first positioning plate (9), wherein second positioning holes (11) are arranged on the surface of the second positioning plate (10), wherein locking bolts (12) are each inserted through the first positioning holes (8) and the second positioning holes (11), wherein locking nuts (13) are placed on the surface of the locking bolts (12). [5] Galvanic enclosure structure for a copper-coated ceramic substrate plate according to claim 4, characterized by that the first positioning plate (9) has an "L" shape, wherein the second positioning hole (11) has a "T" shape. [6] Galvanic enclosure structure for a copper-coated ceramic substrate plate according to claim 4, characterized by that the first positioning hole (8) is elongated, wherein the width of the first positioning hole (8) corresponds to the minimum width of the second positioning hole (11), wherein the maximum diameter of the locking bolt (12) and the diameter of the locking nut (13) are each greater than the width of the first positioning hole (8).

Images