System arrangement and pressure sensor arrangement
DE202025104553U1Active Publication Date: 2025-10-16TDK ELECTRONICS AG
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Patent Information
- Application Number
- DE202025104553
- Authority / Receiving Office
- DE · DE
- Patent Type
- Utility models
- Current Assignee / Owner
- Priority Date
- 2024-08-06
- Filing Date
- 2025-08-04
- Publication Date
- 2025-10-16
- Estimated Expiration
- 2035-08-31
Smart Images
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Abstract
System arrangement comprising a printed circuit board which is fastened to a carrier by means of a closed adhesive contour, wherein a venting device is formed in the carrier which is designed to discharge gases from the space enclosed between the printed circuit board and the carrier by the adhesive contour.
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