Computer housing with a heat-dissipating flow guide structure

DE202026102951U1Undetermined Publication Date: 2026-07-30CHENG ZHILIN
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Patent Information

Authority / Receiving Office
DE · DE
Patent Type
Utility models
Current Assignee / Owner
CHENG ZHILIN
Filing Date
2026-05-21
Publication Date
2026-07-30
Patent Text Reader

Abstract

A computer housing with a heat-dissipating flow guide structure, characterized in that it comprises: a housing main part; a bracket attached to the housing main part for mounting a motherboard, the bracket together with the back of the motherboard forming a heat collection chamber; a heat-dissipating flow guide device comprising: an active exhaust unit, the bracket being provided with an air inlet and the active exhaust unit being arranged at the air inlet; an air guide duct connected to the air outlet of the active exhaust unit, the end of the air guide duct facing away from the active exhaust unit being opposite the air inlet surface of the cooling fan of the heat sink; the air guide duct being filled with a phase-change material.
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