arrangement
DE202026103152U1Undetermined Publication Date: 2026-07-30SAINT-GOBAIN SEKURIT DEUTSCHLAND GMBH
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Patent Information
- Authority / Receiving Office
- DE · DE
- Patent Type
- Utility models
- Current Assignee / Owner
- SAINT-GOBAIN SEKURIT DEUTSCHLAND GMBH
- Filing Date
- 2026-05-28
- Publication Date
- 2026-07-30
Abstract
Arrangement (100) comprising: - a composite disk (1) consisting of a first disk (2) having a first surface (I) and a second surface (II) and a second disk (3) having a first surface (III) and a second surface (IV), which are connected to each other via an intermediate layer (4), wherein the second surface (II) of the first disk (2) faces the first surface (III) of the second disk (3); - an electrical functional element (5) which is arranged between the two disks (2, 3); - a ribbon cable (6) with at least one electrical conductor (13), and a first end (7) arranged between the disks (2, 3), which has a first connection area (9) with at least one first contact field (11), and a second end (8) arranged on the second surface (IV) of the second disk (3),which has a second connection area (10) with at least one second contact field (12); - an electrical component (28) comprising a housing (29) and a printed circuit board (17) arranged in or on the housing (29) with at least one contact element (16); and - at least one fastening means (19) arranged on the second surface (IV) of the second disk (3), comprising an adhesive layer (25); wherein the at least one electrical conductor (13) in the first connection area (9) electrically contacts the electrical functional element (5) via the at least one first contact field (11), and wherein the fastening means (19) is designed and the fastening means (19), the ribbon cable (6) and the electrical component (28) are arranged such that the adhesive layer (25) is arranged at least partially between the second surface (IV) of the second disk (3) and the electrical component (28),that the second end (8) of the ribbon cable (6) is fixed on the second surface (IV) of the second disk (3), and that the at least one contact element (16) and the at least one second contact field (12) are aligned with each other and held in position such that a solderless electrical connection (21) is formed in the second connection area (10) between the at least one contact element (16) and the at least one second contact field (12), so that the at least one electrical conductor (13) in the second connection area (10) makes electrically conductive contact with the at least one contact element (16) via the at least one second contact field (12).
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