Clamping device for semiconductors

Abstract

A clamping device for semiconductors, comprising: a control module; a drive unit which is connected to the control module via a signal, wherein a main bevel gear is fixedly mounted on the output shaft of the drive unit; two drive bevel gears which are each engaged with the main bevel gear, so that the main bevel gear can drive the respective drive bevel gears to rotate; two guide spindle assemblies which are each connected at one end to the corresponding drive bevel gears, so that they are driven by the rotation of the corresponding drive bevel gears; two seat bodies which are each movably arranged on the corresponding guide spindle assemblies, so that the seat bodies are movable along the corresponding guide spindle assemblies;as well as two support arrangements, each of which is arranged on the respective seat bodies, such that the support arrangements are moved in opposite directions by the movement of the seat bodies in order to jointly support a wafer.;