Method for producing a laser device
Patent Information
- Application Number
- DE502010013714
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2009-12-23
- Filing Date
- 2010-11-23
- Publication Date
- 2011-06-30
- Estimated Expiration
- 2030-11-23
AI Technical Summary
Existing laser devices face challenges in precisely adjusting the position of a semiconductor laser and its accompanying lens, which affects the alignment and focusing of the laser beam, particularly in projection applications where high precision and stability are crucial.
The method involves shifting the lens perpendicularly to the laser beam's direction and aligning its optical axis parallel to the beam's propagation, followed by fixing it using a joint connection with flowable material that solidifies, allowing for precise adjustment and stabilization of the lens relative to the semiconductor laser, ensuring accurate beam alignment and focusing.
This approach enables high-precision adjustment and stabilization of the lens, compensating for assembly-related fluctuations and ensuring optimal beam alignment and focusing, particularly suitable for high-resolution applications like portable projectors where precise beam deflection and diameter control are essential.
Abstract
Description
[0001] Description
[0002] Method for manufacturing a laser device
[0003] Technical field
[0004] The present invention relates to a method for manufacturing a laser device comprising a semiconductor laser designed to emit a laser beam and a lens which is aligned relative to the semiconductor. The invention further relates to an inventive ¬ Properly manufactured laser devices and their use for projection applications.
[0005] State of the art
[0006] In a semiconductor laser, light is generated by recombination processes of electrons and holes at the interface between a p- and an n-doped region, whereby the emitted wavelength can be determined by the choice of semiconductor material, which typically ¬ which is evidently in a range from near-infrared to ultraviolet.
[0007] In laser devices known from the prior art, the semiconductor laser is mounted in a metal housing, and a lens is provided in the housing to focus the laser beam. This lens rests against an opening in the housing lid on the inside and is held in this position by a clamping mechanism.
[0008] Description of the invention
[0009] The invention is based on the objective of providing a method for manufacturing a laser device with a counter- to specify a lens aligned over a semiconductor laser.
[0010] According to the invention, this problem is solved by the line ¬The lens is first displaced perpendicular to the direction of propagation of the laser beam and thereby penetrated by the laser beam, with the optical axis of the lens lying parallel to the direction of propagation of the laser beam, and the lens is then fixed to a lens holder by means of a joining connection using a flowable material which solidifies for the purpose of joining, such that the ¬ Lens sliding capability perpendicular to the direction of propagation ¬ The laser beam is blocked.
[0011] The lens is therefore aligned in such a way that the optical ¬ The axis is parallel to the direction of propagation of the laser beam. Parallelism is also considered given within an angular range of up to 15° in either direction, preferably with a... ¬Deviation of up to 5°, particularly preferably up to 2°. The laser beam can also be convergent or divergent, so that the propagation ¬ direction can be an average of a multitude of directions.
[0012] The one parallel to the optical axis of propagation ¬ The lens, oriented in the direction of the laser beam, is then shifted perpendicular to the direction of propagation of the laser beam and is thereby penetrated by the laser beam. The term "perpendicular" is also understood within the framework of the aforementioned angular tolerance. The lens can, if necessary, be shifted along the optical axis before, during, or after the shift perpendicular to the optical axis. The lens holder can be moved along with the lens at a fixed relative position, either along the direction of propagation or perpendicular to it. Alternatively, the lens holder can be moved independently of the lens, allowing, for example, the lens to be moved into its final position first and then the lens holder attached, or the lens holder to be moved along the direction of propagation and then the lens to be moved perpendicular to it along the lens holder.
[0013] After being shifted perpendicular to the direction of propagation, the lens is fixed to the lens holder with a connecting element in such a way that its movement is blocked. Here, the term "movability" describes the ability to change the lens's position relative to the direction of propagation. ¬The conductor laser can be modified, for example by using a guide tool to move the lens of a guide vane. ¬ The lens is held in a specific direction and moved relative to the semiconductor laser. This movement is also present when the lens is not being moved, because it is held in a tool. ¬ The lens will only be able to be moved by the sliding mechanism. The movement can then be permanently blocked by a bonding connection using a flowable material that then solidifies, for example, by welding, soldering, or gluing, between the lens and the lens holder.
[0014] A joining connection according to the invention thus permanently fixes two components in position relative to each other by means of flowable material between or on the components, which solidifies for the purpose of joining. The material is initially in a flowable state, i.e., with a certain degree of fluidity. ¬of this viscosity, liquid state, and can preferably also be applied in this state. For example, through contact with air or another gas, or... ¬ Through the addition of a chemical reactant, through another interaction, for example with light, or through cooling, the material then transitions from a flowable to a solidified state. In this state, the material is dimensionally stable, meaning it essentially retains its shape, but can still be elastically adjusted if necessary. ¬ The joint reacts statically or viscoplastically to mechanical stress; it is therefore not necessarily rigid. The joint is permanent in the sense that the components can only be moved relative to each other again after the joint has been broken, for example by mechanical action, especially force, heating or chemical treatment.
[0015] By first displacing the lens perpendicular to the direction of propagation according to the invention and only then fixing it in position, the lens can be individually aligned with the semiconductor laser with high precision. ¬ The lens position can be adjusted. For example, assembly-related fluctuations in the position of the semiconductor laser can be compensated for by adjusting the lens position.
[0016] Preferred embodiments of the invention are specified in the dependent claims. In the following, a detailed distinction will no longer be made between the description of the method for manufacturing a laser device and the device and application aspects of the invention. The revelation is to be understood implicitly with regard to all categories.
[0017] A first embodiment of the invention provides that the lens is displaced along the direction of propagation, but no longer as soon as the displacement of the lens perpendicular to the direction of propagation is blocked. The lens holder is preferably mounted so as to be displaceable along the direction of propagation of the laser beam, and the position of the lens along this direction is more preferably determined by a contact between the lens and the lens holder, particularly preferably a planar contact.
[0018] Preferably, the movable storage allows for ¬ Along the propagation direction, a multitude of relative positions exist between the lens holder (and thus the contact surface for the lens) and the semiconductor laser, particularly preferably through a linear movement. A ¬ However, a sliding bearing could also be achieved, for example, by a screw connection whose axis of rotation is oriented in the direction of expansion.
[0019] The relative position between the lens mounting surface and the semiconductor laser can be adjusted under control by distance measurement, for example optically, mechanically, or electrically. However, it is preferred that the relative position between the mounting surface and the semiconductor laser be adjusted as a function of the laser beam after passing through the lens, particularly as a function of its diameter.
[0020] Crucially, the position of the lens must be aligned with the direction of laser propagation. Beams already determined (though not yet necessary) ¬ (perhaps blocked) is when the displacement of the lens perpendicular to the direction of propagation is blocked.
[0021] In a further embodiment, it is provided that the lens can be moved perpendicular to the direction of propagation. ¬The movement is blocked simultaneously with the ability to shift along the direction of propagation. This can be achieved, on the one hand, by restricting the movement of the lens holder along the direction of propagation. ¬ The direction of propagation may already be blocked, so that the joining connection between the lens holder and the lens prevents its movement perpendicular to the direction of propagation and thus prevents it from moving. ¬ as long as it is blocked. The lens can be used for this purpose, for example. ¬ The lens holder can be adjusted twice in position, so that after the first adjustment, and depending on this, the movement of the lens holder is blocked, and after the second adjustment, the joining connection between the lens holder and the lens is established.
[0022] On the other hand, the joining of the lens and lens holder can also occur simultaneously with blocking its movement along the direction of propagation. The lens is preferably first moved in such a way. ¬ben that specified target values for deflection and through ¬ The laser beam's diameter is reached, meaning the lens is moved into its final adjusted position. The lens holder can be moved simultaneously or even synchronously with the lens, or independently. Once the lens is in the adjusted position, the adjustability of the lens and holder is checked. ¬ The holder is blocked simultaneously. In another embodiment, it is provided that the lens is moved perpendicular to the spread. ¬ The lens is guided along a flat surface on an end face of the lens holder, while the lens is otherwise free. It is therefore connected to the lens holder as ¬ If necessary, by means of a guide device used for assembly. ¬The lens holder is connected to a device that is removed after the movement along the planar surface is blocked. The lens holder thus preferably comprises a planar surface oriented perpendicular to the direction of propagation, on which, for example, the planar side of a lens is attached. ¬ A convex or plano-convex lens has a planar orientation. If the lens is now moved perpendicular to the direction of propagation, its position along the propagation path does not change due to this planar orientation. ¬ direction .
[0023] The lens does not necessarily have to touch the lens holder. It is therefore also possible for the guiding tool to touch the lens holder, or for neither the guiding tool nor the lens to touch the lens holder, and for the lens to be moved at a substantially constant distance from it. The crucial point is that the lens position can be adjusted perpendicular to the direction of propagation, for example, depending on the deflection of the laser beam, without changing the diameter of the laser beam. In addition to a lens with a flat surface, a lens with a circumferential projection rising perpendicular to the optical axis can also be used, with the flank of the projection facing the semiconductor laser. ¬ Sprungs finds a planar arrangement on the lens holder. Although the lens lies flat against the lens holder during assembly and may even touch it, it is only secured by the guide used for assembly. ¬ The guide device, which is removed after assembly, is connected to the lens holder. The term "connected" therefore refers to a sufficient physical connection for guiding purposes. ¬ A personal connection that can also be dissolved without the use of force, i.e., not a joint. ¬ connection. The lens holder and lens are thus held, for example, by guide tools of the guide device using a clamping, screw or vacuum mechanism when the lens is moved along the flat surface of the lens holder.
[0024] In another embodiment, it is provided that after a displacement of the lens perpendicular to and from ¬along the direction of propagation of the laser beam, the lens holder is guided to the lens free from it (and thus, if necessary, by a guide serving the mounting process). ¬ (device with which this is connected, which is removed after the joining connection between the lens holder and the lens has been made). The lens is therefore ¬ for example, with a leadership tool. ¬ The lens holder was moved into the position aligned with the semiconductor laser. This position was also guided by a guide tool of the guide device. ¬ The lens, the lens holder, and the semiconductor laser, along with any mounting device, are only brought into contact with the lens once it is in the adjusted position and is no longer being moved. During adjustment, the lens, the lens holder, and the semiconductor laser are therefore preferably moved solely via the guide device. connected by being held in their guiding tools.
[0025] Moving the lens is particularly easy if the lens holder is not moved along with it, because in this case only one guide tool needs to be moved during adjustment. The lens holder is only brought into contact with the lens after it has been positioned, and this can then be done, for example, by coordinating the two guide tools, possibly also with distance-dependent speed adjustment.
[0026] By providing the lens and lens holder with a preferably flat contact surface in a region (the area of typical expected relative displacement), no further adjustment is necessary beyond the displacement of the lens holder along the propagation direction towards the lens. A joining connection between the lens holder and a guide device or a mounting device for the semiconductor laser, as in ¬ For example, a housing blocks the movement of the lens holder along the direction of propagation, and a second joining connection between the lens and the lens holder blocks the movement of the lens perpendicular to the direction of propagation (and also along the direction of propagation); the lens is fixed in position relative to the semiconductor laser by the two joining connections.
[0027] In a further embodiment, the lens and lens holder are held by negative pressure against guide tools of the guide device. In this way, the lens holder and the lens can be held securely during positioning and The lens holder and lens can then be easily released by removing the vacuum, without breaking any mechanical connection, thus preventing any impairment of the corrected position.
[0028] The guide tools and the lens or lens holder can be adapted to each other, so that, for example, the guide tools can have intake openings adapted to a curvature of the corresponding outer surface of the lens holder or lens. Alternatively, flat surfaces can also be provided on the lens or lens holder, against which a correspondingly flat intake opening of the guide tool finds a flat contact surface.
[0029] In a further embodiment, it is provided that the semiconductor laser is housed in a casing and the ¬ The lens's movement along the direction of propagation is blocked by a connection between the housing and the lens holder. The housing can have a round or rectangular cross-section in a plane perpendicular to the direction of propagation.
[0030] In a further embodiment, the lens holder is a tubular body with a through-opening such that the lens holder can be slid onto the housing before the lens is moved, and is itself slid onto the housing before the lens is moved. Depending on the housing, the through-opening can have a cross-section that is essentially circular or rectangular in the direction of propagation. and is preferably designed so that the interior wall ¬ The tubular body, when moved along the direction of propagation, forms a flat contact surface on the opposite outer surface of the housing. Within the range of motion necessary for movement along the direction of propagation, this flat contact surface blocks the movement of the lens. ¬ters perpendicular to the direction of propagation. In this preferred embodiment, the lens holder is therefore (essentially) only displaceable along the direction of propagation (a rotational movement that does not change the distance between the centers of gravity is not a displacement in this sense).
[0031] In a further embodiment, a second lens is displaced along the direction of propagation and perpendicular to it, and then fixed to a second lens holder by means of a bonding connection achieved by applying a flowable material that solidifies for the purpose of bonding. The second lens holder and the second lens are displaceable in the manner described above and their displacement can be locked by a bonding connection. The displaceability of the second lens holder ¬The laser beam can be blocked by a connection to the first lens holder or to a mounting device of the semiconductor laser, for example, a housing. By providing two lenses, for example, a cylindrical lens can be used to focus a laser beam with a spreading pattern. ¬ The elliptical cross-sectional profile, viewed from the direction of rotation, can be modified in such a way that an essentially circular cross-sectional profile results. An elliptical ¬ A sche cross-sectional profile is created, for example, by A waveguide geometry within the semiconductor laser itself has a rectangular, specifically non-square, profile. A second lens, rotationally symmetric in the direction of propagation, can then be used to change the deflection and diameter of the (then circular) laser beam as previously described.
[0032] In another embodiment, the laser beam is directed onto an optical sensor during the movement of the lens. The laser beam can fall directly from the lens onto the sensor or be directed onto it via further optics. The sensor can, for example, be constructed from a diode, with which ¬ In an arrangement of two diodes, the deflection of the laser beam in one direction can be measured by calculating the difference. Similarly, with four diodes or a diode with four quadrants (four-quadrant diode), the deflection of the laser beam in one plane or... ¬ its diameter can be determined. This is also possible with a CCD sensor (Charged-Coupled-Device), which consists of a matrix of light-sensitive elements.
[0033] An optical sensor can therefore provide electrical signals depending on the deflection or diameter of the laser beam. These signals can then be fed to an automated control unit or displayed visually for an operator. The electrical signals, which can also be converted into electronic signals if necessary, are thus preferably used as a control variable for moving the lens. In another embodiment, the joining connection is made using an adhesive. In the case of an adhesive bond between, for example, the lens holder and the lens, the bond is formed on the one hand by the adhesion of the adhesive to the lens holder and the lens, and on the other hand by the internal strength of the adhesive. ¬ The material forms a firm (though not inseparable) bond ¬ dung between the lens holder and the lens.
[0034] Suitable adhesives include, for example, solvent-based adhesives, dispersion adhesives, or chemically curing adhesives. The adhesive can bond not only plastic materials but also components such as... ¬ It contains metal or glass and its composition is further optimized to minimize shrinkage during curing.
[0035] The spatial arrangement of the adhesive is preferably... ¬ The adhesive is symmetrical in such a way that the forces exerted on the respective components by the adhesive in the event of shrinkage essentially cancel each other out (this also applies generally to the joints). In the case of a lens that is round in the direction of expansion, for example, this can be achieved over its entire circumference. ¬ The entire circumference can be covered with adhesive, or equidistant adhesive points can be provided along the circumference.
[0036] The adhesive can be, in particular, a UV-curing adhesive. The UV-curing adhesive, for example, acrylate-based, can be pre-cured. The guide tools can preferably be removed from the lens and the lens holder after pre-curing. This allows the guide device to be ready for adjusting the next laser device. The pre-hardened component can then be fully cured, which can also be done at a different wavelength or lamp power.
[0037] In a further embodiment, the lens holder consists of a UV-permeable material, and the adhesive bond between the housing and the lens holder is cured by irradiation with UV light. Therefore, a UV-permeable material is preferably used for the lens holder, which, unlike the material of the bonding agent, is already in a dimensionally stable state before the lens is moved. ¬Material or quartz glass is provided. This reduces shadowing caused by the lens holder during UV irradiation. Depending on the geometry of the housing and the lens holder, the adhesive can preferably be completely pre- or post-cured with irradiation from a single direction. ¬ They are hardened. Adhesive bonds between the housing and lens holder, as well as between the holder and the lens, are particularly preferred. ¬ Well-cured.
[0038] In a further embodiment, the flowable material is brought to the housing through an additional opening in the lens holder. This allows for a joining connection between the two. ¬The housing and lens holder can also be implemented even if, for example, the outer surface of the lens holder opposite the contact surface for the lens is difficult to access for applying the flowable material. The additional opening extends there ¬ when perpendicular to the opening, but not necessary- not with an angle of 90°, but with an arbitrary angle ¬ large angle between 0° and 180°.
[0039] The invention also relates to a laser device comprising a semiconductor laser, a lens, and a lens holder, wherein the lens is aligned relative to the semiconductor laser in a method according to one of the preceding claims and joined to the lens by means of a previously flowable material which has solidified. ¬The holder is fixed. Furthermore, the invention also relates to the use of a laser device manufactured according to the invention in a laser RGB module. Such a module can, for example, be used as a component of a projection device, in particular a portable projector. ¬ Onsgerät. Even the highest resolution requirements, such as Video Graphics Array (VGA) or Extended Video Graphics Array (EVGA), are possible. The three primary colors, red, green, and blue, are each generated by a laser beam source and superimposed by appropriate optics in such a way that a single beam... ¬A spot is formed in a specific order. To achieve the correspondingly high resolutions, the offset of the beams in this sequence must preferably not exceed 100 micrometers, 75 micrometers, 50 micrometers, and 25 micrometers. A laser device manufactured according to the invention with a lens aligned relative to the semiconductor laser, which adjusts both the deflection and the diameter of the laser beam accordingly, is therefore particularly suitable for such an application. Brief description of the drawings
[0040] The invention will now be described with reference to embodiments. ¬ Examples are explained in more detail, whereby the individual features can also be essential to the invention in other combinations and implicitly refer to all categories of the invention.
[0041] Fig. 1 shows a lens attached to a lens holder with an adhesive bond.
[0042] Fig. 2 shows the displacement of the lens as a function of the laser beam deflection. Fig. 3 shows cross-sectional profiles of various lenses. ¬ holder .
[0043] Fig. 4 shows laser devices with two lens holders. Fig. 5 shows a detail from Fig. 4.
[0044] Figure 1 shows a laser device with a semiconductor laser 1 that emits a laser beam 2. The laser beam 2 is focused by a lens 3, which is attached to a lens holder 5 by a joining connection 4. The lens holder 5 is fixed to a housing 7 of the semiconductor laser by a further joining connection 6 and is thus also fixed in position relative to the semiconductor laser 1.
[0045] The lens holder 5 has a through-opening 8 into which the housing 7 is partially inserted, the lens holder being slidable on the housing 7 until it abutted a mounting base 9 before the joining connection 6 was attached. The recess 8 abutting the housing 7 was then secured. The lens holder is located on an outer surface of the housing 7. ¬ in relation to directions perpendicular to propagation ¬The lens holder 5 is fixed in position along the direction of the laser beam 2. After adjusting the lens position along the propagation direction of the laser beam 2 and perpendicular to it, the lens holder 5, which was previously slid onto the housing 7, can be moved towards the lens 3. Since the lens 3 is in a flat contact position with the lens holder 5, the lens holder 5 can be moved along the propagation direction of the laser beam 2 independently of the position of the lens 3 in directions perpendicular to the propagation direction of the laser beam 2. After the lens holder 5 has been moved towards the correctly positioned lens 3, a bond 4 is created between the lens holder 5 and the lens 3, as well as between the lens holder 5 and the housing 7, using UV-curing adhesive.Since the lens holder 5 is made of a UV-permeable material, the joining connection between the lens holder and the housing can be cured by irradiation with UV light from a direction opposite to the propagation direction of the laser beam 2.
[0046] Figure 2 shows a guide device 10 with three guide tools 11 in which the semiconductor laser 1 with a housing 7, the lens holder 5, and the lens 3 are held, the latter two being held against the guide tools 11 by negative pressure. The laser beam 2 passes through the lens 3 and then falls onto a sensor 12, with which the deflection and diameter of the laser beam 2 are measured. The sensor 12 sends corresponding electrical signals to the evaluation unit 13. which determines the positioning of lens 3 via the guide ¬ Device 10 regulates.
[0047] Figure 3 shows cross-sections through different lens halves ¬The cross-sectional planes of the lens holder 5 contain both the propagation direction of the laser beam 2 (top row) and are oriented perpendicular to this direction (bottom row). The lens holder 5 can have a straight through-opening 8 or a through-opening 8 that tapers in such a way that a stop 15 is formed. Such a stop 15 can then abut the housing 7 before the joining connection 6 between the lens holder 5 and the housing 7 is applied. In the upper right cross-sectional shape, an additional through-opening 16 extending transversely to the propagation direction towards the through-opening 8 is also provided. Adhesive can be introduced through this through-opening between the housing 7 and the lens holder 5 even if the side surface of the lens holder 5 opposite the contact surface for the lens 3 is difficult to access.The lens holder 5 can have a round outer surface, to which a vacuum tool 11 is then appropriately adapted, or it can also have a flattened outer surface. ¬ or generally have a flat outer surface shape, so that a vacuum-generating guide tool 11 lies flat against it. The recess 8 can be adapted to the housing geometry, i.e., round, in particular ¬ which may be circular or angular, in particular square.
[0048] Figure 4 shows laser devices manufactured according to the invention, each with two lens holders and two lin- As shown, the second lens holder 25 is fixed to the first lens holder 5 by a joining connection 26, which in turn is fixed to the housing 7 of the semiconductor laser 1 by a joining connection 6. The diameter of the first lens 3 is smaller than the outer diameter of the first lens holder 5 such that, during normal positioning during adjustment, the joining connection 4 does not protrude beyond the lens holder 5 perpendicular to the direction of propagation. Thus, even after the first lens 3 has been mounted, the second lens holder 25 can be moved along the direction of propagation by means of a flat contact with the outer surface of the first lens holder 5.
[0049] The lower illustration shows two lens holders designed as complementary halves. The first lens holder 5 does not completely surround the lens. ¬ fend on the housing 7, and the second lens holder 25 is also attached to the housing 7 by a connecting connection 6.¬ In this way, a laser device with two lens holders can be designed to be particularly space-saving with respect to directions perpendicular to the direction of propagation. ¬ this allows two laser devices to be placed in one module at a smaller distance from each other.
[0050] Figure 5 shows, viewed in the direction of propagation, a planar arrangement 30 of the first lens holder 5 from the bottom. ¬ The representation is shown in Figure 4. The first lens 3 can be positioned along the planar structure 30 perpendicular to the propagation. ¬ The direction is shifted and its movement is blocked by a circumferential joining connection 4 (not shown). Since the planar system 30 only partially engages the housing 7 in directions perpendicular to the direction of propagation, If the second lens holder 25 is projected beyond the flat surface 30, it can be guided past it in such a way that the second lens holder is movable along the direction of propagation until the movableness is blocked by a joining connection 6 to the housing 7.
Claims
Claims Method for manufacturing a laser device with a semiconductor laser (1) designed to emit a laser beam (2), and a lens (3) which is adjusted relative to the semiconductor laser (1), by first moving the lens (3) perpendicular to the propagation direction of the laser beam (2) and thereby being penetrated by the laser beam (2), wherein the optical axis of the lens (3) is parallel to the propagation direction of the laser beam (2), and the lens (3) is then joined with a connecting connection (4) by means of flowable material which solidifies for the purpose of joining, to a lens holder (5) is fixed in this way, that the displacement of the lens (3) perpendicular to the direction of propagation of the laser beam (2) is blocked. Method according to claim 1, wherein the lens (3) is displaced along the direction of propagation, but no longer as soon as the displacement of the lens (3) perpendicular to the direction of propagation is blocked. Method according to claim 2, wherein the displacement of the lens (3) perpendicular to the direction of propagation is blocked simultaneously with the displacement along the direction of propagation. Method according to one of the preceding claims, wherein the lens (3) is guided along a planar surface on an end face of the lens holder (5) during displacement perpendicular to the direction of propagation, to which the lens (3) is connected only by a guide device (10) serving for assembly, which is removed after displacement along the planar surface is blocked. Method according to one of claims 1 to 3, in which, after a displacement of the lens (3) perpendicular to and along the direction of propagation, the lens holder (5) is guided to the lens (3) and is guided only by a guide device serving the assembly. (10) is connected to this, which is removed after the joining connection (4) between lens holder (5) and lens (3) is manufactured. Method according to one of the preceding claims, wherein the lens (3) and the lens holder (5) are held by negative pressure on guide tools (11) of a guide device (10). Method according to one of the preceding claims, wherein the semiconductor laser (1) is mounted in a housing (7) and the displacement of the lens (3) along the direction of propagation is blocked by a joining connection (6) between housing (7) and lens holder (5) by means of flowable material which solidifies for the purpose of the joining connection. Method according to claim 7, wherein the lens holder (5) is a tubular body with a through-opening (8) such that the lens holder (5) can be slid onto the housing (7) and is slid onto the housing (7) before the lens (3) is moved.
9. Method according to one of the preceding claims, wherein a second lens (23) is displaced along the direction of propagation and perpendicular to it and then fixed to a second lens holder (25) by means of a joining connection (24) through flowable material which solidifies for the purpose of the joining connection.
10. Method according to one of the preceding claims, wherein the laser beam (2) is directed onto an optical sensor (12) during the displacement of the lens (3).
11. A method according to any one of the preceding claims, wherein the joining connection is produced by an adhesive, in particular a UV-curing adhesive.
12. A method according to claim 11 in combination with any one of claims 7 and 8, wherein the lens holder (5) is made of a UV-transmitting material and the adhesive bond between the housing (7) and the lens holder (5) is cured by irradiation with UV light.
13. A method according to claim 8 in conjunction with claim 11 or 12, wherein the flowable material is brought to the housing (7) through an additional opening (16) in the lens holder (5).
14. A laser device comprising a semiconductor laser (1), a lens (3), and a lens holder (5), wherein the lens (3) is aligned relative to the semiconductor laser (1) in a method according to any of the preceding claims and fixed to the lens holder (5) by means of an joining connection (4) through previously flowable material which has solidified. Use of a laser device according to claim 14 in a laser RGB module, in particular as part of a portable projection device.