AIR HEAT EXCHANGER AND METHOD FOR ITS MANUFACTURING AND ELECTRONIC ASSEMBLY EQUIPPED THERE

Description

[0001] The invention relates to an air heat exchanger for cooling a power electronics component as defined in the preamble of claim 1, and as known from US 6,477,045B.

[0002] An embodiment of an air heat exchanger is known from EP0051315A2. Although improving the heat dissipation of individual components was already the objective of EP0051315A2, this is still inadequately addressed in EP0051315A2 for components with high thermal output, such as power electronics components.

[0003] Further heat exchangers are known from US 2010 / 0155030 A1, US 6,889,756 B1, US 2013 / 0056178 A1, US 2014 / 0246176 A1, DE 20 2010 011 783 U1 and WO 2015 / 057900 A1.

[0004] The object of the present invention was to overcome the disadvantages of the prior art and to provide an air heat exchanger which has improved heat dissipation even for electronic components with high thermal output.

[0005] One way to improve heat dissipation would be to use a liquid heat exchanger. However, liquid heat exchangers have the disadvantage of high energy consumption for circulating the cooling medium. Furthermore, liquid heat exchangers have a complex design, which makes them considerably more prone to failure. For this reason, the use of liquid heat exchangers is ruled out in this application.

[0006] The object of the invention is solved by an air heat exchanger according to the claims.

[0007] The invention relates to an air heat exchanger for cooling a power electronics component comprising: a carrier plate with a receiving area for receiving the power electronics component; a heat exchanger plate coupled to the carrier plate, wherein at least one hermetically sealed cavity for receiving a working medium is formed, bounded by the carrier plate and the heat exchanger plate, wherein the cavity has an evaporator and a condenser, wherein the evaporator is spaced apart from the condenser in a heat transfer direction; cooling fins coupled to the heat exchanger plate.

[0008] During operation, the cooling fins of the air heat exchanger are surrounded by air, allowing the heat generated by the power electronics component to be released to the environment as efficiently as possible.

[0009] The inventive design of the air heat exchanger offers the surprising advantage that, thanks to the hermetically sealed cavity and the working medium contained therein, or rather the inventive arrangement of the hermetically sealed cavity, an efficiency increase of 20-30% can be achieved compared to an air heat exchanger without a cavity. This surprisingly high increase in efficiency can be achieved in particular by ensuring that the heat input from the power electronics component in the receiving area of ​​the carrier plate can be distributed evenly to the cooling fins coupled to the heat exchanger plate, whereby the entirety of the cooling fins can dissipate the heat to the ambient air in approximately the same way.

[0010] According to the invention, the support plate has a support plate connection surface and the heat exchanger plate has a heat exchanger plate connection surface, wherein the support plate connection surface and the heat exchanger plate connection surface are in contact with each other. The contact between the support plate connection surface and the heat exchanger plate connection surface also includes the condition when an intermediate layer, such as a solder layer or an adhesive layer, is formed between the support plate connection surface and the heat exchanger plate connection surface.

[0011] Furthermore, it may be provided that the carrier plate connection surface is located on the opposite side of the receiving area of ​​the carrier plate.

[0012] Furthermore, the heat exchanger plate connection surface can be arranged on the side of the heat exchanger plate opposite the cooling fins. It can also be arranged that the support plate connection surface and the heat exchanger plate connection surface are each designed as flat surfaces, with the cavity formed by a recess in the heat exchanger plate connection surface. This offers the surprising advantage that the air heat exchanger can have the simplest possible design and, moreover, achieve the highest possible efficiency. Alternatively or additionally, the recess forming the cavity can be arranged in the support plate.

[0013] According to the invention, the carrier plate connection surface and the heat exchanger plate connection surface are coupled to each other by a material-bonded connection, in particular by a vacuum brazing connection.

[0014] Such a material-bonded connection allows for a tight seal of the cavity. Furthermore, vacuum brazing enables a particularly tight seal of the cavity and facilitates the simple creation of a connection between the support plate and the heat exchanger plate. Additionally, the working fluid can be easily introduced into the cavity during the vacuum brazing process.

[0015] Another advantageous design is one in which, at least in the area of ​​the evaporator, ribs are arranged in the recess, bearing against the mounting surface of the support plate. This offers the advantage of improving the thermal conductivity between the support plate and the heat exchanger plate, thereby achieving a further surprising increase in the efficiency of the air heat exchanger. Furthermore, the ribs can serve as support elements, thus improving the stability of the air heat exchanger and the dimensional stability of the cavity.

[0016] Alternatively, it can be provided that, at least in the area of ​​the evaporator, ribs are arranged in the recess which rest against the heat exchanger plate connection surface.

[0017] According to a further development, it is possible to arrange several of the baffles in a row, with multiple rows of baffles arranged one behind the other. This offers the advantage of further improving the efficiency of the air heat exchanger. Furthermore, it is possible to provide that the individual baffles within a row and / or from different rows have different dimensions and / or that the individual baffles are arranged at different distances from each other. This offers the advantage that the distribution of the baffles can be adapted to the specific heat dissipation requirements.

[0018] In particular, it can be provided that several rows of bridges are arranged one behind the other in the direction of heat transport.

[0019] Furthermore, it can be provided that the individual webs have a longitudinal extension in the heat transfer direction and a transverse extension perpendicular to the heat transfer direction, wherein the longitudinal extension is greater than the transverse extension. In addition, it can be provided that the individual webs have a longitudinal extension between 2 mm and 50 mm, in particular between 4 mm and 20 mm, preferably between 6 mm and 10 mm. Furthermore, it can be provided that the individual webs have a transverse extension between 1 mm and 20 mm, in particular between 2 mm and 10 mm, preferably between 3 mm and 4 mm.

[0020] Furthermore, it may be provided that at least one spacer is formed in the area of ​​the capacitor. The spacer is designed such that the support plate rests against the spacer. It may also be provided that the spacer has a longitudinal extension in the heat transfer direction and a transverse extension perpendicular to the heat transfer direction, wherein the longitudinal extension is greater than the transverse extension. In addition, it may be provided that the spacer has a longitudinal extension between 20 mm and 300 mm, in particular between 50 mm and 200 mm, preferably between 120 mm and 130 mm. Furthermore, it may be provided that the spacer has a transverse extension between 1 mm and 20 mm, in particular between 2 mm and 15 mm, preferably between 4 mm and 8 mm.

[0021] Furthermore, it can be advantageous to have at least two cavities. This offers the surprising benefit of further improving the efficiency of the air heat exchanger compared to a single, larger cavity. The individual cavities can be arranged independently of each other and not connected within the air heat exchanger.

[0022] Furthermore, it can be provided that the at least two cavities are arranged next to each other, with the at least two cavities having opposite directions of heat transport. This brings with it the surprising advantage of improved heat distribution.

[0023] Furthermore, the heat exchanger plate may be designed with recesses for cooling fins. Such an embodiment of the heat exchanger, in which the cooling fins are not integrally formed with the heat exchanger plate but are separately formed and recessed within the plate, offers the advantage of simple and cost-effective manufacturing of the heat exchanger plate.

[0024] Alternatively, cooling fins can be integrally molded onto the heat exchanger plate. This can be achieved, for example, if the heat exchanger plate is designed as a continuously cast profile.

[0025] Furthermore, the heat exchanger plate can be designed as a deep-drawn part. In this case, the cooling fins can also be integrally molded onto the heat exchanger plate.

[0026] In particular, it may be provided that the mounting plate and / or the heat exchanger plate are made of aluminum or an aluminum alloy.

[0027] Furthermore, it may be provided that the cooling fins are incorporated into the cooling fin recess for the use of a highly thermally conductive material, such as thermal paste.

[0028] The cooling fins can be made of the same material as the heat exchanger plate.

[0029] Furthermore, the evaporator can be arranged in the receiving area, which, viewed from above, is positioned off-center on the support plate. This off-center arrangement of the receiving area allows for a space-saving and highly efficient design of the air heat exchanger. Simultaneously, the design of the cavity ensures uniform heat distribution across the entire surface of the heat exchanger plate.

[0030] In one particular configuration, the cavity can contain the evaporator and several condensers, with multiple heat transfer paths extending from the evaporator to the condensers. This design ensures a uniform heat distribution and spreading across the heat exchanger plate. Consequently, the cooling capacity of the air heat exchanger can be surprisingly improved.

[0031] In particular, it can be provided that the evaporator, viewed from above, is centrally located on the support plate and that the condensers are arranged around the evaporator on the support plate. For example, the evaporator can be centrally located, and a first condenser can be spaced apart in a first direction, and a second condenser can be spaced apart in a second direction.

[0032] According to an advantageous further development, it can be provided that the carrier plate has a carrier plate thickness between 1mm and 10mm, in particular between 1.5mm and 5mm, preferably between 2mm and 3mm.

[0033] In particular, it can be advantageous if the heat exchanger plate has a heat exchanger plate thickness between 5mm and 50mm, especially between 15mm and 35mm, preferably between 24mm and 27mm.

[0034] Furthermore, it can be provided that the support plate thickness is between 5% and 40%, in particular between 10% and 20%, preferably between 15% and 17% of the heat exchanger plate thickness. Such a distribution between the support plate thickness and the heat exchanger plate thickness results in a surprising increase in the efficiency of the air heat exchanger.

[0035] Furthermore, the heat exchanger plate and / or the support plate may be manufactured by machining, in particular by milling. The recess in the heat exchanger plate, in particular, can be easily produced by milling, allowing for a wide variety of shapes.

[0036] In an alternative embodiment, the heat exchanger plate and / or the support plate can be manufactured by a casting process, in particular a die-casting process. In a preferred embodiment, the heat exchanger plate and / or the support plate can be manufactured by an aluminum die-casting process.

[0037] Furthermore, the cooling fins can be arranged such that their longitudinal extent, viewed from above on the heat exchanger plate connection surface, is perpendicular to the heat transfer direction. Particularly with such an arrangement of the cooling fins, an above-average increase in the efficiency of the air heat exchanger can be achieved.

[0038] In an alternative variant, it can also be provided that the cooling fins are arranged in such a way that the longitudinal extent of the cooling fins, viewed from above on the heat exchanger plate connection surface, is longitudinal to the heat transport direction.

[0039] Furthermore, it may be provided that the cooling fins are arranged both under the evaporator and under the condenser. In particular, it may be provided that, viewed in the direction of heat transfer, the cooling fins are uniformly distributed over a range starting from the outermost end or across the entire base area of ​​the evaporator to the outermost end or across the entire base area of ​​the condenser.

[0040] Furthermore, the carrier plate may be provided with an opening designed to be closed by means of a base for the power electronics component. In such an embodiment, the base of the power electronics component can define the cavity, thereby achieving particularly efficient heat dissipation from the power electronics component. In such an embodiment, the carrier plate and the heat exchanger plate may also be formed as a single piece, for example, in the form of a casting.

[0041] In a further development, it may be provided that the cavity has a vapor flow channel and, structurally separated from it, a liquid return channel. This offers the advantage that the condensed working fluid can be returned from the condenser to the evaporator in the liquid return channel, and the vaporized working fluid can flow from the evaporator to the condenser in the vapor flow channel. This allows the working fluid to be circulated, which surprisingly increases cooling efficiency, as no heat exchange occurs between the condensed and vaporized working fluids.

[0042] Furthermore, a porous structure or a wick can be arranged in the liquid return channel. This has the advantage of improving the return of the working medium.

[0043] Furthermore, it can be provided that a depression is formed in the bottom of the depression, the deepest point of which lies in the area of ​​the evaporator. This has the advantage that the working medium, in its liquid state, can be returned to the evaporator by gravity.

[0044] In another embodiment, it can be provided that several evaporators and / or several condensers are formed in one cavity.

[0045] Furthermore, it can be provided that a filling opening, connected to the cavity via the flow path, is formed in the support plate or the heat exchanger plate. This offers the advantage that, after connecting the support plate to the heat exchanger plate, the working medium can be introduced into the cavity via the filling opening, and the desired pressure in the cavity can be set via the filling opening.

[0046] Furthermore, the filling opening of the air heat exchanger can be designed to be pressed shut in such a way that it is tightly sealed. This offers the advantage that the filling opening can be easily compressed using a press, thus sealing it.

[0047] Alternatively, the filling opening can be closed with a plug. This plug can have a seal.

[0048] In yet another variant, the filling opening may be closed by means of a screw, such as a worm screw.

[0049] According to the invention, an electronic assembly is designed. The electronic assembly comprises: an air heat exchanger; a power electronics component arranged on the air heat exchanger, in particular a bipolar transistor with an insulated gate electrode.

[0050] The air heat exchanger is designed according to one of the above-mentioned types.

[0051] The electronic design according to the invention offers the advantage that, due to the use of the improved air heat exchanger, a power electronic component with increased operating power and thus increased heat dissipation can be used in the same installation space. Bipolar transistors with insulated gate electrodes, in particular, require a high heat dissipation capacity.

[0052] According to further training, it is possible to arrange the power electronics component in the evaporator area of ​​the air heat exchanger and to arrange another electronic component in the condenser area, with the latter having a lower heat dissipation power than the power electronics component. This offers the advantage that several components can be mounted on the air heat exchanger, enabling efficient cooling of all electronic components located on it.

[0053] The cavity structure in the air heat exchanger according to the invention acts like a heat pipe. In a first embodiment, the air heat exchanger, and in particular the cavity, can function as a heat pipe. In a second embodiment, the air heat exchanger, and in particular the cavity, can function as a two-phase thermosiphon. Both embodiments have in common that the working fluid is converted into a gaseous state in the evaporator and then flows to the condenser in this gaseous state. In the condenser, the working fluid is converted back into a liquid state and, in the case of the heat pipe, returns to the evaporator via the wicking effect of a porous structure, while in the case of the two-phase thermosiphon, it returns to the evaporator by gravity.

[0054] According to the invention, a method for manufacturing an air heat exchanger, in particular an air heat exchanger according to one of the preceding claims, is provided. The method comprises the following process steps: Connecting a carrier plate to a heat exchanger plate; filling a cavity with a working medium via the filling opening; setting the desired pressure in the cavity; hermetically sealing the cavity by pressing the filling opening.

[0055] Alcohols, acetone, or other refrigerants can be used as the working fluid. The internal pressure within the cavity and the evaporation temperature of the chosen working fluid determine the operating temperature of the air heat exchanger, i.e., the temperature at which it achieves its maximum heat dissipation capacity.

[0056] In particular, a porous structure exhibiting capillary action can be arranged within the cavity. This porous structure could, for example, be made of a sintered material. Alternatively, the porous structure could take the form of a wick, such as a steel mesh, which would also exhibit capillary action.

[0057] For the purposes of this document, an evaporator or condenser is understood to be an area enclosed by the heat exchanger plate and / or the support plate. The evaporator and condenser are therefore not independent components, but may be formed by independent components.

[0058] To better understand the invention, it is explained in more detail with reference to the following figures.

[0059] They each show, in a highly simplified, schematic representation: Fig. 1 a perspective view of a first embodiment of an air heat exchanger; Fig. 2 a top view of a heat exchanger plate connection surface of the first embodiment of the air heat exchanger; Fig. 3 a top view of the heat exchanger plate connection surface of a second embodiment of the air heat exchanger; Fig. 4 a top view of the heat exchanger plate connection surface of a third embodiment of the air heat exchanger; Fig. 5 a perspective view of a further embodiment of the air heat exchanger with a vapor flow channel and a liquid return channel; Fig. 6 a perspective view of a further embodiment of the air heat exchanger with a sink; Fig. 7 a perspective view of a further embodiment of the air heat exchanger with a vapor flow channel and a liquid return channel; Fig.Fig. 8 A perspective view of another embodiment of the air heat exchanger with a cavity and several evaporators formed on the cavity; Fig. 9 A top view of the heat exchanger plate connection surface of another embodiment of the air heat exchanger with a vapor flow channel and a liquid return channel.

[0060] It should be noted at the outset that in the differently described embodiments, identical parts are provided with the same reference numerals or component designations, and the disclosures contained in the entire description can be applied analogously to identical parts with the same reference numerals or component designations. Furthermore, the positional designations chosen in the description, such as top, bottom, side, etc., refer to the figure directly described and illustrated, and these positional designations must be applied analogously to the new position if the position changes.

[0061] Fig. 1 Figure 1 shows a perspective view of a first embodiment of an air heat exchanger 1 for cooling a power electronics component 2. Such a power electronics component 2 to be cooled can, for example, be a bipolar transistor with an insulated gate electrode. The air heat exchanger 1 comprises a carrier plate 3 with a receiving area 4 for receiving the power electronics component 2. The receiving area 4 is formed on a receiving side 5 of the carrier plate 3. A carrier plate connection surface 6 is formed on the side of the carrier plate 3 opposite the receiving side 5.

[0062] Furthermore, the air heat exchanger 1 includes a heat exchanger plate 7. The heat exchanger plate 7 has a heat exchanger plate connection surface 8, which, in the assembled state of the air heat exchanger 1, rests against the support plate connection surface 6.

[0063] In Fig. 1For clarity, the air heat exchanger 1 is shown in an exploded view, with the support plate 3 shown separated from the heat exchanger plate 7. In the installed state of the air heat exchanger 1, the support plate connection surfaces 6 and the heat exchanger plate connection surfaces 8 are coupled to each other by a material-bonded connection.

[0064] As from Fig. 1 As can be further seen, according to the invention it is provided that a recess 9 is formed in the heat exchanger plate 7, in particular in the heat exchanger plate connection surface 8, which forms a hermetically sealed cavity 10 in the assembled state of the support plate 3 and the heat exchanger plate 7.

[0065] Within the cavity 10, an evaporator 11 and a condenser 12 are formed. A working medium 13 contained within the cavity 10 evaporates upon heat input in the region of the evaporator 11 and subsequently flows to the condenser 12, where it condenses again. The specific vaporization rate of the working medium is utilized to conduct the thermal energy from the evaporator 11 to the condenser 12, thus achieving a uniform heat distribution within the heat exchanger plate 7. Since the working medium 13 transports the thermal energy from the evaporator 11 to the condenser 12, the path from the evaporator 11 to the condenser 12 can also be considered the heat transfer direction 14.

[0066] The working medium 13 condensed in the condenser 12 can either return to the evaporator 11 through the wicking effect of a porous structure or through gravity.

[0067] Cooling fins 15 are arranged on the side opposite the heat exchanger plate connection surface 8. In particular, a cooling fin receptacle 16 may be provided into which the cooling fins 15 are inserted and which serves to transfer the heat energy from the heat exchanger plate 7 to the cooling fins 15.

[0068] In an alternative embodiment not shown, it may be provided that the cooling fins 15 are integrally formed onto the heat exchanger plate 7.

[0069] As from Fig. 1 As can be further seen, the cooling fins 15 can be arranged to extend in a transverse direction 17. The transverse direction 17 can be arranged at a right angle to the heat transfer direction 14 when viewed from above on the heat exchanger plate connection surface 8.

[0070] The individual cooling fins 15 are arranged at a fin spacing 18 and have a fin thickness 19. In particular, the fin thickness 19 can be between 20% and 350%, more specifically between 80% and 200%, and preferably between 140% and 160% of the fin spacing 18. Furthermore, the cooling fins 15 can project beyond the fin receptacle 16 by a fin projection 20. The fin projection 20 can be 20 to 25 times the fin thickness 19. In particular, the fin projection 20 can be between 50 mm and 150 mm, more specifically between 70 mm and 120 mm, and preferably between 90 mm and 95 mm.

[0071] Furthermore, it can be provided that the cooling fin spacing 18 is between 1 mm and 20 mm, in particular between 3 mm and 15 mm, preferably between 5 mm and 7 mm.

[0072] Furthermore, it can be provided that the cooling fin thickness 19 is between 1 mm and 20 mm, in particular between 2 mm and 10 mm, preferably between 3 mm and 5 mm.

[0073] Furthermore, the cooling fins 15 may have a cooling fin depth 21 along their longitudinal extent, which extends in the transverse direction 17. The cooling fin depth 21 can be between 100 mm and 500 mm, in particular between 300 mm and 400 mm, preferably between 250 mm and 350 mm.

[0074] The support plate 3 can have a thickness of 22. The heat exchanger plate 7 has a thickness of 23.

[0075] Furthermore, threaded elements 24 may be provided in the heat exchanger plate 7, particularly in the area of ​​the evaporator 11, which serve to receive fastening screws for the power electronic components 2. The threaded elements 24 may correspond to through holes 25 in the carrier plate 3. Such a combination of threaded elements 24 and through holes 25 allows the greater thickness of the heat exchanger plate 23, compared to the thickness of the carrier plate 22, to be used for the secure and durable reception of a fastening screw.

[0076] The recess 9 of the heat exchanger plate 7 extends from the heat exchanger plate connection surface 8 to a recess bottom 27.

[0077] As from Fig. 1As further shown, according to the invention, one or more webs 26 are arranged in the area of ​​the evaporator 11, extending between the bottom 27 of the recess 9 and the heat exchanger plate connection surface 8. The webs 26 serve to improve heat transfer from the support plate 3 to the evaporator 11. In particular, it is provided that the webs 26 bear against the support plate connection surface 6 of the support plate 3 when the air heat exchanger 1 is assembled.

[0078] As from Fig. 1 It can further be seen that the webs 26 are arranged in a row 28, with several rows 28 of webs 26 being arranged one behind the other in the heat transport direction 14.

[0079] Furthermore, it can be provided that 12 additional electronic components 29 are arranged on the carrier plate 3 in the area of ​​the capacitor.

[0080] As from Fig. 1As can be further seen, a spacer 30 may be provided in the area of ​​the capacitor. The spacer 30 can serve to support the carrier plate 3 in the area of ​​the capacitor 12.

[0081] Fig. 2 Figure 7 shows the heat exchanger plate 7 in a top view of the heat exchanger plate connection surface 8, where again the same reference numerals or component designations are used for identical parts as in the preceding figure. Fig. 1 to be used. To avoid unnecessary repetition, reference is made to the detailed description in the preceding section. Fig. 1 pointed out or referenced.

[0082] As from Fig. 2 As can be seen, the webs 26 each have a longitudinal extent 31 and a transverse extent 32. The spacer 30 also has a longitudinal extent 33 and a transverse extent 34.

[0083] In the Fig. 3Another embodiment of the air heat exchanger 1, which may be independent in itself, is shown, with the same reference numerals or component designations used for identical parts as in the preceding illustrations. Figure 1 and 2 to be used. To avoid unnecessary repetition, reference is made to the detailed description in the preceding sections. Figure 1 and 2 pointed out or referenced.

[0084] Fig. 3 shows the air heat exchanger 1 in a view similar to that shown in Fig. 2 was elected. As from Fig. 3It can be seen that the evaporator 11 is centrally located on the heat exchanger plate 7 and that a condenser 12 is formed on both sides of the evaporator 11. Thus, during operation of the air heat exchanger 1, a first heat transfer direction 14 and a second heat transfer direction 14 are established, each leading from the evaporator 11 to the condenser 12. This measure improves the potential heat dissipation, as heat can be dissipated in different directions.

[0085] In the Fig. 4 Another embodiment of the air heat exchanger 1, which may be independent in itself, is shown, with the same reference numerals or component designations used for identical parts as in the preceding illustrations. Figures 1 to 3 to be used. To avoid unnecessary repetition, reference is made to the detailed description in the preceding sections. Figures 1 to 3 pointed out or referenced.

[0086] As from Fig. 4 It can be provided that not only are two condensers 12 arranged opposite each other, but that several condensers 12, in particular four condensers 12, are connected to the evaporator 11, which can, for example, be arranged in a star configuration. The evaporator 11 can, for example, be located in the center of the heat exchanger plate 7.

[0087] Of course, in another embodiment, three or more than four condensers 12 can also be arranged in a star shape around the evaporator 11.

[0088] The Figures 5 to 9 Each figure shows a further embodiment of the air heat exchanger 1, using the same reference numerals and component designations for identical parts as in the preceding figures. To avoid unnecessary repetition, reference is made to the detailed description in the preceding figure. Fig. 1pointed out or referenced. As from Fig. 5 As can be seen, the cavity 10 may be provided with a steam flow channel 35 and, structurally separate from it, a liquid return channel 36. A separating web 37 may be arranged between the steam flow channel 35 and the liquid return channel 36.

[0089] Out of Fig. 5It is further evident that the carrier plate 3 may be provided with an opening 38, which is located in the area where the power electronics component 2 is installed. Thus, a socket 39 of the power electronics component 2, when installed, can close the opening 38 and therefore be placed on top of or inserted into the opening 38. In this way, the socket 39 of the power electronics component 2 can simultaneously form a boundary for the cavity 10. This measure allows the heat energy to be transferred as efficiently as possible from the power electronics component 2 to the working medium 13 contained in the cavity 10.

[0090] As from Fig. 5As further shown, a filling opening 40 may be provided for filling the cavity 10 with the working medium 13. The filling opening 40 may, for example, be arranged in a side surface of the cavity 10. Alternatively, the filling opening 40 may be formed in the heat exchanger plate 7.

[0091] If the power electronics component 2 serves to close the cavity 10, it can also be provided that the webs 26 are arranged directly on the base 39 of the power electronics component 2.

[0092] As from Fig. 6 It can be seen that a depression 41 is formed in the bottom 27 of the depression 9, which is located in the area of ​​the condenser 12. In the intended installation position of the air heat exchanger 1, the depression 41 has its lowest point in the area of ​​the evaporator 11.

[0093] As from Fig. 6As can be further seen, the sink 41, and thus the evaporator 11, can be arranged in the center of the heat exchanger plate 7. The condenser 12 is thus formed around the evaporator 11. Furthermore, support ribs 42 can be provided, which serve to support the carrier plate on the heat exchanger plate 7.

[0094] As from Fig. 7 It can be seen that several cavities 10 are formed side by side, which have different or opposing heat transfer directions 14. This measure allows a homogeneous temperature distribution to be achieved across the entire heat exchanger plate 7.

[0095] In the exemplary embodiment according to Fig. 7 The power electronics components 2 are schematically indicated in the form of rectangles on the carrier plate 3.

[0096] In Fig. 8The power electronics components 2 are shown schematically, with the carrier plate 3 hidden for clarity. As can be seen from Fig. 8 It can be assumed that only a single large cavity 10 is formed, which has several evaporators 11 and several capacitors 12. The evaporators 11 are each formed in the area of ​​the power electronics component 2, and the capacitors 12 are formed on the remaining surface.

[0097] The exemplary embodiment according to Fig. 9 exhibits a fundamentally similar structure to the exemplary embodiment Fig. 5 up. As from Fig. 9As can be seen, the air heat exchanger 1 can be arranged in a vertical configuration, so that in the operational state of the air heat exchanger 1, the evaporator 11 is formed below the condenser 12, allowing the working medium 13 to flow from the condenser 12 into the evaporator 11 by the action of gravity. In the exemplary embodiment, a cavity side surface 43 of the cavity 10 exhibits Fig. 9 a gradient from the steam flow channel 35 to the liquid return channel 36, whereby the working medium 13 condensed on the cavity side surface 43 flows into the liquid return channel 36 by gravity.

[0098] The exemplary embodiments show possible embodiment variants, whereby it should be noted at this point that the invention is not limited to the specifically illustrated embodiment variants, but rather various combinations of the individual embodiment variants are also possible and this possibility of variation lies within the skill of the person skilled in this technical field due to the teaching on technical action by the present invention.

[0099] The scope of protection is defined by the claims. However, the description and drawings must be consulted for the interpretation of the claims. Individual features or combinations of features from the different embodiments shown and described can, in themselves, represent independent inventive solutions. The problem underlying these independent inventive solutions can be found in the description.

[0100] All references to value ranges in this description are to be understood as encompassing any and all sub-ranges thereof, e.g., the reference 1 to 10 is to be understood as including all sub-ranges, starting from the lower limit 1 and the upper limit 10, i.e., all sub-ranges begin with a lower limit of 1 or greater and end with an upper limit of 10 or less, e.g., 1 to 1.7, or 3.2 to 8.1, or 5.5 to 10.

[0101] Finally, for the sake of clarity, it should be noted that, for a better understanding of the structure, some elements have been shown not to scale and / or enlarged and / or reduced in size. Reference numeral list

[0102] 1 Air heat exchanger 30 spacers 2 Power electronics component 31 Longitudinal extension of the bridge 3 carrier plate 32 transverse extension of the bridge 4 Recording area 33 Longitudinal extension spacer 5 admission page 34 Transverse extension spacer 6 Carrier plate connection surface 35 Steam flow channel 7 heat exchanger plate 36 Fluid return channel 8 Heat exchanger plate connection surface 37 dividing wall 38 opening 9 in-depth 39 base 10 cavity 40 Filling opening 11 Evaporator 41 depression 12 capacitor 42 Support bridge 13 working medium 43 cavity side surface 14 Heat transport direction 15 cooling fin 16 Cooling fin mounting 17 transverse direction 18 Cooling fin spacing 19 Cooling fin thickness 20 Cooling fin protrusion 21 Cooling fin depth 22 Carrier plate thickness 23 Heat exchanger plate thickness 24 Threaded element 25 Through hole 26 web 27 depression bottom 28 Row 29 further electronic component

Claims

1. An air heat exchanger (1) for cooling a power electronics component (2), comprising: - a carrier plate (3) having an accommodating region (4) for accommodating the power electronics component (2); - a heat exchanger plate (7) which is coupled to the carrier plate (3), wherein at least one hermetically sealed cavity (10) for accommodating a working medium (13) is formed and at least partly delimited by the carrier plate (3) and the heat exchanger plate (7), wherein the cavity (10) comprises an evaporator (11) and a condenser (12), wherein the evaporator (11) is arranged so as to be spaced apart from the condenser (12) in a heat transport direction (14); - cooling ribs (15) which are coupled to the heat exchanger plate (7), wherein the carrier plate (3) has a carrier plate connecting surface (6) and the heat exchanger plate (7) has a heat exchanger plate connecting surface (8), wherein the carrier plate connecting surface (6) and the heat exchanger plate connecting surface (8) abut on one another, wherein a recess (9) is formed in the heat exchanger plate connecting surface (8) of the heat exchanger plate (7), which recess (9), in the assembled state of the carrier plate (3) and the heat exchanger plate (7), forms a hermetically sealed cavity (10), characterized in that the carrier plate connecting surface (6) and the heat exchanger plate connecting surface (8) are coupled to one another by a materially bonded connection, and that one or multiple webs (26), which extend between the recess base (27) of the recess (9) and the heat exchanger plate connecting surface (8), are arranged in the region of the evaporator (11), wherein the webs (26), in the assembled state of the air heat exchanger (1), abut on the carrier plate connecting surface (6) of the carrier plate (3).

2. The air heat exchanger (1) according to claim 1, characterized in that the carrier plate connecting surface (6) and the heat exchanger plate connecting surface (8) are each formed as planar surfaces.

3. The air heat exchanger (1) according to one of the preceding claims, characterized in that the carrier plate connecting surface (6) and the heat exchanger plate connecting surface (8) are coupled to one another by a vacuum brazing connection.

4. The air heat exchanger (1) according to one of the preceding claims, characterized in that multiple ones of the webs (26) are arranged in a row (28), wherein multiple rows (28) of webs (26) are arranged behind one another.

5. The air heat exchanger (1) according to claim 4, characterized in that the individual webs (26) of one row (28) and / or of different rows (28) have a dimensioning differing from one another and / or that the individual webs (26) are arranged at different distances from one another.

6. The air heat exchanger (1) according to one of the preceding claims, characterized in that cooling rib receptacles (16), in which the cooling ribs (15) are received, are formed in the heat exchanger plate (7).

7. The air heat exchanger (1) according to one of claims 1 to 5, characterized in that cooling ribs (15) are formed in one piece with the heat exchanger plate (7).

8. The air heat exchanger (1) according to one of the preceding claims, characterized in that the evaporator (11) is arranged in the accommodating region (4), wherein the accommodating region (4) is arranged off-center of the carrier plate (3) as seen in top view.

9. The air heat exchanger (1) according to one of the preceding claims, characterized in that the cavity (10) comprises the evaporator (11) and multiple ones of the condensers (12), wherein multiple heat transport directions (14) are formed.

10. The air heat exchanger (1) according to one of the preceding claims, characterized in that a carrier plate thickness (22) amounts to between 2% and 300%, in particular between 5% and 70%, preferably between 15% and 30% of a heat exchanger plate thickness (23).

11. The air heat exchanger (1) according to one of the preceding claims, characterized in that the cooling ribs (15) are arranged such that the longitudinal extension of the cooling ribs (15) as seen in top view onto the heat exchanger plate connecting surface (8) are formed transversely to the heat transport direction (14).

12. The air heat exchanger (1) according to one of the preceding claims, characterized in that the cavity (10) comprises a vapor flow channel (35) and a liquid return channel (36) at a constructional distance therefrom.

13. The air heat exchanger (1) according to claim 12, characterized in that a porous structure or a wick is arranged in the liquid return channel (36).

14. The air heat exchanger (1) according to one of the preceding claims, characterized in that a depression (41), which has its deepest point in the region of the evaporator (11), is formed in a recess base (27) of the recess (9).

15. The air heat exchanger (1) according to one of the preceding claims, characterized in that multiple evaporators (11) and / or multiple condensers (12) are formed in a cavity (10).

16. The air heat exchanger (1) according to one of the preceding claims, characterized in that the at least two cavities (10) are arranged next to one another, wherein the at least two cavities (10) have opposite heat transport directions (14).

17. The air heat exchanger (1) according to one of the preceding claims, characterized in that a filling opening (40) that is in flow connection with the cavity (10) is formed in the carrier plate (3) or in the heat exchanger plate (7), wherein the filling opening (40) in the installed state of the air heat exchanger (1) is pressed in such a way that it is tightly sealed.

18. An electronic assembly comprising: - an air heat exchanger (1); - a power electronics component (2), in particular an insulated-gate bipolar transistor, arranged on the air heat exchanger (1); characterized in that the air heat exchanger (1) is formed according to one of the preceding claims.

19. The electronic assembly according to claim 18, characterized in that the power electronics component (2) is arranged in the region of the evaporator (11) of the air heat exchanger (1) and that a further electronic component (29) is arranged in the region of the condenser (12), wherein the further electronic component (29) has a lower heat dissipation performance than a heat dissipation performance of the power electronics component (2).

20. The electronic assembly according to claim 18 or 19, characterized in that an opening (38) is formed in the carrier plate (3), wherein the power electronics component (2) is mounted on the carrier plate (3) such that a footing (39) of the power electronics component (2) closes the recess and delimits the cavity (10).

21. A method for producing an air heat exchanger (1) according to one of the preceding claims, characterized by the method steps: - connecting a carrier plate (3) to a heat exchanger plate (7), wherein the carrier plate (3) has a carrier plate connecting surface (6) and the heat exchanger plate (7) has a heat exchanger plate connecting surface (8), wherein the carrier plate connecting surface (6) and the heat exchanger plate connecting surface (8) abut on one another, wherein the carrier plate connecting surface (6) and the heat exchanger plate connecting surface (8) are coupled to one another by a materially bonded connection, wherein a recess (9) is formed in the heat exchanger plate connecting surface (8) of the heat exchanger plate (7), which recess (9), in the assembled state of the carrier plate (3) and the heat exchanger plate (7), forms a hermetically sealed cavity (10), wherein one or multiple webs (26), which extend between the recess base (27) of the recess (9) and the heat exchanger plate connecting surface (8), are arranged in the region of the evaporator (11), wherein the webs (26), in the assembled state of the air heat exchanger (1), abut on the carrier plate connecting surface (6) of the carrier plate (3); - filling a cavity (10) with a working medium (13) via the filling opening (40); - setting the desired pressure in the cavity (10); - hermetically sealing the cavity (10) by pressing the filling opening (40).