CONTACT ELEMENT, SMD COMPONENT AND METHOD FOR MANUFACTURING THIS SMD COMPONENT

Description

[0001] The present invention relates to an SMD component and a method for manufacturing this SMD component.

[0002] Components can be mounted on printed circuit boards (PCBs) using two different techniques: through-hole technology (THT), where leads are inserted through mounting holes in the PCB from the front to the back and then soldered. Surface mount technology (SMT) involves soldering a component directly to a PCB's solderable pads on only one side, eliminating the need for leads. Surface mount technology offers the advantage of much denser component placement compared to through-hole technology, as SMT allows components to be mounted on both sides of the board, whereas THT is limited to one side.

[0003] Furthermore, SMT assembly is simpler than THT assembly in that no leads need to be threaded through mounting holes. However, in SMT, precise alignment of an SMD component (surface-mounted device) with the pads on the circuit board must be ensured. This precise alignment is crucial for the high quality of a circuit manufactured using SMT on a circuit board. Therefore, flawless soldering of SMD components is of paramount importance, as it determines the reliability of devices with appropriately populated circuit boards. With increasingly miniaturized SMD components, it is becoming ever more difficult to check this alignment on circuit boards with these miniaturized components using the naked eye or a microscope.In SMT, image processing systems, so-called AOI systems (AOI for "automated optical inspection"), are also commonly used, which check the prescribed important parameters with high precision and speed.

[0004] Furthermore, SMD components require connections between the solderable contacts provided on the component and internal leads within the SMD. For example, in the case of an inductor supplied as an SMD component, SMD contacts, often injection-molded, must be provided within the inductor housing. These contacts are insulated by removing the outer sheath from the leads of the inductor windings, and the exposed leads are then typically soldered or welded to the inductor contacts. However, soldering or welding places a thermal stress on the housing and the leads being soldered or welded, as heat is generated at the connection point during the process.This heating can impair the reliability of electrical and mechanical connections at the connection point, potentially affecting the reliability of the entire component. Furthermore, soldering or welding at this point in the manufacturing process is inherently energy-intensive, contributing significantly to production costs. Additionally, further cleaning processes may be required after soldering or welding to remove residues from the component, as these can negatively impact its electrical and / or mechanical performance. These additional cleaning processes, in turn, affect production time and manufacturing costs.

[0005] Furthermore, a challenge in SMT lies in the fact that the package design must take into account the SMD contacts to be injection-molded within the package, which must be positioned within the mold during the injection molding process. Inaccurate positioning of the SMD contacts in the mold can lead to difficulties in SMT if the SMD contact on the SMD component is not aligned precisely enough with the pads on a printed circuit board. Overall, these processes contribute to the challenges and costs associated with SMT.

[0006] Another point to consider when manufacturing components is that electromechanical connections in many applications, especially in the automotive sector, are subject to vibrations that can negatively affect the mechanical stability of an electromechanical connection, such as a soldered or welded joint. For example, electrical connections can deteriorate over time, ultimately leading to the failure of the entire component with that electromechanical connection under these conditions.

[0007] US Patent 7,320,616 B1 discloses a surface-mount IDC connector for attaching wires to a printed circuit board, comprising a housing with a number of parallel wire-receiving channels at least equal to the number of wires to be joined, and defining, when the connector is mounted on a printed circuit board, a plane substantially parallel to the surface of the board on which the connector is mounted. The wire-receiving channels are dimensioned to receive the wires with close spacing, thereby generally fixing the physical positions of the wires against lateral or transverse displacement. The housing further comprises a plurality of slots equal to the number of channels. Each slot is oriented substantially perpendicular to and connected with a corresponding channel.A plurality of piercing blade assemblies, one of which is accommodated in each of the slots, each piercing blade assembly comprising at least one piercing blade that can be inserted into the slot and is at least partially inserted into a corresponding channel. The piercing blades have a length greater than the dimension of the slots in the normal direction and a solder section that is positioned above the housing when the piercing blades are fully inserted into the channels. When inserted into the channels, the piercing blades pierce the insulation of wires in the wire receiving channels, while the solder sections remain exposed for surface mounting on a printed circuit board outside the housing. The piercing blades of a piercing blade assembly extend along a wire receiving channel.

[0008] Document WO 2020 / 006023 A1 describes an insulation displacement connector for making an electrical connection with at least one wire having an inner metal conductor covered with an outer insulating layer. The insulation displacement connector comprises a plurality of metal plates joined together to form a stack that defines a passage for receiving the wire, with at least one of the plates having a cutting edge for interrupting the insulating layer of the wire to allow the conductor to make direct contact with the plate.The insulation displacement connector is further designed for electrically connecting the wire to a second wire which has an inner metal conductor covered with an outer insulating layer, by having a second passage for receiving the second wire and at least one of the plates having a second cutting edge for cutting through the insulating layer of the second wire in order to directly contact the conductor of the second wire.

[0009] Document JP H07-282873 A shows a connector for wiring cables in which a conductor is coated with insulation. A pair of insulation displacement connectors (IDCs) are connected by a connecting section. The IDCs are formed by cutting with a Y-shaped profile that cuts into the insulation of a wiring cable inserted into the connector and makes contact with the conductor of the wiring cable.

[0010] Patent application US 2012 / 154087 A1 discloses an isolating transformer with an insulating case having an opening, a pair of walls, and a space connected to the opening; a magnetic element having wires and enclosed in the space of the insulating case; and a plurality of conductive elements connected to the wires fixed in the pair of walls. Each of the conductive elements has a plate. One end of the plate is divided into a first contact section and a second contact section, and the other end of the plate extends with a pin. The second contact section is further bent and forms a slot with the first contact section through which one of the wires passes.

[0011] In view of the requirements described above, the task is therefore to provide surface mount SMD components with a contact element, as well as a method for manufacturing such an SMD component, which avoid the problems described above.

[0012] In a first aspect, the present invention provides an SMD component. In illustrative embodiments thereof, the SMD component comprises a contact element with at least two insulation displacement connectors (IDCs) spaced apart along a connection section, and a contact surface designed for SMD mounting. The IDCs and the contact surface are positioned at opposite ends of the contact element with respect to the insertion direction of electrical conductors to be contacted into the IDCs for IDC contacting, such that the contact surface is formed on the side of the connection section opposite the IDCs. Each IDC comprises a V-shaped clamping contact with sharp flanks to cut through the insulation of an electrical conductor to be contacted, which is pressed into the V-shaped clamping contact.

[0013] This means that the contact element of the SMD component is designed such that the contact surface intended for SMD mounting is suitable for being subjected to an SMT process, in particular a soldering or welding process, and thus to the conditions associated with such a process, without impairing the electrical and mechanical properties of the insulation displacement connector (IDC), and vice versa. In other words, this means that the contact surface is designed, at least by means of a structural design in the shape of the contact surface, a material of the contact surface, and the presence of at least one solder contact point on the contact surface, and the like, to function as an SMD contact, while at the same time the IDC connector implements a function as an insulation displacement contact.

[0014] The contact surface is formed by an edge of the contact element that extends perpendicular to the insertion direction.

[0015] The contact element of the SMD component, as described in the first aspect, provides a contact element with one surface-mount device (SMD contact pad) and one insulated contact (IDC) interface, all within a single contact element. This allows the contact element to be used for both surface mounting and IDC applications. For the SMD component with this contact element, this means that internal leads can be connected via the IDC terminals, while simultaneously providing the surface-mount interface for PCB mounting. An IDC contact offers the advantage of a vibration-resistant and gas-tight connection, where, for example, a connection is created at the contact surface between the IDC terminals and the lead wire to be contacted through cold welding.The insulation displacement contact (IDC) not only provides a reliable connection, but also allows for easy attachment of the contact element to the SMD component without the need for thermal bonding processes or overmolding during the manufacturing of the SMD component housing. This prevents changes to the coplanarity of the SMD surfaces during the production process, as there is no thermal stress from soldering or welding. Furthermore, the IDC contact enables clean contacting of a current-carrying lead inside the SMD component, eliminating the need for additional cleaning processes.Furthermore, manufacturing processes using such contact elements eliminate the need for overmolding, stripping of a connecting wire, and soldering or welding. Therefore, the SMD component's contact element, in this respect, offers the possibility of reducing production processes (i.e., no inserting an SMD contact into an injection mold, welding / soldering, cleaning, stripping, etc.), thus reducing component complexity. As a result, component and process costs can be reduced. In summary, the contact element, in the first respect, allows for improved contact quality (since there is no residual contamination, soot, deviations in coplanarity, voids, etc.), and by avoiding soldering or welding for internal contacts within the SMD component, energy consumption during manufacturing is reduced, partly because fume / soot extraction is not required.

[0016] Furthermore, according to the first aspect, the contact element of the SMD component represents an insulating contact interface as the contact transition between the connecting wire and a component of the SMD, while the contact surface represents an SMD contact interface as the contact transition between the SMD component and a printed circuit board. In general, a contact transition is one of the most important aspects in the design and manufacture of components, as the quality of a contact point influences the electrical performance. Exemplary parameters that determine the quality of a contact point depend on the electrical resistance at the contact point and the contact resistance. This is composed of the contact resistance and the foreign layer resistance.The contact resistance arises from irregularities in the contact surface, which means that electrical contacts at the contact point do not make complete contact across the entire surface, but rather at a multitude of raised microsurfaces. Under current load, this leads to a narrowing of the current paths at these points. The resistance due to foreign layers accounts for resistance components caused by extremely thin surface layers, such as oxide or corrosion films. To avoid this, tin plating and precious metal coatings of gold, silver, palladium, or platinum are used. Both resistances depend on the contact force with which the contact surfaces are pressed against each other. With increasing force, the sum of the microsurfaces increases due to elastic or plastic deformation, and foreign layers can be partially destroyed, thus reducing the overall resistance.

[0017] This design allows for advantageous coplanarity adjustment via the contact element, while simultaneously enabling contact of multiple leads via the contact element, thus achieving SMD-compatible contacting of a multitude of leads. This allows for scaling of SMD contacts without increasing tolerances in SMD contact arrangements.

[0018] In a straightforward embodiment of the first aspect, the contact element can be made from a single metal. This allows the contact element to exhibit advantageous electrical and mechanical properties and also be easy to manufacture. For example, sufficient elasticity at the insulation displacement connectors can be ensured in this way, along with advantageous electrical conductivity properties and good solderability in SMD assembly. In an advantageous embodiment, the metal can be selected from brass (e.g., CuZn with a Zn content of 20% to 40%, such as CuZn30), bronze (e.g., CuSnX, such as CuSn6), or a copper-nickel alloy (e.g., a CuNi alloy with at least one of Si and one of Mg, such as CuNi3Si1Mg).These metals are advantageous, with bronze and a copper-nickel alloy proving particularly beneficial in terms of clamping resistance and foreign layer resistance, as these materials offer advantageous properties regarding potential coatings, contact geometry, mechanical contact wear, sliding properties, and any locking mechanisms and seals. Furthermore, a copper-nickel alloy and bronze are advantageous over brass as materials for the contact element because they exhibit comparatively low thermal stress relaxation and residual mechanical stress after thermal stress, such as that caused by soldering or welding.For example, contact elements made of bronze or a copper-nickel alloy exhibit a residual mechanical stress of at least 80% after thermal stress, such as that occurring during soldering or welding, while brass has a residual mechanical stress of between 40% and 50%. Therefore, a sufficient residual stress at the insulation displacement terminal of the contact element can be ensured by using a copper-nickel alloy and / or bronze.

[0019] In another illustrative embodiment of the first aspect, the connecting section of the contact element can further comprise stop sections, which represent portions of the connecting section extending beyond the insulation displacement contacts transversely to the insertion direction. This allows contact elements with a predetermined insertion depth to be easily provided in the SMD component. For example, in some specific illustrative examples, the stop sections can be offset laterally to the contact surface and recessed, representing a simple structural design for contact elements with stop sections.

[0020] The SMD component according to the first aspect further comprises an inductive component with a magnetic core and a winding arranged above it, and a housing designed to receive the component and one or more insulation displacement contacts (IDCs). Each IDC is inserted into a groove formed in a surface of the housing along the insertion direction. The winding comprises at least one electrical conductor. Furthermore, each IDC is at least partially exposed by a slot in a side wall extending away from the surface along its normal direction.

[0021] The SMD component according to the invention provides a housing design for an SMD component, for example, an inductive SMD component, without an inserted and overmolded SMD contact. The contact element prevents changes to the coplanarity of SMD surfaces on the contact element during the production process, as thermal stress from soldering or welding is avoided. Furthermore, each cutting contact provides a clean contacting method for a current-carrying lead wire inside the SMD component to the SMD contact of the SMD component through a vibration-resistant and gas-tight connection. Since overmolding of a contact during housing production, stripping of a lead wire, and soldering or welding are no longer required, the contact element according to the first aspect reduces production processes in the manufacture of the SMD component (i.e.,(No need to insert an SMD contact into an injection mold, no welding / soldering, no cleaning, no stripping, etc.), thus reducing component complexity. This allows for a reduction in component costs and therefore in process costs. The contact element of the SMD component, as described in the first aspect, allows for improved contact quality (since there is no residual contamination, soot, deviations in coplanarity, voids, etc.). Furthermore, by avoiding soldering or welding for internal contacts in the SMD component, energy consumption during manufacturing is reduced, partly because fume / soot extraction is not required.

[0022] In embodiments of the SMD component with an inductive component, the housing design comprises a trough- or pot-shaped housing into which the magnetic core with the winding arranged above it is inserted. Preferably, the magnetic core, for example a magnetic ring core, is inserted into an opening at the top of the housing, with at least one contact element arranged on an opposite underside of the housing such that the underside is positioned for SMD mounting on another component, for example a printed circuit board. The at least one contact element is brought into contact with an SMD contact of the other component.In other words, an SMD component can be provided in which the housing can be designed as a trough- or pot-shaped housing with an opening at the top into which the magnetic core is inserted, with at least one contact element arranged on an opposite underside of the housing.

[0023] In a more illustrative embodiment of the second aspect, each slot can completely penetrate the side wall along a direction perpendicular to the insertion direction. This allows one end of a connecting wire to be inserted into a single slot, facilitating easy contact.

[0024] In a further illustrative embodiment of the second aspect, in which at least two insulation displacement connectors (IDCs) are provided, each side wall can have a recess between each pair of slots formed therein, such that, viewed along the insertion direction, this side wall has a tapered section between each pair of slots. A groove can extend continuously between each pair of slots, with the connecting section between the IDCs being positively engaged in the groove within the tapered section. The recess allows for optical monitoring of the contact elements during surface mounting of the SMD component on a printed circuit board. The positive engagement of the contact elements in the grooves mechanically stabilizes the connecting section between the slots.

[0025] In a second aspect, the present invention provides a method for manufacturing the SMD component according to the first aspect. In illustrative embodiments thereof, the method comprises providing the housing, mounting the component in the housing, wherein at least one terminal end of one of the electrical conductors is inserted into a slot, and inserting the contact element into a groove that is connected to the slot into which the at least one terminal end is inserted, along the insertion direction, whereby IDC contacting of the at least one terminal end with the contact element is carried out. This avoids processes in the method that could cause a change in the coplanarity of SMD surfaces on the contact element during the production process, since the method avoids thermal stress from soldering or welding.Furthermore, the cutting contact offers a clean contacting method for a current-carrying lead wire inside the SMD component to the SMD contact of the component via a vibration-resistant and gas-tight connection. Since stripping a lead wire and soldering or welding are no longer required, production processes are reduced (i.e., no inserting an SMD contact into an injection mold, welding / soldering, cleaning, stripping, etc.), thus reducing component complexity. This allows for a reduction in component costs and therefore a reduction in process costs during SMD component manufacturing. By avoiding soldering or welding for internal contacting within the SMD component, energy consumption during manufacturing can be reduced, and fume / soot extraction is also unnecessary.

[0026] Further advantages and illustrative embodiments of the aspects of the invention described above are described below with reference to the accompanying figures, which are not drawn to scale and in which: Fig. 1 schematically represents an SMD component according to some illustrative embodiments; Fig. 2 schematically shows a disassembled representation of the in Fig. 1 The SMD component shown is represented; and Fig. 3 schematically shows a side view of a contact element for the SMD component according to the Figs. 1 and 2 represents;

[0027] With reference to the Figs. 1 and 2 Illustrative embodiments of an SMD component 200 are shown and described below. Fig. 1 Figure 1 shows a perspective view of the underside of the SMD component 200, while Figure 2 shows a disassembled perspective view of the SMD component 200 in Figure 3. Fig. 2 is shown. Fig. 3illustrates a side view of contact elements according to these illustrative embodiments.

[0028] With reference to Fig. 1 The SMD component 200 is shown with a housing 210 and a component 220 enclosed in the housing. The component 220 can, for example, be implemented as an inductive component with a magnetic core 222 and a winding 224 provided over the magnetic core 222. Alternatively, the electrical component 220 can also be implemented as a capacitive component (not shown), another passive component, or by a plurality of components. This does not represent a limitation, and the component 220 can be implemented as a general-purpose component.

[0029] In the representation of Fig. 1The SMD component 200 further comprises contact elements 231 and 233, which are provided on opposing contact strips 215a and 215b. Each of the contact elements 231, 233 is inserted into the associated contact strip 215a, 215b.

[0030] With reference to Fig. 2The figure shows that each of the contact strips 215a and 215b has a groove and a plurality of slots. According to the illustrated embodiment, the contact strip 215a has a groove 211 and slots 216 and 217 extending transversely to the groove 211, which are spaced apart from one another along one direction of extension of the groove 211. In a side wall SW3 of the contact strip 215a, the slots 216 and 217 are formed such that they extend only partially along the side wall SW3 transversely to the direction of extension of the groove 211. Accordingly, a continuous groove 213 and slots 218 and 219 extending transversely to the groove 213 are formed on the contact strip 215a, wherein the slots 218 and 219 are spaced apart from each other along an extension direction of the groove 213 and are formed in a side wall SW4 opposite the side wall SW3 on the contact strip 215b as slots running partially along the side wall SW4.Each of the slots 216 and 218 completely penetrates the corresponding side wall SW3, SW4 along one thickness direction of the side wall. Thus, the connection ends 225, 226, 227, and 228 of the winding 224 of the electrical component 220 can be inserted into the slots 216 to 218. For contacting, the contact elements 231 and 233 are then inserted into the respective grooves 211 and 213. As shown in the illustration. Figs. 1 and 2 Electrical and mechanical contact of the terminal ends 225 to 228 is achieved by means of the contact elements 231 and 233.

[0031] With reference to Fig. 3A side view of a contact element 240 is shown as an exemplary representation of the contact elements 231 and 233. The contact element 240 has two insulation displacement connectors 241 and 243, which are spaced apart from each other along a connecting section 245. On a side of the connecting section 245 opposite the insulation displacement connectors 241 and 243, a contact surface 244 for SMD mounting is formed. The insulation displacement connectors 241 and 243 are located opposite the contact surface 244 with respect to an insertion direction E2 from terminal ends corresponding to terminal ends 225 to 228 into the insulation displacement connectors 241 and 243. In illustrative examples, the connecting section 245 can have stop sections 246, which represent sections of the connecting section 245 that extend beyond the insulation displacement connectors 241 and 243 transversely to the insertion direction E2. These stop sections 246 can be offset laterally to the contact surface 244 and recessed.The number of insulation displacement terminals and the number of slots on a contact strip in the housing (in . Fig. 3 (not shown) of the SMD component assigned to contact element 240 (in Fig. 3 (not shown) are coordinated in such a way that there are as many slots along a groove as the contact element to be inserted into the groove has insulation displacement contacts.

[0032] Each of the insulation displacement connectors 241, 243 represents a contact interface based on IDC (insulation displacement connection) technology. This is a connection solution that requires no soldering, screws, or stripping and also implements a simple wiring principle. A conductor (not shown) of an electrical conductor (not shown) to be contacted by one of the insulation displacement connectors 241, 243 is pressed, along with its insulation, into a V-shaped clamping contact (formed by the insulation displacement connector 42). When the electrical conductor (not shown) to be contacted is pressed in, sharp edges of the insulation displacement connector 42 cut through the insulation (not shown) on the electrical conductor (not shown), creating an electrically conductive connection, a contact transition, between the conductor (not shown) and the corresponding insulation displacement connector 241, 243. This results in a gas-tight and corrosion-resistant connection at the contact transition.The clamping effect of the corresponding insulation displacement connector 241, 243 is achieved by a cutting edge geometry specified for this insulation displacement connector 241 or 243. High contact force, good conductivity, and the correct shape of a base material for this insulation displacement connector 241 or 243 determine the transmission quality and long-term reliability of an IDC connection. For the contact element 240, the electrical and mechanical properties provided by the IDC connection ensure a reliable connection between an electrical conductor (not shown) to be contacted and the contact element 240.

[0033] With reference to Fig. 2The manufacturing process for the SMD component will now be described. For this purpose, the housing 210 is provided, and the electrical component 220 is placed inside it. The terminal ends 225 to 228 are inserted into corresponding slots 216 to 218, such that terminal ends 225 in slots 216 and 217 extend completely through the groove 211, and terminal ends 227 and 228 in slots 218 and 219 extend completely perpendicular to the groove 213. Subsequently, the contact elements 231 and 233 are inserted into their respective grooves 211 and 213, with the terminal ends 225 to 228 being pressed into the insulation displacement contacts (IDCs) of the contact elements 231 and 233. This creates contact between the terminal ends and the IDCs of the contact elements 231 and 233.

[0034] Each of the grooves 211 and 213 has different depths along one direction of extension of the grooves 211 and 213. In particular, the groove 211 at the slots 216 and 217 has a depth corresponding to the insulation displacement contacts of the contact element 231. Adjacent to the slots 216 and 217, and especially in a section between the slots 216 and 217, the side wall SW3 has a thickness that is less than outside the slots 216 and 217. This provides a tapered section 250 of the side wall SW3 between the slots 216 and 217, in which the side wall SW3 is recessed between the slots 216 and 217 relative to the rest of the side wall SW3 outside the slots 216 and 217. This provides a recess on the housing 210, by means of which the contact surface of the contact element 231 can be observed during surface mounting. The same applies to the side wall SW4.Furthermore, the groove 211 outside the slots 216 and 217 and at the tapered section 250 has a depth that is less than the depth of the groove 211 at the slots 216 and 217. Thus, the connecting section 245 between the insulation displacement connectors serves in the illustration of . Fig. 3 as a stop surface together with sections 246 in Fig. 3 . Thus, sufficient coplanarity of the contact elements 231 and 233 can be ensured.

[0035] In summary, with regard to Fig. 3 The contact element 240 is shown with a plurality of insulation displacement connectors, for example the two explicitly shown insulation displacement connectors 241, 243, and the contact surface 244, which is designed for SMD mounting, wherein the insulation displacement connectors 241, 243 and the contact surface 244 are aligned with respect to the insertion direction E2 of an electrical conductor to be contacted (cf. the electrical conductor of the winding 224 in the illustration of Figs. 1 and 2) in each of the insulation displacement connectors 241, 243 for IDC contacting at opposite ends of the contact element 240. In illustrative examples, the contact element 240 can be made of a single metal, e.g., brass or bronze, or a copper-nickel alloy. In Fig. 3 The contact element 240 with the contact surface 244 is equipped such that the contact surface 244 is formed by an edge of the contact element 240 which is arranged along the insertion direction E2 at an end of the contact element 240 opposite the insulation displacement connectors 241, 243. This does not constitute a limitation and alternatively, although this is in Fig. 3Not shown, the contact surface 244 can be formed by a section of the contact element 240 that extends away from the insulation displacement contacts 241, 243 of this contact element 240 in a direction transverse to the insertion direction E2, for example, bent in a direction transverse to the insertion direction E2 with respect to the insulation displacement contacts 241, 243. According to the illustration in Fig. 3 On the contact element 240, exactly two insulation displacement connectors 241, 243 are formed, which are connected by a connecting section 245 extending transversely to the insertion direction E2, and the contact surface 244 extends along the connecting section 245 transversely to the insertion direction E2. Alternatively to the two insulation displacement connectors 241, 243 shown, only one connector (not shown) centered with respect to the connecting section along a direction transverse to the insertion direction may be provided, or three or more insulation displacement connectors may be present.

[0036] With reference to the Figs. 1 and 2 In summary, the SMD component 200 is shown with the housing 210 and the contact elements 231, 233, wherein each insulation displacement connector of each contact element 241, 243 is inserted into a corresponding groove 211, 213 formed in a surface of the housing 210 along the insertion direction E2. The insulation displacement connectors of each contact element 241, 243 are at least partially exposed in one of the side walls SW3, SW4 extending away from the surface along its normal direction by one of the slots 217, 218, 219, wherein the contact surface of the corresponding contact element 231, 233 projects from the surface of the housing 210 as an SMD contact surface. Each of the slots 217, 218, 219 can completely penetrate the respective side wall SW3 or SW4 in a direction perpendicular to the insertion direction E2. In vivid examples and as in Figs. 1 and 2As shown, each side wall SW3, SW4 can have a recess between the slots 216, 217 or 218, 219 formed therein, such that this side wall SW3 or SW4, in a view along the insertion direction E2, has the tapered section 250 between each of these two slots 216, 217 or 218, 219. One of the grooves 211, 213 can extend continuously between each of the two slots 216, 217 or 218, 219, with the connecting section 244 between the insulation displacement contacts of the corresponding contact element 231 or 233 being positively engaged in the groove 211 or 213 running through the tapered section 250.

[0037] In connection with the Figs. 1 to 3Above, a method for manufacturing the SMD component 200 was also described, comprising providing the housing 210, mounting at least one electrical conductor of the component 220 on the housing 210, wherein at least one terminal end 225, 226, 227 or 228 of the electrical conductor is inserted into one of the slots 216, 217, 218, 219, and inserting one of the contact elements 231, 233 into a corresponding groove 211, 213, which is connected to the respective slot 216, 217, 218 or 219 into which the at least one terminal end is inserted, along the insertion direction E2, wherein an IDC contacting of this terminal end 225, 226, 227 or 228 with the corresponding contact element 231, 233 is carried out.

Claims

1. SMD component (200), comprising: a contact element (240) having at least two insulation displacement terminals (241, 243), which are spaced apart from one another along a connecting section (245), wherein each insulation displacement terminal (241; 243) comprises a V-shaped clamping contact with sharp flanks in order to cut through an insulation of an electrical conductor to be contacted, which is pressed into the V-shaped clamping contact, and a contact surface (244), which is configured for SMD mounting, wherein the insulation displacement terminals (241, 243) and the contact surface (244), with respect to an insertion direction (E2) of electrical conductors to be contacted into the insulation displacement terminals (241, 243) for IDC contacting, are formed at ends of the contact element (240) opposite one another, so that the contact surface (244) is formed on the side of the connecting section opposite the insulation displacement terminals (241, 243), wherein the contact surface (244) is formed by an edge of the contact element (240), which extends transversely to the insertion direction (E2), an inductive component (220), which comprises a magnetic core and a winding (224) arranged thereover, wherein the winding (224) comprises at least one electrical conductor (224), and a housing (210), wherein the housing (210) is configured to receive the component (220) and each insulation displacement terminal (241; 243), and each insulation displacement terminal (241; 243) is inserted into a groove (211; 213), formed in a surface of the housing (210), along the insertion direction (E2), wherein each insulation displacement terminal (241; 243) is at least partially exposed in a side wall (SW3; SW4), extending away from the surface along its normal direction, by a slot (216; 217; 218; 219).

2. SMD component (200) according to claim 1, wherein the contact element (40; 240) is formed from a single metal.

3. SMD component (200) according to claim 2, wherein the metal is selected from brass, bronze, or a copper-nickel alloy.

4. SMD component (200) according to one of claims 1 to 3, wherein the connecting section further has stop sections (246), which represent sections of the connecting section (245) extending beyond the insulation displacement terminals (241, 243) transversely to the insertion direction (E2).

5. SMD component (200) according to claim 4, wherein the stop sections (246) are formed offset laterally with respect to the contact surface (244) and recessed.

6. SMD component (100; 200) according to one of claims 1 to 5, wherein each slot (216; 217; 218; 219) passes completely through the side wall (SW3; SW4) along a direction perpendicular to the insertion direction (E2).

7. SMD component (200) according to one of claims 1 to 6, wherein each side wall (SW3; SW4) has a recess between in each case two slots (216, 217; 218, 219) formed therein, so that this side wall (SW3; SW4), in a view along the insertion direction (E2), has in each case a tapering section (250) between these two slots (216, 217; 218, 219), and a groove (211; 213) extends continuously between the respective two slots (216, 217; 218, 219), and wherein the connecting section (244) between the insulation displacement terminals (241, 243) is received in a form-fitting manner in the groove (211; 213) extending therein in the tapering section (250).

8. SMD component (200) according to one of claims 1 to 7, wherein the housing (210) is formed as a trough-shaped or pot-shaped housing with an upper opening, into which the magnetic core (222) is inserted, wherein on an opposite underside of the housing (210) the at least one contact element (231; 233; 240) is arranged.

9. Method for producing the SMD component (200) according to one of claims 1 to 8, comprising: providing the housing (210); populating the housing (210) with the component (220), wherein at least one connection end (225; 226; 227; 228) of the at least one electrical conductor (224) is inserted into the slot (216; 217; 218; 219); and inserting the contact element (231; 233; 240) into a groove (211; 213), which is connected to the slot (216; 217; 218; 219), into which the at least one connection end is inserted, along the insertion direction (E2), wherein during this an IDC contacting of the at least one connection end (225; 226; 227; 228) with the contact element (231; 233; 240) is carried out.