DEVICE, SYSTEM AND METHOD FOR COOLING A PROCESSOR

Description

[0001] The present invention relates to a cooler for a processor, in particular for a CPU or a GPU, as well as a system for cooling a processor and a method for cooling a processor.

[0002] Operating electronic components, especially processors, generates waste heat that can lead to undesirable temperature increases. To counteract such temperature rises, suitable cooling systems can be used to dissipate the waste heat from the electrical component. Fluid-cooled cooling systems are known in the art, enabling the heat dissipation of a processor by means of a fluid. For this purpose, the processor is brought into thermal contact with a cooler of the fluid-cooled cooling system, allowing the cooler to absorb the processor's waste heat. The cooler itself is cooled, for example, by a coolant (such as water) that flows through a cooling channel within the heat sink. Efficient heat dissipation can be achieved by minimizing the thermal resistance between the processor and the coolant.Optimal heat dissipation can typically be achieved when the coolant is in contact with the heat sink at every point in the cooling channel.

[0003] Fluid-cooled cooling systems, like liquid-cooled cooling systems, can be designed as closed systems. Such systems may include a pump to circulate coolant through a cooling circuit and a radiator to dissipate the heat energy carried away by the coolant. During operation, it is common for air and / or gas to be carried along with the coolant and / or to separate from the liquid during operation and / or while the cooling system is i.e., to separate. Furthermore, when installing such a fluid-cooled cooling system, it is difficult to prevent air and / or gas from becoming trapped in the coolant circuit, which includes the cooling channel. Regardless, gas and / or air can also enter the cooling circuit through leaks in the system and / or via diffusion.When gas or separated gas is mentioned below, this refers to gas and / or air that is in the cooling circuit, regardless of how it got into the cooling circuit and what type of gas it is.

[0004] The separated gas typically has a lower thermal conductivity than the coolant and can therefore increase the thermal resistance between the processor and the coolant. Furthermore, the gas can generate unwanted noise, reduce the pump's flow rate, or even cause it to fail if, for example, large amounts of gas accumulate in the pump. Therefore, gas accumulation in certain areas of the cooling circuit should be avoided for optimal cooling system operation.

[0005] The gas is typically lighter than the coolant and is deposited against the direction of gravity, i.e., upwards. Therefore, in fluid-cooled systems, it is often stipulated that the system components are arranged only at specific heights relative to each other and / or orientations to gravity. This is intended to prevent gas accumulation in areas that could adversely affect the operation of such a cooling system.

[0006] State-of-the-art fluid-cooled cooling systems enable efficient cooling of a processor, particularly when operated in a specific installation position, i.e., when oriented in a particular direction relative to gravity. Specifically, this means that the processor, especially a CPU or GPU, can usually only be operated in a single, specific installation position, which is typically vertical or horizontal.

[0007] Prior art coolers are known, for example, from the following publications: WO 2007 / 006590 A2, which discloses a cooler for a processor according to the preamble of claim 1, CN 213 659 402 U, US 2019 / 101341 A1, US 2018 / 100710 A1 and US 2012 / 211199 A1.

[0008] The object of the present invention is to provide a cooler, a cooling system, and a method for operating a cooler, which at least partially solve the aforementioned problems.

[0009] The problem is solved by a cooler, the cooling system, and the method according to the independent claims. Advantageous embodiments of the invention are specified by the dependent claims.

[0010] The invention is based on the idea of ​​providing volumes within the cooler that are suitable for receiving and storing the separated gases in at least two installation positions of the cooler and are arranged in such a way that they do not impair the thermal resistance between the processor and the coolant. In particular, the accumulation of the gas separated from the coolant in an area located within the cooler on a direct line between the processor and the coolant is to be avoided.

[0011] A cooler according to the invention for a processor, in particular for a CPU or a GPU, comprises a heat sink with an external cooling surface for cooling the processor. The external cooling surface is a portion of the outer surface of the heat sink designed to absorb heat, in particular the waste heat from a processor. The cooler may optionally have at least one further cooling surface designed to cool at least one further electronic component, another processor, in particular a CPU or GPU, and / or at least one heat-emitting or heat-generating area of ​​a circuit board. An electronic component can be understood to be any electronic element that produces waste heat during operation; in particular, this can include electronic circuits, integrated circuits (ICs), or other programmable or non-programmable computing units.

[0012] The shape of the heat sink can be adapted to the processor being cooled. In some embodiments, the heat sink can be made of materials with high thermal conductivity, in particular at least partially of aluminum or copper. Regardless of the specific material, the heat sink or parts thereof can be manufactured, for example, using injection molding, die casting, or 3D printing. In one embodiment, the heat sink can include retaining elements for mounting it, for example, in a housing, particularly a computer housing. In an optional embodiment, the heat sink can include mounting elements for sensors whose signals can be used for controlling and / or regulating a cooling circuit.

[0013] The external cooling surface can advantageously be designed to conform to the geometry of the processor, particularly to a portion of the processor designed to dissipate the heat generated by the processor. Furthermore, the surface of the external cooling surface can be partially or completely functionalized by coatings or surface treatments to increase its heat transfer coefficient. To compensate for tolerances, a thermally conductive paste can be applied between the processor and the external cooling surface.

[0014] Furthermore, the cooler features a channel running through the heat sink, designed to convey a coolant. Coolant can thus flow into the channel through an inlet and out through an outlet. Heat exchange between the heat sink and the coolant can potentially occur at any interface between the channel and the heat sink, which will be referred to as the channel wall. The path of the channel through the heat sink, i.e., the route along which the channel extends, can be adapted to the geometry of the heat sink. For example, the channel can be designed such that the wall thickness of the heat sink is constant in certain sections. Regardless of this, the channel's path can, for example, be at least partially meandering to maximize the surface area for heat transfer between the heat sink and the coolant.Both the shape and the area of ​​a cross-section of the channel can advantageously vary along its length and need not be constant. The channel can be circular and / or polygonal, such as rectangular, in cross-section in sections, with the corners potentially being rounded.

[0015] The inlet and outlet of the channel can have mounting points for fluid lines, allowing, for example, a coolant to be transported to the channel inlet via a first fluid line and away from the channel outlet via a second. In optional channel configurations, the channel can be designed so that the cooler's function is independent of the coolant flow direction. In these optional cases, the channel's inlet and outlet can be interchanged without consequence in the above and subsequent descriptions.

[0016] The channel also features an internal cooling surface. This internal cooling surface is a portion of the channel wall and is formed as a projection of the external cooling surface onto the nearest channel wall. The straight lines of this projection can be chosen to form the shortest connection between a point on the external cooling surface and the channel wall. The internal cooling surface can thus be the area of ​​the channel wall that exhibits the lowest thermal resistance to the external cooling surface. There are also embodiments in which the section of the channel wall closest to the external cooling surface is parallel to it. In this case, the internal cooling surface is formed as an orthogonal projection of the external cooling surface onto the channel wall.

[0017] In optional cases, the cooler can have multiple external cooling surfaces, with internal cooling surfaces being orthogonal projections of each external cooling surface onto the channel wall. Separately, areas of the heat sink's outer surface that are not considered external cooling surfaces can be used to cool additional electronic circuits and / or to provide additional cooling for at least one processor. The heat sink can therefore be designed, in particular, to cool multiple electronic components, which may, for example, be arranged on a circuit board.

[0018] The heat sink also includes at least one air reservoir connected to the duct. The air reservoir is typically a volume enclosed by the heat sink and connected to the duct. Furthermore, the air reservoir is located outside the projection lines of the inner and outer cooling surfaces. For the following description, two mounting positions, a first and a second mounting position, are defined, each describing a specific orientation of the cooler relative to the direction of gravity. Multiple mounting positions may also be provided. Certain mounting positions may be required, for example, because a processor, particularly a CPU or GPU, is mounted on a circuit board. The circuit board may be plugged into a motherboard at an angle of approximately 90°.Essentially 90° here means that deviations of at most 10°, preferably at most 5°, and particularly at most 2° from 90° are possible. The motherboard is typically oriented essentially horizontally or vertically, for example with respect to a computer case, which may result in corresponding vertical or horizontal orientations of the processor. When vertical or horizontal directions are mentioned here and below, directions that deviate preferably less than 15°, particularly preferably less than 10°, most preferably less than 5°, and particularly less than 2° from the vertical or horizontal direction are also included.

[0019] The air reservoir is designed such that in each of its two installation positions, air and / or a gas can be separated into at least a partial volume of the reservoir. "Separatible into a partial volume of the air reservoir" in the context of the air reservoir means that a gas that separates from or is carried along by the coolant can be directed into the air reservoir and remain or be collected there. Since the air reservoir is not located in the area of ​​the internal cooling surface, it is possible to prevent a gas separated from the coolant into a partial volume of the air reservoir from accumulating in the area of ​​the internal cooling surface and displacing the coolant flowing past it. The coolant can therefore be in essentially complete contact with the internal cooling surface, allowing heat to be efficiently dissipated via the coolant.In particular, more than 90%, advantageously more than 95% or, most advantageously, more than 99% of the internal cooling surface can be in contact with the coolant.

[0020] The air reservoir can optionally be positioned in areas of the duct where boundary layer separation occurs during coolant flow, meaning the fluid detaches from the duct wall. Such areas can also be referred to as dead spaces or turbulence zones. Dead spaces can arise, for example, along the coolant flow path after sharp edges in the duct or sudden increases in the duct cross-section. In conjunction with the air reservoirs, these dead spaces can be used to capture and store gas that separates from the coolant. The air reservoir can also be positioned at an angle to or against the coolant flow direction after a change in the duct's direction.

[0021] Advantageously, in each of the two installation chambers, at least a partial volume of the air reservoir can be positioned higher in the direction of gravity than at least one region of the channel adjacent to the air reservoir. This prevents any gas deposited therein from escaping the respective partial volume in either installation chamber, thus enabling permanent storage of the gas in this partial volume in any installation position. In an optional embodiment of the invention, regions of the channel that do not border the air reservoir can be positioned higher than the partial volume of the air reservoir into which a gas can be deposited in at least one of the two installation positions. The partial volume described above need not necessarily be identical for each of the installation chambers.For example, different partial volumes can be involved, where, for instance, air can be separated into a first partial volume in a first installation position and air can be separated into a second partial volume in a second installation position. The first and second partial volumes can overlap at least partially or be disjoint, i.e., separate.

[0022] Optionally, the cross-sectional area of ​​the channel can be smaller in the region of the internal cooling surface than in a section of the channel immediately upstream of the coolant flow. This reduction in cross-sectional area can increase the coolant flow velocity in this region. Heat can then be dissipated efficiently because the likelihood of boundary layer separation of the coolant in the region of the internal cooling surface is reduced. This separation ensures that the coolant is in contact with the internal cooling surface. Separation of gas dissolved in the coolant or gas carried by the coolant typically occurs at low flow velocities.

[0023] In an optional embodiment of the cooler, the external cooling surface is designed such that, in the first installation position of the cooler, it extends essentially perpendicular to the direction of gravity and / or, in the second installation position, it extends essentially parallel to the direction of gravity. This can mean that the external cooling surface is essentially horizontal in the first installation position and essentially vertical in the second. The external cooling surface can be adapted to the shape of the processor to be cooled and, for example, need not necessarily be flat.

[0024] In a further embodiment of the invention, the air storage unit can comprise two air storage segments, for example, a first air storage segment and a second air storage segment, which are spatially separated from one another and are fluidically connected to each other only via the channel. The two air storage segments can, for example, be configured such that in the first installation position, gas can be separated into a partial volume of the first air storage segment, and in the second installation position, gas can be separated into a partial volume of the second air storage segment. It is also conceivable that in each of the two installation positions, gas is separated into each of the two air storage segments.

[0025] It is also conceivable that the cooler for a processor can be designed in which the outer cooling surface has a mounting point for the processor. This mounting point could, for example, utilize fasteners such as screws or clips. Advantageously, these fasteners can generate contact pressure, ensuring a secure connection between the outer cooling surface and a heat-dissipating area of ​​the processor. However, fasteners such as adhesive or thermal pads are also conceivable. To increase heat transfer from the processor to the outer cooling surface, materials such as thermal paste or thermal pads can be used, either independently or in addition to the mounting point.

[0026] In a further optional embodiment of the invention, the cooler comprises two interconnected shells. A first shell has a first connecting surface, and a second shell has a second connecting surface. The two shells come into contact at their connecting surfaces, are connected to each other at these surfaces, and together form the cooling element, the channel, and the air reservoir(s). The two shells can be shaped such that the channel wall, at any point along a specific section of the channel, is part of both the first shell and the second shell. Optionally, the channel can run at least partially perpendicular to the connecting surfaces of the shells. Regardless of this, the channel can run at least partially parallel to the connecting surfaces and / or at least partially along the connecting surfaces.

[0027] Each of the two shells can itself be composed of several shell components. It is also conceivable that the heat sink itself is composed of several components, which will also be referred to as shell components below. Sealing elements can be provided at the connecting surfaces, particularly the connecting surfaces of the shells, to ensure a tight seal between the two shells. The shells and / or the shell components can be joined to each other using various fasteners. Examples include screws, bolts, or clamps. Connections by joining, bonding, and / or welding are also conceivable. The two shells and / or the shell components can be manufactured, for example, using milling, injection molding, die casting, or 3D printing processes. At least one of the shells can, for example, be made of aluminum.

[0028] In a further embodiment of the invention, the inner cooling surface features a microchannel heat exchanger with grooves aligned along the flow direction. This increases the surface area exposed to the flow, contributing to improved heat exchange at the inner cooling surface. Other embodiments of the inner cooling surface are also conceivable that further enhance heat transfer, for example, through surface functionalization. Regardless of the specific embodiment, it is also conceivable to design the inner cooling surface convexly in the flow direction of the cooling fluid or to have a continuously tapered cross-section in the flow direction of the channel adjacent to the inner cooling surface.

[0029] In an optional embodiment of the invention, the air reservoir can be configured such that, in each of the two installation positions, at least one corresponding partial volume within the air reservoir is arranged higher along the force of gravity than any point on the internal cooling surface. For example, it can be provided that in a first installation position, a first partial volume, in a second installation position, a second partial volume, and in a third installation position, a third partial volume within the air reservoir are arranged higher along the force of gravity than any point on the internal cooling surface. The number of installation positions is not limited to three. The partial volumes described can be different volumes, which can, for example, be disjoint. With this arrangement, it can be achieved, for certain duct configurations, that a separated gas and / or separated air collects in the respective partial volume and remains there.

[0030] In a further optional embodiment of the invention, in at least one installation position, a portion of the air reservoir can be positioned lower than the highest point of the internal cooling surface. This is made possible by a special design of the duct and the air reservoir and allows for a more compact and / or flexible cooler design. The air reservoir and the internal cooling surface are spaced apart from each other.

[0031] In a particularly preferred embodiment of the invention, elastic compensation elements can be located in the air reservoirs, making it possible to vary the total volume enclosed by the cooler. When the cooler is connected to other components of a cooling circuit, undesirable pressure increases can occur within the cooling circuit. For example, when fluid lines filled with liquid are connected, the liquid-carrying volume can decrease while the liquid / gas quantity remains constant. This can cause the pressure within the volume to rise. The elastic elements can yield to the pressure and compensate for the pressure increase by increasing the enclosed volume.The elastic compensation elements can be made of foam or designed as gas-filled cushions; however, basically all materials are conceivable that can yield in the direction of pressure when pressure is applied to them.

[0032] Furthermore, a system for cooling a processor is proposed. In addition to the processor cooler described above, the system also includes a pump and a radiator. The cooler, pump, and radiator are fluidically connected via fluid lines, allowing coolant to be pumped through the fluid lines, the cooler's channel, and the radiator. Heat is transferred to the coolant at the cooler's internal cooling surface. The heated coolant is then circulated through the radiator, which transfers its heat. The radiator is typically positioned at a distance from the cooler. The cooled coolant is then returned to the cooler's internal cooling surface, which again transfers its heat to the coolant. This cooling circuit allows for the cooling of at least one processor, which dissipates its heat to the cooler's external cooling surface.The system may further include a fan designed to cool the radiator, and preferably located on the radiator.

[0033] According to another aspect, a method for cooling a processor is provided, comprising the following steps. The cooler is oriented in one of its two installation positions. An installation position can, for example, be an orientation of the cooler in which the cooler can be attached to a processor. The processor, in turn, can, for example, be mounted on a circuit board in a PC case. The cooler can also be oriented, for example, such that a longitudinal axis of the cooler runs horizontally or vertically. The cooler can, for example, be designed such that the external cooling surface extends substantially horizontally in a first installation position and / or substantially vertically in a second installation position. However, embodiments of the method are also conceivable in which the external cooling surface is not oriented horizontally and / or vertically in any installation position.In a further process step, a coolant is passed through the cooler's channel. In optional embodiments, the coolant can be conveyed to and / or away from the cooler via fluid lines. As the coolant passes through, air and / or gas dissolved in the coolant and / or gas carried by the coolant can be separated into the designated air reservoirs of the cooler, ensuring that the cooler's internal cooling surface is in contact with the coolant. This allows heat to be transferred to the coolant. It is also conceivable to create a cooling circuit and pass the coolant, which has absorbed the heat, through a radiator that absorbs the heat from the coolant. The coolant, cooled by the radiator, can then be passed back through the cooler.

[0034] It is understood that the features of the cooler, the cooling system and the method described above can be combined with each other, provided they do not contradict each other.

[0035] Various embodiments of the invention are schematically illustrated in two figures and are explained below by way of example.

[0036] It shows: Fig. 1 Sectional views of a first embodiment of a cooler for a processor in two installation positions; Fig. 2 Sectional views of a second embodiment of a cooler for a processor in two installation positions; Fig. 3 a schematic representation of a system for cooling a processor; and Fig. 4 A schematic representation of a process flow for operating a cooler.

[0037] Figure 1 shows sectional views of a first embodiment of a cooler 10 for a processor 2 in two installation positions. One direction of gravity 8 is shown in the Figure 1 downwards and can be viewed as the negative z-direction of a Cartesian coordinate system 11. Figure 1a shows a first installation position of the cooler 10 in which the processor 2 is essentially horizontally aligned, Figure 1b Figure 10 shows the cooler for a processor 2 in a second installation position, in which the processor 2 is essentially vertically oriented. Figure 1b This shows the cooler 10 for a processor 2 of the Figure 1a which was rotated 90° clockwise around the x-axis of the coordinate system 11 shown. The two installation positions shown are to be understood as examples of two installation positions. Installation positions that are not at a 90° angle to each other are also conceivable. Furthermore, installation positions that are neither perpendicular nor parallel to the direction of gravity are conceivable.

[0038] The cooler 10 is shown below in its first installation position, as shown in Figure 1ashown, described. Figures 1a and 1b Figure 1 shows a sectional view of a heat sink 1, which has a generally rectangular profile. However, the profile of the heat sink is not limited to rectangular shapes.

[0039] The external cooling surface 4 is in the first installation position ( Fig. 1a ) on the upper side of the heat sink 1. The external cooling surface 4 can optionally include mounting elements for electronic components, for example, for processors 2. The external cooling surface 4 itself can optionally be adapted to the surface area of ​​an electronic component. Likewise, the external cooling surface 4 can be formed from two separate surfaces. Configurations are also conceivable in which several external cooling surfaces 4 are formed with corresponding internal cooling surfaces 5.

[0040] Regardless, it may be possible to cool multiple elements, for example, multiple processors 2 and / or additional electronic components besides a processor. In particular, it may be possible for the heat sink 1 to be in contact with multiple heat-generating elements or areas of a circuit board. The cooler 1 can also be designed to absorb heat from at least two electronic components arranged on a circuit board, with at least one of these elements being in contact with the at least one external cooling surface 4. In some embodiments, the cooler 10 can be designed to absorb heat from at least two electronic components, for example, those arranged on a graphics card. The external cooling surface 4 is arranged on a processor 2. A channel 3 runs through the heat sink 1.In the first installation position shown, for example, both an inlet and an outlet of the channel 3 are arranged on the underside of the heat sink 1. In this example, the channel 3 runs vertically upwards from the inlet, i.e., opposite to the direction of gravity 8, then transitions into a horizontal section, and finally runs vertically downwards towards the outlet. The flow direction of the coolant is irrelevant in this embodiment. Therefore, there is no preferred flow direction for the coolant in this example. However, embodiments in which the flow direction can be significant are certainly conceivable.

[0041] An internal cooling surface 5 is formed on the upper surface of the horizontal section of the channel 3 as an orthogonal projection of the external cooling surface 4. In the illustrated embodiment, the internal cooling surface 5 is depicted as a flat surface. Embodiments are also conceivable in which the internal cooling surface 5 is convex in the direction of coolant flow. This means that a line connecting two points on the internal cooling surface 5, running parallel to the flow direction, lies entirely within the material of the heat sink. Regardless of the specific embodiment, it is conceivable that the cross-section of the channel 3 tapers continuously in the region of the internal cooling surface along the direction of coolant flow. This can, for example, reduce the probability of boundary layer detachment in the region of the internal cooling surface, as the flow velocity of the coolant increases steadily in this area.Furthermore, embodiments are conceivable in which the inner cooling surface has 5 ribs arranged parallel to the flow direction. This can, for example, increase the surface area of ​​the inner cooling surface, which promotes heat exchange.

[0042] The heat sink also has at least one air reservoir 6, which is arranged outside of straight connecting lines or projection lines between the inner cooling surface 5 and the outer cooling surface 4 and is fluidically connected to the channel 3. In this embodiment, the air reservoir 6 is arranged and designed such that in each of the two installation positions, i.e., both in Figure 1a as well as Figure 1bA partial volume or the entire volume of the air reservoir 6 is arranged higher in the direction of gravity than any point on the internal cooling surface 5. If gas and / or air is separated from the coolant, it can be collected in the air reservoir 6, so that the internal cooling surface is in contact with the coolant substantially completely, preferably more than 90%, more than 95%, or more than 99%. Embodiments are also conceivable in which the air reservoir 6 has a first air reservoir segment and a second air reservoir segment that are fluidically connected to each other only via the channel. The first air reservoir segment can have a first partial volume into which air and / or gas can be separated in the first installation position, and the second air reservoir segment can have a second partial volume into which air and / or gas can be separated in the second installation position.

[0043] Furthermore, more than two installation positions are conceivable in which air can be separated into an air storage unit, for example three, four or more than four installation positions.

[0044] The Figures 2a and 2b The figures also show sectional views of a design of a cooler 10 for a processor in two different installation positions. In a first installation position, as shown in Figure 2a As shown, an external cooling surface 4 extends essentially horizontally, meaning that the external cooling surface 4 extends essentially orthogonally to the direction of gravity 8. The gravity 8 is in the Figures 2a and 2b downwards. Figure 2b Figure 1 shows a sectional view of the cooler 10 for a processor 2 in a second installation position, in which the outer cooling surface 4 extends essentially in a vertical direction, i.e., parallel to the direction of gravity 8. The cooler 10 will be described below. Figure 2a described. The cooler 10 of the Figure 2bThis results from rotating the cooler 10 of the Figure 2a 90° clockwise around the x-axis of the coordinate system 11, i.e. the axis that is orthogonal to the plane of view.

[0045] In the illustrated embodiment of the invention, the heat sink 1 has a rectangular profile. A channel 3 runs along the surface of the heat sink. Figure 2aStarting from an inlet, the coolant flows vertically upwards and then transitions into a first horizontal section. This first horizontal section is followed by another vertically upward-flowing section, which then transitions into a second horizontal section. Finally, the second horizontal section transitions into a vertically downward-flowing section, leading to an outlet of the channel. In this embodiment, the flow direction of the coolant is irrelevant. Therefore, in this example, there is no preferred flow direction for the coolant. However, embodiments in which the flow direction could be significant are certainly conceivable.

[0046] An internal cooling surface 5 is formed in the second horizontally extending channel section as an orthogonal projection of the external cooling surface 4. The cross-section of the channel can be, as exemplified in Figure 2shown to be smaller in the area of ​​the internal cooling surface 5 than in the two surrounding channel sections.

[0047] The heat sink has an air reservoir 6, which is connected to the first horizontally extending channel section. The air reservoir 6 can, for example, be connected to the channel 3 at a point along the channel where boundary layer separation of the coolant from the channel wall can occur. The dead space created by this boundary layer separation is increased by the air reservoir 6 and serves to receive and store the separated gas and / or air.

[0048] The air reservoir 6 can be designed such that in the first exemplary installation position, which is shown in Figure 2a As shown, it is positioned lower than any point on the internal cooling surface 5. In the second installation position, shown in Figure 2bThe entire air reservoir 6 is, for example, arranged higher in the direction of gravity 8 than any point of the internal cooling surface 5. It is also possible to have embodiments in which at least a partial volume of the air reservoir 6, dimensioned differently for each installation position, is arranged higher than the internal cooling surface 5.

[0049] The air storage unit 6 can be used both in the Fig. 1 as well as in the Fig. 2 , designed as a concave bulge in the canal wall.

[0050] The heat sink 1 shown can, for example, be made of aluminum, or at least partially or predominantly made of it. Regardless, the heat sink 1, or parts of it, can be manufactured, for example, using injection molding, die casting, or 3D printing processes. In one embodiment of the heat sink 1, it can have retaining means with which it can be held, for example, in a housing, particularly a computer housing. In an optional embodiment of the heat sink 1, it can have mounting means for sensors whose signals can be used for controlling and / or for the control of a cooling circuit.

[0051] Optionally, the heat sink 1 can have or consist of two or more shells. The at least two shells are connected to the system at the connection surfaces, are joined to each other at these connection surfaces, and together form the heat sink 1, the channel 3, and the air reservoir(s) 6. The two shells can be shaped such that the channel wall is part of both the first and second shell at any point along a specific section of the channel. Optionally, the channel 3 can run at least partially perpendicular to the connection surfaces of the shells. Regardless of this, the channel 3 can run at least partially parallel to the connection surfaces and / or at least partially along the connection surfaces.

[0052] In a further optional embodiment, the cooler 10 can have compensating elements (not shown) that allow the total volume enclosed by the heat sink 1 to be varied. These elastic elements can yield under pressure increase and, for example, change their shape or volume. This allows a pressure increase to be compensated for by an increase in the enclosed volume. The elastic compensating elements can be made of foam or designed as gas-filled cushions; however, basically any material is conceivable that can yield in the direction of pressure when pressure is applied to it. The compensating elements can be arranged at any point in the channel 3 and / or the air reservoir 6.

[0053] Figure 3Figure 1 shows a schematic representation of a system for cooling a processor 2. The system has a cooler 10 which is fluidically connected to a radiator 32 via fluid lines 31. The cooler can, for example, be one of the coolers 10 from the Figure 1 or 2The cooler 10 is positioned with its external cooling surface 4 on a processor 2. Coolant can be pumped by a pump 33 through the fluid lines 31, through the radiator 32, and through the channel 3 of the cooler 10. Heat, generated, for example, by the processor 2, can be absorbed by the cooler 10 and transferred to the coolant. The coolant is then pumped by the pump 33 through the fluid line 31 to a radiator 32. The radiator 32 cools the coolant, for example, by transferring the heat from the coolant to the air surrounding the radiator 32. A processor cooling system may also include a fan 34. Figure 3The fan 34 is arranged and / or attached to the radiator 32. The fan 34 can preferably be arranged such that the air to which the radiator 32 transfers heat can be moved by the fan 34. The airflow from the fan 34 thus cools the radiator 32. Alternatively, any means that can cool the coolant are conceivable instead of the radiator 32. Optionally or additionally, air cooling using fans and / or blowers is also conceivable.

[0054] Figure 4 Figure 1 shows a schematic representation of a method for operating a cooler 10, wherein the method comprises steps S41-S44. The method can begin with the alignment of the cooler, step S41. The cooler 10 is thereby aligned in one of its installation positions. The cooler 10 can, for example, be a cooler 10 of the Figure 1 or 2Next, a coolant can be circulated through channel 3 of the cooler 10, see step S42. This can be done, for example, by the aforementioned pump 33, which is positioned at a suitable location. In a further step S43, air and / or gas dissolved in the coolant is separated into a partial volume of the air reservoir 6. Additionally, heat is transferred from the internal cooling surface 5 of the cooler 10 to the coolant, see step S44. The successful execution of the process does not require that all steps follow each other in strict sequence. In particular, the circulating of the coolant in step S42, the separation of air and / or gas dissolved in the coolant in step S43, and the transfer of heat to the coolant in step S44 occur partially simultaneously and / or overlap. It is also possible to realign the cooler 10 in a new installation position after steps S42, S43, and S44.Further steps may include, for example, switching on the pump 33 and / or cooling the radiator 32 with the fan 34. This is in . Figure 4 The procedure shown is therefore not limited to steps S41-S44 and may include further steps. List of reference symbols:

[0055] 1 Heat sink 2 Processor 3 Channel 4 External cooling surface 5 Internal cooling surface 6 Air reservoir 8 Direction of gravity 10 Cooler 11 Coordinate system 31 Fluid line 32 Radiator 33 Pump 34 Fan S41 Aligning the cooler S42 Passing coolant / cooling fluid S43 Separating air and / or gas dissolved in the coolant / cooling fluid S44 Transferring heat to the coolant / cooling fluid

Claims

1. A cooler (10) for a processor (2), in particular for a CPU or a GPU, comprising a heat sink (1) with at least one exterior cooling surface (4) for cooling the processor, which is a partial surface of one of the heat sink's outer surfaces, a duct (3), which runs through the heat sink (1), to convey a coolant, and a first and a second installation position, the cooler (10) being in a respective specific orientation in relation to the force of gravity (8) in each of the two installation positions, wherein the duct (3) has at least one interior cooling surface (5) which is formed as a projection of the exterior cooling surface (4) onto the nearest interface between the duct (3) and the heat sink (1), characterized in that the heat sink (1) has at least one air reservoir (6) that is connected to the duct (3), wherein the air reservoir (6) is arranged outside the projection lines of the interior cooling surface (5) and the exterior cooling surface (4) and is designed such that, in each of the two installation positions, air and / or gas can be separated into at least one subvolume of the air reservoir (6) and the interior cooling surface (5) is in contact with the coolant.

2. A cooler (10) for a processor (2), according to the preceding claim, wherein, in each of the two installation positions, at least a subvolume within the air reservoir (6) is arranged higher in the direction of gravity (8) than at least an area of the duct (3) adjacent to the air reservoir (6).

3. The cooler (10) for a processor (2), according to one of the preceding claims, wherein a cross-section of the duct (3) in the region of the interior cooling surface (5) is smaller than a cross-section of the duct (3) in a directly preceding region in the coolant's direction of flow.

4. The cooler (10) for a processor (2), according to one of the preceding claims, wherein the cooler (10) is orientated in the first installation position such that the at least one exterior cooling surface (4) is perpendicular to the force of gravity (8) and is orientated in the second installation position such that the at least one exterior cooling surface (4) is parallel to the force of gravity (8).

5. The cooler (10) for a processor (2), according to one of the preceding claims, wherein the air reservoir (6) has a first air reservoir segment and a second air reservoir segment which are connected to one another only via the duct (3), wherein the first air reservoir segment has a first subvolume into which air and / or gas is separable in the first installation position, and the second air reservoir segment has a second subvolume into which air and / or gas is separable in the second installation position.

6. The cooler (10) for a processor (2), according to one of the preceding claims, wherein the exterior cooling surface (4) has an attachment option for the processor (2).

7. The cooler (10) for a processor (2), according to one of the preceding claims, wherein the cooler (10) comprises two interconnected trays.

8. The cooler (10) for a processor (2), according to one of the preceding claims, wherein the interior cooling surface (5) is flat or has a convex shape.

9. The cooler (10) for a processor (2), according to one of the preceding claims, wherein the at least one air reservoir (6) is designed such that, in each of the two installation positions, at least a subvolume in the air reservoir (6) is arranged higher than any point of the interior cooling surface (5) in the direction of the force of gravity (8).

10. The cooler (10) for a processor (2), according to one of the preceding claims 1 to 8, wherein the at least one air reservoir (6) is designed such that, in at least one installation position, the air reservoir (6) is arranged lower than any point of the interior cooling surface (5) in the direction of gravity (8).

11. The Cooler (10) for a processor (2) according to one of the preceding claims, with at least one elastic compensation element being arranged within the air reservoir (6) and / or the duct (3), thus enabling a change in the total volume enclosed by the heat sink (1).

12. A system for cooling a processor (2), comprising a cooler (10) for a processor (2) according to one of the preceding claims, a pump (33), and a radiator (32), which are fluidically connected to one another via fluid lines (31), wherein a coolant can be pumped through the fluid lines (31), through the duct (3) of the heat sink (1), and through the radiator (33), by way of the at least one pump (33).

13. The system for cooling a processor (2) according to the previous claim, comprising a fan (34) that is designed to cool the radiator (32) and is preferably arranged on the radiator (32).

14. A method for operating the cooler (10) according to one of claims 1 to 11, whereby the cooler (10) is aligned in one of its installation positions (S41), a coolant is conveyed through the duct (3) of the cooler (10) (S42), air and / or gas dissolved in the coolant is separated into the subvolume of the air reservoir (6) (S43), and the interior cooling surface (5) is in contact with the cooling fluid such that heat is transferred along the interior cooling surface (5) to the cooling fluid (S44).