METHOD FOR PRODUCING LOW MELTING TEMPERATURE CONNECTIONS AT WAFER LEVEL FOR A WAFER BONDING ARRANGEMENT

DE602018080967T2Active Publication Date: 2025-04-09RAYTHEON CO
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Patent Information

Application Number
DE602018080967
Authority / Receiving Office
DE · DE
Patent Type
Patents
Current Assignee / Owner
Priority Date
2018-02-13
Filing Date
2018-08-21
Publication Date
2025-04-09
Estimated Expiration
2038-08-21
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