REMOVAL OF HIGH-VOLTAGE ZONES IN ELECTRONIC ASSEMBLIES
Patent Information
- Application Number
- DE602018088989
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2017-12-19
- Filing Date
- 2018-12-03
- Publication Date
- 2026-02-04
- Estimated Expiration
- 2038-12-03
AI Technical Summary
Existing surface-mount component (SMD) solder joints on electronic boards are prone to cracking due to high shear stresses and relative displacements caused by differential thermal expansion, leading to reduced lifespan and reliability, especially in harsh environments.
Adjust the positioning of solder pads on the printed circuit board to ensure they are located on either side of the SMD terminations, with a distance calculated to compensate for the difference in thermal expansion coefficients, and optionally use sacrificial pads or glue to stabilize the SMD during soldering.
This approach enhances the lifespan and robustness of SMD solder joints by minimizing stress and preventing cracking, while maintaining assembly efficiency and cost-effectiveness.