ULTRASOUND MICROSCOPE

DE602019076869T2Active Publication Date: 2025-10-15PVA TEPLA ANALYTICAL SYST
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Patent Information

Application Number
DE602019076869
Authority / Receiving Office
DE · DE
Patent Type
Patents
Current Assignee / Owner
Priority Date
2018-05-25
Filing Date
2019-05-17
Publication Date
2025-10-15
Estimated Expiration
2039-05-17

AI Technical Summary

Technical Problem

Existing ultrasonic microscopes face challenges in inspecting objects with uneven surfaces quickly and accurately, particularly in semiconductor structures, due to difficulties in maintaining focal point alignment and adjusting for surface geometry.

Method used

An ultrasonic microscope with a movable scan head, transducers, and actuators that adjust the focal point based on detection signals to maintain a predefined working distance and align transducers, using immersion liquid for improved focus and alignment, and weight compensation for rapid movement.

Benefits of technology

Enables high-speed, accurate inspection of objects with uneven surfaces by maintaining focal point alignment and minimizing fluid resistance, allowing for quick and precise detection of defects in semiconductor structures.

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