Semiconductor laser device and analysis device

DE602020048988T2Active Publication Date: 2025-04-09HORIBA LTD
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Patent Information

Application Number
DE602020048988
Authority / Receiving Office
DE · DE
Patent Type
Patents
Current Assignee / Owner
Priority Date
2019-03-08
Filing Date
2020-03-04
Publication Date
2025-04-09
Estimated Expiration
2040-03-04

AI Technical Summary

Technical Problem

Existing semiconductor laser devices face challenges in accurately controlling the temperature of the semiconductor laser element due to measurement errors caused by heat transfer from pin terminals through electrically conductive wires to the temperature detection part.

Method used

The semiconductor laser device incorporates a heat capacity increasing part that contacts the wire connecting the temperature detecting element and the output terminal, thereby increasing the heat capacity of the wire and reducing heat transfer to the temperature detecting element.

Benefits of technology

This configuration allows for accurate detection of the semiconductor laser element's temperature, enabling highly accurate control of the semiconductor laser element's temperature and reducing wavenumber variation, which is particularly beneficial for optical analysis applications like infrared spectroscopic analysis.

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