Curable composition and cured product thereof
Patent Information
- Application Number
- DE602020056721
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2020-12-01
- Publication Date
- 2025-08-13
- Estimated Expiration
- 2040-12-01
AI Technical Summary
Existing insulating materials face challenges in achieving low dielectric properties, high mechanical strength, and moldability, particularly in high-frequency applications, due to issues with heat resistance, film formability, adhesive strength, and processability.
A curable composition comprising an olefin-aromatic vinyl compound-aromatic polyene copolymer, combined with additive resins and optional monomers, is formulated to have specific molecular weight and monomer content ranges, ensuring excellent low dielectric properties and high mechanical strength in cured products.
The composition provides thermoplasticity and high mechanical strength at room and high temperatures, with improved adhesion to copper foils and reduced dielectric constants, suitable for high-frequency insulating materials.