THERMOELECTRIC DEVICE
Patent Information
- Application Number
- DE602020076845
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2019-12-24
- Filing Date
- 2020-12-16
- Publication Date
- 2026-09-16
- Estimated Expiration
- 2040-12-16
AI Technical Summary
Thermoelectric elements face challenges in maintaining high heat conduction, withstand voltage, and thermal stress relaxation performance, particularly when exposed to high temperatures, leading to potential electrode destruction and reduced reliability.
Incorporation of a thermoelectric element structure with a first and second buffer layer composed of silicone resin and inorganic materials, where the second buffer layer has a lower Young's modulus than the first, and a copper substrate is used for the second substrate, along with an aluminum oxide layer between the first substrate and the first buffer layer, to enhance thermal stress relaxation and withstand voltage performance.
The proposed structure improves heat conduction, withstand voltage, and thermal stress relaxation, ensuring high reliability and performance in both small and large-scale applications, including vehicles, ships, and industrial settings like steel mills and incinerators.