PCB SEPARATION MECHANISM

DE602021027992T2Active Publication Date: 2025-03-26ROCKWELL COLLINS INC
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Patent Information

Application Number
DE602021027992
Authority / Receiving Office
DE · DE
Patent Type
Patents
Current Assignee / Owner
Priority Date
2020-02-03
Filing Date
2021-02-03
Publication Date
2025-03-26
Estimated Expiration
2041-02-03

AI Technical Summary

Technical Problem

Avionics module assemblies require specific Circuit Card Assembly (CCA) designs with high-density connectors and cooling components, making it difficult to apply a controlled de-mating force when separating base cards and mezzanine cards, which can lead to stress on delicate connector interfaces.

Method used

A circuit board separation mechanism featuring a set screw and separation block positioned within a heatsink cut-out, allowing controlled separation of connectors by lifting against the circuit board, with optional actuation inhibitors to limit motion and prevent damage.

Benefits of technology

Enables controlled and stress-free separation of circuit boards, protecting connector interfaces by applying a lifting force through a single point, reducing the risk of damage during disassembly.

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