THERMAL HEAD AND THERMAL PRINTER
DE602021031190T2Active Publication Date: 2025-05-21KYOCERA CORP
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Patent Information
- Application Number
- DE602021031190
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2021-03-26
- Publication Date
- 2025-05-21
- Estimated Expiration
- 2041-03-26
AI Technical Summary
Technical Problem
Existing thermal heads face challenges in durability due to peeling or breakage of bonding materials and underfill materials, leading to reduced reliability and lifespan.
Method used
A thermal head design incorporating a bonding material with a protruding portion at the outer circumferential edge of the electrically conductive member, which increases the contact area with the underfill material, enhancing durability by reducing the likelihood of peeling and breakage.
Benefits of technology
The design improves the thermal head's durability by increasing the contact area between the bonding material and the underfill material, thereby reducing the risk of peeling and breakage, resulting in a more reliable and long-lasting thermal printing solution.
✦ Generated by Eureka AI based on patent content.
Abstract
A thermal head includes a substrate, an electrode, a bonding material, an electrically conductive member, and a sealing material. The electrode is located on the substrate. The bonding material is located on the substrate or the electrode. The electrically conductive member is located on the bonding material and is electrically connected to the electrode via the bonding material. The sealing material is located on the substrate and covers the bonding material and the electrically conductive member. The bonding material includes a protruding portion located at an outer circumferential edge of the electrically conductive member away from the substrate and the electrically conductive member.
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