METHOD FOR PRODUCING ACTIVE RECONSTRUCTED WAFERS

Abstract

Provided is a method of manufacturing an active reconstructed wafer including a plurality of chiplets. The method includes dicing a product wafer including chiplets to singulate the chiplets using plasma dicing on a glass carrier, selecting good dies for chiplets using laser release and a pick-up tool, bonding the selected good dies to a sacrificial wafer, filling gaps between chiplets thereby forming a first layer forming the active reconstructed wafer, thinning of the selected good dies, bonding the reconstructed wafer to a silicon wafer, removing the sacrificial wafer, connecting chiplets, stacking further dies in at least one further layer, and then forming interconnects for attachment.