ADJUSTABLE HEAT DISTRIBUTOR FOR A HEAT SINK
Patent Information
- Application Number
- DE602023005550
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2023-01-25
- Publication Date
- 2025-08-13
- Estimated Expiration
- 2043-01-25
AI Technical Summary
Existing heat sinks have unavoidable physical gaps with integrated circuits due to manufacturing tolerances, leading to suboptimal thermal efficiency, which can be improved by minimizing the thermal interface material layer thickness through adjustable positioning of a heat spreader.
A heat sink system with an adjustable heat spreader insert that allows for precise positioning relative to the circuit board, enabling a thin layer of thermal interface material and separation from the heat sink for easy access and adjustment, utilizing threaded or push-fit mechanisms for adjustment.
Achieves enhanced thermal efficiency by minimizing the thermal interface material layer thickness and allowing for easy maintenance and inspection of electronic components, while maintaining effective heat transfer.