Method for treating metal powder for sintering purposes

Description

[0001] Rudolf Kürth, currently of unknown whereabouts, represented by his guardian ad litem, Mrs. Gertrud Molkentin, née Kürth, Berlin. At the Production of metal objects by converting metal powders (metal grains) into a solid form using a sintering process, e.g. for grinding compounds, Abrasives, cutting, scrubbing, scraping and polishing tools, for the incandescent lamp and electrical industries and for many other modern applications Tasks, furthermore for the production of alloys from several components, it is important to consider the binders and fillers between the crystals, to distribute crystalloids, grains, and dust particles in such a fine manner that all cavities and irregularities are filled by the binders or fillers. ...and actually fill the space completely, ensuring full contact between the crystals and the binders. With increasing degree, When this requirement is met, the adhesive strength between the components of the powder metals increases. With moving tools, For rotating grinding wheels, the increased adhesion means the possibility of higher rotational speeds and increased performance.

[0002] The invention is characterized in that the metal powder is used for the purpose of fine distribution of the binders (fillers) around the crystals, Crystals, grains, dust particles, etc., are exposed to the force field of short-wave electric currents. Research has shown that the electrical shortwaves, especially at the two These blockages give rise to an energy build-up on the sides facing the wave direction and subsequently to a heat build-up. This results in a closer bond at the contact surfaces between the crystal and the binder, particularly with moist binders, such as... They are used in the mixing process. In addition, there is the inherent movement of the crystals, grains, etc., which is distorted in the electric field and be rotated so that its longitudinal axis is at a right angle to the electric line of force.

[0003] Since this movement occurs without changing the center of gravity and its position, a complete adhesion of the binder to the the grains, crystals, etc. are caused by a kind of twisting and screwing motion.

[0004] The process of fine dispersion and closer bonding between binder (coating mass) and crystals also occurs in Exertion of external pressures. During the relative movement between crystals, etc., and surrounding binders, changes can occur by switching on and off. Electrical energy is also transferred to cavities of small size and very small cross-section within the binding agents. so that the binding agent remains between the grains, crystals, etc., in the form of struts, bridges, and the like.

Claims

[0005] PATENT CLAIMS: i. Method for treating metal powder for sintering purposes, characterized in that the metal powder for the purpose of fine distribution of the binders (fillers) around the crystals, crystalloids, grains, dust particles, etc., the force field of short-wave electric currents is exposed.

2. Method according to claim i, characterized by fine dispersal of the binders under external pressure.