METHOD FOR OPERATING A HEAT DISTRIBUTOR MEASURING DEVICE AND HEAT DISTRIBUTOR MEASURING DEVICE

Abstract

The invention relates to a method for operating a heat cost allocator (1), wherein, as parameters of a first parameter group, a volume flow rate (m) and a supply temperature (Tv) of a heat transfer medium flowing through the radiator (3), as well as a surface temperature (To) of the radiator (3) at a predetermined relative height (h%) on the radiator (3) and a room temperature (TL) are determined, and from at least one parameter of this first parameter group, the following are derived as parameters of a second parameter group: a return temperature (TR) of the radiator (3), a logarithmic excess temperature (ΔT1n) of the radiator (3), a radiator exponent (n) of the radiator (3), a reference output (QR) of the radiator (3), and at least one consumption value (Q1, Q2) corresponding to a quantity of heat emitted by the radiator (3). The invention further relates to a heat cost allocator (1).

Description

[0001] The invention relates to a method for operating a heat cost allocation device and a heat cost allocation device.

[0002] From DE 10 2016 104 225 A1, a heat cost allocator and a method for measuring the amount of heat emitted by a radiator are known. The measurement of the amount of heat emitted by a radiator is based on a measured flow temperature and a measured radiator temperature of the heat transfer medium at the radiator. The valve stroke of a radiator control valve is determined, and the amount of heat emitted is calculated from the values ​​of valve stroke position, flow temperature, and radiator temperature using an optionally preset operating characteristic of the radiator control valve and a differential pressure of the heat transfer medium across the radiator control valve known at the operating point. The optionally preset operating characteristic establishes the relationship between the stroke position and the volume flow rate at the known differential pressure.

[0003] The invention is based on the objective of providing a method for operating a heat cost allocation device that is improved compared to the prior art, and a heat cost allocation device that is improved compared to the prior art.

[0004] The problem is solved according to the invention by a method for operating a heat cost allocator with the features of claim 1 and a heat cost allocator with the features of claim 8.

[0005] Advantageous embodiments of the invention are the subject of the dependent claims.

[0006] In a method according to the invention for operating a heat cost allocator, a volume flow rate m and a supply temperature Tv of a heat transfer medium flowing through the radiator, as well as a surface temperature To of the radiator at a predetermined relative height h% on the radiator and a room temperature TL, i.e., a room air temperature of the room in which the radiator is located, are determined. These parameters form a first parameter group, i.e., they are a component thereof.

[0007] The volume flow rate m is determined, for example, by means of a volume flow sensor of the heat cost allocator, in particular by measurement. Alternatively, the heat cost allocator, in particular a supply assembly of the heat cost allocator, can have, for example, a radiator valve with a constant volume flow rate m, which is, in particular, adjustable. This constant volume flow rate m is then known, for example, due to a preset constant volume flow rate m when the radiator valve is installed on the radiator. For the method described here, this known constant volume flow rate m is then used, whereby the constant volume flow rate m, i.e., its current state, is then further determined, for example, based on the supply temperature or on an opening sensor on the radiator valve.

[0008] The flow temperature Tv of the heat transfer medium flowing through the radiator is determined, in particular measured, by means of a flow temperature sensor of the heat cost allocator.

[0009] The surface temperature To of the radiator at the specified relative height h% on the radiator is determined, in particular measured, by means of a radiator surface temperature sensor of the heat cost allocation device.

[0010] The room temperature TL, i.e. the room air temperature of the room in which the radiator is located, is determined, in particular measured, by means of a room temperature sensor of the heat cost allocator.

[0011] From at least one parameter of the above-mentioned parameters, i.e., from at least one of the parameters of the first parameter group mentioned above, or from several or all parameters of the first parameter group mentioned above, A return temperature TR of the radiator, a logarithmic excess temperature ΔT ln of the radiator, a radiator exponent n of the radiator, a reference output QR of the radiator, and at least one consumption value Q1, Q2 corresponding to a quantity of heat emitted by the radiator are derived. These parameters, each derived from at least one of the parameters of the first parameter group, form a second parameter group.

[0012] Thus, the parameters of the first parameter group are each determined, in particular measured, whereby for the parameter volume flow m, as described above, it may be provided, for example, that this parameter is also measured, in particular by means of the volume flow sensor, or that, in particular when using the radiator valve with, in particular adjustable, constant volume flow m, this then known constant volume flow m is used, whereby the constant volume flow m, i.e. its current presence, is then determined.

[0013] The parameters of the second parameter group are, as described, each derived from at least one of the parameters of the first parameter group. They are each calculated, in particular, using at least one parameter from the first parameter group.

[0014] The specified relative height h% refers to a relative height value on the respective radiator, depending on and in relation to its overall height. Specifically, the specified relative height h% on the radiator is a height position at which the surface temperature To can be measured as a good approximation of the radiator's average surface temperature. Therefore, conventional heat cost allocators, particularly those conforming to EN 834:2013 + AC:2015 (D), are mounted at this specified relative height h% on the radiator. The specified relative height h% on the respective radiator is determined by the heat cost allocator manufacturer's installation instructions. For example, the specified relative height might be 50% or 75% of the radiator's overall height.

[0015] A heat cost allocator according to the invention, operable or operated by means of this method, comprises a flow assembly that can be arranged or is arranged on a flow pipe of a radiator, with a flow temperature sensor and, in particular, with a communication device; a radiator surface assembly that can be arranged or is arranged on the radiator at a predetermined relative height h%, with a radiator surface temperature sensor and, in particular, with a communication device; as well as at least one room temperature sensor and at least one processing unit. The flow assembly further comprises, for example, a volume flow sensor and / or a radiator valve with, in particular, an adjustable, constant volume flow m. The volume flow sensor is, in particular, designed and configured for determining, in particular measuring, the volume flow m.

[0016] The flow temperature sensor is specifically designed and configured for determining, in particular measuring, the flow temperature Tv.

[0017] The radiator surface temperature sensor is specifically designed and configured to determine, in particular measure, the surface temperature (To) of the radiator (3) at the specified relative height (h%) on the radiator (3).

[0018] The room temperature sensor is specifically designed and configured for determining, in particular measuring, the room temperature TL.

[0019] The at least one arithmetic unit is specifically designed and configured to determine, and in particular calculate, at least one parameter of the second parameter group using at least one parameter, or several or all parameters of the first parameter group, and in particular to determine, and in particular calculate, several or all parameters of the second parameter group, each using at least one parameter, or several or all parameters of the first parameter group. For this purpose, the at least one parameter, or the several or all parameters of the first parameter group, are transferred to the arithmetic unit and processed by it in order to determine, and in particular calculate, the at least one parameter, or several or all parameters of the second parameter group.

[0020] If multiple arithmetic units are present, the necessary calculations are distributed across them. With multiple arithmetic units, it is specifically intended that they are configured and designed to determine all parameters of the second parameter group using at least one parameter from the first parameter group. It is specifically intended that each parameter of the second parameter group is determined using only one of the multiple arithmetic units. Alternatively, it may be possible, for example, to determine at least one, several, or all parameters of the second parameter group using several or all arithmetic units, perhaps for redundancy reasons.

[0021] The communication device of the pre-assembly unit is specifically designed and equipped for communication with the radiator surface assembly and / or a third assembly and / or a fourth assembly.

[0022] The communication device of the radiator surface assembly is specifically designed and configured for communication with the flow assembly and / or the third assembly and / or the fourth assembly. The at least one room temperature sensor and the at least one computing unit are advantageously arranged in the flow assembly, the radiator surface assembly, or, if present in the heat cost allocator, in a third assembly described in more detail below. The at least one computing unit can, for example, also be arranged in a fourth assembly, if present in the heat cost allocator, described in more detail below. However, at least one room temperature sensor and at least one computing unit must be present and arranged in one of these assemblies of the heat cost allocator.

[0023] The heat cost allocator may also include one or more additional room temperature sensors and / or one or more additional calculating units. The at least one additional room temperature sensor is then, for example, located in the flow pipe assembly, the radiator surface assembly, or in the third assembly, if present in the heat cost allocator. The at least one additional calculating unit is then, for example, located in the flow pipe assembly, the radiator surface assembly, the third assembly, if present in the heat cost allocator, or the fourth assembly, if present in the heat cost allocator.

[0024] Advantageously, each of the aforementioned assemblies contains a maximum of one room temperature sensor and / or a maximum of one processing unit. It can be advantageous, for example, to place the room temperature sensor alone or additionally in the third assembly, which is located in the room with the radiator but thermally decoupled from it. Placing it only in the third assembly has the advantage that the room temperature measurement there cannot be distorted by the heat emitted by the radiator. Alternatively, the room temperature sensor in the third assembly can be used, for example, in addition to a room temperature sensor in the flow assembly and / or in the radiator surface assembly. Using such an additional room temperature sensor in the third assembly, the plausibility of the measurement results from the room temperature sensors in the flow assembly and / or in the radiator surface assembly can then be checked.Thus, the supply assembly, the radiator surface assembly, and the third assembly (if present in the heat cost allocator) optionally include a room temperature sensor, whereby at least one of these assemblies of the heat cost allocator must include a room temperature sensor. Furthermore, the supply assembly, the radiator surface assembly, the third assembly (if present in the heat cost allocator), and the fourth assembly (if present in the heat cost allocator) optionally include a calculating unit, whereby at least one of these assemblies must include a calculating unit. All existing assemblies of the heat cost allocator can therefore optionally include a calculating unit.For example, all existing assemblies, especially the third and / or fourth assembly if present, have a calculation unit to avoid more complex calculations in the feeder assembly and / or in the radiator surface assembly.

[0025] The heat cost allocator also includes at least one electrical power supply. For example, several or all modules may each have their own electrical power supply. It is also possible for several or all modules to share a common electrical power supply. The electrical power supply, or the respective electrical power supply of the individual modules or modules, may include, for example, a battery, which may also be a rechargeable accumulator, and / or a mains connection to an electrical power supply network.

[0026] The option described above of using room temperature sensors in multiple modules of the heat cost allocator allows, for example, improved redundancy through these multiple room temperature sensors and the possibility of verifying the plausibility of the measured values. The option described above of using processing units in several or all modules of the heat cost allocator also offers the advantage of redundancy and additionally allows calculations to be distributed across different processing units. If one of the processing units involved is located in a module with mains power, then, for example, shifting the processing power to this module can relieve the energy budgets of the other modules, such as those powered by batteries.

[0027] The components of the flow assembly are advantageously arranged, or can be arranged, on and / or in the flow pipe. The radiator's flow pipe is a line for the heat transfer medium, leading exclusively to that radiator. The components of the flow assembly are advantageously arranged directly on and / or in the flow pipe at the radiator. Accordingly, the flow temperature Tv is also measured at this position, advantageously directly at the radiator, in the flow pipe. The determined, and in particular calculated, return temperature TR corresponds to a temperature that could be measured, advantageously directly at the radiator, on and / or in a return pipe of the radiator. However, in the solution described here, this return temperature TR is not measured, but calculated. Therefore, no components of the heat cost allocator are required on the radiator's return pipe.

[0028] The flow pipe of the radiator is a pipe for the heat transfer medium, which leads exclusively to this radiator, and the return pipe of the radiator is a pipe for the heat transfer medium, which leads exclusively away from this radiator.

[0029] The flow temperature Tv of the heat transfer medium flowing through the radiator is determined, specifically measured, by means of the flow temperature sensor. The surface temperature To of the radiator at the specified relative height h% on the radiator is determined, specifically measured, by means of the radiator surface temperature sensor. If present, the volume flow rate m of the heat transfer medium flowing through the radiator is determined by means of the volume flow sensor. The volume flow rate sensor is only necessary if a radiator valve with a constant volume flow rate m is not used in the heat cost allocator. Otherwise, i.e., if such a radiator valve with a constant volume flow rate m is used in the heat cost allocator, this known constant volume flow rate m is used for the procedure.The room temperature sensor determines, and in particular measures, the room temperature TL of the room in a building where the radiator is located, specifically the room air temperature of that room. The communication devices serve primarily to transmit sensor values ​​determined by the respective sensor to the processing unit. The processing unit uses these determined, and in particular measured, sensor values ​​to calculate the other parameters mentioned above.

[0030] In one possible embodiment of the heat cost allocator, the supply assembly is designed as a radiator valve with a thermostatic head, either with a constant flow rate m or for proportional operation, in which there is a direct proportionality between the valve stroke of the radiator valve and the flow rate m through the radiator valve. Alternatively, the supply assembly may include such a radiator valve with a thermostatic head. In this case, the flow rate m is known or can be determined in a particularly simple manner by measuring the respective valve stroke. Even when using the radiator valve with a constant flow rate m, it is advantageous to determine the flow rate m for the method, as described above.

[0031] The radiator surface assembly is designed, for example, as a compact heat cost allocator for surface mounting on the radiator, particularly a conventional one.

[0032] In one possible embodiment, the heat cost allocator comprises the third assembly, already mentioned above, which is spaced apart from the radiator. This third assembly includes, in particular, a further communication device, which is specifically designed and configured for communication with the flow assembly and / or the radiator surface assembly and / or the fourth assembly. The third assembly can be arranged, or is arranged, in the same room of the building as the radiator, i.e., it is intended for arrangement in the same room as the radiator. The at least one room temperature sensor, or a further room temperature sensor, which is designed and configured for determining, in particular measuring, the room temperature, can be arranged in this third assembly.The at least one arithmetic unit, or at least one further arithmetic unit, which is designed and configured to determine, in particular calculate, at least one parameter of the second parameter group using at least one parameter or several or all parameters of the first parameter group, and in particular to determine, in particular calculate, several or all parameters of the second parameter group using at least one parameter or several or all parameters of the first parameter group, can be arranged in this third assembly. The at least one parameter or the several or all parameters of the first parameter group are then transferred to the at least one arithmetic unit and / or to the at least one further arithmetic unit and processed with it in order to determine, in particular calculate, the at least one parameter or several or all parameters of the second parameter group.

[0033] In one possible embodiment, the heat cost allocation device comprises the fourth assembly, already mentioned above, which is spaced apart from the radiator, in particular with a further communication device, which is in particular designed and equipped for communication with the flow assembly and / or the radiator surface assembly and / or the third assembly, wherein the fourth assembly can be arranged or is arranged outside the room in which the radiator is arranged.The at least one arithmetic unit, or at least one further arithmetic unit, which is designed and configured to determine, in particular calculate, at least one parameter of the second parameter group using at least one parameter or several or all parameters of the first parameter group, and in particular to determine, in particular calculate, several or all parameters of the second parameter group using at least one parameter or several or all parameters of the first parameter group, can be arranged in this fourth assembly. The at least one parameter or the several or all parameters of the first parameter group are then transferred to the at least one arithmetic unit and / or to the at least one further arithmetic unit and processed with it in order to determine, in particular calculate, the at least one parameter or several or all parameters of the second parameter group.

[0034] In one possible embodiment of the heat cost allocation device, the at least one room temperature sensor or at least one further room temperature sensor, which is designed and configured to determine, in particular measure, the room temperature TL, is arranged in the flow assembly, in the radiator surface assembly or in the third assembly.

[0035] In one possible embodiment of the heat cost allocator, the computing unit, or at least one further computing unit, is designed and configured to determine, and in particular calculate, at least one parameter of the second parameter group using at least one parameter, or several or all parameters, of the first parameter group. Specifically, the at least one computing unit is configured to determine, and in particular calculate, several or all parameters of the second parameter group using at least one parameter, or several or all parameters, of the first parameter group. The at least one parameter, or the several or all parameters of the first parameter group, are then transferred to the at least one computing unit and / or to the at least one further computing unit and processed by it in order to determine, and in particular calculate, the at least one parameter, or several or all parameters, of the second parameter group.If multiple processing units are present, the necessary calculations are distributed across the individual units, for example, to save energy in the flow assembly and / or in the radiator surface assembly. The result of the calculation of the radiator's reference output is, for example, only needed in the processing unit that also calculates the weighted consumption value; therefore, it is advantageous to calculate the reference output only in this unit.

[0036] The at least one processing unit can be arranged in the inlet assembly, the radiator surface assembly, the third assembly, or the fourth assembly. Another embodiment provides that several of the assemblies, or each assembly, in particular the inlet assembly, the radiator surface assembly, the third assembly, and / or the fourth assembly, each comprise an associated processing unit. In this further embodiment, the multiple processing units communicate with each other, for example, wirelessly (e.g., via radio or Bluetooth) or via a wired connection.

[0037] As already mentioned, each component of the heat cost allocator should ideally include a power supply. This can preferably be a battery and / or an energy harvesting device. In principle, it is also conceivable to equip one, several, or all components with a mains power supply. The energy harvesting device can, for example, also be designed to power several or all components together.

[0038] Heat cost allocators, and in particular the heat cost allocator described here, are measuring devices for measuring the amount of heat emitted by a radiator. There are two basic operating principles.

[0039] One operating principle is based on measurements of the flow temperature Tv and the return temperatures TR, as well as the volume flow rate m of the heat transfer medium flowing through the radiator, and integration over time t. Measuring the volume flow rate m is only necessary if a radiator valve with a constant volume flow rate m is not used. If such a radiator valve with a constant volume flow rate m is used, then the known constant volume flow rate m is used for the method, as already mentioned above. The heat quantity, or the consumption value Q1 corresponding to the heat quantity emitted by the radiator, is then: Q 1 = c ∫ m T V − T R dt

[0040] Here, c is the specific heat capacity of the heat transfer medium. This approach is the principle behind a heat meter. These meters can measure the amount of heat consumed very accurately. However, they are relatively expensive and their installation is comparatively complex.

[0041] Another operating principle is based on determining the excess temperature, i.e., the temperature difference between surface temperature To and room temperature TL. For this purpose, the heat cost allocator is mounted on the radiator at a predetermined relative height h%, where the surface temperature To can be measured as a good approximation of the radiator's average surface temperature. The surface temperature To is thus measured directly. The temperature difference between surface temperature To and the measured room temperature TL, i.e., the excess temperature of the radiator, is raised to the power of the radiator exponent n and integrated over time t. The heat quantity, or the consumption value Q2 corresponding to the heat quantity emitted by the radiator, is then: Q 2 = K ∫ T O − T L n dt

[0042] In formula (2), K is a correction factor composed of a scaling factor and at least the correction values ​​Kc-value and KQ-value. The Kc-value serves to correct for different thermal couplings of the temperature sensors of the heat cost allocator, in particular the radiator surface temperature sensor and the room temperature sensor. The KQ-value scales for different nominal outputs of radiators.

[0043] Compact devices of the second operating principle, designed for mounting on the radiator surface, are colloquially known as heat cost allocators or compact heat cost allocators. These devices are relatively inexpensive, easy to install, and therefore widely used.

[0044] A disadvantage of these devices is that correct operation requires identification of the respective radiator in order to assign its reference output (QR) and thermal coupling factors, particularly c-values. This reference output (QR) is determined in a laboratory measurement during a radiator type test. The thermal coupling factors are measured in laboratory tests of both the radiator and the heat cost allocator and stored in heat cost allocator manufacturer databases. With over 40,000 different radiators, correctly identifying each one and thus accurately assigning the reference output (QR) and thermal coupling factors is by no means trivial and can ultimately lead to very large measurement errors.

[0045] Another disadvantage of this principle is that it only provides accurate results for large heat transfer fluid flows, i.e., only for large volume flows (m). However, due to cost optimization and the excellent insulation of modern houses, modern heating systems operate at small heat transfer fluid flows, i.e., small volume flows (m).

[0046] These heat cost allocators are tested and approved for heat cost allocation according to EN 834:2013 + AC:2015 (D). It is doubtful whether there is currently a single heat cost allocator that can literally fulfill requirement 8.1 of this EN 834:2013 + AC:2015 (D). "The assessment using KQ must be based on the actually installed radiator."

[0047] The rating factor KQ, i.e., the KQ value derived from the reference output of the installed radiator, is currently determined based on a type test of an individual radiator in the laboratory. The rating factor KQ typically corresponds to the ratio of the standard heat output of the radiator being evaluated to the standard heat output of a base radiator (e.g., 1000 watts). Thus, the reading on a radiator with a standard heat output of 1000 watts is rated with a KQ factor of 1.0. A standard heat output of 1386 watts results in a KQ of 1.39. Therefore, unavoidable individual variations, particularly in radiators produced over decades, sometimes in different factories, cannot be taken into account. Aging and installation effects are also disregarded.

[0048] The solution according to the invention overcomes these disadvantages and also enables the approval of this heat cost allocator according to EN 834:2013 + AC:2015 (D), since advantageously at least one consumption value Q2 corresponding to the amount of heat emitted by the radiator is determined on the basis of the radiator's excess temperature, i.e., the temperature difference between surface temperature To and room temperature TL, as well as the radiator exponent n and the radiator's reference output QR. Thus, the heat cost allocator determines and uses at least one temperature relevant to the heat emission of the radiator, the radiator exponent n, and the actual reference output QR of the radiator to calculate the consumption value Q2, as required by EN 834:2013 + AC:2015 (D), so that the approval requirements of EN 834:2013 + AC:2015 (D) are met.The solution according to the invention enables, in particular, the determination of consumption values ​​Q1, Q2 corresponding to the amount of heat emitted by the radiator, according to the known operating principles described above, based on volume flow measurement or with knowledge of the magnitude of the set, constant volume flow m, especially according to formula (1), and also based on the measurement of the surface temperature To of the radiator at the predetermined relative height h% on the radiator, especially according to formula (2). As mentioned, the heat cost allocator according to the invention is thus eligible for approval according to EN 834:2013 + AC:2015 (D). The solution according to the invention, in particular the method described here, makes it possible, in particular, to operate the heat cost allocator described here, in such a way that the requirements of EN 834:2013 + AC:2015 (D) are met.

[0049] As described above, the heat cost allocation device is advantageously designed as a heat cost allocation system with at least two independent modules that can advantageously communicate with each other. The supply module determines, by means of its flow rate sensor, for example via a respective valve position if it is designed as a radiator valve with a thermostatic head as described above, in particular based on a known valve characteristic curve of this radiator valve, a flow rate, i.e., the volume flow m of the heat transfer medium, and the supply temperature Tv, as well as optionally the room temperature TL if this is not measured by the radiator surface module or by the third module, and transmits these measured values ​​to at least one other module which contains the processing unit if the supply module does not itself contain the processing unit.If the supply assembly includes a radiator valve with a constant flow rate m, for example, the radiator valve with a constant flow rate m and thermostatic head described above, measuring the flow rate m is not necessary; instead, the known constant flow rate m is used. However, it is then necessary to determine whether this flow rate m is present, for example, based on the measured supply temperature or by means of an opening sensor on the radiator valve. The known constant flow rate is present, for example, only if the opening sensor detects that the radiator valve is open, and / or if the supply temperature sensor detects that the supply temperature has reached or exceeded a predetermined minimum value or has increased.The radiator surface assembly, for example designed as a compact heat cost allocator, measures the surface temperature To of the radiator at the specified relative height h% on the radiator and optionally the room temperature TL, and also transmits this data to the assembly containing the processing unit if the processing unit is not located in the radiator surface assembly. The processing unit determines, in particular calculates, the return temperature TR, the logarithmic excess temperature ΔT ln of the radiator, the radiator exponent n, the reference output QR of the radiator, and at least one consumption value Q1, Q2 corresponding to the amount of heat emitted by the radiator, i.e., in particular, one or more consumption values ​​Q1, Q2 based on the flow information according to formula (1) above and / or based on the excess temperature of the radiator.the temperature difference between surface temperature To of the radiator and room temperature TL , according to the above formula (2).

[0050] In one possible embodiment of the method, at least two operating points are determined with, at least substantially, constant volume flow rate m, constant supply temperature Tv, constant surface temperature and constant room temperature TL.

[0051] In one possible embodiment of the method, the return temperature TR of the radiator is determined for each of the operating points from the flow temperature Tv and the surface temperature To of the radiator at the specified relative height h% on the radiator.

[0052] In one possible embodiment of the method, an instantaneous power Q A1 , Q A2 of the radiator is determined for each of the operating points from the supply temperature Tv, the return temperature TR and the volume flow m.

[0053] In one possible embodiment of the method, the logarithmic excess temperature ΔT ln,A1 , ΔT ln,A2 of the radiator is determined for each of the operating points from the flow temperature Tv, the return temperature TR and the room temperature TL.

[0054] In one possible embodiment of the method, the radiator exponent n is determined from the logarithmic temperature differences ΔT ln,A1 , ΔT ln,A2 and instantaneous powers Q A1 , Q A2 of the two operating points.

[0055] In one possible embodiment of the method, the reference power QR of the radiator is determined from the logarithmic excess temperature ΔT ln,A1 , ΔT ln,A2 and the instantaneous power Q A1 , Q A2 of at least one of the operating points and the radiator exponent n.

[0056] In one possible embodiment of the method, the KQ value is determined from the reference power QR of the radiator.

[0057] Since the relationships between the temperatures at the radiator—i.e., between the flow temperature Tv, the return temperature TR, and the surface temperature To of the radiator at the given relative height h%—are not constant, but can generally change, even out of phase, due to changes in the flow rate and the heat capacity of the radiator, the detection of the point in time of a defined operating state at the radiator is necessary for all calculations described below. (It should be noted that even when using a radiator valve with a constant flow rate m, a change in flow rate occurs when the radiator valve opens and closes.) A suitable point in time for this, referred to below as the operating point mentioned above, is, for example, the reaching of a relative maximum of the measured surface temperature To at the given relative height h%.To reliably detect all measured values ​​at this point in time, the assemblies advantageously reduce their measurement intervals, for example, from four minutes in normal operation to four seconds for measuring the volume flow rate m if no radiator valve with a constant volume flow rate m is used, as well as for measuring the supply temperature Tv, the surface temperature To of the radiator at the specified relative height h% on the radiator, and the room temperature TL. From the measured values, the aforementioned values—return temperature TR, logarithmic excess temperature ΔT ln of the radiator, radiator exponent n, and reference output QR of the radiator—are determined.This determination can be carried out, for example, once after the installation of the heat cost allocator, or several times, for example, regularly, such as annually or at other intervals, in order to also capture changes in these parameters that are caused, for example, by aging effects. If the volume flow rate m is not measured because the radiator valve is used with a constant volume flow rate m, then the known value of the constant volume flow rate m is used instead of the measured value for the volume flow rate m.

[0058] For a stable operating point, constant flow rate m, and constant values ​​of the flow temperature Tv, the surface temperature To at the relative height h%, and the room temperature TL, a linear profile of the radiator's surface temperature To can be assumed. A stable operating point exists, in particular, when the flow temperature Tv, the surface temperature To of the radiator at the specified relative height h%, and the room temperature TL do not change for a given period. Specifically, an operating point can be assigned to each new room temperature TL.

[0059] Since the flow temperature Tv is generally fixed by the heating system and the room temperature TL changes only slowly due to the room's high heat capacity, the surface temperature To of the radiator will also stabilize after the valve opens and the flow rate stabilizes, following a time determined by the radiator's heat capacity. This surface temperature can then be considered constant at the specified relative height h% on the radiator over a given period. At operating points with different room temperatures TL, even with the same flow temperature Tv, different surface temperatures To of the radiator will occur at the specified relative height h% on the radiator, or at least different relative maxima of the surface temperature To of the radiator at the specified relative height h% on the radiator, relative to the flow temperature Tv.For example, the flow temperature Tv is always the same, but at different room temperatures TL, the resulting different heat output of the radiator to the room, especially to the room air, leads to different surface temperatures To of the radiator at the given relative height h% on the radiator. With the linear progression of the surface temperature To of the radiator at the given relative height h% on the radiator mentioned above, the following applies: . T O − T R = h % T V − T R

[0060] The computing unit of the distributed heat cost allocation system, i.e., the heat cost allocation device, which is advantageously arranged in one of the assemblies, calculates the return temperature TR of the radiator for this defined time, i.e., for this operating point, from the flow temperature Tv and surface temperature To of the radiator at the specified relative height h% on the radiator: T R = T O − h % ∗ T V 1 − h %

[0061] Using the flow information for this operating point, i.e. the volume flow m, of the supply assembly, an instantaneous power Q of the radiator is calculated according to the following formula (5). Q = c m T V − T R

[0062] As described, this is carried out for at least two operating points, so that the instantaneous powers Q A1 , Q A2 for the two operating points are determined according to formula (5).

[0063] The distributed heat cost allocation system, i.e. the heat cost allocation device, stores the value of the instantaneous power Q A1 , Q A2 of the respective operating point together with the operating point data volume flow m, supply temperature Tv, return temperature TR and room temperature TL of the respective operating point.

[0064] Using the known relationship for the logarithmic temperature difference ΔT ln : ΔT ln = T V − T R ln T V − T L T R − T L The logarithmic excess temperature ΔT ln,A1 , ΔT ln,A2 is now calculated for each of the operating points. If data from at least two different operating points are available, the distributed heat cost allocation system, i.e., the heat cost allocation device, can calculate the radiator exponent n from this: n = ln ΔT ln , A 1 ΔT ln , A 2 Q A 1 Q A 2

[0065] Using the well-known radiator equation Q R = Q ΔT ln , R ΔT ln n The reference output QR of the radiator can now be calculated. This calculation is performed, for example, using the logarithmic excess temperature ΔT ln,A1, ΔT ln,A2 and the instantaneous output Q A1, Q A2 of one of the operating points, or, for verification purposes, separately using the logarithmic excess temperature ΔT ln,A1, ΔT ln,A2 of several or all recorded operating points. The logarithmic excess temperature ΔT ln,A1, ΔT ln,A2 of the respective operating point is then used for ΔT ln, and the instantaneous output Q A1, Q A2 of the respective operating point is used for Q in formula (8). The logarithmic reference excess temperature ΔT ln,R is a predetermined and therefore known value for the heat cost allocator.

[0066] The reference output QR of the radiator determined in this way will generally not correspond to the radiator's nominal output determined in the laboratory, because it will have been determined at different operating points and under real installation conditions on an individual radiator. It is therefore advantageously more accurate for the respective specific radiator than a radiator's nominal output determined in the laboratory on another radiator of the same type.

[0067] Using this determined reference output QR of the radiator, the KQ value can then be calculated as a dimensionless numerical value for the reference output QR of the radiator. This KQ value and its calculation are specific to the respective heat cost allocator, in particular according to a predefined base output of the heat cost allocator. The KQ value is, in particular, the quotient of the determined reference output QR of the radiator to the predefined base output.

[0068] In one possible embodiment of the method, the c-values ​​of the flow temperature sensor, the radiator surface temperature sensor, and the at least one room temperature sensor, or the multiple room temperature sensors (if the heat cost allocator includes several room temperature sensors), are determined and taken into account. That is, these c-values, which represent correction factors of the temperature sensors, are considered. These c-values ​​can be determined, for example, conventionally by radiator detection or alternatively with the aid of a c-value measuring device. For this purpose, the heat cost allocator has, for example, a calibration mode with increased measurement frequency of all sensors, which can be started by a user, i.e., an operator. In one possible embodiment of the method, a Kc-value is therefore determined directly at the radiator using the c-values.

[0069] Advantageously, the correction factor K is determined from the determined KQ value and the determined Kc value.

[0070] In one possible embodiment of the method, a consumption value Q1, Q2 corresponding to the amount of heat emitted by the radiator is determined using the specific heat capacity c of the heat transfer medium flowing through the radiator, the volume flow rate m, the supply temperature Tv and the return temperature TR, in particular according to formula (1), and / or using the correction factor K determined from the KQ value and the Kc value, the surface temperature To of the radiator at the specified relative height h% on the radiator, the room temperature TL and the radiator exponent n, in particular according to formula (2).This determination of at least one consumption value Q1, Q2 corresponding to the amount of heat emitted by the radiator, in particular according to formula (1) and / or (2), is expediently carried out not only on the basis of the operating points mentioned above, but in a manner customary and / or prescribed for heat cost allocators, for example continuously, in particular constantly, i.e. continuously, or for example regularly, in particular at specified times and / or in specified periods, and / or in a specified event-controlled manner.

[0071] For example, the flow control module transmits its measurement results to the radiator surface control module via its communication device only at predefined times, for example, only when the thermostatic valve is fully open. The radiator surface control module monitors the surface temperature To of the radiator at the predefined relative height h% on the radiator. For example, if the rise in the surface temperature To of the radiator at the predefined relative height h% on the radiator is registered above a predefined, especially adjustable, threshold value, this radiator surface control module can also initiate communication between the modules.

[0072] Communication between the modules is wireless, for example bidirectional, event-driven, and especially uses such low transmission power that communication is just barely possible, e.g., only over a few meters. This protects the communication link from external interference, saves energy, and reduces high-frequency radiation in the environment. For example, the transmission power for communication between modules in the same room is 0 dBm or less, i.e., a maximum of 0 dBm, and / or for communication between modules in different rooms, different apartments, and / or different buildings, it is 10 dBm or more, i.e., at least 10 dBm.

[0073] For example, during installation, the modules send installation telegrams that serve to exchange device identifications between all related modules of the heat cost allocator. Once the group has been established, the transmission power of each individual transmission path, e.g., between the supply module and the radiator surface module, is reduced to the minimum necessary for communication, thus saving energy. To achieve this, the modules measure the input levels of the received signals and communicate these to the transmitting modules. These then calculate how much the transmission power can be reduced to just achieve the minimum required input level of, for example, -90 dBm.

[0074] Communication between the modules is event-driven, for example, to save energy. This means that telegrams are generally not constantly exchanged between the modules. Events that trigger transmissions can be occurrences (e.g., a valve opening) or specific times (e.g., the change of month). This means that, for example, in summer when the heating is not in use, a status signal is only sent at defined times. If, for example, the flow control module registers the opening of the radiator valve, this information is communicated to the radiator surface module.

[0075] Advantageously, each component of the heat cost allocator is configured to detect a failure of another component of the heat cost allocator and to send an error message, for example with increased transmission power, to one or more higher-level system devices via its communication device. This is carried out accordingly in the procedure.

[0076] In principle, it is also possible to connect closely spaced assemblies with a cable. In such a case, it may be advantageous to equip these connected assemblies with only one power supply, e.g., a battery.

[0077] Advantageously, in the event of a failure of the flow assembly, the heat cost allocator is configured to continue determining the consumption value Q2 corresponding to the amount of heat emitted by the radiator according to formula (2) using the radiator surface assembly. The procedure is then carried out accordingly. For this purpose, it is advantageously provided that the room temperature sensor, or at least one of the several room temperature sensors, is arranged in the radiator surface assembly, or in the third assembly if one is present.

[0078] The heat cost allocator is advantageously backward compatible with compact heat cost allocators based on the surface temperature measurement principle described above. In particular, if the KQ value is determined identically to these compact heat cost allocators, the heat cost allocator can thus be integrated into a heat cost allocator system that incorporates such compact heat cost allocators.

[0079] The heat cost allocator is advantageously designed to apply, in particular by means of the so-called chameleon principle, a start and counting behavior of any compact heat cost allocator as described and in particular claimed in EP 1 592 948 B1 of the applicant.

[0080] Another advantageous feature of the heat cost allocator is its ability to reliably detect measurement errors caused by external heating of the radiator, for example, by direct sunlight. This is achieved by checking, for instance, whether an elevated surface temperature (To) of the radiator at a specified relative height (h%) and a flow rate (m) of the heat transfer medium are present simultaneously, or by determining and comparing the room temperature (TL) in the various modules if room temperature sensors are installed in multiple modules. External heating or manipulation can then be ruled out if the modules have determined the same room temperature (TL) value, for example, taking into account a specified tolerance.Exclusive external heating is also not present if there is an increased surface temperature To of the radiator at the specified relative height h% on the radiator and a volume flow rate m is not equal to 0.

[0081] The processing unit and the room temperature sensor(s) can be located, for example, in the supply module and / or, if necessary redundantly, in the radiator surface module of the heat cost allocator, together with the respective communication device. Alternatively, it is also possible, for example, for the room temperature sensor and / or the processing unit to be located in a third module in the room containing the radiator. In this case, this third module also includes a communication device to exchange the measured values ​​with the other modules or at least to receive the measured values ​​from the other modules. Such a third module has the advantage that the room temperature measurement can be carried out completely independently of the heating system; that is, the room temperature (TL) is not measured directly at the radiator, i.e., in its immediate vicinity, but at a greater distance from the radiator in the same room.

[0082] The processing unit of the heat cost allocator can be located in any module of the heat cost allocator, or redundantly in several or all modules, or, alternatively or redundantly, outside the modules containing the sensors, in the fourth module. This fourth module is, for example, an external module. It can also be, for example, an application on a cloud server that calculates the consumption values ​​Q1 and Q2 from the measurement data of the individual sensors in the manner described above and then advantageously makes them available for further use. Advantageously, this fourth module also has a communication device for communicating with the other modules, in particular to receive the sensor measurements and to perform the calculations described above using its processing unit.It is specifically intended that sensor values ​​from the sensors of the modules are transmitted via their communication devices to the module with the computing unit, in order to be processed in the computing unit in the manner described above.

[0083] In another possible embodiment, at least two or more or all components of the heat cost allocator, in particular at least the flow assembly and the radiator surface assembly, are interconnected by data transmission lines. For example, in this case, the radiator surface assembly may only include the radiator surface temperature sensor, i.e., no communication device of its own. This radiator surface temperature sensor is then, for example, designed as a conventional remote sensor that is connected by cable to at least one of the other components.

[0084] If at least two modules are connected by a cable, this cable can also be used for power distribution. In this case, both modules can be powered from a single power supply, e.g., a battery.

[0085] Communication between the modules can therefore be wireless or wired, with the communication devices being designed accordingly. A combination of wired and wireless communication between two or more modules of the heat cost allocator is also possible, with the communication devices being designed accordingly in each case. For example, communication between the flow module and the radiator surface module is wired, while communication between the third and / or fourth module, if present, and the other modules is wireless.

[0086] Exemplary embodiments of the invention are explained in more detail below with reference to the drawings. These show: Figure 1 schematically shows an embodiment of a heat cost allocation device, Figure 2 schematically shows another embodiment of a heat cost allocation device, Figure 3 schematically shows another embodiment of a heat cost allocation device. Corresponding parts are marked with the same reference symbols in all figures.

[0087] Figure 1Figure 1 shows an embodiment of a heat cost allocation device 1 designed as a distributed heat cost allocation system. In this embodiment, the heat cost allocation device 1 comprises two assemblies BG1 and BG2: a flow pipe assembly BG1, which can be arranged on a supply line 2 of a radiator 3 or, as shown here, is already arranged, and which includes a communication device, a flow temperature sensor, and a volume flow sensor; and a radiator surface assembly BG2, which can be arranged on the radiator 3 at a predetermined relative height h% or, as shown here, is already arranged, and which includes a further communication device and a radiator surface temperature sensor. The volume flow sensor is only necessary if a radiator valve with a constant volume flow m is not used, since, when such a radiator valve with a constant volume flow m is used, the known constant volume flow m is used for the method described below.These two assemblies BG1, BG2 with this respective minimum equipment are also available in the two further embodiments according to the . Figures 2 and 3 present. Furthermore, the heat cost allocator 1 includes both in the Figure 1 the embodiment shown as well as in the embodiments according to the Figures 2 and 3 , at least one room temperature sensor and at least one computing unit.

[0088] In the embodiment according to Figure 1The room temperature sensor is located in the flow assembly BG1 or in the radiator surface assembly BG2, or both the flow assembly BG1 and the radiator surface assembly BG2 each have a room temperature sensor for detecting a room temperature TL. Likewise, the processing unit is located in the flow assembly BG1 or in the radiator surface assembly BG2, or both the flow assembly BG1 and the radiator surface assembly BG2 each have a processing unit.

[0089] The flow assembly BG1 is, for example, configured as a radiator valve with a thermostatic head, which is operated, for example, with a constant flow rate or in proportional operation, in which there is a direct proportionality between a valve stroke and a flow rate m of a heat transfer medium flowing through the radiator 3, or this flow assembly BG1 comprises such a radiator valve with a thermostatic head. The flow temperature sensor in the flow assembly BG1 detects a flow temperature Tv of the radiator 3. The radiator surface temperature sensor in the radiator surface assembly BG2 detects a surface temperature To of the radiator 3 at the specified relative height h% on the radiator 3.

[0090] The computer calculates a return temperature TR of radiator 3, as it could be measured at a return pipe 4 of radiator 3, from the measured or known process variable volume flow rate m and the measured process variables supply temperature Tv, surface temperature To of radiator 3 at the specified relative height h% at radiator 3, and room temperature TL, using the method described above. However, this return temperature TR is not measured by the heat cost allocator 1 described here, but rather calculated by the computer in the manner described above.Furthermore, the computer calculates, from these process variables and the calculated return temperature TR, a logarithmic temperature difference ΔT ln of radiator 3, a radiator exponent n of radiator 3, a reference power QR of radiator 3, and, in particular according to formulas (1) and / or (2), at least one consumption value Q1, Q2 corresponding to a quantity of heat emitted by radiator 3. Specifically, the computer calculates the current heat output supplied to radiator 3. The radiator exponent n and the reference power QR are advantageously calculated, as described above, from the data of at least two operating points using the computer. The respective data are advantageously transmitted between modules BG1 and BG2 via the communication devices, and optionally also to a measuring device network via at least one of the communication devices.The determination of at least one consumption value Q1, Q2 corresponding to the amount of heat emitted by radiator 3, in particular according to formula (1) and / or (2), is expediently carried out not only on the basis of the operating points mentioned above, but in a manner customary and / or prescribed for heat cost allocators, for example continuously, in particular constantly, i.e. continuously, or for example regularly, in particular at specified times and / or in specified periods, and / or in a specified event-controlled manner.

[0091] Figure 2Figure 1 shows a further embodiment of the heat cost allocator 1. In this embodiment, the heat cost allocator 1 comprises, in addition to the flow pipe assembly BG1, which can be arranged on the flow pipe 2 of the radiator 3 or, as shown here, is already arranged, and the radiator surface assembly BG2, which can be arranged on the radiator 3 at the specified relative height h% or, as shown here, is already arranged, a third assembly BG3. In this embodiment, the room temperature sensor, together with another communication device, is located in the third assembly BG3, away from the radiator 3, in the same room. Optionally, the flow pipe assembly BG1 and / or the radiator surface assembly BG2 can also include a room temperature sensor. In this embodiment, the processing unit can be arranged in any one of the three assemblies BG1, BG2, or BG3.Alternatively, two of the assemblies BG1, BG2, BG3 or all three assemblies BG1, BG2, BG3 can have such a computing unit.

[0092] The computer calculates the return temperature TR of radiator 3 from the measured or known process variable volume flow rate m, as well as from the measured process variables supply temperature Tv, surface temperature To of radiator 3 at the specified relative height h% on radiator 3, and room temperature TL, in the manner described above. Furthermore, the computer calculates the logarithmic temperature difference ΔT ln of radiator 3, the radiator exponent n of radiator 3, the reference power QR of radiator 3, and, in particular according to formulas (1) and / or (2), at least one consumption value Q1, Q2 corresponding to the amount of heat emitted by radiator 3. Specifically, the computer calculates the current heat output supplied to radiator 3.The radiator exponent n and the reference power QR are advantageously calculated from the data of at least two operating points using the computing unit, as described above. The respective data are advantageously transmitted between modules BG1, BG2, and BG3 via the communication devices, and optionally also to a measuring device network via at least one of the communication devices.

[0093] Here too, the determination of at least one consumption value Q1, Q2 corresponding to the amount of heat emitted by radiator 3, in particular according to formula (1) and / or (2), is expediently carried out not only on the basis of the operating points mentioned above, but in a manner customary and / or prescribed for heat cost allocators, for example continuously, in particular constantly, i.e. continuously, or for example regularly, in particular at specified times and / or in specified periods, and / or in a specified event-controlled manner.

[0094] In Figure 3Figure 1 shows a further embodiment of the heat cost allocator 1. In this embodiment, the heat cost allocator 1 comprises, in addition to the flow pipe assembly BG1, which can be arranged on the flow pipe 2 of the radiator 3 or, as shown here, is already arranged, and the radiator surface assembly BG2, which can be arranged on the radiator 3 at the specified relative height h% or, as shown here, is already arranged, as well as the third assembly BG3, a fourth assembly BG4. The room temperature sensor is again arranged in the third assembly BG3, together with the additional communication device, in the same room, away from the radiator 3. Optionally, the flow pipe assembly BG1 and / or the radiator surface assembly BG2 can also include a room temperature sensor. The fourth assembly BG4 contains an additional communication device and the processing unit.Alternatively, two or three of the modules BG1, BG2, BG3, BG4, or all four modules BG1, BG2, BG3, BG4, can have such a calculating unit. The fourth module BG4 is located outside the room containing radiator 3. It is, for example, part of a central computing system in which at least one consumption value from the heat cost allocator is calculated.

[0095] The computer calculates the return temperature TR of radiator 3 from the measured or known process variable volume flow rate m, as well as from the measured process variables supply temperature Tv, surface temperature To of radiator 3 at the specified relative height h% on radiator 3, and room temperature TL, in the manner described above. Furthermore, the computer calculates the logarithmic temperature difference ΔT ln of radiator 3, the radiator exponent n of radiator 3, the reference power QR of radiator 3, and, in particular according to formulas (1) and / or (2), at least one consumption value Q1, Q2 corresponding to the amount of heat emitted by radiator 3. Specifically, the computer calculates the current heat output supplied to radiator 3.The radiator exponent n and the reference power QR are advantageously calculated from the data of at least two operating points using the computing unit, as described above. The respective data are advantageously transmitted between modules BG1, BG2, BG3, and BG4 via the communication devices, and optionally also to a measuring device network via at least one of the communication devices.

[0096] Here too, the determination of at least one consumption value Q1, Q2 corresponding to the amount of heat emitted by radiator 3, in particular according to formula (1) and / or (2), is expediently carried out not only on the basis of the operating points mentioned above, but in a manner customary and / or prescribed for heat cost allocators, for example continuously, in particular constantly, i.e. continuously, or for example regularly, in particular at specified times and / or in specified periods, and / or in a specified event-controlled manner. REFERENCE MARK LIST

[0097] 1Heat cost allocation device 2Supply pipe 3Radiator 4Return pipe BG1 Inlet assembly BG2 Radiator surface assembly BG3 Third assembly BG4 Fourth assembly

Claims

1. Method for operating a heat cost allocator (1), wherein a volume flow rate (m) and a supply temperature (Tv) of a heat transfer medium flowing through the radiator (3), as well as a surface temperature (To) of the radiator (3) at a predetermined relative height (h%) on the radiator (3) and a room temperature (TL) are determined as parameters of a first parameter group, and a return temperature (T) is determined from at least one parameter of this first parameter group. R ) of the radiator (3), - a logarithmic excess temperature (ΔT ln ) of the radiator (3), - a radiator exponent (n) of the radiator (3), - a reference power (Q R ) of the radiator (3), and - at least one consumption value (Q1, Q2) corresponding to a quantity of heat emitted by the radiator (3) is derived as a parameter of a second parameter group.

2. Method according to claim 1, wherein at least two operating points are determined with, at least substantially, constant volume flow rate (m), constant supply temperature (Tv), constant surface temperature (To) of the radiator (3) at the predetermined relative height (h%) on the radiator (3) and constant room temperature (TL).

3. Method according to claim 2, wherein - for each of the operating points, the return temperature (T) is determined from the flow temperature (Tv) and the surface temperature (To) of the radiator (3) at the predetermined relative height (h%) on the radiator (3). R ) of the radiator (3) is determined, - for each of the operating points from the flow temperature (Tv), the return temperature (T R ) and the volume flow rate (m) an instantaneous power (Q A1 , Q A2 ) of the radiator (3) is determined, - for each of the operating points from the flow temperature (Tv), the return temperature (T R ) and the room temperature (T L) the logarithmic temperature rise (ΔT ln,A1 , ΔT ln,A2 ) of the radiator (3) is determined - from the logarithmic excess temperatures (ΔT ln,A1 , ΔT ln,A2 ) and instantaneous powers (Q A1 , Q A2 ) the radiator exponent (n) of the two operating points is determined, - from the logarithmic excess temperature (ΔT) ln,A1 , ΔT ln,A2 ) and the instantaneous power (Q A1 , Q A2 ) at least one of the operating points and the radiator exponent (n) the reference power (Q R ) of the radiator (3) is determined.

4. Method according to claim 3, wherein the reference power (Q) R ) of the radiator (3) a K Q -value is determined.

5. Method according to one of the preceding claims, wherein c-values ​​of a flow temperature sensor, a radiator surface temperature sensor and at least one room temperature sensor are determined.

6. Method according to claim 5, wherein a Kc value is determined using the c-values ​​of the temperature sensors.

7. Method according to one of claims 3 to 6, wherein by means of a specific heat capacity (c) of a heat transfer medium flowing through the radiator (3), the volume flow rate (m), the supply temperature (Tv) and the return temperature (T) R ) and / or by means of one from the K Q -value and the correction factor (K) determined from the Kc value, the surface temperature (To) of the radiator (3) at the specified relative height (h%) on the radiator (3), the room temperature (T L ) and the radiator exponent (n) a consumption value (Q1, Q2) corresponding to the amount of heat emitted by the radiator (3) is determined.

8. Heat cost allocation device (1), operable or operated by means of a method according to one of the preceding claims, comprising a flow assembly (BG1) that can be arranged or is arranged on a flow line (2) of a radiator (3) with a flow temperature sensor which is designed and configured to determine the flow temperature (Tv), a radiator surface assembly (BG2) that can be arranged or is arranged at a predetermined relative height (h%) on the radiator (3) with a radiator surface temperature sensor which is designed and configured to determine the surface temperature (To) of the radiator (3) at the predetermined relative height (h%) on the radiator (3), as well as at least one room temperature sensor which is designed and configured to determine the room temperature (TL), and at least one or more calculating units.which is trained and equipped, or which are jointly equipped and trained, to determine all parameters of the second parameter group using at least one parameter of the first parameter group.

9. Heat cost allocation device (1) according to claim 8, - wherein the supply assembly (BG1) comprises a communication device which is in particular designed and equipped for communication with the radiator surface assembly (BG2) and / or a third assembly (BG3) and / or a fourth assembly (BG4), and / or - wherein the radiator surface assembly (BG2) comprises a communication device which is in particular designed and equipped for communication with the supply assembly (BG1) and / or the third assembly (BG3) and / or the fourth assembly (BG4).

10. Heat cost allocation device (1) according to claim 8 or 9, wherein the supply assembly (BG1) comprises a volume flow sensor which is designed and configured to determine, in particular measure, the volume flow (m).

11. Heat cost allocation device (1) according to one of claims 8 to 10, wherein the supply assembly (BG1) is designed as a radiator valve with a thermostatic head, which is designed with a constant volume flow or for carrying out a proportional operation in which there is a direct proportionality between a valve stroke of the radiator valve and a volume flow (m) through the radiator valve, or comprises such a radiator valve with a thermostatic head.

12. Heat cost allocation device (1) according to one of claims 8 to 11, comprising a third assembly (BG3) spaced apart from the radiator (3), in particular with a further communication device, which is in particular designed and equipped for communication with the supply assembly (BG1) and / or the radiator surface assembly (BG2) and / or a fourth assembly (BG4), wherein the third assembly (BG3) can be arranged or is arranged in the same room of a building as the radiator (3).

13. Heat cost allocation device (1) according to one of claims 8 to 12, comprising a fourth assembly (BG4) spaced apart from the radiator (3), in particular with a further communication device, which is in particular designed and configured for communication with the flow assembly (BG1) and / or the radiator surface assembly (BG2) and / or a third assembly (BG3), wherein the fourth assembly (BG4) can be arranged or is arranged outside the room in which the radiator (3) is arranged.

14. Heat cost allocation device (1) according to one of claims 8 to 13, wherein the at least one room temperature sensor or at least one further room temperature sensor, which is designed and configured to determine the room temperature (T L ), in the pre-assembly unit (BG1), in the radiator surface unit (BG2) or in the third unit (BG3).

15. Heat cost allocation device according to one of claims 8 to 14, wherein the calculating unit or at least one further calculating unit, which is designed and configured to determine at least one parameter of the second parameter group by means of at least one parameter of the first parameter group, is arranged in the flow assembly (BG1), in the radiator surface assembly (BG2), in the third assembly (BG3) or in the fourth assembly (BG4).