Glass core laminate structure and production method for glass core laminate structure

EP4550952A4Active Publication Date: 2025-09-24TOPPAN HOLDINGS INC
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Patent Information

Application Number
EP2023831016
Authority / Receiving Office
EP · EP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2022-12-27
Filing Date
2023-06-08
Publication Date
2025-09-24
Estimated Expiration
2043-06-08

AI Technical Summary

Technical Problem

The formation of microcracks (µ-cracks) in glass substrates during the singulation of multilayer wiring substrates, caused by stress from wiring layers, leads to reliability issues due to differences in linear expansion coefficients between the glass substrate and the wiring layers.

Method used

A glass core laminate structure is developed with a glass core substrate and a laminate layer above and below the substrate, where the side surface is covered with the same material as the laminate, and recessed portions are formed on the side surface to reduce stress and prevent µ-cracks.

Benefits of technology

The proposed solution effectively prevents damage to the core substrate and enhances the reliability of the glass core laminate structure and wiring substrate by reducing stress and µ-crack formation.

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Abstract

The purpose of the present invention is to provide a technique that makes it possible to avoid the occurrence of damage to a core substrate, and ensure the reliability of a glass core laminate structure and a wiring substrate. The glass core laminate structure comprises: a glass core substrate having a first surface, and a second surface opposing the first surface; and a laminate including, above the first surface and below the second surface, a layer formed of a material different from that of the glass core substrate. A side surface of the glass core laminate structure is covered with the same material as one of the materials forming the laminate, and a plurality of recessed portions having a substantially rectangular shape, through which a plurality of vertical ridge lines and horizontal ridge lines can be visually recognized, are formed on at least a portion of the side surface of the glass core substrate.
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Citation Information

Patent Citations

  • Method for manufacturing a multilayer wiring board

    JP7067666B1

  • Wiring substrate and manufacturing method thereof

    US20140015121A1

  • Printed circuit board and method of manufacturing the same

    US20150129293A1

  • Printed circuit board and method of manufacturing the same

    US20160135289A1

  • Glass core device and method of producing the same

    US20200357734A1