Photovoltaic module comprising polyethylene encapsulant
EP4612736A1Pending Publication Date: 2025-09-10SABIC GLOBAL TECHNOLOGIES BV
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Patent Information
- Application Number
- EP2023794431
- Authority / Receiving Office
- EP · EP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2022-12-02
- Filing Date
- 2023-10-27
- Publication Date
- 2025-09-10
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Figure 1.1
Abstract
The present invention relates to an encapsulated solar cell assembly, the assembly comprising a solar cell positioned between positioned between a first and a second sealing layer, wherein the solar cell is positioned such that the first and the second sealing layer are joined so as to completely encapsulate the solar cell, wherein each of the first and the second sealing layer comprise or consist of a film or sheet of a polymer composition comprising: a) an ethylene-based copolymer; b) ≥ 0.1 wt.% and ≤ 5.0 wt.%, preferably ≥ 0.1 wt% and ≤ 1.0 wt%, of a crosslinking agent; c) ≥ 0.05 wt.% and ≤ 5.0 wt.%, preferably ≥ 0.05 wt% and ≤ 0.5 wt%, of a coupling agent, preferably a silane coupling agent; d) ≥ 0.05 wt.% and ≤ 5.0 wt.%, preferably ≥ 0.05 and ≤ 1.0 wt%, of a co-agent, preferably a phosphate-moiety, isocyanurate-moiety or cyanurate-moiety containing co-agent; wherein all wt% are based on the total weight of the polymer composition; and wherein the ethylene-based copolymer has a vinyl unsaturation content of ≥ 6.0 per 105 carbon atoms, preferably ≥ 7.0 per 105 carbon atoms, preferably ≥ 12.0 per 105 carbon atoms, more preferably ≥ 12.0 and ≤ 20.0 per 105 carbon atoms, even more preferably ≥ 12.0 and ≤ 15.0 per 105 carbon atoms, when determined in accordance with ASTM D6248-98 (2012). Such solar cell assembly can be manufactured by a manufacturing process in which a desirably long initial phase in curing, thereby allowing flexibility in thermoplastic moulding, a desirably short curing period, thus reducing cycle time in the production of an encapsulated solar cell assembly, whilst also resulting in a high degree of crosslinking of the encapsulant material, is achieved.
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