Storage stable, one-component, solvent-free, non-halogenated, heat curable compositions for use in encapsulation of electrical components

EP4619473A1Pending Publication Date: 2025-09-24UNISEAL +3
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Patent Information

Application Number
EP2023960362
Authority / Receiving Office
EP · EP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-11-29
Publication Date
2025-09-24

AI Technical Summary

Technical Problem

Existing encapsulation materials for electrical components often require multiple components, halogenated solvents, and are not stable during storage, posing challenges in reliability and environmental safety.

Method used

Development of one-component, solvent-free, non-halogenated, heat-curable compositions that provide stable encapsulation for electrical components, utilizing specific monomers and crosslinking agents to ensure robust adhesion and protection.

Benefits of technology

The solution offers improved storage stability and environmental safety while ensuring effective encapsulation and adhesion, enhancing the reliability of electrical components.

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Abstract

A storage stable, one-component, solvent-free, non-halogenated, heat curable composition which cures to form a cured product for use in encapsulation of electrical components, including: (a) an epoxy resin; (b) a non-halogenated flame retardant based on phosphorus containing epoxy resin; (c) a cyclic anhydride hardening agent; (d) a catalyst; (e) a rheology modifier; (f) a heat stabilizing agent; and (g) wherein the composition is fast gelling / curing and exhibits a high glass transition temperature, and excellent mechanical, electrical, and flame-retardant properties.
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Description

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Claims

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