Mould insert for an injection-moulding system, carrier substrate for such a mould insert, injection-moulding system with such a mould insert, and method for injection moulding

Abstract

A mould insert (50) for an injection-moulding system (18) for producing a microstructure and / or nanostructure on a moulded moulding, wherein, in the state in which it is fitted in the injection-moulding system, the mould insert (50) has a surface profiling (9) which in a fitted state is facing a cavity (20) of the injection-moulding system, comprising: - a structural element (7) with the surface profiling (7) for moulding the microstructure and / or nanostructure on the moulding during an injection-moulding operation, and - a carrier substrate (3), to which the structural element (7) is directly or indirectly bonded, wherein the carrier substrate (3) and preferably the structural element (7) are designed in such a way that the mould insert (50) in the fitted state is deformable, in particular elastically deformable, at least in some regions.

Description

[0001] Mold insert for an injection molding system, carrier substrate for such a mold insert, injection molding system with such a mold insert and method for injection molding

[0002] The present invention relates to a mold insert for an injection molding system for producing a micro- and / or nanostructure on a molded part, in particular a molded part for use in the semiconductor industry, a carrier substrate, an injection molding system with such a mold insert and a method for injection molding.

[0003] In the semiconductor industry, imprint lithography is a well-known process for creating structures in the micrometer or nanometer range. In recent years, this technology has gained increasing importance, particularly in relation to photolithography. The advantage of imprint lithography is that it eliminates the need for expensive masks and is not subject to diffraction limits. While imprint lithography also requires the expensive and complex production of a so-called master stamp, this master stamp is not used directly as a working stamp. Instead, a soft stamp, particularly one based on a polymer, is molded from the master stamp and then serves as the working stamp. When the soft stamp wears out, a new soft stamp can be molded from the master stamp.

[0004] These soft stamps are preferably used in an imprinting device. In an imprinting device, the soft stamp is fixed to a stamp holder, in particular by being secured to a stamp carrier (backplane). The substrate is fixed to a substrate holder and coated with an embossing compound. The stamp holder and substrate holder are movable relative to one another. If the stamp is smaller than the substrate, the negative of the stamp structure can be embossed onto the substrate multiple times in a step-and-repeat process. If the size of the stamp is approximately the same as or identical to the size of the substrate, the embossing compound of the substrate is embossed in a single embossing step. Such imprinting devices feature high precision and reproducibility of the embossed structures. However, the throughput of these technologies is low.Injection molding devices have been used in industry for decades to produce components using an injection molding process. Initially intended only for the production of large, coarse components, the technology has also been used to manufacture components with smaller structural sizes. An example worth mentioning is the injection molding of CDs and DVDs. Such devices are known as press shops.

[0005] Although press shops can deliver high throughput, it has proven particularly difficult to produce structures in the nanometer range while maintaining or improving conversion. Special fixtures and, above all, process steps are required to precisely control not only the injection molding process but also the demolding of the resulting molded part. In particular, demolding a hardened molding compound with structures in the nanometer range requires special fixtures and process steps.

[0006] It is therefore an object of this invention to provide a device and a method by means of which the injection molding and demolding of a molded part or injection-molded article can be carried out with high throughput and as error-free as possible, in particular when it is a molded part on the outside of which a micro- or nanostructure has been embossed.

[0007] The present invention solves the problem with a mold insert according to claim 1, a carrier substrate according to claim 11, an injection molding system according to claim 12 and a method according to claim 13.

[0008] According to a first aspect, a mold insert is provided for an injection molding system for producing a micro- and / or nanostructure on a molded part, wherein the mold insert, in an assembled state in the injection molding system, has a surface profiling that faces a cavity of the injection molding system, comprising: a structural element with the surface profiling for shaping the micro- and / or nanostructure on the molded part during an injection molding process, and a carrier substrate to which the structural element is directly or indirectly connected, wherein the carrier substrate and preferably the structural element is or are designed such that the mold insert, in the assembled state, is at least partially deformable, in particular elastically deformable.

[0009] In contrast to the prior art, the present invention provides a deformable mold insert comprising a carrier substrate and a structural element. Through a targeted selection of material and / or dimensioning of the carrier substrate and preferably the structural element, it is advantageously possible for the mold insert to be deformed at least locally and / or globally. For example, during demolding, more than 50%, preferably more than 70%, and particularly preferably more than 80% of the volume of the mold insert is deformed, in particular elastically deformed. It has been found that, especially with mold inserts intended for the formation of micro- and / or nanostructures, appropriate deformation during the demolding process of the molded part is advantageous, since this simplifies demolding.This advantageously allows the produced molded part to be demolded more quickly without having to fear that the micro- and / or nanostructure of the produced molded part will be damaged or even destroyed.

[0010] Another advantage is the very good molding accuracy. Molding accuracy refers to the smallest feature size that can be produced without defects during demolding. Molding accuracy is less than 1000 nm, preferably less than 500 nm, more preferably less than 100 nm, and most preferably less than 10 nm.

[0011] A further advantage is the possibility of producing structures with high aspect ratios. An aspect ratio is the ratio between the height and a lateral dimension, such as the width, of a structure. The achievable aspect ratios are better than 1:1, preferably better than 5:1, even more preferably better than 10:1, and most preferably better than 20:1.

[0012] The molded part produced by the described method and device preferably comprises one of the following materials

[0013] - PMMA

[0014] - COC

[0015] - COP

[0016] - PS

[0017] - PET - Polyimid

[0018] Experience has shown that these materials are particularly suitable for the production of a molded part.

[0019] The structural element is designed in such a way that it causes a micro- and / or nanostructuring on the outside of the molded part to be molded in the injection molding compound that is introduced into the cavity during operation of the injection molding system, i.e., during the injection molding process. Micro- and / or nanostructuring is understood to mean, in particular, a structuring in which the distance between two profile objects can be less than 50 μm, preferably less than 10 μm, even more preferably less than 1 μm, most preferably less than 100 nm, and most preferably less than 10 nm.

[0020] In particular, a mold insert is to be understood as an insert which is inserted as an exchangeable component into an injection molding system in order to realize a structuring, in particular a surface structuring, on the molded part to be molded when, during operation, a viscous liquid is injected into the cavity of the injection molding system in order to harden it in the cavity for the formation of the molded part.

[0021] In particular, an outer side profiling formed by the profile objects on the outside of the molded part is to be understood as one that can be reproducibly realized in several injection molding processes and in which the spacing between two profile objects, for example in the form of an elevation, can be reproducibly produced with a correspondingly small size.

[0022] The structural element preferably comprises at least one stamp carrier and one stamp. The stamp carrier can be any type of substrate on which a stamp can be manufactured and transported. The stamp preferably has the desired surface profile intended for embossing the outer side of the molded part.

[0023] In one embodiment, the stamp carrier is a wafer, particularly a silicon wafer. Glass wafers are also conceivable. Glass wafers are particularly suitable when the stamping compound, i.e., the compound from which a stamp is formed, must be cured by the stamp carrier using visible or UV light. In this case, the curing electromagnetic radiation can also be accessed through the stamp carrier. This is particularly advantageous when the stamp of an imprinting device, which forms the working stamp, is opaque, semi-transparent, or transparent to this wavelength.

[0024] In another embodiment, the stamp carrier is a foil. The foil is preferably mounted on a frame. In semiconductor technology, such foils and frames are used to transport substrates. Instead of transporting a substrate, a stamp is created on a corresponding foil.

[0025] The stamp carrier can generally be made of metal, glass, polymer, or ceramic. If necessary, a bonding agent can be used between the stamp carrier and the stamp to improve the adhesion of the embossed stamp to the stamp carrier.

[0026] In particular, it is provided that the structural element, in particular the stamp, comprises a hard stamp or a soft stamp. In particular, it is conceivable that the structural element, in particular its stamp, is formed using a master sample, for example made of metal, which has been produced using an imprinting process. This makes it possible to provide structural elements that can realize surface profiling in the molded part that is in the micrometer or nanometer range.

[0027] The stamps of the structural element are preferably connected to a stamp carrier as described above, in particular, manufactured directly on it. These stamps are preferably soft stamps, i.e., they are preferably produced from a stamping compound. The stamping compound is preferably a polymer.

[0028] It's also conceivable that the stamp could be a hard stamp. In this case, the stamp can be used without a stamp holder. Fixing the stamp to a stamp holder is also conceivable. This would be necessary if only the stamp holder, and not the stamp itself, is compatible with the mold insert described later. The stamp holder then also serves as an adapter. Manufacturing stamps as hard stamps is more complex and costly than molding a soft stamp from a master stamp.

[0029] The carrier substrate preferably determines the mechanical properties of the mold insert and is preferably composed of a single component or a single layer, or of multiple components or multiple layers. If the carrier substrate is a composite of multiple layers, each of which has different physical properties, in order to combine several different properties in one carrier substrate, the carrier substrate is also referred to as a hybrid carrier substrate. A mold insert with a hybrid carrier substrate is then preferably a hybrid mold insert. The different layers are preferably made of different materials.

[0030] In particular, it is intended that the molded part is a component from the fields of optics, microfluidics, or electronics, particularly semiconductor technology. For example, the molded part is intended as an optical component or a component from bio- and microfluidics. An optical component could be a lens, particularly a Fresnel lens. Diffraction or refraction gratings or optical elements for holography are also conceivable. The production of photonic crystals is also conceivable. Another possibility would be the production of a complete microfluidic system with chambers, particularly reaction chambers, channels, etc.

[0031] The bending moment of resistance is a measure of the resistance of a beam to the development of internal stresses when subjected to a load. The greater the bending moment of resistance, the greater the external force acting on a beam must be to produce a corresponding bending. The bending moment of resistance can be calculated directly from the cross-sectional profile. Those skilled in the art will know that the bending moment of resistance for a rectangle with width B and height H, when the beam is bent about an axis parallel to B, is calculated using the formula

[0032] W = B*H 2 / 6

[0033] The bending section modulus should be minimal to allow the mold insert to bend as easily as possible for demolding. An example calculation is performed and presented in tabular form in the following table. A molded part the size of a 200 mm substrate is to be stamped. The mold insert is therefore also estimated as a square component group with a length of 200 mm and a width of 200 mm. The length is not included in the calculation of the bending section modulus. The width is fixed at 200 mm. The height is varied using a set of parameters to calculate the corresponding bending section modulus.

[0034] In particular, it is intended that the mold insert has a bending resistance moment that is less than 100000 mm 3 , preferably less than 80000 mm 3 , preferably less than 40000 mm 3 , preferably less than 1000 mm 3, preferably less than 100 mm 3 . Analogous considerations apply to mold inserts that have a different width and / or height.

[0035] In particular, the bending resistance moment is adjusted such that, for example, a maximum local stroke displacement of a portion of the mold insert of up to 1 mm, preferably up to 1 cm, more preferably up to 2 cm, most preferably up to 3 cm can be realized or is realized during demolding. Stroke displacement is understood, in particular, to mean a displacement in a direction perpendicular to the main extension plane, with respect to the position or orientation of the mold insert in the undeformed state.

[0036] Furthermore, it is particularly provided that the structural element is directly connected to the carrier substrate and thus lies directly against the carrier substrate. The carrier substrate is characterized in particular in that it can be inserted into a corresponding holding device or receiving device in the injection molding system and in particular can be fixed therein. The carrier substrate is dimensioned accordingly and has, for example, at least one contact area that allows the mold insert to be fastened in a corresponding holding device in an injection molding system. For example, this contact area is free of the structural element. For example, an extension area of ​​the carrier substrate in a plane running parallel to the main extension plane is larger than an extension area of ​​the structural element.

[0037] The structural element, in particular its stamp, engages with the injection molding compound during the injection process and thus has a formative effect on the molded part to be formed.

[0038] In particular, it is provided that the mold insert has at least one heating element. This advantageously makes it possible, particularly as needed, to influence the injection molding compound in the cavity by applying appropriate heat, for example, during the molding process or the injection molding process of the molded part and / or during demolding.

[0039] In particular, the heating element is a microheating element. The maximum dimension of the microheating element is less than 1 cm, preferably less than 5 mm, even more preferably less than 1 mm, most preferably less than 0.1 mm, and most preferably less than 0.01 mm. As the dimensions of the microheating elements decrease, the achievable spatial temperature resolution increases.

[0040] It is conceivable that the heating element or heating elements are designed such that they can act locally, i.e., spatially limited, at a specific location on the injection-molding compound. In particular, the heating element is a microheating element, for example in the form of a microheating wire, which, for example, runs in a meandering shape and / or has curved and / or circular cutouts. The heating elements, in particular the microheating elements, can take on any desired shape. For example, spiral, meandering, circular, rectangular, or honeycomb-shaped microheaters are conceivable.

[0041] In particular, it is provided that the at least one heating element or a plurality of heating elements are or are arranged in such a way that a spatially anisotropic or inhomogeneous heat distribution can be realized. This makes it possible to have a targeted local effect on the injection molding compound and to apply heat to specific points on the molded part to be molded or to be molded in an application-specific manner. In particular, it is conceivable that individual heating elements can be controlled individually in order to, for example, cause different heating periods and / or different heat inputs for different areas in the molded part. Ideally, each micro heating element or heating element can be heated individually. In this embodiment, inhomogeneous and / or anisotropic heating profiles can be achieved simply by appropriate control or regulation of the heating elements.

[0042] It is also conceivable for several micro heating elements to be grouped and heated together. The grouping of the micro heating elements can be done to more optimally heat certain spatial regions, particularly those where the density of the stamp structures is increased. In this sense, it is possible to achieve heating tailored to the stamp not only through the control, but also through the design and grouping of the heating elements. The disadvantage of this is that a new heating substrate must be produced for each stamp with a different surface profile. Therefore, it is advantageous to achieve inhomogeneous and / or anisotropic heating by appropriate control of the heating elements.

[0043] By deliberately specifying a high density of micro heating elements in areas with high stamping structure densities, it can be ensured that the temperature is high enough to ensure sufficient viscosity of the injection molding compound so that the stamping structures are completely filled. Furthermore, the ability to control the micro heating elements individually ensures fast control due to the low thermal mass. It is no longer necessary to heat the entire stamp to the temperature required to optimally fill high-density stamping structures. In particular, the micro heating elements support the flow of the injection molding compound into the micro or nanostructures. It is not even necessary to temperature-control the entire injection mold. The temperature is controlled directly at the stamping element. This also reduces the necessary demolding temperatures.A further advantage is a more controllable heat transfer from the microheating elements to the stamping die and thus to the injection molding compound. Furthermore, the number of design guidelines for stamping die creation is reduced. In the current state of the art, it is common to provide additional stamping die structures that serve no purpose other than to assist demolding. Improved temperature control can at least reduce these design guidelines.

[0044] It is also conceivable for the heating element to be formed over the entire surface in order to exert as homogeneous a heating effect as possible on the injection molding compound. The microheating elements can be produced, for example, by deposition on a heating substrate. One conceivable example is the deposition of a metal, in particular aluminum or copper, on the heating substrate, followed by structuring of the metal using coating and etching processes as well as photolithography. In another embodiment, the heaters are created directly in the heating substrate by doping. The heating substrate surface is masked accordingly before doping. The heating substrate surface with the microheaters is referred to as the active heating substrate surface. The surface opposite the active heating substrate surface is referred to as the passive heating substrate surface.

[0045] The heating substrate has at least 1, preferably more than 10, preferably more than 50, most preferably more than 100, or even more than 500 microheating elements on its active heating substrate surface. The microheating elements preferably generate heat resistively.

[0046] In particular, the at least one heating element is integrated into the carrier substrate or connected to an outer side of the carrier substrate, in particular to the outer side facing the structural element. This advantageously makes it possible to influence the heating effect on the injection molding compound depending on the molded part to be molded, depending on the position of the integrated heating element.

[0047] In particular, it is provided that the carrier substrate has a multi-layer structure. For this purpose, the carrier substrate has, for example, a first layer and a second layer. This advantageously makes it possible to incorporate a wide variety of physical properties, in particular the mechanical properties of the carrier substrate and thus of the molded part, into the carrier substrate, for example with regard to the bending section modulus and / or thermal conductivity. For this purpose, the first layer and the second layer preferably differ in terms of material and / or dimensions. In the simplest case, the mold insert is a single stamping substrate whose task is to accommodate the subsequent soft stamp, or the soft stamp with its stamp carrier (backplane).

[0048] Furthermore, it is preferably provided that the structural element is made of a first material and the carrier substrate is made of a second material, wherein the first material differs from the second material. In particular, it is preferably provided that the structural element is made of a material whose thermal expansion coefficient is comparable to the thermal expansion coefficient of the injection molding compound of the molded part to be produced. This proves to be particularly advantageous during the demolding process. A further aspect of the present invention is a carrier substrate for a molded part according to the invention. All properties described for the molded part can be transferred analogously to the carrier substrate and vice versa.

[0049] A further aspect of the present invention is an injection molding system with a cavity, comprising a deformation element for deforming an inserted mold insert, in particular a mold insert according to the invention, and / or a means for influencing a quantity of inflowing injection molding compound, in particular in a feed section immediately downstream of an inlet opening of the cavity. The injection molding compound can preferably be adjusted temporally and / or spatially using the means for influencing. For example, time-varying cross-sectional profiles for the inflowing injection molding compound can be adjusted in this way. The feed section is preferably a sprue device. All advantages and properties disclosed in connection with the mold insert apply analogously to the injection molding system and vice versa.

[0050] It has been found that with a corresponding deformation element, which preferably acts on a mold insert according to the invention, a deformation, in particular an elastic deformation of the mold insert, can be achieved, which simplifies demolding of the molded part after completion of the injection molding process. This has been found to be particularly advantageous when the structure is only a few micrometers or nanometers in size.

[0051] In particular, it is provided that the deformation element is a displaceable pin which preferably passes through a corresponding opening or recess in the holding element and can be brought into contact with the mold insert, in particular the carrier substrate, on a side of the mold insert opposite the structural element. As a result, the pin can press against the mold insert and deform it, in particular deform it into a dome shape. However, the deformation element can also be based on a pressure principle, for example, in which the side opposite the structural element is in contact with a fluid which is pressurized in order to bring about the desired deformation. In particular, the injection molding system comprises a holding device for the mold insert. The holding device for the mold insert preferably comprises a holding device base, in which there is preferably an access or opening via whichwhich the deformation element can exert on the mold insert. The mold insert is preferably mounted in a flexible manner. The mold insert is secured peripherally, for example, using fixtures and fixing elements.

[0052] In an extension, several deformation elements can also be used, which are spatially distributed and allow targeted, local demoulding.

[0053] Furthermore, a means for influencing a quantity of inflowing injection molding compound is provided, in particular in a feed section immediately downstream of an inlet opening of the cavity. It has been found that the injection molding process can be influenced by a corresponding means for influencing the quantity of injection molding compound. In particular, by arranging it immediately upstream, i.e. downstream, of the cavity, it is possible to enable individual flow rate control for the cavity. This is particularly possible because the flow rate control takes place directly at the cavity. For example, the inflowing compound can be adjusted accordingly via a corresponding control loop if corresponding sensors in the cavity detect that certain advantageous and / or less advantageous inflow flows are present.This allows you to intervene directly in the injection molding process before a molded part is produced that is unusable.

[0054] The sprue distributor is a component or component group whose task is to guide the injection molding compound into the injection molding chamber, preferably between mold inserts, via its injection molding compound inlet. The sprue distributor, for example, has at least one sliding element that can change the cross-section of the injection molding compound inlet. It is conceivable to use multiple sliding elements to locally change the cross-section of the injection molding compound inlet. This enables targeted control of the injection molding compound metering.

[0055] Another aspect of the present invention is a method for injection molding using an injection molding system according to the invention, wherein the mold insert is deformed and / or the amount of injection molding compound flowing in is influenced for demolding the injection-molded part. All advantages and properties described for the injection molding system can be applied analogously to the injection molding method, and vice versa.

[0056] In particular, it is proposed that during demolding of the molded part, an exposed area of ​​the mold insert is detached from the molded part in a first step, and an inner area of ​​the mold insert is detached from the molded part in a second step. The second step takes place after the first step. In particular, the detachment takes place step by step, i.e., discontinuously. It has been shown that with an appropriate demolding strategy, the reject rate of damaged molded parts can be reduced.

[0057] In particular, it is provided that a cross-section of a feed section is varied during the inflow of the injection molding compound. For example, a hose is modified with regard to its opening cross-section by means of a corresponding buckle, a slide and / or a pin in order to vary the flow rate of the injection molding compound spatially and / or temporally. The hose can be flexible and the cross-section can be changed by an external force or by a structural component that can be placed within the hose or pipe in such a way that different cross-sections or cross-sectional profiles are realized. It is also conceivable for the feed line to form a type of distributor. A corresponding cross-sectional enlargement or change in the cross-section in the feed section can then preferably be used to realize a spatial variation during the inflow of the injection molding compound.It is also conceivable that the feed section is designed as a distributor for the injection molding compound, which introduces the injection molding compound into various cavities.

[0058] Further advantages, features, and details of the invention will become apparent from the following description of preferred embodiments and from the drawings. These show:

[0059] Figure 1 Carrier substrate for a mold insert according to a first exemplary embodiment of the present invention,

[0060] Figure 2a Carrier substrate for a mold insert according to a second exemplary embodiment of the present invention, Figure 2b Carrier substrate for a mold insert according to a third exemplary embodiment of the present invention,

[0061] Figure 3a Carrier substrate for a mold insert according to a fourth exemplary embodiment of the present invention,

[0062] Figure 3b Carrier substrate for a mold insert according to a fourth exemplary embodiment of the present invention,

[0063] Figure 3c mold insert according to a first exemplary embodiment of the present invention,

[0064] Figure 4a Holding device with mold insert according to the first exemplary embodiment in a first operating state,

[0065] Figure 4b Holding device with mold insert according to the first exemplary embodiment in a second operating state,

[0066] Figure 5 top view of a mold insert according to a second exemplary embodiment of the present invention,

[0067] Figure 6a is a side view of an injection molding system according to a first exemplary embodiment of the present invention in a first position,

[0068] Figure 6b is a side view of an injection molding system according to a first exemplary embodiment of the present invention in a second position,

[0069] Figure 7a is a front view of an injection molding system according to a first exemplary embodiment of the present invention with a first sprue distributor and

[0070] Figure 7b shows a front view of an injection molding system according to a second exemplary embodiment of the present invention with a second sprue distributor. In the figures, identical components or components with the same function are identified by the same reference numerals.

[0071] The following figures present various embodiments of an injection molding system 18 (see Figures 6a and 6b) according to the present invention. Such an injection molding system 18 is designed to produce a molded part from an injection molding compound by introducing the injection molding compound into a correspondingly shaping cavity 20 of the injection molding system 18 and allowing it to harden. The injection molding compound is introduced into the cavity 20 via a feed section, which is presented in more detail in Figures 7a and 7b in exemplary embodiments. In particular, the present invention relates to a preferably replaceable mold insert 50 for such an injection molding system 18, the structure of the mold insert 50 being illustrated by way of example in Figure 3c. In addition to a carrier substrate 3, which is illustrated in various exemplary embodiments in Figures 1 to 3b, the mold insert 50 also comprises a structural element 8.In the assembled state of the mold insert 50, the structural element 8 faces the cavity 20 of the injection molding system 18. The structural element 8, in particular its punch 7, defines the external profile of a molded part produced by injection molding through its surface profiling 9. This mold insert 50 can preferably be mounted in a corresponding holding device 12, as shown in Figures 4a and 4b. The holding device 12 is preferably a component of the injection molding system 18.

[0072] Figure 1 shows a schematic, not-to-scale side view of a microheating substrate 1, comprising a microheating base substrate 2, with a microheating surface 2o, on or in which at least one microheating element 11 (not shown) is located. Such a microheating substrate 1 can be a carrier substrate 3 or a part of a carrier substrate 3 for a mold insert 50 according to an exemplary embodiment of the present invention.

[0073] Figure 2a shows a schematic, not-to-scale side view of a first embodiment of a carrier substrate 3 for a mold insert 50, wherein the carrier substrate 3 comprises a single first layer 4. The carrier substrate 3 serves either to directly fix a structure or stamp layer 7 or to fix a stamp carrier 6 on which a stamp 7 has been produced and attached. Figure 2b shows a schematic, not-to-scale side view of another embodiment of a carrier substrate 3, which, in addition to a first layer 4, comprises a second layer 4'. The second layer 4' can perform any desired physical function. It is conceivable that it was made from a material with special thermal conductivity and / or special heat capacity and / or special mechanical stiffness tensor, etc. For the sake of clarity, the illustration of further figures with additional layers has been omitted.However, the number of layers is not limited to two. Each layer can solve a very specific physical task or serve a specific purpose. The carrier substrate 3 serves either to directly fix a stamp 7 or to fix the stamp carrier 6 on which a stamp 7 was manufactured and attached. The first layer 4 and the second layer 4' of the embodiments for the carrier substrates 3 in Figures 2a and 2b serve in particular to specify the mechanical properties of the carrier substrate 3, for example with regard to thermal conductivity and / or bending moment of resistance, and can thus determine the mechanical properties of the mold insert 50. The first layer 4 and the second layer 4' can influence the mechanical properties of the carrier substrate 3, for example through their choice of material and their selected thickness. The layer 4, 4' can be a rigid substrate or a film.By using metallic foils or polymer foils, for example, thermal conduction properties can be adjusted very easily and in an optimized manner.

[0074] Figure 3a shows a schematic, not-to-scale side view of a first embodiment of a carrier substrate 3, which comprises a microheating substrate 1 in addition to a first layer 4, which is provided for specifying the mechanical properties of the carrier substrate 3. The microheating substrate 1 and the first layer 4 are joined together in a sandwich-like manner, wherein, in the embodiment variant of Figure 3a, the microheating surface 2o is arranged between the microheating base substrate 2 and the first layer 4. This embodiment is characterized in that the active microheating surface 2o is or is directly connected to the layer that determines the mechanical component of the carrier substrate 3. As a result, the heat sources of the individual microheating elements are located within the carrier substrate 3. This construction achieves optimal heat homogenization.

[0075] Figure 3b shows a schematic, not-to-scale side view of a second embodiment of a carrier substrate 3 comprising the first layer 4 and the microheating substrate 1. The second embodiment is characterized in that the passive microheating surface 2o is directly connected to the first layer 4, so that the active microheating surface 2o faces outward. This allows the thermal properties of the microheating base substrate 2 to be utilized.

[0076] The hybrid nature of the two embodiments in Figures 3a and 3b is evident in the fact that the microheating elements (not shown) of the microheating substrate 1 are controllable and adjustable, while the set of physical properties of the mold insert substrates 1 of the mechanical mold insert 50 is not changeable.

[0077] Instead of the first layer 4, additional layers can also be used to determine the mechanical properties of the carrier substrate 3. It is conceivable that the first layer 4, for example as a microheating substrate, is variable in terms of its properties and the second layer 4' is fixed in terms of its properties.

[0078] Figure 3c shows a hybrid carrier substrate 3 on which a structural element 8 is fixed. The structural element 8 comprises a backplane 6 and a stamp 7 fabricated thereon. The stamp carrier 6 is then fixed by the hybrid carrier substrate 5. This makes it possible to produce the stamp 7 independently of the hybrid carrier substrate 5 on a stamp carrier 6, so that it can then be transported using the stamp carrier 6. The stamp 7 is typically produced in an imprinting device. The stamp or stamp layer 7 is, in particular, a soft stamp that was molded from a master stamp in an imprinting device. The master stamp of the imprinting device is preferably a metal stamp. In the assembled state of the carrier substrate 3 and the structural element 8, the mold insert 50, in particular in the form of a hybrid mold insert, is provided.This hybrid mold insert 50 now comprises three parts: the microheating substrate 1, which is responsible for the thermal application; the set of all used first and / or second layers, which allow the physical properties to be adjusted; and the stamping layer 7, which is responsible for shaping the molded part during injection molding. The hybrid character has thus been expanded to include the shaping aspect.

[0079] Figure 4a shows the hybrid mold insert 50 in a holding device 12. The holding device 12 has fixings 13, with the aid of which the hybrid mold insert 50' is held peripherally. The fixings 13 are advantageously detachable and replaceable. The fixings 13 are fixed, for example, to a holding device base 15 by fixing elements 14. The holding device base 15 has an access 16 or an opening or recess through which a deformation element 17 can reach the underside of the hybrid mold insert 50'. The deformation element 17 makes the hybrid mold insert 50 bendable. The deformation element 17 is preferably a pin. It is also conceivable for the deformation element 17 to be a fluid outlet opening, through which a fluid, preferably a gas, can be forced onto the rear side of the hybrid mold insert 50.The resulting overpressure then leads to a curvature of the hybrid mold insert 5. Magnetic and / or electrical, particularly electrostatic, devices are also conceivable, which can cause a curvature of the hybrid mold insert 50. The deformation elements 17 should therefore be considered as generally as possible.

[0080] Figure 4b shows a deformation state of the hybrid mold insert 50 by the deformation element 10. The deformation shown supports the demolding of the molded part from the punch 7, which is necessary after injection molding.

[0081] Figure 5 shows a plan view of a stamp surface of a stamp 7, which has several surface profiles 9. The surface profiles 9 have been kept very simple for the sake of clarity. It can be seen that the surface profiles 9 are neither evenly distributed over the stamp surface nor are they homogeneous in terms of their density. This representation was chosen to represent a case that is as abstract and general as possible. The density and distribution of the surface profile 9 can of course also be homogeneous. Shown are four different micro heating elements 11, in particular in the form of a microscopic heating wire, in four different zones Z1-Z4. The micro heating elements in zones Z1 and Z3 are located directly beneath corresponding surface profiles 9. Depending on the density of the surface profile 9, they can have different shapes and / or have different line densities and / or line thicknesses.Zone Z2 is a localized zone beneath a free surface. Zone Z4 is a global zone encompassing the entire stamp or stamp layer 7. However, due to the shape of the microheating element 11, only its outer edge is heated, not the entire surface of the stamp or stamp surface 7. Any number of additional zones can be created in a similar manner.

[0082] Figure 6a shows a schematic side view of a complete injection molding system 18, which comprises at least two holding devices 12 and a feed section, in particular in the form of a sprue distributor 19, in a first position. Preferably, at least one of the two holding devices 12 has a deformation element 17 in order to be able to eject the produced injection-molded product more efficiently after molding. The two holding devices 12, together with the inserted mold inserts 50, form boundaries for the cavity, the so-called injection molding chamber 20, which is filled with the injection molding compound during injection molding. Located on the top side of the injection molding system 18 is a sprue distributor 19, which is responsible for supplying the injection molding compound.The sprue distributor 19 has at least one sliding element 21 on at least one side, preferably on both sides, which can change the cross-section of the injection molding compound inflow 22 leading into the injection molding chamber 20 in a controlled and / or regulated manner. In the first position, the at least one sliding element 21 is completely retracted, so that the cross-section of the injection molding compound inflow 22 is at its maximum.

[0083] Figure 6b shows a schematic side view of a complete injection molding system 18, which comprises at least two holding devices 12 and a sprue distributor 19 in a second position. In the second position, the at least one sliding element 21 is displaced such that the cross-section of the injection molding compound inflow 22 is reduced. By specifically positioning the at least one sliding element 21, control and / or regulation of the injection molding compound flow through the injection molding compound inflow 22 is possible.

[0084] Figure 7a shows a schematic front view of the rear side of a holding device 12 of an injection molding system 18 with a first possible sprue distributor 19. Visible are the access 16 and the rear side of the curvature element or the deformation element 17. Furthermore, the shape of the sprue distributor 19 is visible. Such a sprue distributor 19 is referred to as a bar sprue distributor. Visible is a single, rectangular sliding element 21 that extends almost across the entire width of the sprue distributor 19 and can thus continuously change the cross-section of the injection molding compound inflow 22 across the entire width.

[0085] Figure 7b shows a schematic front view of the rear side of a holding device 12 of an injection molding system 18 with a second possible sprue distributor 19'. The access 16 and the rear side of the curved element 17 are visible. In this embodiment, the sprue distributor 19' has several sliding elements 21 that can be individually inserted into the injection molding compound inlet 22, thus allowing local control of the injection molding compound flow. Extensions of the sprue distributors 19, 19' from the last two figures (not shown) include sliding elements 21 with different cross-sections, in a grid form, in a grid form and with different cross-sections, etc.

[0086] List of reference symbols:

[0087] 1 micro heating substrate

[0088] 2 Micro heating base substrate

[0089] 2o micro heating surface

[0090] 3, Carrier substrate

[0091] 4 first layer

[0092] 4' second layer

[0093] 6 stamp carriers

[0094] 7 stamps

[0095] 8 Structural element

[0096] 9 Surface profiling

[0097] 11 Micro heating element

[0098] 12 Holding device

[0099] 13 Fixation

[0100] 14 Fixing element

[0101] 15 Holding device base

[0102] 16 Access

[0103] 17 Deformation element

[0104] 18 Injection molding system

[0105] 19, 19' sprue distributor

[0106] 20 injection molding room

[0107] 21 Sliding element

[0108] 22 Injection molding mass flow

[0109] 50 mold insert

Claims

Claims 1. A mold insert (50) for an injection molding system (18) for producing a micro- and / or nanostructure on a molded part, wherein the mold insert (50), when mounted in the injection molding system, has a surface profiling (9) which, when mounted, faces a cavity (20) of the injection molding system, comprising: a structural element (7) with the surface profiling (7) for shaping the micro- and / or nanostructure on the molded part during an injection molding process, and a carrier substrate (3) to which the structural element (7) is directly or indirectly bonded, wherein the carrier substrate (3) and preferably the structural element (7) are designed such that the mold insert (50), when mounted, is deformable, in particular elastically deformable, at least in some regions.

2. Mold insert (50) according to claim 1, wherein the mold insert (50) has a bending resistance moment that is less than 100,000 mm 3, preferably less than 80000 mm 3 , preferably less than 40000 mm 3 , preferably less than 1000 mm 3 , preferably less than 100 mm 3 ..

3. Mold insert (50) according to one of the preceding claims, wherein the mold insert (50) has at least one heating element (11).

4. Mold insert (50) according to claim 3, wherein the at least one heating element (11) or a plurality of heating elements (11) are arranged such that a spatially anisotropic and / or inhomogeneous heating distribution can be realized.

5. Mold insert (50) according to one of the preceding claims, wherein the at least one heating element (11) is integrated into the carrier substrate (3) or formed on an outer side of the carrier substrate (3).

6. Mold insert (50) according to one of the preceding claims, wherein the structural element (50) comprises a punch (7) and a punch carrier (6).

7. Mold insert (50) according to one of the preceding claims, wherein the structural element (7) comprises a hard stamp or a soft stamp.

8. Mold insert (50) according to claim 5 or 6, wherein the stamp carrier (6) is transparent or semi-transparent.

9. Mold insert (50) according to one of the preceding claims, wherein the carrier substrate (3) comprises at least a first layer (4) and a second layer (4').

10. Mold insert (50) according to one of the preceding claims, wherein the structural element (7) is made of a first material and the carrier substrate (3) is made of a second material, wherein the first material differs from the second material.

11. Carrier substrate (3) for a mold insert (50) according to one of the preceding claims.

12. Injection molding system (18) with a cavity (20), comprising - a deformation element (17) for deforming an inserted mold insert (50), in particular a mold insert (50) according to one of claims 1 to 10, and / or - a means for influencing a quantity of incoming injection molding compound, in particular in a feed section, preferably in a sprue distributor (19, 19'), immediately downstream of an inlet opening of the cavity (20).

13. A method for injection molding with an injection molding system (18) according to claim 12, wherein the mold insert (50) is deformed and / or the amount of injection molding compound flowing in is influenced in order to demold the injection-molded molded part.

14. The method according to claim 13, wherein during demolding the molded part is detached in a first step from an outer region of the mold insert (50) and in a second step from an inner region of the mold insert (50).

15. The method according to claim 13 or 14, wherein a cross section of a feed section is varied during the flow of the injection molding compound.

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