Use of a tertiary amine in order to improve properties of a chemical wall plug

Abstract

The invention relates to the use of at least one tertiary amine in a chemical wall plug. The at least one tertiary amine is selected from the group consisting of 2,4,6-tris[(di(C1-C6-alkyl)amino-(C1-C6-alkyliden)]phenols, 1,3,5-tris[(di(C1-C6-alkyl)amino-(C1-C6-alkyliden)]hexahydro-1,3,5-triazin, and any mixture of two or more thereof. By virtue of the aforementioned specific at least one tertiary amine, the creep behavior of a chemical wall plug at an underlying-surface temperature of approximately 30 °C to approximately 90 °C is reduced in comparison to a chemical wall plug which has a lower content of the at least one tertiary amine or which does not contain the at least one tertiary amine.

Description

[0001] Use of a tertiary amine to improve the properties of a chemical anchor

[0002] DESCRIPTION

[0003] The present invention relates to the use of at least one tertiary amine in a chemical anchor. The at least one tertiary amine is selected from the group consisting of 2,4,6-tris[(di(Ci-C6-alkyl)amino-(Ci-C6-alkylidene)]phenols, 1,3,5-tris[(di(Ci-C6-alkyl)amino-(Ci-C6-alkylidene)]hexahydro-1,3,5-triazin and any mixtures of two or more thereof. By means of this specific at least one tertiary amine, the creep behavior of a chemical anchor at a substrate temperature of approximately 30°C to approximately 90°C is reduced compared to a chemical anchor which has a lower proportion of the at least one tertiary amine or which does not contain the at least one tertiary amine.

[0004] In construction, resin systems are used for the chemical fastening of structural elements such as anchor rods, rebar, and screws in recesses such as drill holes or cracks in structures. Such resin systems are also referred to as "chemical anchors."

[0005] These resin systems can be provided as a uniform resin mass or as a system consisting of several components. Resin systems are usually available commercially as multi-component resin systems. A multi-component resin system is a resin system with several components, typically two components (two-component resin system), with (i) at least one resin component (A) and (ii) at least one hardener component (B), and optionally other separate components. The components are in separate containers so that they do not come into contact with each other during storage and prior to use and cannot react with each other. For the intended use of a multi-component resin system, components (A) and (B) and optionally other components are mixed at the desired location so that the curing reaction can take place there.

[0006] Cartridges made of plastic, ceramic or glass, for example, in which the components are separated from one another by destructible barrier walls or integrated, separate, destructible containers are suitable for storage before use; for example, as nested cartridges, preferably two-chamber cartridges, and in particular multi-component or preferably two-component cartridges, in whose chambers the components (A) and (B) of a two-component resin system are contained. By destroying the barriers in the cartridges or squeezing the cartridges using, for example, a static mixer, the two or more components are mixed. This initiates a curing reaction, i.e. polymerization, and the resin is cured.

[0007] By blending two or more components for their intended use as a chemical anchor, a mixture is created, which then cures to form a chemically cross-linked composite. The resulting cured material, i.e., the cured chemical anchor, is typically particularly load-bearing, exhibiting high strength and the ability to transfer stresses to the substrate, while maintaining the structural integrity of the chemical anchor even under load.

[0008] Chemical anchors typically cure at the intended location at the ambient temperatures prevailing in the substrate. Since chemical anchors are typically used in construction, the ambient temperatures correspond to the outside temperatures. These usually range from approximately -10°C to approximately 60°C. Depending on solar radiation and other influences, significantly higher temperatures are possible in the substrate, for example, from approximately 40°C to approximately 90°C. The mechanical properties of chemical anchors can be affected by the ambient temperature. Thus, even a temperature increase during the curing reaction can lead to a significant reduction in the load-bearing capacity of the subsequently cured chemical anchor.

[0009] The chemical anchor is also repeatedly exposed to fluctuating temperatures throughout its service life. In particular, elevated temperatures over a prolonged period can impair the load-bearing capacity of a chemical anchor. Even significantly fluctuating short-term substrate temperatures, but especially long-term elevated substrate temperatures, can have an adverse effect on the material properties of a chemical anchor during its service life.

[0010] In particular, so-called "creep," or deformation of a chemical anchor, occurs more frequently. At elevated substrate temperatures of approximately 30°C to approximately 90°C, a chemical anchor can slowly move or become permanently deformed within a period of just a few hours under the influence of sustained mechanical stresses, such as permanent loads.

[0011] With increasing global warming, higher ambient temperatures in the subsurface due to strong solar radiation can be expected in the future, which can cause the subsurface to heat up to approximately 40°C or higher, depending on the outside temperature and weather conditions. Multi-component resin systems described in the state of the art often prove unable to meet these challenges.

[0012] In order to counteract the creep tendency of chemical anchors, the development of new multi-component resin systems for use at elevated temperatures, in particular from about 40°C to about 90°C, is desirable.

[0013] A frequently used multi-component resin system for a chemical anchor is an epoxy-amine-based system. In such a multi-component resin system, the resin component (A) contains at least one curable epoxy resin, and the hardener component (B) contains at least one epoxy-reactive amine for curing the epoxy resin. Epoxy-amine systems typically include other common components, such as reactive diluents, fillers, rheology additives, accelerators, inhibitors, and / or solvents, which may be present in one or both components (A) and / or (B). Furthermore, they may optionally also contain special fillers, which themselves can contribute to strengthening through hydraulic setting, as in the case of cement.

[0014] However, it is known that epoxy-amine systems described in the prior art exhibit a significant deterioration in mechanical properties at elevated temperatures, i.e., temperatures above 20°C, but especially above approximately 40°C. As described above, this deterioration often results in a reduction in long-term stability under continuous loading, which can lead to deformation of the chemical anchor and, as a result, even to displacement in the building structure secured by the chemical anchor.

[0015] Furthermore, it is also known that the deterioration of mechanical properties in materials is related to their glass transition temperature (Tg). Chemical anchors based on epoxy-amine systems generally have a comparatively low Tg. Therefore, epoxy-amine systems often tend to creep at elevated substrate temperatures.

[0016] The primary and secondary amines contained in epoxy-amine-based resin systems are often labelled as "corrosive" (GHS05), which presents problems for the user in handling and may require protective equipment.

[0017] An object underlying the invention is therefore to provide a two-component resin system which, when used as a chemical anchor, shows improved creep behavior at an elevated substrate temperature, such as from about 30°C to about 90°C.

[0018] A further object underlying the invention is to provide a two-component resin system for a chemical anchor that has a high compressive strength after curing, for example, greater than approximately 110 MPa. A further object underlying the invention is to provide a two-component resin system for a chemical anchor that has a high glass transition temperature, for example, greater than approximately 70°C.

[0019] A further object underlying the invention is therefore to provide an environmentally friendly two-component resin system for use as a chemical anchor, in whose hardener component (B) no primary or secondary amines are used.

[0020] The objects underlying the invention are achieved by the uses defined in the independent claims. Preferred embodiments of the invention are defined in the dependent claims, whose features can be freely combined with one another unless otherwise stated.

[0021] One object of the invention is the use of at least one tertiary amine to reduce the creep of a cured chemical anchor at a substrate temperature of about 30°C to about 90°C compared to a chemical anchor which contains a lower proportion of the at least one tertiary amine or does not contain the at least one tertiary amine. The cured chemical anchor is produced by mixing components (A) and (B) of a two-component resin system and subsequent curing, wherein the two-component resin system consists of: (i) a resin component (A) comprising at least one curable epoxy resin, and (ii) a curing component (B) comprising the at least one tertiary amine. In this resin system, the tertiary amine acts as an accelerator for the curing of the epoxy resin.The at least one tertiary amine is selected from the group consisting of 2,4,6-tris[(di(Ci-C6-alkyl)amino-(Ci-C6-alkylidene)]phenols, 1,3,5-tris[(di(Ci-C6-alkyl)amino-(Ci-C6-alkylidene)]hexahydro-1,3,5-triazine and any mixtures of two or more thereof. In a preferred embodiment, it is selected from the group consisting of tris[(di(Ci-C6-alkyl)amino-(Ci-C6-alkylidene)]phenols and any mixtures of two or more thereof. In a further preferred embodiment, it is selected from the group consisting of 2,4,6-tris[(dimethylaminomethyl)phenol and 1,3,5-tris-[3-(dimethylamino)propyl]hexahydro-1,3,5-triazine and any mixtures thereof. The proportion of the at least one tertiary amine in the resin mass formed by mixing the two components (A) and (B) is from about 3 wt.% to about 20 wt.%, preferably from about 4 to about 15 wt.%, based on the at least one curable epoxy resin.

[0022] The two-component resin system used in the invention (also referred to herein as “two-component epoxy resin system”) does not comprise any primary or secondary amine.

[0023] A further object of the invention is the use of the same two-component resin system, which comprises at least one tertiary amine as defined above, as a chemical anchor for fastening structural elements and anchoring means in recesses, such as holes or cracks in a substrate, such as a structural substrate. The chemical anchor resulting from this use can bear loads at a substrate temperature of approximately 30°C to approximately 90°C after curing of the resin composition and exhibits improved creep behavior compared to chemical anchors with a lower content or no content of the tertiary amine as defined above.

[0024] The two-component resin system used for the inventive use as a chemical anchor comprises: (i) a resin component (A) comprising at least one curable epoxy resin, and (ii) a hardener component (B) comprising the at least one tertiary amine. The two-component resin system does not comprise a primary or secondary amine.

[0025] Surprisingly, it has been found that the use of a specific at least one tertiary amine in a two-component epoxy resin system in a proportion of about 3 wt.% to about 20 wt.%, preferably from about 4 to about 15 wt.%, based on the at least one curable epoxy resin, in the absence of primary and secondary amines, improves the creep behavior of a chemical anchor at a substrate temperature of about 30°C to about 90°C compared to a chemical anchor which contains a lower proportion of the at least one tertiary amine or no proportion of the at least one tertiary amine at all. It is therefore essential to the invention that the proportion of the at least one tertiary amine in the resin composition formed by mixing the two components (A) and (B) is from about 3 wt.% to about 20 wt.%, preferably from about 4 to about 15 wt.%, even more preferably from about 5 to about 10 wt.-% based on the at least one curable epoxy resin.

[0026] Furthermore, it was surprisingly found that a two-component epoxy resin system comprising at least one such tertiary amine is generally suitable as a chemical anchor and has advantageous properties, in particular at a substrate temperature of approximately 30°C to approximately 90°C.

[0027] For the purposes of the invention, the terms used here and in the following description have the following meaning:

[0028] "Two-component resin system" means a resin system comprising two separately stored components, wherein the resin system comprises at least one resin component (A) and at least one hardener component (B), so that curing only occurs after all components have been mixed.

[0029] "Epoxy resin composition" refers to a reactive composition comprising a curable epoxy resin and a suitable hardener for the curable epoxy resin. According to the invention, this composition is typically obtained by mixing the resin component (A) and the hardener component (B) and subsequently used for chemical bonding.

[0030] “Curable epoxy resin” means a resin containing reactive epoxy groups that can be reacted with a suitable curing agent to form a cured resin in a polymerization reaction, where an epoxy group, also called a glycidyl group, is a cyclic ether with a three-atom ring.

[0031] "Average epoxy functionality" describes the average number of reactive epoxy groups per molecule of one or a mixture of several curable epoxy resins. "Substrate temperature" refers to the temperature of the substrate at the contact surface with the epoxy resin mass to be cured. The substrate temperature depends on the ambient temperature, typically the outside temperature in construction, as well as possible heating from solar radiation. Heating from external heat sources such as a heating block or a fan heater is also possible. The substrate temperature can be determined using an infrared thermometer. Short-term elevated substrate temperatures are those that occur at short intervals, e.g., as a result of daily cycles. Long-term elevated substrate temperature refers to an elevated average substrate temperature over longer periods (such as weeks and months).The subsurface temperature can be determined, for example, using an infrared thermometer on the surface of the subsurface.

[0032] “Amines” are compounds derived from ammonia by replacing one, two or three hydrogen atoms with hydrocarbon groups and having the general structures RNH2 (primary amines), R2NH (secondary amines) and R3N (tertiary amines).

[0033] "Chemical anchor" refers to a curable resin compound, in the context of the present invention, a curable epoxy resin compound for chemically fastening structural elements and anchoring devices in a recess, in particular a (drilled) hole or gap in various substrates, especially structural substrates (such as masonry, concrete). After the curing reaction, a solid bond to the substrate is formed. Preferred applications are in the construction sector, for example, for fastening anchor rods, anchor bolts, (threaded) rods, (threaded) sleeves, reinforcing bars, or screws in masonry or concrete.

[0034] "Creep behavior" describes the plastic deformation, displacement, or movement of a chemical anchor due to sustained loading, a so-called permanent load. Creep behavior is primarily influenced by two factors: (i) sustained high loads, and (ii) elevated temperature. Creep behavior can be determined as described in the working examples. "Lower portion" means a portion that is 10% lower, in a preferred embodiment, a portion that is 50% lower, compared to the reference portion. In a specific, preferred embodiment, "lower portion of" also means "in the absence of."

[0035] "Aliphatic compounds" are acyclic or cyclic, saturated or unsaturated hydrocarbon compounds, excluding aromatic compounds.

[0036] "aromatic compounds" are cyclic hydrocarbon compounds that follow the Hückel (4n+2) rule.

[0037] "Alicyclic compounds" are aliphatic compounds with a carbocyclic ring structure, excluding benzene (derivatives) or other aromatic systems.

[0038] “poly”, “Poly” as a prefix means that two or more of the groups following this prefix are contained in a compound.

[0039] "a", "an", "another" as an article before a chemical compound class, e.g. before the word "filler", means that one or more compounds falling within this chemical compound class, e.g. different "fillers", can be meant; in a preferred embodiment, this term means numerically "a", "an", "another".

[0040] "at least one", "at least one", "at least one" numerically "one or more"', in a preferred embodiment this term means numerically "a", "an", "an".

[0041] “about” before a numerical value allows a deviation of ±10%, in a preferred embodiment ±5%, in a highly preferred embodiment ±1% of this numerical value, in the most highly preferred embodiment “about” means exactly this numerical value, i.e. a deviation of ±0%. “contain”, “comprise” and “include” mean that in addition to the components mentioned, further components may be present; these terms are meant inclusively and therefore also include “consist of”. “consist of” is meant conclusively and means that no further components may be present; in a preferred embodiment the terms “contain”, “comprise” and “include” mean the term “consist of”.

[0042] Unless otherwise stated, all standards cited in this text (e.g., DIN standards) were used in the current version as of the filing date of this application. All trade names correspond to the products available under these trade names at the time of the filing date of this application.

[0043] As stated above, the invention provides for the use of a two-component resin system as a chemical anchor. The components (A) and (B) of a two-component resin system used in the invention are explained in more detail below.

[0044] Curable epoxy resin

[0045] The resin component (A) of a two-component resin system used according to the invention comprises at least one curable epoxy resin. It is therefore also referred to as the "epoxy resin component" in the context of the invention.

[0046] As the at least one curable epoxy resin in the resin component (A), a large number of the compounds known to the person skilled in the art and commercially available for this purpose can be used, individually or in any desired mixtures with one another.

[0047] An epoxy resin usable according to the invention can be saturated or unsaturated, as well as aliphatic, alicyclic, aromatic, or heterocyclic, and can also contain hydroxyl groups. It can also contain substituents that do not cause disruptive side reactions under the mixing or reaction conditions according to the invention, for example, alkyl or aryl substituents, ether groups, and the like. Trimeric and tetrameric epoxides are also suitable within the scope of the invention. Epoxy resins are preferably liquid and generally have an average molecular weight of MW < 2000 g / mol.

[0048] The curable epoxy resin preferably has an average epoxy functionality of about 1.5 or greater, more preferably about 2 or greater, more preferably from about 2 to about 10, even more preferably from about 2 to about 3, most preferably about 2.

[0049] A curable epoxy resin used in the present invention may have an epoxy equivalent weight (EEW) of about 120 to about 2000 g / eq, preferably from about 140 to about 400 g / eq, more preferably from about 155 to about 300 g / eq, most preferably from 158 to 290 g / eq. Curable epoxy resins having the EEWs specified in the embodiments are particularly preferred.

[0050] Preferably, the at least one curable epoxy resin is a glycidyl ether derived from a polyhydric alcohol, in particular from a polyhydric phenol, such as bisphenol and novolak. Examples of such suitable epoxy resins are compounds selected from the group of diglycidyl ethers based on resorcinol, hydroquinone, 2,2-bis(4-hydroxyphenyl)propane (bisphenol A), isomer mixtures of dihydroxyphenylmethane (bisphenol F), tetrabromobisphenol A, novolaks, 4,4'-dihydroxyphenylcyclohexane, and 4,4'-dihydroxy-3,3'-dimethyldiphenylpropane. Particular preference is given to curable epoxy resins selected from the group of diglycidyl ethers based on bisphenol A and bisphenol F and mixtures thereof, in particular the mixtures used in the exemplary embodiments.

[0051] A preferred example of a commercially available bisphenol F-based epoxy resin containing bisphenol F diglycidyl ether is Araldite GY 282. An example of a commercially available bisphenol A-based epoxy resin containing bisphenol A diglycidyl ether is Araldite GY 240.

[0052] In a further preferred embodiment, the at least one curable epoxy resin is an epoxy resin produced from renewable sources. Such epoxy resins from renewable sources are, for example, isosorbide diglycidyl ether (CAS 13374-44-2), limonene 1,2:8,9-dioxide (LDO, CAS 96-08-2), vanillin diglycidyl ether (DGEVA, CAS 1584677-14-4), phloroglycinol triglycidyl ether (PTHE, CAS 4223-14-7), vanillic acid bisepoxide (CAS 1393710-63-8), and epoxidized vegetable oil, such as. E.g. epoxidized castor oil (CAS 105839-17-6, commercially available as Erisys GE 35-H from Huntsman, Belgium) and epoxidized cardanol oil (mixture containing, among others, CAS 1260636-34-7 and CAS 63284-28-6).In addition to Erisys GE 35-H, examples of bio-based polyepoxides commercially available in larger quantities that can be used in the context of the invention include Erisys GE 60 and GE 61 (epoxy resin based on sorbitol; Huntsman, Belgium) and Araldite DY-S (epoxy resin based on polyglycerol; Huntsman, Belgium).

[0053] The proportion of the at least one curable epoxy resin in the resin component (A) is >0 to 100 wt.%, preferably from about 20 to about 90 wt.%, more preferably from about 30 to about 85 wt.%, and particularly preferably from about 40 to about 80 wt.%, based on the total weight of the resin component (A).

[0054] The proportion of the at least one curable epoxy resin after mixing components (A) and (B) is approximately 30 wt.% to approximately 70 wt.% based on the total weight of the mixed components (A) and (B), preferably approximately 40 wt.% to approximately 65 wt.% based on the total weight of the mixed components (A) and (B).

[0055] Tertiary amine

[0056] The hardener component (B) of a two-component resin system for use according to the invention comprises at least one tertiary amine selected from the group consisting of 2,4,6-tris[(di(Ci-C6-alkyl)amino-(Ci-C6-alkylidene)]phenols, 1,3,5-tris[(di(Ci-C6-alkyl)amino-(Ci-C6-alkylidene)]hexahydro-1,3,5-triazin and any mixtures of two or more thereof.

[0057] In a preferred embodiment, the at least one tertiary amine is selected from the group consisting of tris[(di(Ci-C6-alkyl)amino-(Ci-C6-alkylidene)]phenols and any mixtures of two or more thereof. In a further preferred embodiment, the at least one tertiary amine is selected from the group consisting of 2,4,6-tris[(dimethylaminomethyl)phenol and

[0058] 1,3,5-Tris-[3-(dimethylamino)propyl]hexahydro-1,3,5-triazine and any mixtures thereof.

[0059] In a particularly preferred embodiment, the at least one tertiary amine is

[0060] 2.4.6-Tris(dimethylaminomethyl)phenol.

[0061] Commercially available is 2,4,6-Tris-(dimethylaminomethyl)phenol under the trade name Ancamine® K54 and 1,3,5-Tris[3-(dimethylamino)propyl]hexahydro-1,3,5-triazine under the trade name Lupragen® N600. Commercially available Ancamine® K54 in technical grade may contain as impurities 2,4,6-Tris(di-C2-C1-alkylamino)phenol, 2,4,6-Tris(dimethylamino)phenol and / or

[0062] Contains bis[(dimethylamino)methyl]phenol.

[0063] In a particularly preferred embodiment, 2,4,6-tris-(dimethylaminomethyl)phenol is used for the use according to the invention to improve the creep behavior of a chemical anchor.

[0064] The proportion of the at least one tertiary amine in the resin composition formed by mixing the two components (A) and (B) is from about 3 wt.% to about 20 wt.%, preferably from about 4 to about 15 wt.%, more preferably from about 5 to about 10 wt.%, based on the at least one curable epoxy resin.

[0065] Other components of components (A) and (B)

[0066] Both the resin component (A) and the hardener component (B), as well as both components (A) and (B), typically comprise at least one further component in addition to the curable epoxy resin or the at least one tertiary amine. Other common components include, in particular, reactive diluents, fillers, rheological additives (thixotropic agents), adhesion promoters, and solvents.

[0067] Depending on the desired effect of a further component, it may be preferable for the at least one further component to be contained only in the resin component (A), only in the hardener component (B), or in both components. Reactive diluents

[0068] In one embodiment, the resin component (A) and / or the curing component (B), preferably at least the resin component (A), can contain at least one reactive diluent. Glycidyl ethers of aliphatic, alicyclic, or aromatic mono- or, in particular, polyalcohols, which have a lower molecular mass and viscosity than the curable epoxy resins described above, are used as reactive diluents.

[0069] Examples of suitable reactive diluents are monoglycidyl ethers, e.g. o-cresyl glycidyl ether, and glycidyl ethers with an epoxide functionality of at least 2, such as 1,4-butanediol diglycidyl ether (BDDGE), cyclohexanedimethanol diglycidyl ether and hexanediol diglycidyl ether (HDDGE), as well as tri- or higher glycidyl ethers, such as glycerol triglycidyl ether, pentaerythritol tetraglycidyl ether, trimethylolpropane triglycidyl ether (TMPTGE) or trimethylolethane triglycidyl ether (TMETGE), with BDDGE, HDDGE, trimethylolpropane triglycidyl ether and trimethylolethane triglycidyl ether being preferred. Mixtures of two or more of these reactive diluents can also be used, preferably mixtures containing triglycidyl ether, particularly preferably as a mixture of 1,4-butanediol diglycidyl ether (BDDGE) and trimethylolpropane triglycidyl ether (TMPTGE) or of 1,4-butanediol diglycidyl ether (BDDGE) and trimethylolethane triglycidyl ether (TMETGE).

[0070] Particularly preferred are the reactive diluents used in the examples and the mixtures thereof used therein.

[0071] The at least one reactive diluent, if present, is preferably present in a proportion of >0 to about 30 wt.% based on the total weight of the component in which the reactive diluent is present (for example the resin component (A)), in particular in a proportion of about 10 to about 25 wt.% based on the total weight of the component.

[0072] Fillers

[0073] Both the resin component (A) and the hardener component (B), as well as both components (A) and (B), can contain at least one filler. It is preferred that both the resin component (A) and the hardener component (B) each contain at least one filler.

[0074] Preferred fillers are inorganic fillers, particularly quartz, aluminum oxide, glass, corundum, porcelain, earthenware, barite, light spar, gypsum, talc, cements (such as Portland cement or aluminate cement), and / or chalk, as well as mixtures thereof. The inorganic fillers can be added in the form of particles (e.g., powders, sands, or flours) or molded bodies (the latter preferably in the form of fibers or spheres). By appropriately selecting the fillers with regard to type and particle size distribution, particle size, or (fiber) length, application-relevant properties such as rheological behavior, extrusion forces, internal strength, tensile strength, pull-out forces, and impact strength can be controlled.

[0075] Suitable fillers include non-surface-treated quartz flours, fine quartz flours, and ultra-fine quartz flours, such as Millisil W3, Millisil W6, Millisil W8, and Millisil W12, preferably Millisil W12. Silanized quartz flours, fine quartz flours, and ultra-fine quartz flours can also be used. These are commercially available, for example, as part of the Silbond product series from Quarzwerke. The Silbond EST (epoxysilane-treated) and Silbond AST 25 (aminosilane-treated) product series are particularly preferred. Furthermore, aluminum oxide-based fillers such as aluminum oxide fine filler of the type ASFP from Denka, Japan, (dso = 0.3 pm) or qualities such as DAW or DAM with the type designations 45 (dso < 0.44 pm), 07 (dso > 8.4 pm), 05 (dso < 5.5 pm), 03 (dso < 4.1 pm) can be used.Furthermore, surface-treated fine and ultrafine fillers such as Aktisil AM 30 (aminosilane-treated, d50 = 2.2 pm) and Aktisil EM (epoxysilane-treated, d50 = 2.2 pm) from Hoffman Mineral can be used. The fillers can be used individually or in any desired mixture. Non-surface-treated quartz powder, especially Millisil W12, is particularly preferred.

[0076] The proportion of fillers in the resin component (A) is preferably from about 1 to about 60 wt. %, more preferably from about 15 to about 45 wt. %, based on the total weight of the resin component (A). The proportion of fillers in the hardener component (B) is preferably from about 1 to about 50 wt. %, more preferably from about 5 to about 40 wt. %, based on the total weight of the hardener component (B). The total filler content of an epoxy resin composition comprising components (A) and (B), when at least one filler is present, is in a range from >0 to about 60 wt. %, preferably in a range from about 10 to about 55 wt. %, even more preferably in a range from about 30 to about 50 wt. %. The total filler content of the epoxy resin composition refers to the percentage by weight of all fillers present, based on the total weight of component (A) and component (B).

[0077] Rheology additives

[0078] Other optional ingredients include rheology additives to adjust flow properties. Suitable rheology additives include:

[0079] In one embodiment, the resin component (A), the hardener component (B) or both components may contain at least one rheology additive.

[0080] Suitable rheology additives include (optionally organically post-treated) fumed silica, cellulose or cellulose derivatives such as cellulose esters, alkyl and methylcelluloses, and castor oil derivatives, phyllosilicates such as laponites, bentonites, or montmorillonite, Neuburg Siliceous Earth, fumed silica, polysaccharides, polyacrylate, polyurethane, or polyurea thickeners, or mixtures of two or more thereof. Organically post-treated fumed silica is particularly preferred.

[0081] The proportion of rheology additive, if present, after mixing components (A) and (B) is preferably about 1 wt.% to about 6 wt.% based on the total weight of components (A) and (B), preferably about 1 wt.% to about 5 wt.% based on the total weight of components (A) and (B).

[0082] In a preferred embodiment, component (A) and / or component (B) of a two-component resin system according to the invention comprises quartz flour as a filler and silica as a rheology additive. Further optional components

[0083] Furthermore, adhesion promoters can be used to improve cross-linking with the substrate (e.g. a (bore) hole wall).

[0084] Suitable adhesion promoters are silanes that have at least one Si-bonded hydrolyzable group. Preferred examples are 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, N-2-(aminoethyl)-3-aminopropylmethyldiethoxysilane, N-2-(aminoethyl)-3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-phenyl-3-aminoethyl-3-aminopropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-mercaptopropylmethyldimethoxysilane, and trimethoxysilylpropyldiethylenetetramine, as well as mixtures thereof. Other suitable silanes are described, for example, in EP 3 000 792 A1.

[0085] Furthermore, solvents can be used in the two-component resin system, for example, to deliberately slow down curing times or to change the gel time. Preferred solvents can include monohydric, dihydric, or polyhydric alcohols, preferably a dihydric alcohol. A polyhydric alcohol is understood here to mean a trihydric or higher alcohol. Component (B) can very preferably comprise a dihydric alcohol, in particular dipropylene glycol. Alternatively, component (B) can very preferably comprise benzyl alcohol.

[0086] For optimization, wetting and dispersing agents, phlegmatizing agents, surface additives, plasticizers such as phthalic acid or sebacic acid esters, wax additives, stabilizers, antistatic agents, flexibilizers, curing catalysts, other reaction rate controllers, defoamers and deaerators, viscosity reducers or other process additives can also be added.

[0087] Coloring additives such as dyes or pigments are also conceivable, for example, to color the components differently for better control of their mixing. Mixing ratio of components (A) and (B)

[0088] According to the invention, it is preferred that the curable epoxy resin comprised by component (A) and the at least one tertiary amine comprised by component (B) are present in a non-stoichiometric ratio, wherein the proportion of the at least one tertiary amine in the resin composition formed by mixing the two components (A) and (B) is from about 3 wt.% to about 20 wt.%, preferably from about 4 to about 15 wt.%, even more preferably from about 5 to about 10 wt.%, based on the at least one curable epoxy resin.

[0089] When the curable epoxy resin in component (A) and the at least one tertiary amine in component (B) are present in a non-stoichiometric ratio, the two-component resin system according to the invention can cure particularly quickly. In this way, greater adhesive strengths, high compressive strengths, high glass transition temperatures, and reduced creep of the resulting cured system can also be achieved.

[0090] The mixture is typically produced in an injection device via a static mixer when the two components (A) and (B) are squeezed out of two separate chambers. Therefore, typical mixing ratios of components A:B are about 1:1 (v / v), about 2:1 (v / v), about 3:1 (v / v), about 5:1 (v / v) or about 10:1 (v / v). In a preferred embodiment, the mixing ratio is from about 1:1 (v / v) to about 15:1 (v / v), more preferably from about 3:1 (v / v) to about 10:1 (v / v), in particular about 3:1 (v / ) or about 10:1 (v / v), most preferably about 10:1 (v / v).

[0091] use

[0092] When used according to the invention, the resin component (A) and the hardener component (B) are mixed using a suitable device, for example, a static mixer as described above or a dissolver, resulting in an epoxy resin compound. When used as a chemical anchor, the mixing takes place directly in front of or in a recess, for example, a hole (preferably a drilled hole) or gap, and the epoxy resin compound is then injected into the (possibly previously cleaned) hole or gap using a known injection device. The component to be fixed is then inserted into the epoxy resin compound and adjusted. The resin compound then hardens.

[0093] The hardener component (B) cures the epoxy resin contained in the resin component (A) so that the epoxy resin mass forms a polymer at the application site under ambient conditions, e.g. at the construction site, within a desired time. In the chemical reaction, the at least one tertiary amine, such as 2,4,6-tris(dimethylaminomethyl)phenol, has the role and function of an accelerator. This chemical reaction also depends on the temperature, the humidity in the environment and the substrate, the chemical composition of the substrate, and the other constituents of components (A) and (B). Ambient conditions can vary, such as low temperatures (e.g. 5°C) or high temperatures (e.g. 40°C) during the night-day cycles.

[0094] In one embodiment, the resin composition cures at an ambient temperature of about 10°C to about 35°C, preferably from about 20°C to about 30°C. In another embodiment, the resin composition cures at an elevated ambient temperature of about 30°C to about 90°C, preferably from about 40°C to about 80°C.

[0095] As described above, the curing reaction can be influenced by several factors and can therefore last from several hours to several days. Typically, the curing reaction can last between approximately 24 hours and approximately 72 hours. Preferably, complete curing can be achieved after a curing time of approximately 48 hours.

[0096] A two-component resin system as described herein is preferably used for construction purposes according to the invention. The term "for construction purposes" means the bonding of construction materials, in particular concrete / concrete, steel / concrete, or steel / steel, or of one of the aforementioned materials to other mineral materials; the structural reinforcement of components made of concrete, masonry, and other mineral materials; the reinforcement of building objects with fiber-reinforced polymers; the chemical fastening on or in surfaces made of concrete, steel, or other mineral materials, in particular the chemical fastening of structural elements and anchoring devices, such as anchor rods, anchor bolts, (threaded) rods, (threaded) sleeves, reinforcing bars, screws, and the like, in recesses, in particular in (drilled) holes or crevices in various substrates, such as (reinforced) concrete, masonry, other mineral materials, metals (e.g., steel), ceramics, plastics, glass, and wood.

[0097] Most preferably, a two-component resin system comprising the at least one tertiary amine is used for the chemical fixing of anchoring elements in a hole (in particular a borehole) or gap in a substrate (in particular a building substrate).

[0098] The ambient temperature may fluctuate over the lifetime of a chemical anchor after it has cured. Typically, the ambient temperature is from about -10°C to about 60°C, preferably from about -5°C to about 50°C, more preferably from about 0°C to about 40°C. For example, the ambient temperature may be about 30°C.

[0099] However, the subsurface temperature may be correspondingly higher, which is usually the case in construction when there is strong sunlight or an external heat source.

[0100] Use according to the invention preferably occurs at a substrate temperature of about 30°C to about 90°C, preferably about 35°C to about 85°C, more preferably from about 40°C to about 80°C, and even more preferably from about 45°C to about 75°C. At such a substrate temperature, the use of the at least one tertiary amine can improve the creep behavior.

[0101] In a preferred embodiment, the chemical anchor, after curing, is capable of temporarily or permanently supporting loads at a substrate temperature of approximately 30°C to approximately 90°C.

[0102] Preferred embodiments of the invention have, with respect to component (A), the

[0103] Component (B), and the resin mass produced by mixing components (A) and (B), the following features:

[0104] In a preferred embodiment, component (A) of a two-component resin system used according to the invention comprises bisphenol F diglycidyl ether and bisphenol A diglycidyl ether.

[0105] In a more preferred embodiment, component (A) of a two-component resin system used according to the invention comprises bisphenol F diglycidyl ether and bisphenol A diglycidyl ether, as well as 1,4-butanediol diglycidyl ether, trimethylolpropane triglycidyl ether, quartz flour and silica.

[0106] In a particularly preferred embodiment, component (A) of a two-component resin system used according to the invention comprises from about 20 to about 40% by weight of bisphenol F diglycidyl ether, from about 10 to about 25% by weight of bisphenol A diglycidyl ether, and from about 2 to about 10% by weight of 1,4-butanediol diglycidyl ether, from about 4 to about 8% by weight of trimethylolpropane triglycidyl ether, from about 25 to about 55% by weight of quartz flour and from about 2 to about 4% by weight of silica, based on the total weight of component (A).

[0107] In a preferred embodiment, component (B) comprises from about 30 to about 70 wt.% 2,4,6-tris(dimethylaminomethyl)phenol, based on the total weight of component (B).

[0108] In a further preferred embodiment, component (B) of a two-component resin system used according to the invention comprises from about 25 to about 55 wt.% quartz flour and from about 2 to about 6 wt.% silica, based on the total weight of component (B). In a particularly preferred embodiment, component (B) comprises from about 30 to about 70 wt.% 2,4,6-tris(dimethylaminomethyl)phenol, from about 25 to about 55 wt.% quartz flour, and from about 2 to about 6 wt.% silica, each based on the total weight of component (B).

[0109] Components A+B:

[0110] Particularly preferred as components of a two-component resin system used according to the invention are the combinations of epoxy resins, reactive diluents, rheology additives, and fillers with 2,4,6-tris(dimethylaminomethyl)phenol used in the example compositions, particularly in the weight proportions used therein and very particularly preferably in combination with the other constituents of components (A) and (B) used therein. Most preferred are those compositions of components (A) and (B) described in the examples.

[0111] In a particularly preferred embodiment, component (A) and component (B) of a two-component resin system used according to the invention are mixed in a mixing ratio of A:B of about 10:1 (v / v), wherein component (A) comprises from about 20 to about 40 wt.% bisphenol F diglycidyl ether, from about 10 to about 25 wt.% bisphenol A diglycidyl ether, and from about 2 to about 10 wt.% 1,4-butanediol diglycidyl ether, from about 4 to about 8 wt.% trimethylolpropane triglycidyl ether, from about 25 to about 55 wt.% quartz flour and from about 2 to about 4 wt.% silica, based on the total weight of component (A); and wherein component (B) comprises from about 30 to about 70 wt.% 2,4,6-tris(dimethylaminomethyl)phenol, from about 25 to about 55 wt.% quartz flour, and from about 2 to about 6 wt.% silica based on the total weight of component (B).

[0112] The invention is further described below with reference to exemplary embodiments, which, however, should not be understood in a limiting sense. Description of the figures

[0113] Fig. 1 shows the graphical representation of Log(G'), Log(G") and Tan(delta) from

[0114] DMTA measurements (comparison examples in bold).

[0115] Fig. 2 shows the displacement due to creep at 43°C

[0116] EXAMPLES OF IMPLEMENTATION

[0117] Production of components (A) and (B)

[0118] The ingredients used for components (A) and (B) are listed in Table 1.

[0119] Table 1 : Components used i ! I | < I

[0120] To prepare the resin component (A), its liquid components were first mixed with a wooden spatula. Then, quartz powder and silica were added and stirred for 8.5 min, first manually with the wooden spatula and then in a dissolver (PC laboratory system, volume 1 L) at 80 mbar and 3500 rpm.

[0121] For Comparative Examples 1 and 2, an 80% solution of calcium nitrate in glycerol was used. 400 g of Ca(NO3)2 tetrahydrate was added to 100 g of glycerol and stirred at 50°C for approximately 3 hours until the salt was completely dissolved.

[0122] To prepare the hardener component (B), m-xylylenediamine (mXDA) and / or 2,4,6-tris(dimethylaminomethyl)phenol were first placed in a plastic bucket. For Comparative Examples 1 and 2, the calcium nitrate solution was added and mixed manually with a wooden spatula. The quartz powder and silica were then added to the resulting mixture and stirred in a dissolver (PC laboratory system, volume 1 L) at 80 mbar and 3500 rpm for 8.5 min.

[0123] Preparation for the use of components (A) and (B)

[0124] For Comparative Examples 1 and 2, components (A) and (B) were mixed together for 30 seconds shortly before use using a speed mixer (Hauschild, Hamm) in the ratios specified below in Table 2. For use as a chemical anchor, the resulting mixture was filled into a single-component cartridge immediately after mixing. The material was injected directly into the borehole through a nozzle from the single-component cartridge.

[0125] For the example according to the invention, components (A) and (B) were filled into a hard cartridge at the desired mixing ratio (10:1 (v / v)). For injection into the borehole, a static mixer was connected to the hard cartridge, and the epoxy resin mixture was metered using a dispenser. The epoxy resin mixture was injected after the first three triggers had been disposed of to ensure proper mixing of both components.

[0126] Measurement methods for the characterization of two-component resin systems Pull-out tests from concrete

[0127] In accordance with EAD 330499-01-0601, 14 mm diameter holes were drilled into a horizontal concrete slab (C20 / 25) using a hammer drill. The holes were cleaned (2x blowing out with 6 bar compressed air, 2x brushing, and 2x blowing out with 6 bar compressed air). The holes were then filled two-thirds full, starting from the bottom of the hole, with the epoxy resin compound to be tested, which was prepared from the respective components (A) and (B) as described above. A steel threaded rod (M12) was manually pressed into the hole to an embedment depth of 60 mm. The excess epoxy resin compound was removed using a spatula. Curing took place at the temperature and for the time specified for each test. The threaded rod was then withdrawn until failure, and the tensile strength (in MPa) was measured.The tensile strength was determined three times and the standard deviation (SD) was calculated.

[0128] Compressive strength

[0129] The specimens were prepared as described above for the pull-out tests and cured as described below for each test. Curing took place in a PE pipe with an inner diameter of 6 mm. The specimens were then cut to a length of 10 mm (plane-parallel surfaces). The specimens were conditioned for 5 days at 23°C and 50% relative humidity. The determination of the compressive strength and the associated Young's modulus was carried out in accordance with DIN EN ISO 604:2003-12 at a test speed of 1 mm / min. The measurement was performed using a testing machine from Zwick Roell.

[0130] Thermomechanical analysis (DMTA, Dynamic mechanical thermal analysis)

[0131] To determine the thermomechanical properties of a cured epoxy resin mixture, sample cylinders with a diameter of 1 cm and a length of 5 cm were prepared. The epoxy resin mixture was pressed into a PE pipe with an inner diameter of 6 mm and cured for 24 hours at 25°C. The PE pipe, filled with the now-cured epoxy resin mixture, was then cut into 5 cm long pieces, and the epoxy resin cylinders were pressed out of the PE pipe. The cylinders were then stored for 5 days in a temperature-controlled chamber at 23°C and 50% relative humidity before being measured with a HAAKE MARS rheometer.

[0132] In the subsequent DMTA experiments, the storage modulus (G 1), the loss modulus (G") and the loss angle tan delta (δ) were determined as a function of temperature in accordance with DIN EN ISO 6721-11:2019-06. From the obtained curves, the glass transition temperature (Tg) could be determined from the peak in the loss modulus curve.

[0133] Creep behavior

[0134] The specimens were prepared as described above for the pull-out tests and cured for 24 hours at 23°C. After subsequent 24 hours of storage at 43°C, creep tests were also conducted at 43°C. To investigate the creep behavior, a creep test was conducted as described above with a continuous load of 21 kN according to EAD 330499-01-0601, and the displacement of the threaded rod was measured over time.

[0135] Results

[0136] Table 2 lists the proportions of the individual components in components (A) and (B) in (comparative) examples 1 and 2 in weight percent (wt%).

[0137] Table 2: (Comparative) examples 1 and 2

[0138] The epoxy resin mixtures of Examples 1 and 2, as well as Comparative Examples 1 and 2, were prepared from components (A) and (B) according to Table 2. The pull-out tests were then carried out as described above. For this purpose, the epoxy resin mixtures were first cured for 24 hours at 25°C and then for 24 hours at 80°C. The tensile strength of the cured chemical anchors was determined as described above.

[0139] Table 3 shows the measurement results for Comparative Examples 1 and 2, as well as Examples 1 and 2. The tensile strength of all chemical anchors tested was at the same level. This suggests that chemical anchors manufactured according to the invention can achieve tensile strengths just as high as those described in the prior art and made from epoxy-amine systems with primary amines. Furthermore, the result shows that a high proportion of 2,4,6-tris(dimethylaminomethyl)phenol, as in Example 1, exhibits a comparable tensile strength to a chemical anchor with a lower proportion of 2,4,6-tris(dimethylaminomethyl)phenol.

[0140] Table 3: Measurement results of the pull-out tests from concrete

[0141] The compressive strength was determined as described above for Comparative Example 1 and Example 1. For the compressive strength measurement, the chemical anchors were cured for 5 days at 25°C.

[0142] The compressive strength test results in Table 4 show an improvement in compressive strength in Example 1 with an inventive proportion of 2,4,6-tris(dimethylaminomethyl)phenol compared to Comparative Example 1 without 2,4,6-tris(dimethylaminomethyl)phenol.

[0143] Table 4: Compressive strength determined by pull-out tests from concrete Both the compressive strength and the modulus of elasticity are significantly higher in Example 1 than in Comparative Example 1.

[0144] To determine the mechanical properties at elevated temperatures, DMTA experiments were carried out with chemical anchors prepared according to Comparative Example 2 and Inventive Example 1 as described above.

[0145] From the DMTA data (see Figure 1), the glass transition temperature Tg was determined as the maximum of the tan (delta). It was 66°C for Comparative Example 2 and 80°C for Example 1 according to the invention, see Table 5. Example 1 showed a higher Tg and a later G' in the measurement. These are advantageous when the cured epoxy resin mixture is used as a chemical anchor at elevated temperatures, since these data imply that the chemical anchor can withstand higher loads at an elevated substrate temperature, such as above approximately 30°C, in particular above approximately 40°C. This elevated glass transition temperature Tg is attributable to the inventive proportion of 2,4,6-tris(dimethylaminomethyl)phenol.

[0146] Table 5: Glass transition temperature determined by DMTA measurements

[0147] To investigate the creep behavior of the chemical anchors at elevated temperatures, the chemical anchors were prepared as described in the pull-out tests and cured for 24 hours at 23°C. After a further 24 hours of storage at 43°C, the creep tests were conducted with a continuous load of 21 kN as described above. Two chemical anchors manufactured according to Example 1 and two chemical anchors manufactured according to Comparative Example 2 were compared.

[0148] The observed creep-induced displacement of the chemical anchors over time is shown in Figure 2. During the first few hours, a more significant displacement, known as primary creep, occurs, with a steady-state phase, known as secondary creep, occurring after approximately 8 hours. Displacement measurements continued for 200 hours, reaching a plateau in the displacement curve. For a comparative analysis of the chemical anchors, the displacement after 8 hours was used for the evaluation. Both chemical anchors of inventive example 1 showed less displacement than those of comparative example 2.

[0149] These results demonstrate that creep when used at elevated temperatures was lower for the example with a high proportion of 2,4,6-tris(dimethylaminomethyl)phenol than for the comparative example with a low proportion of 2,4,6-tris(dimethylaminomethyl)phenol. Thus, a certain proportion of 2,4,6-tris(dimethylaminomethyl)phenol is essential to the invention for reducing the creep of a chemical anchor.

Claims

PATENT CLAIMS 1. Use of at least one tertiary amine to reduce the creep of a cured chemical anchor at a substrate temperature of about 30°C to about 90°C compared to a chemical anchor with a lower or no proportion of the at least one tertiary amine, wherein the cured chemical anchor was produced by mixing components (A) and (B) of a two-component resin system and subsequent curing, wherein the two-component resin system consists of: a resin component (A) comprising at least one curable epoxy resin, and a curing component (B) comprising the at least one tertiary amine, wherein the at least one tertiary amine is selected from the group consisting of 2,4,6-tris[(di(Ci-C6-alkyl)amino-(Ci-C6-alkylidene)]phenols, 1,3,5-tris[(di(Ci-C6-alkyl)amino-(Ci-C6- alkylidene)]hexahydro-1,3,5-triazines and any mixtures of two or more thereof,wherein the proportion of the at least one tertiary amine in the resin composition formed by mixing the two components (A) and (B) is from about 3 wt.% to about 20 wt.% based on the at least one curable epoxy resin, and wherein the two-component resin system comprises no primary and no secondary amine.

2. The use according to claim 1, wherein the substrate temperature is from about 35°C to about 85°C, preferably from about 40°C to about 80°C.

3. Use of a two-component resin system as a chemical anchor for fastening a construction element or anchoring means in a depression in a substrate, wherein the two-component resin system consists of the following components: a resin component (A) comprising at least one curable epoxy resin, and a hardener component (B) comprising at least one tertiary amine, wherein components (A) and (B) are mixed before use, resulting in a resin mass, wherein the proportion of the at least one tertiary amine in the resin mass formed by mixing the two components (A) and (B) is from about 3% by weight to about 20% by weight.-% based on the at least one curable epoxy resin, wherein the at least one tertiary amine is selected from the group consisting of 2,4,6-tris[(di(Ci-C6-alkyl)amino-(Ci-C6-alkylidene)]phenols, 1,3,5-tris[(di(Ci-C6-alkyl)amino-(Ci-Cß-alkylidene)]hexahydro-1,3,5-triazines and any mixtures thereof, preferably selected from the group consisting of 2,4,6-tris[(di(Ci-C6-alkyl)amino-(Ci-C6-alkylidene)]phenols and any mixtures thereof, wherein the two-component resin system comprises no primary and no secondary amine.

4. The use according to any one of the preceding claims, wherein the at least one tertiary amine is selected from the group consisting of 2,4,6-tris[(di(Ci-C6-alkyl)amino-(Ci-C6-alkylidene)]phenols, 1,3,5-tris[3-(dimethylamino)propyl]hexahydro-1,3,5-triazine and any mixtures of two or more thereof, preferably from the group consisting of 2,4,6-tris[(di(Ci-C6-alkyl)amino-(Ci-C6-alkylidene)]phenols and any mixtures of two or more thereof.

5. The use according to any one of the preceding claims, wherein the at least one tertiary amine is selected from the group consisting of 2,4,6-tris(dimethylaminomethyl)phenol and 1,3,5-tris[3-(dimethylamino)propyl]hexahydro-1,3,5-triazine and any mixtures thereof, and is preferably 2,4,6-tris(dimethylaminomethyl)phenol.

6. The use according to any one of the preceding claims, wherein the proportion of the at least one tertiary amine in the resin composition formed by mixing the two components (A) and (B) is from about 4 wt.% to about 15 wt.%, preferably from about 5 to about 10 wt.%, based on the at least one curable epoxy resin.

7. The use according to any one of the preceding claims, wherein the at least one curable epoxy resin is a compound selected from the group consisting of glycidyl ethers of polyhydric phenols having a glycidyl group functionality of about 1.5 or greater and epoxidized vegetable oils, as well as mixtures of two or more thereof; preferably from the group consisting of glycidyl ethers based on resorcinol, bisphenol A, bisphenol F, as well as mixtures of two or more thereof; especially from the group consisting of glycidyl ethers based on bisphenol A, bisphenol F, as well as mixtures of two or more thereof.

8. The use according to any one of the preceding claims, wherein the at least one curable epoxy resin is present after mixing components (A) and (B) in about 30 wt.% to about 70 wt.% based on the total weight of components (A) and (B), preferably in about 40 wt.% to about 65 wt.% based on the total weight of components (A) and (B).

9. The use according to any one of the preceding claims, wherein the two-component resin system additionally comprises at least one reactive diluent, wherein the reactive diluent is contained in component (A).

10. The use according to any one of the preceding claims, wherein the two-component resin system additionally comprises at least one filler, wherein the filler is contained in either component (A) or component (B) or in both components (A) and (B).

11. The use according to claim 10, wherein the at least one filler is selected from the group consisting of quartz sand, glass, corundum, porcelain, earthenware, barite, feldspar, granulated blast furnace slag, gypsum, cement (for example Portland cement), talc, fly ash, limestone, and any mixtures of two or more thereof.

12. The use according to claim 10 or 11, wherein the at least one filler is present after mixing of components (A) and (B) in about 10 wt.% to about 55 wt.% based on the total weight of components (A) and (B), preferably in about 30 wt.% to about 50 wt.% based on the total weight of components (A) and (B).

13. The use according to any one of the preceding claims, wherein the two-component resin system additionally comprises at least one thixotropic agent, wherein the at least one thixotropic agent is contained either in component (A) or in component (B) or in both components (A) and (B), and wherein the at least one thixotropic agent is selected from the group consisting of organically post-treated pyrogenic silica, bentonites, alkyl and methyl celluloses and castor oil derivatives, as well as any mixtures of two or more thereof.

14. The use according to claim 13, wherein the at least one thixotropic agent is present after mixing components (A) and (B) in about 1 wt.% to about 6 wt.% based on the total weight of components (A) and (B), preferably in about 2 wt.% to about 5 wt.% based on the total weight of components (A) and (B).

15. The use according to any one of the preceding claims, wherein the two components (A) and (B) are initially present in two separate chambers of an injection system and are pressed out of the respective chambers immediately before use and mixed via a static mixer, the resulting resin mass being injected from the tip of the static mixer into a hole or crack in the substrate to subsequently harden there.

16. The use according to any one of the preceding claims for chemically fixing a structural element or anchoring means selected from the group consisting of anchor rods, anchor bolts, threaded strands, threaded sleeves, concrete iron, reinforcing iron and screws in a substrate selected from the group consisting of concrete, masonry, steel, ceramics, plastics, glass, wood, and any combinations thereof.

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