2k-epoxy mortar with styrenated phenol in the resin component

Abstract

A multi-component, in particular two-component synthetic resin system for fastening purposes, in particular for fastening an anchoring element in a construction substrate, comprises an epoxy resin component (A) which contains epoxy resin and at least phenol styrenated in the epoxy resin component, and a curing agent component (B) which contains a curing agent.

Description

[0001] 2K epoxy mortar with styrenated phenol in the resin component

[0002] The invention relates to one- or (preferably) multi-component (in particular two-component) synthetic resin systems for fastening purposes, in particular for fastening anchoring elements in a building substrate, comprising an epoxy resin component (A) which contains an epoxy resin (containing one or more curable epoxies) and styrenated phenol, and a hardener component (B) which contains one or more hardeners (in particular amine hardeners). The invention also relates in particular to the use of such a synthetic resin system and methods using the same, as well as to the use of styrenated phenol as a constituent of the epoxy resin component of such a synthetic resin system, in particular for adjusting its viscosity and for producing two-component synthetic resin systems with a volume ratio of epoxy resin component to hardener component of 5:1 or greater.Non-aqueous synthetic resin systems are preferred in all variants of the invention, that is to say in particular those which are not present as dispersions of the organic constituents of one or more of the components before use - however, smaller mass fractions of water which may be present in the components as a result of production and / or storage, e.g. of each component (in particular 0.1%) up to 3%, are not excluded here.

[0003] Multi- (or two-) component epoxy-based compounds are known in principle in fastening technology in construction for the fastening of anchoring elements in holes or gaps in building substrates.

[0004] It should be noted that such systems usually have a

[0005] Volume ratio of epoxy component to hardener component (epoxy component : hardener component) in the range of 5 : 1 or mostly 3 : 1 or 1 : 1.

[0006] Formulating systems with higher volume ratios, such as 10:1, has so far been virtually impossible for epoxy-based products. The reason for this is that the significant reduction in resin concentration required to achieve the correct mixing ratio, for example, through fillers, is not possible, and the epoxy component would be too viscous for practical use due to excessive extrusion forces, for example, in two-chamber cartridges with static mixers, but also in two-chamber foil bags.

[0007] Styrenized phenol is basically known as an accelerator for a hardener in a hardener component (B) of two-component curable synthetic resin systems for fastening purposes, for example as described in W02005 / 090433 A with Mannich base formulations as amine hardeners.

[0008] The object of the present invention is to provide synthetic resin systems for fastening purposes which also enable higher volume ratios of epoxy resin component to hardener component - in particular in two-chamber foil bags or two-chamber cartridges.

[0009] A further object of the present invention is to provide synthetic resin systems for fastening purposes which, for example, in cartridge systems with static mixers, enable low extrusion forces even at low temperatures (such as 10 °C or colder).

[0010] Now a surprisingly simple solution has been found to eliminate the conflicting objectives at higher volume ratios: The solution to the problem is based on the use of styrenated phenol as a thinner in the epoxy resin component.

[0011] It was surprisingly found that styrenated phenol has an accelerating effect on the hardener, even if the (e.g. amine) hardener only comes into contact with the styrenated phenol after the hardener component has been thoroughly mixed with the epoxy component, which contains styrenated phenol as a thinner, and also reduces the viscosity of the epoxy component, so that good reactivity and good extrusion properties ultimately result.

[0012] The styrenated phenol therefore acts as a non-reactive thinner and allows, particularly when using cartridges, a relatively large amount (volume) of epoxy component (A) to be formulated in relation to the volume of the hardener component (B). On the other hand, the accelerating effect is retained in the application when mixed with the hardener component.

[0013] A first aspect of the present invention relates to a one- or multi-component (in particular two-component) synthetic resin system for fastening purposes, in particular for fastening anchoring elements in a building substrate, comprising an epoxy resin component (A) which contains an epoxy resin (containing one or more curable epoxies) and styrenated phenol, and a hardener component (B) which contains a hardener, in particular an amine hardener. This can be produced in particular by adding styrenated phenol to an epoxy resin component of the synthetic resin system during the formulation of the epoxy resin component. Preferably, in such a synthetic resin system according to the invention, the volume ratio of epoxy resin component to hardener component is in the range of about 5:about 1; or with a larger volume ratio, e.g.: 7:1, 8:1, 9:1, 10:1, 12:1 or 15:1 A second subject matter of the present invention relates to the use of a one- or more (in particular two-) component synthetic resin system as defined above or below, in particular as defined in the preceding paragraph, for fastening an object, in particular for fastening an anchoring element in a hole or gap, on or in a building substrate.

[0014] A further subject matter of the invention relates to a method for fastening an object, in particular for fastening an anchoring element, to or in a building substrate, in which a one-component or more (in particular two-component) synthetic resin system defined above or below (in particular with the volume ratios of epoxy resin component to hardener component specified in the penultimate paragraph) is brought into contact with the object to be fastened and / or the building substrate, or an anchoring element and a one-component or more (in particular two-component) synthetic resin system defined above or below and an anchoring element are introduced into a hole or a gap in a building substrate.

[0015] A fourth subject matter of the invention relates to the use of styrenated phenol as an additive to an epoxy resin component of a one- or multi-component (in particular two-component) synthetic resin system, in particular for adjusting (in particular reducing) its viscosity and for facilitating extrusion, in particular compared to otherwise comparable synthetic resin systems without styrenated phenol in the epoxy resin component.

[0016] A fifth subject matter of the invention relates to the use of styrenated phenol as an additive in an epoxy resin component of a two-component synthetic resin system which comprises an epoxy resin component (A) which is an epoxy resin (containing one or more curable epoxies) and a hardener component (B) which comprises an amine hardener, for producing a two-component synthetic resin system with a >3:1, preferably 4:1, volume ratio of epoxy resin component to hardener component of about 5:about 1; or a larger volume ratio, e.g.: 7:1, 8:1, 9:1, 10:1, 12:1 or 15:1.

[0017] The following definitions serve to describe preferred meanings of general terms or features mentioned above and below and may replace one, several or all of the broader terms or features used to describe the subject matter of the invention, resulting in preferred embodiments of the invention, all of which are deemed to be disclosed herein.

[0018] “Building substrates” include, in particular, concrete or masonry (including brick), in particular concrete.

[0019] A hole or gap is understood to mean, in particular, a drilled hole. This hole can be cleaned (e.g., by blowing it out once or several times and / or brushing it) or uncleaned before being used for the inventive use or method.

[0020] Anchoring elements are understood to mean, in particular, those made of metal, e.g. undercut anchors, threaded rods, screws, drilling anchors, bolts, or also of another material, such as plastic or wood.

[0021] "Include (d)" or "comprise (d)" or "contain (d)" means that in addition to the named components or features, others may be present, thus represents a non-exhaustive list, in contrast to "consist (d) of", which means an exhaustive list of the components or features listed in its use. For special

[0022] For embodiments of the subject matter of the invention, one of the non-exhaustive expressions may be replaced by "consisting of". "Based on" also means "including".

[0023] "One" means primarily the indefinite article (corresponding in particular to "one or more" or "at least one"), except where the context requires its use as a numeral.

[0024] Where "further" is mentioned, it means that features without this attribute may be more preferred.

[0025] Above and below, percentages or content specifications in percent always mean mass percentages, unless otherwise stated. Where no other information is provided, the percentages refer to the total mass of the components of a multi-component synthetic resin system excluding packaging (e.g., excluding the material used for the casings of films, excluding (e.g., glass) walls of glass cartridges, excluding the material used for the casing of plastic containers or cartridges (including static mixers), and the like).

[0026] "Producible" (= available) preferably means "manufactured" or "obtained", but also manufactured / obtained in a manner other than directly described.

[0027] Where variants are mentioned, this means all embodiments of the invention (e.g. products, processes, uses) as they are described or claimed in particular in the claims, as subject matter of the invention or by definitions of terms.

[0028] "And / or" means that the mentioned characteristics / substances can be present alone or in combination of two or more (up to all) of the mentioned characteristics / substances.

[0029] "Approximately" means in particular that a numerical value identified thereby may deviate from the stated value by ± 10%, preferably by ± 5%, for example by ± 2%. "Approximately" may be deleted for preferred embodiments of the invention.

[0030] The (reactive) epoxy resins (as reactive synthetic resins) based on epoxy contained in the epoxy component in synthetic resin systems according to the invention contain an epoxy component, preferably based on glycidyl compounds, for example those with an average glycidyl group functionality of 1.5 or greater, in particular of 2 or greater, e.g. from 2 to 10, which may optionally contain further glycidyl ethers as reactive diluent (which are preferably not styrenated phenols carrying epoxy or glycidyl groups).The epoxides of the epoxy component are preferably poly(including di)glycidyl ethers of at least one polyhydric alcohol or phenol, such as novolak, bisphenol F or bisphenol A (these three are particularly preferred, or mixtures of two or more thereof), or mixtures of such epoxides, in particular bisphenol A / F, obtainable for example by reacting the corresponding polyhydric alcohols with epichlorohydrin. Examples are trimethylolpropane triglycidyl ethers, novolak epoxy resins, bisphenol A epichlorohydrin resins and / or bisphenol F epichlorohydrin resins, for example with an average molecular weight of < 2000 Da, in particular < 700 Da.The epoxy resins can, for example, have an epoxy equivalent of 120 to 2000, preferably 150 to 400, such as in particular 155 to 195, for example 165 to 185. In a variant according to the invention, resins which are at least partially produced from biogenic components are preferred because they can increase the proportion of biogenic carbon, such as, for example, bisphenol A, bisphenol F or bisphenol A / F resins with a biogenic glycidyl portion (available, for example, from Spolchemie, Revolucni 1930 / 86, 400 32 Üsti nad Labern, Czech Republic). The proportion of epoxy resins in the total mass of reactants and additives of the multi-component synthetic resin system is preferably >0%, e.g. 5% to less than 100%, in particular 10 to 80%, 10 to 70% or 10 to 60%.

[0031] Mixtures of two or more such epoxy components are also possible. Suitable epoxy resins, reactive diluents, and hardeners can also be found in the standard work by Lee H and Neville K, "Handbook of Epoxy Resins" (New York: McGraw-Hill), 1982 (these compounds are incorporated herein by reference).

[0032] Styrenated phenols are understood to mean the reaction products (electrophilic substitution products) of phenols (such as phenol itself, which is particularly preferred), pyrocatechol, resorcinol, hydroquinone, hydroxyhydroquinone, phloroglucinol, pyrogallol, o-cresol, m-cresol or p-cresol, in particular phenol, with styrene or styrene analogues, such as vinyltoluene, divinylbenzene or 4-vinylpyridine, in particular with styrene, in particular "styrenated phenol" itself (reaction product of styrene and phenol; GAS Reg. No. 61788-44-1), which may include, purely illustratively and not exhaustively, mixtures of compounds or individual compounds of the following formulae:

[0033] or 2,6-distyrylphenol, as well as oligo- and polystyrene compound moieties or compounds. The term "styrenated phenols" preferably does not include those with ethoxylation / propoxylation, and / or other derivatization, for example, by epoxy or glycidyl or residues containing epoxy and glycidyl groups, each of phenolic OH groups (in the context of the present invention, OH groups, preferably all of them, which contribute to the acceleration effect, should remain free).

[0034] The mass fraction of styrenated phenols in a system according to the invention is preferably from 0.01 to 50%, in particular from 0.1 to 30%, advantageously from 1 to 10%, preferably from >3 (e.g., 3.5 or 4) to 10%. Relative to (= in) the epoxy resin component, it is preferably from 0.01 to 50%, in particular from 0.1 to 30%, advantageously from 1 to 15%, in particular from >3 (e.g., 3.5 or 4) to 15%.

[0035] In all variants of the invention, the styrenated phenols can be present in one or the epoxy resin component as well as in one or the hardener component, or in a special embodiment only in one or the epoxy resin component, i.e. not in a hardener component.

[0036] It has been shown that excessive amounts of styrenated phenol, based on the amount of curable compounds carrying epoxy radicals (= in particular glycidyl group-bearing), can have a detrimental effect on the temperature resistance of the cured mass. It is therefore preferred that, based on the amount of curable compounds carrying epoxy radicals (= glycidyl group-bearing) in the (A) component, the mass fraction of styrenated phenol does not exceed 40%, but preferably remains below 30%, e.g. below 25 or preferably below 20%, preferably in each case with a lower limit of 0.01 or 1 or 3 or in particular more than 3 (e.g. 3, 5 or 4)%.

[0037] Preferably, a synthetic resin system according to the invention contains one or more silanes (particularly preferred variant) which have no or one or more hydrolyzable groups bonded to Si, wherein in the epoxy component (because of their reactivity with the epoxides) no silanes with amino or other groups reactive with the epoxy reactive resin may be present - such groups may, however, be provided in silanes which only occur in a hardener component.Preferably, the silanes can be selected according to the above-mentioned limitations from aminopropyl-trialkoxysilanes, such as 3-aminopropyl-trimethoxysilane or 3-aminopropyl-triethoxysilane, N-(aminoalkyl)-3-amino-ipro-ipyltrialkoxysilane, such as N-(2-aminoethyl)-3-amino-propyl-itrimethoxysilane or N-(N'-(2-aminoethyl)-2-aminoethyl)-aminopropyltrimethoxysilane, 3-mercaptopropyl-trialkoxysilane, such as 3-mercaptopropyltrimethoxysilane, tetraalkoxysilane, such as tetraethoxysilane, bis-(3-trialkoxy-isilylpropyl)amine, such as bis-(3-trimethoxysilylpropyl)amine, and furthermore 3-(meth)acryloyl-oxypropyltrialkoxy- silanes, such as 3-(meth)acryloyl-oxy-propyltrimethoxysilane and / or alkenylalkoxysilanes such as vinyltrimethoxysilane or vinyltriethoxysilane, and 3-glycidyloxypropyltrialkoxysilanes, such as 3-glycidyloxypropyltrimethoxysilane or 3-glycidyloxypropyltriethoxysilane. Glycidylsilanes are particularly preferred.Mixtures of two or more of the silanes mentioned may also be present. One or more such silanes are preferably present in a mass fraction of 0.05 to 10%, in particular of 0.3 to 8%, advantageously of 0.5 to 5%, based on the total mass of a synthetic resin system according to the invention, or only in the epoxy component (component

[0038] (A) ) , then, based on the mass of component (A), in a mass fraction of 0.2 to 10%, in particular of 0.5 to 8%, advantageously of 1 to 5%.

[0039] As reactive diluents (which should not be present in a hardener component), glycidyl ethers of aliphatic, cycloaliphatic, araliphatic or aromatic mono- or especially polyalcohols can be used, such as monoglycidyl ethers, e.g. o-cresyl glycidyl ether, and / or in particular glycidyl ethers with an epoxy functionality of at least 2, such as 1,4-butanediol diglycidyl ether, cyclohexane di-25 methanol diglycidyl ether, hexanediol diglycidyl ether and / or in particular tri- or higher glycidyl ethers, e.g. glycerol triglycidyl ether, pentaerythritol tetraglycidyl ether or trimethylolpropane triglycidyl ether, or further mixtures of two or more of these reactive diluents. The reactive diluents are preferably present in a mass fraction of 0 or 0.1 to 60%, in particular of 1 to 30%, based on the total mass of the epoxy component (a).

[0040] Further components of a synthetic resin system according to the invention can be selected from fillers, accelerators, inhibitors, thixotropic agents and other additives.

[0041] Conventional fillers are used as fillers, in particular cements (e.g. Portland cements or high-alumina cements) or other hydraulically hardenable minerals, such as gypsum, quicklime, water glass or active aluminum hydroxides, chalks, sand, quartz sand, quartz flour or the like, which can be added as powder, in granular form or in the form of shaped bodies, or others, as mentioned for example in WO 02 / 079341 and WO 02 / 079293 (which are incorporated herein by reference), or mixtures thereof, it being possible for the fillers to furthermore or in particular also be silanized, for example as amino- or epoxysilane-treated quartz flour, such as Silbond AST or EST® from the company. Quarzwerke GmbH, as amino- or glycidyl-silane-treated silica, such as Aktisil AM or EM® from Hoffmann Mineral, or amino- or glycidyl-silane-treated fumed silicas.The fillers may be present in one or more components, for example, of a multi-component kit according to the invention, for example one or both components of a corresponding two-component kit; the mass fraction of fillers is preferably 0.1 to 95%, in particular 10 to 90%, advantageously 20 to 70%.

[0042] Common rheological aids, such as pyrogenic (especially hydrophobized) silica, can be used as thixotropic agents. They can be added in a mass fraction of 0.01 to 25%, preferably 0.5 to 20%, and especially 1-5%.

[0043] Accelerators which can be included are, for example, tert-amines, such as imidazoles or tert-aminophenols, such as tris-(dimethylaminomethyl)phenol, bis-(dimethylaminomethyl)phenol or N,N-dimethylaminophenol, organophosphines or Lewis bases or acids, such as phosphoric acid esters, or mixtures of two or more thereof, in one or (particularly in multi-component systems) in several of the components, preferably in each case in a hardener component, or mixtures of two or more thereof, for example in a mass fraction of 0.001 to 15%, in particular of 0.1 to 10%, advantageously of 2 to 6%.

[0044] Other phenolic substances such as bisphenol A, bisphenol F or novolak resins may also be included as particularly preferred accelerators according to the teaching of EP 2 826 798 B1, which is incorporated herein by reference.

[0045] Further additives may also be added, such as plasticizers, other non-reactive diluents, flexibilizers, stabilizers, wetting agents, coloring additives such as dyes or, in particular, pigments, for example for differently coloring the components for better control of their mixing, or the like, or mixtures of two or more thereof. Such further additives can preferably be added in total mass fractions of >0 to 90%, for example from 0.1 to 50% by weight.

[0046] Si-bonded hydrolyzable groups are, for example, halogen atoms (halogen, such as chloro), ketoximates, amino, aminoxy, mercapto, acyloxy, aryloxy, aralkyloxy (= arylalkoxy) or in particular alkyloxy (alkoxy), such as in particular methoxy or ethoxy.

[0047] A hardener component contains at least one compound commonly used for epoxy curing (= hardener in the narrower sense; reactant in polyaddition). The term "hardener component" preferably means at least one compound commonly used for epoxy curing, with or without filler additives and / or other additives, such as water, thickeners, and / or other additives, such as dyes or thixotropic agents or the like—in other words, a complete hardener component.

[0048] The compounds commonly used for epoxy curing (which act as reactants in the polyaddition) are, in particular, those containing two or more groups selected from amino, imino, and mercapto, for example, corresponding amines (preferred), thiols, or amino-ithiols, or mixtures thereof, for example as mentioned in Lee H and Neville K, "Handbook of Epoxy Resins" (New York: McGraw-Hill), 1982, which is incorporated herein by reference, for example, di- or polyamines mentioned therein, and / or further di- or polythiols. Preferably, the curing agent is an amine (which also includes mixtures of two or more amine curing agents).

[0049] The compounds commonly used for epoxy curing include, for example, in preferred embodiments of the invention

[0050] - Amine hardeners, ie di- or polyamines such as in particular aliphatic (such as ethylenediamine), cycloaliphatic and aromatic di- or polyamines, amidoamines, amine adducts, polyetherdiamines or polyphenyl / polymethylene polyamines, Mannich bases, polyamides and the like (wherein in the case of Mannich bases in particular those as disclosed in the document WO 2005 / 090433, in particular on pages 3, last, to page 6, 2nd paragraph, as in Example 1 or in particular 2 thereof, which is incorporated herein by reference, alone or in admixture with one or more further di- or polyamines are particularly preferred), or mixtures of two or more thereof; Preferred are diamines, especially xylylenediamines, such as m-xylylenediamine, Cl-Cl O-alkanedi- or polyamines, e.g. 1,2-diaminoethane, trimethylhexane-1,6-diamine, diethylenetriamine or triethylenetetraamine; oligomeric diamines of the formula H2N-(CH2) i-NH-[(CH2) j-NH] k- (CH2)1-NH2, wherein i, j and 1 independently of one another are 2 to 4 and k is 0, 1 or 2, in particular "triethylenetetramine" (TETA = N,N'-bis(2-aminoethyl)ethylenediamine) or tetraethylenepentamine (TEPA); cycloaliphatic amines, such as 1,2-diaminocyclohexane or bis(aminomethyl)-itricyclodecane (TCD) or bis(4-aminocyclohexyl)methane (PACM), amine adducts; N,N'-bis(3-amino-n-propyl)piperazine (BAPP), 1,3-bis(aminomethyl)cyclohexane (BAG), N-(2-aminoethyl)piperazine (AEP) or, in particular, 3-aminomethyl-3,5,5-trimethylcyclohexylamine (isophoronediamine = IPDA), or Mannich bases; or mixtures of two or more thereof;

[0051] - furthermore di- or polythiols such as in particular di- or higher-functional thiols, for example dimercapto-a, W-C1-C12 alkanes, 4,4'-dimercapto-dicyclo-ihexyl-imethane, dimercaptodiphenylmethane or the like;

[0052] - furthermore aliphatic aminos, such as in particular hydroxy-lower alkylamines, such as ethanolamine, diethanolamine or 3-aminopropanol, or aromatic aminos, such as 2-, 3- or 4-aminophenol.

[0053] Mixtures of two or more of the compounds commonly used for epoxy curing may also be used or included.

[0054] Particularly preferred for all subject matter of the invention are diamines or polyamines with a HEQ value of up to 55. This is calculated based on the chemical structure or specified by manufacturers. Preferred examples are isophoronediamine and / or triethylenetetraamine.

[0055] The compound(s) commonly used for epoxy curing (hardener in the narrower sense as a component of the hardener component) are preferably present in mass fractions of up to 95%, in particular from 2 to 70%, advantageously in total, based on the total mass of the reactants and additives to the mass of the hardener component, mass fractions in the range from 5 to 90%, preferably from 10 to 80%, advantageously from 20 to 75%.

[0056] Particularly in the case of a hardener component of a multi-component synthetic resin according to the invention, further additives may also be part of the "hardener", e.g. organic solvents such as benzyl alcohol, fillers (e.g. as mentioned above) and other of the above-mentioned additives, for example not at all or in a total weight proportion of 0.01 to 70 wt.%, e.g. from 1 to 40 wt.%.

[0057] Components that would otherwise react with each other in an undesirable manner, such as water and / or acids and the hydrolyzable groups of the silanes to be used according to the invention or water and cement, are to be kept separate from each other (separate compartments) in a manner known to the person skilled in the art, preferably before use in the hole or gap.

[0058] Parameters, as far as they are presented in the context of the present application, are determined by methods known to the person skilled in the art as follows:

[0059] For pull-out tests with M12 threaded rods, the following procedure is followed according to EAD 330499-02-0601:

[0060] First, drill holes (diameter 14 mm; depth 72 mm) are drilled into a horizontally lying concrete test specimen (concrete compressive strength class C20 / 25) using a hammer drill and a hammer drill with carbide cutting edges. The drill holes are cleaned using a hand blower and a hand brush. The drill holes are then filled two-thirds full, starting from the bottom of the hole, with the adhesive system to be tested. A threaded rod is inserted into each drill hole by hand. The excess mortar is removed using a spatula. After 24 hours (minimum curing time) at room temperature, the threaded rod is subjected to a centric tensile load until failure, with the applied force and displacement being continuously recorded.

[0061] Viscosity measurements are performed using a Brookfield DV3T rotational viscometer with spindle 7 at 23 °C and 10 rpm. The viscosity plateau value, which is reached after a few seconds of run-in time, is read off.

[0062] Extrusion force and gel time are determined as described in the examples.

[0063] The permissible temperature range for the cured product can also be determined by pull-out testing after treatment with different temperatures (e.g. 24 h curing at room temperature, at 50 ° C and / or at 80 ° C).

[0064] The invention particularly relates to those variants of the embodiments of the invention which are mentioned in the claims, which are to be considered as incorporated herein by reference.

[0065] Examples: The following examples serve to illustrate the invention without limiting its scope:

[0066] Example 1 and comparison (=reference~) example:

[0067] A fischer 3 : 1 cartridge contains:

[0068]

[0069]

[0070] The sum of components A and B results in an identical overall composition of the synthetic resin systems compared.

[0071] It can be seen that when styrenated phenol is used in the epoxy resin component, significantly lower extrusion values ​​are found compared to when styrenated phenol is used only in the hardener component. Nevertheless, the gel times show that even when styrenated phenol is used only in the epoxy resin component, the accelerating effect on the hardener is maintained (same gel time).

[0072] The extrusion force is measured from the appropriately tempered 3 : 1 fischer cartridge with fischer static mixer FIS MR plus on a Walter & Bai universal testing machine (Walter+bai AG, Löhningen, Switzerland) at a feed rate of 40 mm / min.

[0073] The gelling time (“gel time”) is determined from a 100 g sample at 23 °C on a GELNORM® Geltimer GT-SP (Gel Instrumente AG, Oberuzwil, Switzerland).

[0074] The viscosity is determined as above. A 10 : 1 cartridge contains:

[0075]

[0076] The pull-out values ​​are determined as indicated above.

Claims

Claims 1. A multi-component (in particular two-component) non-aqueous synthetic resin system for fastening purposes, in particular for fastening anchoring elements in a building substrate, comprising an epoxy resin component (A) which contains an epoxy resin and at least styrenated phenol in the epoxy resin component, and a hardener component (B) which contains a hardener.

2. Synthetic resin system according to claim 1 in the form of a multi-component, in particular two-component, synthetic resin system.

3. Synthetic resin system according to one of the preceding claims, characterized in that the hardener component is free of styrenated phenols.

4. Synthetic resin system according to one of the preceding claims, characterized in that it is in the form of a two-component cartridge, wherein it preferably has an extrusion force of 100 to 2500 N at 5°C and / or an extrusion force of 200 to 1500 N at 20°C; and / or wherein it has a volume ratio of component (A) to component (B) of 5:1 or greater.

5. Synthetic resin system according to one of the preceding claims, characterized in that the viscosity of component (A) is in the range from 20 to 350 Pa*s.

6. Synthetic resin system according to one of the preceding claims, wherein the mass fraction of styrenated phenol in component (A), based on the total mass of the components of the multi-component synthetic resin system except the packaging, is 0.01 to 50%, in particular 0.1 to 30%, advantageously 1 to 10%, preferably >3 (e.g. 3.5 or 4) to 10%, or based on the (= in the) epoxy resin component at 0.01 to 50%, in particular at 0.1 to 30%, advantageously at 1 to 15%, in particular at >3 (e.g. 3, 5 or 4) to 15%! 7. Synthetic resin system according to one of the preceding claims, wherein the mass fraction of styrenated phenol based on the amount of curable compounds carrying epoxy residues in the (A) component does not exceed 40%, but preferably remains below 30%, e.g. below 25 or preferably below 20%, preferably in each case with a lower limit of 0.01 or 1 or 3 or in particular more than 3 (e.g. 3.5 or 4) 8. Synthetic resin system according to one of claims 1 to 7, which further components selected from one or more silanes (particularly preferred component) which have no or one or more hydrolyzable groups bonded to Si, in particular in a mass fraction of 0.05 to 10%, in particular from 0.3 to 8%, advantageously from 0.5 to 5%; one or more reactive diluents, preferably in a mass fraction of 0 to 60%, in particular from 1 to 30%; fillers, in particular in a mass fraction of 0.1 to 95%, in particular 10 to 90%, advantageously 20 to 70%, and preferably one or more further additives, in particular selected from thixotropic agents, accelerators and further non-reactive diluents, flexibilizers, wetting agents, coloring additives; where the mass fractions relate to the total mass of the components of the multi-component synthetic resin system apart from the packaging.

9. Synthetic resin system according to one of claims 1 to 8, wherein the epoxy component comprises one or more epoxy resins selected on the basis of glycidyl compounds, in particular those having an average glycidyl group functionality of 1.5 or greater, in particular of 2 or greater, e.g. from 2 to 10, which may optionally contain further glycidyl ether(s) as reactive diluent.

10. Synthetic resin system according to one of claims 1 to 9, characterized in that it contains in the hardener component one or more hardeners with two or more groups selected from amino, imino, and mercapto, for example corresponding amines, thiols, or aminothiols, or mixtures thereof, preferably in a mass fraction of 5 to 90%, preferably of 10 to 80%, advantageously of 20 to 75%. 11 . Use of a one- or multi-component (in particular two-) component synthetic resin system according to one of claims 1 to 10 for fastening an object, in particular for fastening an anchoring element in a hole or gap, on or in a building substrate. 12 . Method for fastening an object, in particular for fastening an anchoring element, to or in a building substrate, in which a one- or more (in particular two-) component synthetic resin system according to one of claims 1 to 10 is brought into contact with the object to be fastened and / or the building substrate, or an anchoring element and a one- or more (in particular two-) component synthetic resin system according to one of claims 1 to 9 as defined above or below and an anchoring element are inserted into a hole or a gap of a building substrate.

13. Use of styrenated phenol as an additive in an epoxy resin component of a one- or multi-component (especially two-component) synthetic resin system, in particular for adjusting (especially reducing) its viscosity and / or for facilitating extrusion.

14. Use of styrenated phenol as an additive in an epoxy resin component of a two-component synthetic resin system comprising an epoxy resin component (A) which is an epoxy resin (containing one or more curable Epoxies) and a hardener component (B) which comprises a hardener (in particular amine hardener), for producing a two-component synthetic resin system with a volume ratio of epoxy resin component to hardener component of about 7: about 1; or a larger Volume ratio; in particular 7:1, 8:1, 9:1, 10:1, 12:1 or 15:1.

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