Submersible electronics module and submersible pump assembly with such
Patent Information
- Authority / Receiving Office
- EP · EP
- Patent Type
- Applications
- Current Assignee / Owner
- GRUNDFOS HLDG
- Filing Date
- 2024-05-13
- Publication Date
- 2026-04-22
AI Technical Summary
Submersible pump assemblies face limitations in maintenance and repair due to integrated control electronics within the motor module, which restricts lateral space and requires a variety of motor modules for different applications, while also limiting power due to slim shape constraints.
A submersible electronics module is introduced, axially installed between the pump and motor modules, allowing independent maintenance and reducing the variety of motor modules needed, by decoupling power lines and enabling larger motor diameters, with standardized couplings and optional hermetic sealing for efficient cooling and insulation.
This solution enhances maintenance efficiency, reduces the variety of motor modules required, and allows for increased motor power without increasing the assembly's diameter, while maintaining a slim shape suitable for boreholes and tanks.
Smart Images

Figure EP2024063100_19122024_PF_FP_ABST