Feedthrough assembly and device including same

Abstract

Various embodiments of a feedthrough assembly and a hermetically-sealed package including such assembly are disclosed. The assembly includes a monolithic diamond substrate having a first surface and a second surface; a feedthrough extending through the monolithic diamond substrate between the first surface and the second surface of the substrate, where the feedthrough includes conductive carbon material; and an external contact disposed adjacent to the first surface of the monolithic diamond substrate and electrically connected to the feedthrough.

Description

FEEDTHROUGH ASSEMBLY AND DEVICE INCLUDING SAME

[0001] This application claims the benefit of U.S. Provisional Patent Application Serial No. 63 / 535,855, filed August 31, 2023, the entire content of which is incorporated herein by reference.TECHNICAL FIELD

[0002] This disclosure generally relates to, among other things, electrical feedthroughs and, more particularly, electrical feedthroughs disposed in diamond substrates.BACKGROUND

[0003] Various systems require electrical coupling between electrical devices disposed within a hermetically sealed enclosure and external devices. Oftentimes, such electrical coupling needs to withstand various environmental factors such that a conductive pathway or pathways from the external surface to within the enclosure remains stable. For example, implantable medical devices (IMDs), e.g., cardiac pacemakers, defibrillators, neurostimulators and drug pumps, which include electronic circuitry and battery elements, require an enclosure or housing to contain and hermetically seal these elements within a body of a patient. Many of these IMDs include one or more electrical feedthrough assemblies to provide electrical connection between the elements contained within the housing and components of the IMD external to the housing, for example, sensors and / or electrodes and / or lead wires mounted on an exterior surface of the housing, or electrical contacts housed within a connector header, which is mounted on the housing to provide coupling for one or more implantable leads, which typically carry one or more electrodes and / or one or more other types of physiological sensors. A physiological sensor, for example a pressure sensor, incorporated within a body of a lead may also require a hermetically sealed housing to contain electronic circuitry of the sensor and an electrical feedthrough assembly to provide electrical connection between one or more lead wires, which extend within the implantable lead body, and the contained circuitry.

[0004] A feedthrough assembly typically includes one or more feedthrough pins that extend from an interior to an exterior of the housing through a ferrule. Each feedthrough pin is electrically isolated from the ferrule, and, for multipolar assemblies, from one another, by an insulator element, e.g., glass or ceramic, that is mounted within the ferruleand surrounds the feedthrough pin(s). Glass insulators are typically sealed directly to the pin(s) and to the ferrule, e.g., by heating the assembly to a temperature at which the glass wets the pin(s) and ferrule, while ceramic insulators are typically sealed to the pin(s) and to the ferrule by a braze joint. High temperatures are typically required to join corrosionresistant conductive materials with corrosion-resistant insulative materials.SUMMARY

[0005] The techniques of this disclosure generally relate to a feedthrough assembly and a device that includes such feedthrough assembly. The feedthrough assembly can include a monolithic diamond substrate and a feedthrough that extends through the substrate. The feedthrough can include a conductive carbon material that is either deposited within the substrate or formed by converting the monolithic diamond material of the substrate into conductive carbon using, e.g., electromagnetic radiation that can be directed into the substrate using any suitable technique. One or more additional devices or components such as one or more capacitors can be disposed within the substrate as well. Such devices and components can be connected to one or more feedthroughs using any suitable technique.

[0006] This disclosure includes without limitation the following clauses:

[0007] Clause 1: A feedthrough assembly that includes a monolithic diamond substrate having a first surface and a second surface; a feedthrough extending through the monolithic diamond substrate between the first surface and the second surface of the substrate, where the feedthrough includes conductive carbon material; and an external contact disposed adjacent to the first surface of the monolithic diamond substrate and electrically connected to the feedthrough.

[0008] Clause 2: The assembly of Clause 1, where the conductive carbon material is converted from a portion of the monolithic diamond substrate.

[0009] Clause 3: The assembly of Clause 2, where the conductive carbon material includes a laser converted conductive carbon material.

[0010] Clause 4: The assembly of any one of Clauses 1-3, where the feedthrough further includes an internal contact electrically connected to the feedthrough.

[0011] Clause 5: The assembly of any one of Clauses 1-4, where the monolithic diamond substrate includes a single crystal diamond substrate.

[0012] Clause 6: The assembly of any one of Clauses 1-5, where the feedthrough includes a first feedthrough, where the assembly further includes a second feedthrough extending through the monolithic diamond substrate between the first surface and the second surface of the substrate, where the second feedthrough includes conductive carbon material and a second external contact disposed adjacent to the first surface of the monolithic diamond substrate and electrically connected to the second feedthrough.

[0013] Clause 7: The assembly of Clause 6, where a center-to-center distance between the first feedthrough and the second feedthrough measured in a direction substantially parallel to the first surface of the substrate is at least 50 microns.

[0014] Clause 8: The assembly of Clause 6, where a center-to-center distance between the first feedthrough and the second feedthrough measured in a direction substantially parallel to the first surface of the substrate is no greater than 0.060 inches.

[0015] Clause 9: The assembly of any one of Clauses 1-5, where the feedthrough includes an array of feedthroughs.

[0016] Clause 10: The assembly of any one of Clauses 1-8, where the conductive carbon material includes graphitic carbon.

[0017] Clause 11: The assembly of any one of Clauses 1-10, further including a patterned conductive layer disposed adjacent to the first surface of the monolithic diamond substrate and electrically connected to the external contact.

[0018] Clause 12: The assembly of any one of Clauses 1-11, further including a capacitor disposed within the substrate adjacent to the feedthrough, where the capacitor is electrically coupled to the feedthrough.

[0019] Clause 13: The assembly of Clause 12, where the capacitor includes a first plate and a second plate that is substantially parallel to the first plate, where a portion of the substrate is disposed between the first plate and the second plate.

[0020] Clause 14: The assembly of Clause 13, where major surfaces of each of the first plate and the second plate are substantially orthogonal to the feedthrough.

[0021] Clause 15: The assembly of Clause 14, where the feedthrough extends through the first plate and the second plate.

[0022] Clause 16: The assembly of any one of Clauses 13-15, where the first plate and the second plate of the capacitor includes conductive carbon material that is converted from a portion of the monolithic diamond substrate.

[0023] Clause 17: A hermetically-sealed package including a housing and a feedthrough assembly that forms a portion of the housing. The feedthrough assembly includes a monolithic diamond substrate including a first surface and a second surface, where the substrate is connected to the housing; a feedthrough extending through the monolithic diamond substrate between the first surface and the second surface of the substrate, where the feedthrough includes conductive carbon material; and an external contact disposed adjacent to the first surface of the monolithic diamond substrate and electrically connected to the feedthrough.

[0024] Clause 18: The package of Clause 17, where the conductive carbon material is converted from a portion of the monolithic diamond substrate.

[0025] Clause 19: The package of Clause 18, where the conductive carbon material includes a laser converted conductive carbon material.

[0026] Clause 20: The package of any one of Clauses 17-19, where the feedthrough further includes an internal contact electrically connected to the feedthrough.

[0027] Clause 21: The package of Clause 20, further including a patterned conductive layer disposed on the second surface of the substrate and electrically connected to the internal contact.

[0028] Clause 22: The package of any one of Clauses 17-21, where the feedthrough includes a first feedthrough. The assembly further includes a second feedthrough extending through the monolithic diamond substrate between the first surface and the second surface of the substrate. The second feedthrough includes conductive carbon material and a second external contact disposed adjacent to the first surface of the monolithic diamond substrate and electrically connected to the second feedthrough.

[0029] Clause 23: The package of Clause 22, where a distance between the first feedthrough and the second feedthrough measured in a direction substantially parallel to the first surface of the substrate is at least 50 microns.

[0030] Clause 24: The package of Clause 22, where a distance between the first feedthrough and the second feedthrough measured in a direction substantially parallel to the first surface of the substrate is no greater than 0.060 inches.

[0031] Clause 25: The package of any one of Clauses 17-21, where the feedthrough includes an array of feedthroughs.

[0032] Clause 26: The package of any one of Clauses 17-25, where the conductive carbon material includes graphitic carbon.

[0033] Clause 27: The package of any one of Clauses 17-26, further including a patterned conductive layer disposed adjacent to the first surface of the monolithic diamond substrate and electrically connected to the external contact.

[0034] Clause 28: The package of any one of Clauses 17-27, further including a capacitor disposed within the substrate adjacent to the feedthrough, where the capacitor is electrically coupled to the feedthrough.

[0035] Clause 29: The package of Clause 28, where the capacitor includes a first plate and a second plate that is substantially parallel to the first plate, where a portion of the substrate is disposed between the first plate and the second plate.

[0036] Clause 30: The package of Clause 29, where major surfaces of each of the first plate and the second plate are substantially orthogonal to the feedthrough.

[0037] Clause 31: The package of Clause 30, where the feedthrough extends through the first plate and the second plate.

[0038] Clause 32: The package of any one of Clauses 29-31, where the first plate and the second plate of the capacitor includes conductive carbon material that is converted from a portion of the monolithic diamond substrate.

[0039] Clause 33: An implantable medical device including the hermetically-sealed package of any one of Clauses 17-32.

[0040] Clause 34: A method including focusing electromagnetic radiation into a monolithic diamond substrate to convert a region of the monolithic diamond substrate into conductive carbon material that forms a feedthrough that extends between a first surface and a second surface of the monolithic diamond substrate. The method further includes disposing an external contact adjacent to the first surface of the monolithic diamond substrate such that it is electrically connected to the feedthrough.

[0041] Clause 35: The method of Clause 34, further including disposing a patterned conductive layer adjacent to the first surface of the monolithic diamond substrate.

[0042] Clause 36: The method of Clause 35, further including electrically connecting the patterned conductive layer to the external contact.

[0043] Clause 37: The method of any one of Clauses 34-36, where focusing electromagnetic radiation includes shaping a laser beam to form a Bessel focus.

[0044] Clause 38: The method of any one of Clauses 34-36, where focusing electromagnetic radiation includes shaping a laser beam to form a Gaussian focus.

[0045] Clause 39: The method of any one of Clauses 34-36, where focusing electromagnetic radiation includes focusing pulsed electromagnetic radiation into the monolithic diamond body.

[0046] Clause 40: The method of any one of Clauses 34-39, further including laser bonding the external contact to the first surface of the monolithic diamond substrate.

[0047] Clause 41: The method of any one of Clauses 34-40, further including disposing an internal contact adjacent to the second surface of the monolithic diamond substrate such that the internal contact is electrically connected to the feedthrough.

[0048] Clause 42: The method of any one of Clauses 34-41, where the feedthrough includes a first feedthrough. The method further includes focusing electromagnetic radiation into the monolithic diamond substrate to convert a second region of the monolithic diamond substrate into conductive carbon material that forms a second feedthrough that extends between the first surface and the second surface of the monolithic diamond substrate. The method further includes disposing a second external contact adjacent to the first surface of the monolithic diamond substrate such that it is electrically connected to the second feedthrough.

[0049] Clause 43: The method of Clause 42, where a distance between the first feedthrough and the second feedthrough measured in a direction substantially parallel to the first surface of substrate is at least 50 microns.

[0050] Clause 44: The method of any one of Clauses 34-43, further including connecting the monolithic diamond substrate to a housing to form a hermetically-sealed package.

[0051] Clause 45: The method of any one of Clauses 34-44, further including focusing electromagnetic radiation into the monolithic diamond substrate to convert a third region of the monolithic diamond substrate into conductive carbon material that forms a capacitor within the substrate, where the capacitor is electrically coupled to the feedthrough.

[0052] Clause 46: The method of Clause 45, where the capacitor includes a first plate and a second plate that is substantially parallel to the first plate. A portion of the substrate is disposed between the first plate and the second plate.

[0053] Clause 47: The method of Clause 46, where major surfaces of each of the first plate and the second plate are substantially orthogonal to the feedthrough.

[0054] Clause 48: The method of Clause 47, where the feedthrough extends through the first plate and the second plate.

[0055] Clause 49: The method of Clause 34, further including removing the conductive carbon material of the feedthrough to form a via; and disposing a metallic material within the via to form the feedthrough.

[0056] The details of one or more aspects of the disclosure are set forth in the accompanying drawings and the description below. Other features, objects, and advantages of the techniques described in this disclosure will be apparent from the description and drawings, and from the claims.BRIEF DESCRIPTION OF DRAWINGS

[0057] FIG. 1 is a schematic cross-section view of one embodiment of a feedthrough assembly.

[0058] FIG. 2 is a schematic plan view of a feedthrough of the feedthrough assembly of FIG. 1.

[0059] FIG. 3 is a schematic cross-section view of one embodiment of a hermetically- sealed package that includes a housing and the feedthrough assembly of FIG. 1.

[0060] FIGS. 4A-D are schematic cross-section views of a method of forming the feedthrough assembly of FIG. 1, where FIG. 4A illustrates electromagnetic radiation being focused into a substrate to form one or more feedthroughs of the assembly; FIG. 4B illustrates one or more external contacts being disposed on a first surface of the substrate and electrically connected to the feedthroughs; FIG. 4C illustrates patterned conductive layers being disposed on the first surface and a second surface of the substrate; and FIG. 4D illustrates one or more internal contacts being disposed on the second surface of the substrate and electrically connected to the feedthroughs.

[0061] FIG. 5 is a schematic perspective view of another embodiment of a feedthrough assembly with a substrate of the assembly made transparent for explanatory purposes.

[0062] FIG. 6 is a schematic cross-section view of the feedthrough assembly of FIG. 5.

[0063] FIG. 7 is a schematic plan view of another embodiment of a feedthrough assembly.

[0064] FIG. 8 is a schematic cross-section view of another embodiment of a feedthrough assembly.DETAILED DESCRIPTION

[0065] The techniques of this disclosure generally relate to a feedthrough assembly and a device that includes such feedthrough assembly. The feedthrough assembly can include a monolithic diamond substrate and a feedthrough that extends through the substrate. The feedthrough can include a conductive carbon material that can be formed by converting the monolithic diamond material of the substrate into conductive carbon using, e.g., electromagnetic radiation that can be directed into the substrate using any suitable technique. One or more additional devices or components such as one or more capacitors can be disposed within the substrate as well. Such devices and components can be connected to one or more feedthroughs using any suitable technique.

[0066] Electrical feedthroughs used in suitable devices such as medical devices typically include a nonconductive substrate such as sapphire such that electrical pathways formed by one or more feedthroughs that extend through the substrate remain electrically isolated. Other suitable nonconductive materials such as diamond can also be utilized for the assembly substrate. Diamond is commercially available in millimeter and sub-millimeter thick single crystal formats.

[0067] Using a diamond substrate, a feedthrough can be created by converting the bulk diamond to a line of conductive carbon material (e.g., graphitic carbon) using electromagnetic radiation provided, e.g., by a laser. Multiple feedthroughs can be created in a single diamond substrate. Because of the fine resolutions that can be achieved using lasers, bias of the feedthroughs can be located within a few microns or fewer, potentially providing substantial improvement over what is possible with typical glassed feedthroughs. Further, diamond and graphitic carbon are chemically inert, which can provide feedthroughs that are stable and corrosion resistant.

[0068] As described herein, a feedthrough assembly can be formed using a monolithic diamond substrate by selectively converting regions of the diamond substrate into conductive carbon material. Using electromagnetic radiation, regions of conductive carbon material can be formed in the diamond substrate to establish feedthroughs and other devices or components on or within the substrate. In one or more embodiments, one or more capacitors can be disposed or formed within the substrate that can be utilized to limit or prevent electromagnetic interference from passing along a conductive pathway or via formed by the conductive carbon material. Plates or electrodes of these capacitors can beseparated by layers of unconverted diamond substrate to establish one or more dielectric layers of the diamond capacitor. Diamond may be described as having a high dielectric strength, allowing energy to be stored in capacitors at higher voltage with reduced volume of dielectric compared to other dielectric materials, such as in electrolytic capacitors. Thus, individual diamond capacitors may also be smaller than individual electrolytic capacitors and still operate at a higher voltage than electrolytic capacitors, as an example.

[0069] The various embodiments of feedthrough assemblies described herein can be utilized with any device or system that requires hermetically sealed conductive pathways. For example, one or more embodiments of feedthrough assemblies described herein can be utilized with an implantable medical device or system. In one or more embodiments, the implantable medical device or system can employ one or more leads that may be used with the various embodiments of feedthrough assemblies described herein. Representative examples of such implantable medical devices include hearing implants, e.g., cochlear implants; sensing or monitoring devices; signal generators such as cardiac pacemakers or defibrillators, neurostimulators (such as spinal cord stimulators, brain or deep brain stimulators, peripheral nerve stimulators, vagal nerve stimulators, occipital nerve stimulators, subcutaneous stimulators, etc.), gastric stimulators; or the like. Further, in one or more embodiments, an implantable medical device can include one or more external contacts of a hermetic assembly that can be utilized to directly provide energy to tissue of a patient.

[0070] FIGS. 1-2 are cross-section and top plan views of one embodiment of a feedthrough assembly 10. The assembly 10 includes a monolithic diamond substrate 12 having a first surface 14 and a second surface 16; one or more feedthroughs 18 extending through the monolithic diamond substrate between the first surface and the second surface of the substrate, where the feedthrough includes conductive carbon material 20; and an external contact 22 disposed adjacent to the first surface of the monolithic diamond substrate and electrically connected to one or more of the feedthroughs.

[0071] The assembly 10 includes the monolithic diamond substrate. Although described as monolithic, in one or more embodiments, the substrate 12 can include two or more portions that can be connected or joined using any suitable technique. In one or more embodiments, the substrate 12 can be described as a single-crystal diamond or as a bulk, single-crystal diamond. Any suitable technique can be utilized to form the substrate 12. Inone or more embodiments, the substrate 12 can be lab-grown. In one or more embodiments, the substrate 12 can be naturally formed. The substrate 12 can be of any suitable quality. Suitable qualities may include industrial grade diamonds, for example. In one or more embodiments, one or more dopants can be disposed on or within the monolithic diamond substrate in any suitable concentration, e.g., nitrogen, boron, etc.

[0072] The substrate 12 can take any suitable shape and have any suitable dimensions. The substrate 12 can be between 2 centimeters and 6 centimeters wide and between 0.1 centimeters and 0.5 centimeters thick, as an example. In one or more embodiments, the width of the substrate 12 can be between 1 cm and 10 cm. In further examples, the width of the substrate 12 can be more than 0.5 cm, more than 1 cm, more than 2 cm, more than 5 cm, more than 8 cm, or more than 10 cm and / or less than 15 cm, less than 12 cm, less than 10 cm, less than 8 cm, less than 5 cm, less than 3 cm, or less than 1 cm. The substrate 12 can be about 4 cm. In one or more embodiments, a height of the substrate 12 can be between 0.05 cm and 1 cm. In further examples, the height of the substrate 12 can be more than 0.05 cm, more than 0.1 cm, more than 0.2 cm, more than 0.5 cm, more than 0.8 cm, or more than 1 cm and / or less than 1.5 cm, less than 1.2 cm, less than 1 cm, less than 0.8 cm, less than 0.5 cm, less than 0.3 cm, or less than 0.1 cm. In one or more embodiments, the height of the substrate 12 can be about 0.3 cm. In one or more embodiments, a depth of the substrate 12 can be between 0.5 cm and 5 cm. In further examples, the depth of the substrate 12 can be more than 0.5 cm, more than 1 cm, more than 2 cm, more than 5 cm, or more than 8 cm, and / or less than 10 cm, less than 7 cm, less than 5 cm, less than 3 cm, less than 2 cm, less than 1 cm, or less than 0.5 cm. In one or more embodiments, the depth of the substrate 12 can be about 2 cm.

[0073] The substrate 12 can have any suitable volume. Suitable volumes can include, for example, between 0.1 cubic cm and 10 cubic cm. In one or more embodiments, the volume of the substrate 12 can be more than 0.1 cubic cm, more than 1 cubic cm, more than 3 cubic cm, more than 5 cubic cm, more than 8 cubic cm, or more than 10 cubic cm and / or less than 15 cubic cm, less than 12 cubic cm, less than 8 cubic cm, less than 6 cubic cm, less than 3 cubic cm, less than 1 cubic cm, or less than 0.5 cubic cm. In one or more embodiments, the volume of the substrate 12 can be about 2 cubic cm.

[0074] The first and second surfaces 14, 16 of the substrate 12 can take any suitable shape. Further the first and second surfaces 14, 16 can be any suitable surfaces of the substrate12. The first and second surfaces 14, 16 can be disposed in any suitable geometric relationship to each other. In one or more embodiments, the first surface 14 can be a first major surface of the substrate 12, and the second surface 16 of the substrate 12 can be a second major surface such that the first and second surfaces are substantially parallel as shown in FIG. 1. In one or more embodiments, the first and second surfaces 14, 16 can be substantially orthogonal.

[0075] Extending through the substrate 12 between the substrate’s first surface 14 and second surface 16 are one or more feedthroughs 18. Although depicted as extending through the substrate 12, in one or more embodiments, one or more feedthroughs 18 can extend from a surface of the substrate to a device or component disposed within the substrate such that the feedthrough does not extend from one surface to another surface of the substrate. Such feedthroughs 18 can be formed using any suitable technique as is further described herein.

[0076] The assembly 10 can include any suitable number of feedthroughs 18. At least one of the feedthroughs 18 includes the conductive carbon material 20. In one or more embodiments, the assembly 10 can include a first feedthrough 18-1 and a second feedthrough 18-2, where each of the first and second feedthroughs includes a conductive carbon material 20. Further, each of the first and second feedthroughs 18-1, 18-2 includes an external contact 22 disposed adjacent to the first surface 14 of the substrate 12 and electrically connected to such feedthrough. The assembly 10 can further include a third feedthrough 18-3 and a fourth feedthrough 18-4.

[0077] The first and second feedthroughs 18-1, 18-2 can be disposed at any suitable center-to-center distance 2 (i.e., pitch) as measured in a direction substantially parallel to the first surface 14 of the substrate 12. In one or more embodiments, the distance 2 is at least 50 microns. In one or more embodiments, the distance 2 can be no greater than 0.060 inches. Further, the assembly 10 can include an array 24 of feedthroughs 18. Such array 24 can include feedthroughs 18 disposed in any suitable arrangement. For example, the feedthroughs 18 can be disposed in a regular array, pseudo random array, or random array.

[0078] Each feedthrough 18 can take any suitable shape and have any suitable dimensions. For example, each feedthrough 18 can have any suitable cross-sectional shape in a plane parallel to the first surface 14 of the substrate 12, e.g., elliptical, rectilinear, polygonal, etc. In one or more embodiments, the feedthrough 18 can have the same cross-sectional shapealong an axis that is substantially orthogonal to the first surface 14 of the substrate 12. In one or more embodiments, the feedthrough 18 can have a cross-sectional shape that varies along such axis. Each feedthrough 18 can also have any suitable cross-sectional area\.

[0079] FIG. 8 is a schematic cross-section view of another embodiment of a feedthrough assembly 500. All design considerations and possibilities described herein regarding the feedthrough assembly 10 of FIGS. 1-2 apply equally to the feedthrough assembly 500 of FIG. 8. One difference between assembly 500 and assembly 10 is that at least one of feedthroughs 518 of assembly 500 has a cross-sectional shape that varies along an axis 502 that is substantially orthogonal to a first surface 514 of substrate 512. For example, each of the feedthroughs 518 has a first portion 521 and a second portion 523. The first portion 521 has a greater cross-sectional area in a plane orthogonal to the axis 502 than a cross-sectional area of the second portion 523. In one or more embodiments, the first portion 521 can have a cross-sectional shape in the plane orthogonal to the axis 502 that is different from a cross-sectional shape of the second portion 523. Further, in one or more embodiments, the first portion 521 can have a cross-sectional shape in a plane substantially parallel to the axis 502 that is different from a cross-sectional shape in such plane of the second portion 523. The first portion 521 can be disposed in a cavity 513 of the substrate 512 that can be formed when the substrate is converted to the conductive carbon material 520. In one or more embodiments, the first portion 521 and the second portion 523 can include conductive carbon material 520. In one or more embodiments, the first portion 521 can include a material that is different from a material of the second portion 523. For example, the first portion 521 can include a conductive material (e.g., a metal such as copper), and the second portion 523 can include conductive carbon material 520. In such embodiment, the cavity 513 can be formed in the substrate 512 using any suitable technique, and a conductive material can be disposed in the cavity using any suitable technique such that the conductive material is electrically connected to the second portion 523 of the feedthrough 518. In the embodiment illustrated in FIG. 8, the greater cross-sectional area of the first portion 521 of the feedthrough 518 in the plane orthogonal to the axis 502 can enhance electrically connectivity of the feedthrough with external contact 522.

[0080] As mentioned herein, the feedthrough 18 can include the conductive carbon material 20. Any suitable conductive carbon material can be utilized. Suitable forms ofconductive carbon may be described as electrically conductive carbon allotropes such as non-diamond carbon allotropes, as an example. Suitable forms of conductive carbon may include carbon allotropes having an sp2hybridized orbital, as an example. As another example, suitable forms of conductive carbon may include conductive allotropes of carbon formed by thermolysis of diamond. Further examples of conductive carbon may include at least one of graphene, graphite, graphitic carbon, carbon nanotubes, or amorphous carbon.

[0081] The conductive carbon 20 can be characterized based on resistivity. Conductive carbon can be characterized by any suitable resistivity. Suitable conductive carbon resistivities can include between 2 microohms per meter (uO / m) and 3,000 uO / m, between 500 uO / m and 800 uO / m, or between 2.5 uO / m and 5 uO / m, for example. Suitable conductive carbon resistivities can additionally or alternatively include less than 5,000 uO / m, less than 500 uO / m, less than 50 uO / m, or less than 5 uO / m.

[0082] The conductive carbon material 20 can additionally or alternatively be characterized based on conductivity. Conductive carbon can be characterized by any suitable conductivity. Suitable conductive carbon conductivities can include between 1 Siemen per meter (S / m) and 300,000 S / m, between 200 S / m and 2,000 S / m, or between 2 S / m and 300,000 S / m, for example. Suitable conductive carbon conductivities can additionally or alternatively include greater than 1 S / m, greater than 100 S / m, greater than 1,000 S / m, greater than 10,000 S / m, or greater than 100,000 S / m.

[0083] The conductive carbon material 20 can be formed using any suitable technique. In one or more embodiments, the conductive carbon material 20 is converted from a portion of the monolithic diamond substrate 12 using any suitable technique. In one or more embodiments, the conductive carbon material is a laser converted conductive carbon material as is further described herein.

[0084] The assembly 10 can also include one or more external contacts 22 disposed adjacent to the first surface 14 of the substrate 12. As used herein, the term “adjacent to the first major surface of the substrate” means that an element or component is disposed closer to the first surface 14 of the substrate 12 than to the second surface 16 of the substrate. In one or more embodiments, the external contact 22 can be disposed on and in contact with the first surface 14. In one or more embodiments, one or more additional layers can be disposed between the external contact 22 and the first surface 14. The external contact 22 can be disposed over the conductive carbon material 20 of thefeedthrough adjacent to the first surface 14 of the substrate 12 as viewed in a plan substantially parallel to the first surface 14.

[0085] At least one external contact 22 can be electrically connected to one of the feedthroughs 18. In one or more embodiments, one external contact 22 is electrically connected to each feedthrough 18. Any suitable technique can be utilized to electrically connect the external contact 22 to the feedthrough. In one or more embodiments, the external contact 22 can be adapted to electrically couple the feedthrough 18 to a conductor or a contact of a device, e.g., a contact of a header of an implantable medical device. Such conductors and contacts can be electrically coupled to the external contact 22 using any suitable technique, e.g., soldering, physical contact, welding, etc.

[0086] In one or more embodiments, the external contact 22 is hermetically sealed to the first surface 14 of the substrate 12. Any suitable technique can be utilized to hermetically seal the external contact 22 to the first surface 14. For example, in one or more embodiments, the external contact 22 can be hermetically sealed to the first surface 14 of the substrate 12 by a bond 26 that surrounds the feedthrough 18 in the plane substantially parallel to the first surface as shown in FIG. 2. Any suitable technique can be utilized to form this bond 26. For example, in one or more embodiments, the bond 26 can be formed using a laser to provide a laser bond such as described in one or more embodiments of laser diffusion bonding techniques described in U.S. Patent No. 10,124,559 B2, entitled KINETICALLY LIMITED NANO-SCALE DIFFUSION BOND STRUCTURES AND METHODS. By surrounding the feedthrough 18 with the bond 26 that hermetically seals the external contact 22 to the first surface 14 of the substrate 12, the feedthrough is also protected from the external environment. The electrical coupling between the external contact 22 and the conductive carbon material 20 of the feedthrough 18 is, therefore, protected, and the integrity of this electrical pathway from the first surface 14 of the substrate 12 to the second surface 16 can be maintained. In one or more embodiments, the external contact 22 can also be attached to the first surface 14 of the substrate 12 using bonds in addition to bond 26. In one or more embodiments, the substrate 12 can be chemically functionalized to enhance bonding of the external contact 22 and the substrate.

[0087] One or more of the feedthroughs 18 can include an internal contact 28 disposed adjacent to the second surface 16 of the substrate 12. As used herein, the term “adjacent to the second surface of the substrate” means that an element or component is disposedcloser to the second surface 16 than to the first surface 14 of the substrate 12. The internal contact 28 can include any suitable material, e.g., the same materials utilized for the external contact 22, and can be formed using any suitable technique such as sputtering, plating, evaporating, etc. Further, the internal contact 28 can take any suitable shape and have any suitable thickness in a direction normal to the second surface 16 of the substrate 12, e.g., the same shapes and thicknesses as described regarding the external contact 22, or other thicknesses and shapes such as conductive traces.

[0088] The internal contact 28 is disposed over the feedthrough 18 on the second surface 16 of the substrate 12. The internal contact 28 can be electrically coupled to the conductive carbon material 20 of the feedthrough 18. The arrangement of the external contact 22, the feedthrough 18, and the internal contact 28 facilitates creation of an electrical pathway between an external side adjacent to the first surface 14 and an interior side adjacent to the second surface 16. In one or more embodiments, the internal contact 28 is hermetically sealed to the second major surface 16 of the substrate 12 using any suitable technique, e.g., by a bond (e.g., laser bond) that surrounds the feedthrough in a plane substantially parallel to the second surface 16 as described herein regarding hermetic sealing of the external contact 22.

[0089] Disposed adjacent to the first surface 14 of the substrate 12 is a patterned conductive layer 30. The patterned conductive layer 30 can be electrically connected to the external contact 22 using any suitable technique. The patterned conductive layer 30 can include any suitable conductive or nonconductive material, e.g., at least one of copper, silver, titanium, niobium, zirconium, tantalum, stainless steel, platinum, iridium, aluminum, Kovar, or nickel. The patterned conductive layer 30 can include any suitable number of layers. In one or more embodiments, the patterned conductive layer 30 can include a foil or foils disposed using any suitable technique. The patterned conductive layer 30 can include any suitable layers or sublayers.

[0090] Further, the patterned conductive layer 30 can be disposed in any suitable pattern when connected to the first surface 14 of the substrate 12. In one or more embodiments, one or more portions of the patterned conductive layer 30 can form one or more external contacts 22. Further, the patterned conductive layer 30 can include one or more welding portions that can be utilized to connect a ferrule 106 (FIG. 3) to the substrate 12 as is further described herein.

[0091] Any suitable technique can be utilized to dispose the patterned conductive layer 30 on or adjacent to the first surface 14 of the substrate 12. For example, the patterned conductive layer 30 can be disposed on or adjacent the first surface 14 utilizing one or more of photolithography, etching, plasma vapor deposition, chemical vapor deposition, electroplating, laser bonding, etc. In one or more embodiments, the patterned conductive layer 30 can be connected to the first surface 14 by one or more laser bonds 36.

[0092] The patterned conductive layer 30 can, in one or more embodiments, be considered a first patterned conductive layer, and the assembly 10 can optionally include a second patterned conductive layer 38 disposed on or adjacent to the second surface 16 of the substrate 12. The second patterned conductive layer 38 can include any suitable patterned conductive layer, e.g., patterned conductive layer 30. The same design characteristics and possibilities described herein regarding the first patterned conductive layer 30 can be applied to the second patterned conductive layer 38. The second patterned conductive layer 38 can be electrically connected to one or more of the internal contacts 328 using any suitable technique.

[0093] The assembly 10 can also include one or more electronics or electronic components 40 disposed adjacent to at least one of the first surface 14 or the second surface 16 of the substrate 12. The electronic component 40 can include any suitable circuit or component, e.g., at least one of a capacitor, transistor, integrated circuit, including controller or multiplexer, sensor, accelerometer, optical components such as emitters and detectors, etc. Although depicted as including one electronic component 40, the assembly 10 can include any suitable number of electronic components. Further, the electronic component 40 can be electrically connected to one or more feedthroughs 18 using any suitable technique or techniques. In one or more embodiments, the electronic component 40 is electrically connected to one or more feedthroughs 18 by one or more device contacts 42. Such device contacts 42 can be electrically connected to one or more internal contacts 28 of feedthroughs 18 using any suitable technique. In one or more embodiments, the electronic component 40 can include one or more test points disposed on one or more surfaces of the electronic component as is further described, e.g., in U.S. Patent Publication No. 2021 / 0178518 Al entitled HERMETIC ASSEMBLY AND DEVICE INCLUDING SAME.

[0094] As mentioned herein, the various embodiments of feedthrough assemblies can be utilized in any suitable device or system. For example, FIG. 3 is a schematic cross-section view of one embodiment of a hermetically-sealed package 100. The package 100 includes a housing 102 and the feedthrough assembly 10 of FIGS. 1-2. Although depicted as including the assembly 10, the hermetically-sealed package 100 can include any suitable feedthrough assembly. In one or more embodiments, the assembly 10 can form a part of the housing 102 of the package 100. The housing 102 defines a recess 104 within which one or more electronic components or circuitry (e.g., electronic component 40) can be disposed.

[0095] The housing 102 can be connected to the assembly 10 using any suitable technique. In one or more embodiments, a ferrule 106 can be connected to the assembly 10 and the housing 102 using any suitable technique, e.g., one or more of the techniques described in U.S. Patent Publication No. 2021 / 0178518 Al. For example, the ferrule 106 can be connected to the patterned conductive layer 30 of the assembly 10 by one or more welds 108. Any suitable welding technique can be utilized to provide the weld 108, e.g., laser welding. Further, the weld 108 can take any suitable shape or shapes and have any suitable dimensions. Further, the ferrule 106 can be connected to the housing 102 by one or more bonds or welds 110. Any suitable technique can be utilized to form the weld 110, e.g., the same technique described herein regarding the weld 108. When connected, the housing 102, ferrule 106, and substrate 12 of the feedthrough assembly 10 form a cavity 112.

[0096] The housing 102 of the package 100 can include any suitable dimensions and take any suitable shape. Further, the housing 102 can include any suitable material, e.g., metallic, polymeric, ceramic, or inorganic materials. In one or more embodiments, the housing 102 can include at least one of glass, quartz, silica, sapphire, silicon carbide, diamond, synthetic diamond, or gallium nitride (including clad structures, laminates etc.). In one or more embodiments, the housing 102 can include at least one of copper, silver, titanium, niobium, zirconium, tantalum, stainless steel, platinum, iridium, aluminum, nickel, Kovar, or AlMg (including clad structures, laminates etc.). In one or more embodiments, the housing 102 can include the same material as the substrate 12 of the assembly 10.

[0097] The package 100 can include any suitable electronic component 40 or electronics disposed within the housing 102. In one or more embodiments, the electronic component 40 can include any suitable integrated circuit or device, e.g., a controller, a multiplexer, etc. It should be understood that any of the electronic devices mentioned in this disclosure can be coupled to a power source. Further, the package 100 can include a second electronic component 114 disposed in any suitable location within the housing 102. The second electronic component 114 can include any suitable integrated circuit or device. In one or more embodiments, the second electronic component 114 can include a power source that is adapted to provide power to one or more integrated circuits or devices disposed within the housing 102 or exterior to the housing. Any suitable power source 114 can be disposed within the housing 102, e.g., one or more batteries, capacitors, etc. The power source 114 can be rechargeable by electrically connecting the power source to a power supply through the feedthrough assembly 10. In one or more embodiments, the power source 114 can be adapted to be inductively charged by an inductive power system that is external to the package 100. The power source 114 can be electrically connected to the electronic component 40 using any suitable technique. In one or more embodiments, the power source 114 can include a hermetically-sealed battery that is connected to the feedthrough assembly 10 using any suitable technique or techniques.

[0098] As mentioned herein, any suitable technique can be utilized to form the feedthroughs 18 of assembly 10. For example, FIGS. 4A-D are schematic cross-section views of one embodiment of a method of forming the feedthrough assembly 10 of FIGS. 1-2. Although depicted as referring to assembly 10, the method 200 can be utilized to form any suitable feedthrough assembly. As shown in FIG. 4A, electromagnetic radiation 202 is focused into the monolithic diamond substrate 12 to convert a region 204 of the substrate into the conductive carbon material 20 that forms the feedthrough 18 and that extends between the first surface 14 and the second surface 16 of the substrate. Although depicted as directing electromagnetic radiation 202 through the first surface 14 of the substrate 12, the electromagnetic radiation 202 can be directed through any surface of the substrate to convert the region 204 of the substrate into conductive carbon material 20. For example, in one or more embodiments, the electromagnetic radiation 202 can be directed through the second surface 16 of the substrate to convert the region 204 into conductive carbon material 20. Any suitable electromagnetic radiation having any suitable wavelengthor wavelengths and pulse width can be utilized. In one or more embodiments, the electromagnetic radiation 202 can include a pulsed laser (e.g., an ultrafast-pulsed laser) having any suitable pulse length, e.g., less than 1 picosecond, less than 30 femtoseconds, etc.

[0099] Focusing the electromagnetic radiation 202 into the substrate 12 can include shaping the electromagnetic radiation (e.g., a laser beam) to create a Gaussian focus. For example, Gaussian laser pulses can be focused inside the substrate 12. A Gaussian focus can be described as exhibiting a relatively shallow axial depth of focus, which may be approximately the same size as the lateral extent of focus. In other words, a Gaussian focus may be described as having a low aspect ratio.

[0100] Focusing the electromagnetic radiation 202 can additionally or alternatively include shaping the electromagnetic radiation (e.g., a laser beam) to create a Bessel Focus. For example, Bessel laser pulses may be focused inside the substrate 12. A Bessel focus can be described as exhibiting a relatively deep axial depth of focus, which may be up to hundreds of times longer than the lateral extent of the focus. In other words, a Bessel focus can be described as forming a cylindrical focal region conceptually similar to a pencil. Put another way, a Bessel focus can be described as having a low aspect ratio. Although the rays of the Bessel laser may be described as converging across a wide lateral extent, the energy intensity may be described as reaching the threshold for transforming the diamond monolithic body only in the centermost 1-2 micrometers of the overlap region. In one or more embodiments, Bessel laser pulses can convert a large amount of material at a time, thereby potential reducing manufacturing time.

[0101] In one or more embodiments, the feedthrough 18 can be the first feedthrough 18-1, and the method can include focusing electromagnetic radiation into the substrate 12 to convert a second region 206 of the substrate into conductive carbon material 20 that forms a second feedthrough 18-2 that extends between the first surface 14 and the second surface of the substrate as shown in FIG. 4B. A first external contact 22-1 of the external contacts 22 can be electrically connected to the first feedthrough 18-1 and a second external contact 22-2 can be associated with the second feedthrough 18-2. In one or more embodiments, a third external contact 22-3 can be associated with a third feedthrough 18- 3, and a fourth external contract 22-4 can be associated with a fourth feedthrough 18-4.As is further described herein, any suitable number of feedthroughs 18 can be disposed in the substrate 12.

[0102] In one or more embodiments, the conductive carbon material 20 can be removed using any suitable technique to form a via prior to disposal of at least one of the external or internal contacts 22, 28. For example, the conductive carbon material 20 can be laser ablated to form the via. Any suitable conductive material can then be disposed within the via using any suitable technique to form the feedthrough 18.

[0103] As also shown in FIG. 4B, one or more external contacts 22 can be disposed adjacent to the first surface 14 of the substrate 12 such that at least one external contact is electrically connected to each feedthrough 18. Any suitable technique can be utilized to dispose the external contacts 22 adjacent to the first surface 14 of the substrate 12. In one or more embodiments, one or more of the external contacts 22 can be connected to the first surface 14 of the substrate 12 using any suitable technique. For example, one or more of the external contact 22 can be laser bonded to the first surface 14 of the substrate 12 by forming the bond line 26 (FIG. 2).

[0104] The patterned conductive layer 30 can be disposed adjacent to the first surface 14 of the substrate 12 as shown in FIG. 4C using any suitable technique. Further, the patterned conductive layer 30 can be electrically connected to one or more of the external contacts 22 using any suitable technique. Further, the patterned conductive layer 30 can be a first patterned conductive layer, and the second patterned conductive layer 38 can be disposed adjacent to the second surface 16 of the substrate 12 using any suitable technique.

[0105] In FIG. 4D, one or more internal contacts 28 can be disposed adjacent to the second surface 16 of the substrate 12 such that one or more of the internal contacts are electrically connected to one or more of the feedthroughs 18. Any suitable technique can be utilized to dispose the internal contacts 28 on the second surface 16 of the substrate 12. Further, one or more of the internal contacts 28 can be electrically connected to the second patterned conductive layer 38 using any suitable technique.

[0106] Although not shown, in one or more embodiments, the substrate 12 of the assembly 10 can be connected to a housing (e.g., housing 102 FIG. 3) to form a hermetically sealed package (e.g., hermetically-sealed package 100) using any suitable technique. For example, a ferrule (e.g., ferrule 106) can be connected to the assembly 10and the housing by forming one or more laser welds between at least one of the ferrule and the assembly or housing.

[0107] As mentioned herein, any suitable devices or components can be disposed within the substrate 12 of the assembly 10. For example, FIGS. 5-6 are various views of another embodiment of a feedthrough assembly 300. All design considerations and possibilities described herein regarding feedthrough assembly 10 of FIGS. 1-2 apply equally to feedthrough assembly 300 of FIGS. 5-6. The feedthrough assembly 300 includes a monolithic diamond substrate 312 having a first surface 314 and a second surface 316. One or more feedthroughs 318 extend through the substrate 312 between the first surface 314 and the second surface 316. One or more of the feedthroughs 318 include conductive carbon material 320. Further, one or more external contacts 322 are disposed adjacent to the first surface 314 of the substrate 312, where an external contact can be electrically connected to each feedthrough 318 using any suitable technique. Further, as shown in FIG. 6, one or more internal contacts 328 can be disposed adjacent to the second surface 316 of the substrate 312 using any suitable technique, where an internal contact can be electrically connected to each feedthrough 318 using any suitable technique.

[0108] One difference between feedthrough assembly 300 of FIGS. 5-6 and feedthrough assembly 10 of FIGS. 1-2 is that the assembly 300 includes one or more capacitors 350 disposed within the substrate 312 adjacent to the feedthroughs 318. One or more of the capacitors 350 can be electrically coupled to one or more of the feedthroughs 318 using any suitable technique. As used herein, the term “electrically coupled” means that one or more capacitors 350 are disposed in relation to a feedthrough 318 such that capacitors are capable of filtering one or more signals that are transmitted through the feedthrough. Any suitable capacitors 350 can be disposed on or within the substrate 312, e.g., one or more of the capacitors described in U.S. Patent Application No. 63 / 461,037, entitled MONOLITHIC DIAMOND CAPACITOR WITH CONDUCTIVE CARBON ELECTRODES. The assembly 300 can include any suitable number of capacitors.

[0109] Each capacitor 350 includes the first plate or electrode region 352 and the second plate or electrode region 354 that is substantially parallel to the first plate. The first plate 352 can define a plane or an axis. Further, the first plate 352 can extend from a first electrode contact region 353 at a third surface 315 of the substrate 312, a fourth surface 317 of the substrate, or each of the third and fourth surfaces. In one or more embodiments,the first plate 352 can extend from either or both of the first surface 314 and second surface 316. The first plate 352 can have a polarity, such as a positive polarity or a negative polarity.

[0110] Although not shown, the second plate 354 can extend from a second electrode contact region at one or more surfaces of the substrate 312. The second plate 354 can define a plane or an axis, which may be parallel to the plane or the axis of the first plate 352. The second plate 354 can have a polarity, such as a negative polarity or a positive polarity. The second plate 354 can have a polarity opposite the polarity of the first plate 352.

[0111] Further, one or more portions 356 of the substrate 312 can be disposed between the first plate 352 and the second plate 354 to form a layer. The portions 356 can be described as separating capacitive interface regions of the first plate 352 and the second plate 354, respectively. The illustrative capacitors 350 can be described as including multiple capacitor unit cells. That is, each capacitor 350 includes one dielectric diamond layer 356 separating two electrode plates 352, 354, thereby establishing one capacitor unit cell.

[0112] Each of the first plate 352 and the second plate 354 is substantially orthogonal to the feedthroughs 318. In one or more embodiments, each feedthrough 318 extends through the first plate 352 and the second plate 354 through one or more openings 358 disposed in the first plate and one or more openings 360 disposed in the second plate. The openings 358, 360 can take any suitable shape and have any suitable dimensions.

[0113] Each of the first plate 352 and the second plate 354 of the capacitor 350 can include any suitable conductive material. In one or more embodiments, at least one of the first plate 352 and the second plate 354 of the capacitor 350 includes a conductive carbon material that is converted from one or more portions of the substrate 12 using any suitable technique as described herein regarding formation of feedthroughs (e.g., feedthrough 18 of FIGS. 1-2).

[0114] In one or more embodiments, each capacitor 350 can include a first electrode connector (not shown), which may electrically connect at least two first plates 352 of the plurality of capacitor unit cells 350. Additionally, or alternatively, the capacitor 350 can include a second electrode connector (not shown), which may electrically connect at least two second plates 354 of the plurality of capacitor unit cells. The first or second electrode connector may each be electrically connectable to a power source (such as a battery oranother capacitor, as just two examples) for transfer of energy from the power source to the capacitor. Additionally, or alternatively, the first or second electrode connector may each be electrically connectable to a device (such as the leads of a medical device, for example) for transfer of energy from the capacitor to the leads.

[0115] The electrode connector may include any suitable material. Suitable electrode connector materials may be selected based on conductivity of the material, a desired method of assembly, and a material compatibility (such as between the electrode connector and the electrode region or between the electrode connector and the monolithic diamond substrate), as a few examples. As another example, suitable materials may be selected based on compatibility of the material with the conductive carbon of the electrode regions. Compatibility may include factors such as contact resistance between the electrode connector material and the conductive carbon or adhesion between the electrode connector material and the conductive carbon. Suitable electrode connector materials may include a metal, a conductive resin, a conductive epoxy (such as an epoxy impregnated with silver), a conductive polymer, or combinations of two or more thereof, for example. As further examples, suitable electrode connector materials may include aluminum, copper, silver, gold, platinum or combinations of two or more thereof. As still further examples, suitable electrode connector materials may include a simple metal layer, sputtered metal, solder balls, or a combination of two or more thereof. It will be understood in light of the present disclosure that any suitable electrode connector material may be used, and the disclosure is not limited in this regard.

[0116] The feedthrough assembly 300 can be formed using any suitable technique. For example, the feedthroughs 318, external contacts 322, and internal contacts 328 can be formed using the techniques described in reference to FIGS. 4A-D regarding feedthrough assembly 10. The capacitors 350 can be formed using any suitable technique, e.g., one or more of the techniques described in U.S. Patent Application No. 63 / 461,037.

[0117] For example, electromagnetic radiation can be focused into the substrate 312 to convert a region 302 of the substrate into conductive carbon material that forms one or more capacitors 350 within the substrate. The capacitors 350 can be electrically coupled to one or more of the feedthroughs 318 using any suitable technique. Each capacitor 350 can include the first plate 352, the second plate 354, and the portion or layer 356 of thesubstrate 312 that is disposed between the first plate and the second plate. Any suitable number of capacitors 350 can be formed within the substrate 312.

[0118] One or more embodiments of feedthrough assemblies described herein include one or more feedthroughs disposed in a monolithic diamond substrate. In one or more embodiments, one or more feedthroughs can be disposed within a portion of the monolithic diamond substrate that is then disposed within an additional substrate to provide a feedthrough assembly. For example, FIG. 7 is a schematic plan view of a feedthrough assembly 400 that includes a feedthrough 418. All design considerations and possibilities described herein regarding the feedthrough assembly 10 of FIGS. 1-2 and the feedthrough assembly 300 of FIGS. 5-6 apply equally to the feedthrough assembly 400 of FIG. 7.

[0119] One difference between assembly 400 and assemblies 10 and 300 is that assembly 400 includes a monolithic diamond portion 412 that surrounds a feedthrough 418 to form a subassembly 402. Such subassembly 402 is disposed within a substrate 404 to provide the feedthrough assembly 400. The subassembly 402 can be formed using any suitable technique. In one or more embodiments, the subassembly 402 can be formed along with additional subassemblies in a monolithic diamond substrate and then singulated using any suitable technique, e.g., sawing, laser ablating, laser cutting, etc. Such singulated subassembly 402 can then be disposed within substrate 404 using any suitable technique.

[0120] It should be understood that various aspects disclosed herein may be combined in different combinations than the combinations specifically presented in the description and accompanying drawings. It should also be understood that, depending on the example, certain acts or events of any of the processes or methods described herein may be performed in a different sequence, may be added, merged, or left out altogether (e.g., all described acts or events may not be necessary to carry out the techniques). In addition, while certain aspects of this disclosure are described as being performed by a single module or unit for purposes of clarity, it should be understood that the techniques of this disclosure may be performed by a combination of units or modules associated with, for example, a medical device.

[0121] In one or more examples, the described techniques may be implemented in hardware, software, firmware, or any combination thereof. If implemented in software, the functions may be stored as one or more instructions or code on a computer-readablemedium and executed by a hardware -based processing unit. Computer-readable media may include computer-readable storage media, which corresponds to a tangible medium such as data storage media (e.g., RAM, ROM, EEPROM, flash memory, or any other medium that can be used to store desired program code in the form of instructions or data structures and that can be accessed by a computer).

[0122] Instructions may be executed by one or more processors, such as one or more digital signal processors (DSPs), general purpose microprocessors, application specific integrated circuits (ASICs), field programmable logic arrays (FPGAs), or other equivalent integrated or discrete logic circuitry. Accordingly, the term “processor” as used herein may refer to any of the foregoing structure or any other physical structure suitable for implementation of the described techniques. Also, the techniques could be fully implemented in one or more circuits or logic elements.

[0123] All references and publications cited herein are expressly incorporated herein by reference in their entirety into this disclosure, except to the extent they may directly contradict this disclosure. Illustrative embodiments of this disclosure are discussed and reference has been made to possible variations within the scope of this disclosure. These and other variations and modifications in the disclosure will be apparent to those skilled in the art without departing from the scope of the disclosure, and it should be understood that this disclosure is not limited to the illustrative embodiments set forth herein. Accordingly, the disclosure is to be limited only by the claims provided below.

Claims

WHAT IS CLAIMED IS:

1. A feedthrough assembly comprising: a monolithic diamond substrate comprising a first surface and a second surface; a feedthrough extending through the monolithic diamond substrate between the first surface and the second surface of the substrate, wherein the feedthrough comprises conductive carbon material; and an external contact disposed adjacent to the first surface of the monolithic diamond substrate and electrically connected to the feedthrough.

2. The assembly of claim 1, wherein the conductive carbon material is converted from a portion of the monolithic diamond substrate.

3. The assembly of any one of claims 1-2, wherein the monolithic diamond substrate comprises a single crystal diamond substrate.

4. The assembly of any one of claims 1-3, wherein the conductive carbon material comprises graphitic carbon.

5. The assembly of any one of claims 1-4, further comprising a capacitor disposed within the substrate adjacent to the feedthrough, wherein the capacitor is electrically coupled to the feedthrough.

6. The assembly of claim 5, wherein the capacitor comprises a first plate and a second plate that is substantially parallel to the first plate, wherein a portion of the substrate is disposed between the first plate and the second plate.

7. The assembly of claim 6, wherein the first plate and the second plate of the capacitor comprises conductive carbon material that is converted from a portion of the monolithic diamond substrate.

8. A hermetically- sealed package comprising a housing and a feedthrough assembly that forms a portion of the housing, wherein the feedthrough assembly comprises: a monolithic diamond substrate comprising a first surface and a second surface, wherein the substrate is connected to the housing; a feedthrough extending through the monolithic diamond substrate between the first surface and the second surface of the substrate, wherein the feedthrough comprises conductive carbon material; and an external contact disposed adjacent to the first surface of the monolithic diamond substrate and electrically connected to the feedthrough.

9. The package of claim 8, further comprising a capacitor disposed within the substrate adjacent to the feedthrough, wherein the capacitor is electrically coupled to the feedthrough.

10. The package of claim 9, wherein the capacitor comprises a first plate and a second plate that is substantially parallel to the first plate, wherein a portion of the substrate is disposed between the first plate and the second plate.

11. The package of claim 10, wherein major surfaces of each of the first plate and the second plate are substantially orthogonal to the feedthrough.

12. The package of claim 11, wherein the feedthrough extends through the first plate and the second plate.

13. The package of any one of claims 9-12, wherein the first plate and the second plate of the capacitor comprises conductive carbon material that is converted from a portion of the monolithic diamond substrate.

14. An implantable medical device comprising the hermetically-sealed package of any one of claims 8-13.

15. A method comprising: focusing electromagnetic radiation into a monolithic diamond substrate to convert a region of the monolithic diamond substrate into conductive carbon material that forms a feedthrough that extends between a first surface and a second surface of the monolithic diamond substrate; and disposing an external contact adjacent to the first surface of the monolithic diamond substrate such that it is electrically connected to the feedthrough.

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