Film-free packaging

Abstract

The invention relates to a printed substrate, preferably for producing paper-based packaging, having a backing layer which has at least one paper layer, wherein a first transfer-metallised metal layer is provided on a first side of the backing layer, which metal layer is connected to the backing layer via at least one adhesive layer, preferably at least one varnish layer, wherein the first metal layer optionally has at least one coating containing a release varnish on the side opposite the backing layer. The problem addressed by the present invention of providing a printed substrate for producing packaging, with which, in addition to very economical producibility and good recyclability, other functional properties of contemporary printed substrates for producing packaging can also be provided, is solved in that the backing layer (1), on the first transfer-metallised metal layer (5) and / or on the coating containing a release varnish optionally provided at least in regions on the first transfer-metallised metal layer, is printed at least in regions with at least one electron-beam-curable printing ink (7), wherein at least one coating, which is electron-beam-curable at least in regions and contains an overprint varnish (8), is provided on the printed side of the backing layer (1).

Description

[0001]August 26, 2024 Film-free packaging The invention relates to a printed substrate, preferably for the production of paper-based packaging, with a carrier layer comprising at least one paper layer, wherein a first transfer-metallized metal layer is provided on a first side of the carrier layer, which is bonded to the carrier layer via at least one adhesive layer, preferably at least one lacquer layer, wherein the first metal layer optionally has at least one coating with a release lacquer on the side opposite the carrier layer. The invention further relates to a method for producing a printed substrate, comprising the steps: (i) providing a carrier layer with at least one paper layer,(ii) at least partially transfer-metallizing the at least one carrier layer on one side with at least one first metal layer, comprising the steps of a) laminating the carrier layer with a carrier film using at least one adhesive layer, wherein the carrier film has an optional release lacquer layer and a metal layer provided at least partially on the release lacquer layer or directly on the carrier film, b) curing the at least one adhesive layer, and c) separating the carrier film from the carrier layer, so that the adhesive layer with the at least partially provided metal layer remains on the carrier layer, wherein optionally the metal layer on the side opposite the carrier layer has at least one coating with a release lacquer. The invention further relates to a packaging for consumer goods,Preferably for consumer goods from the food or non-food sector. Packaging for consumer goods, especially food packaging, is now predominantly made from substrates that comprise multi-layer composites. Important packaging properties, such as barrier properties for water vapor or oxygen, are often achieved via polymer layers as the predominant components of the substrate. The various requirements are usually not met by a single polymer; therefore, different polymer layers are usually combined in a composite to provide essential packaging properties. Essential properties can include resistance to polar and non-polar solvents, such as water, fats, or oils, or barrier properties against the diffusion of gases, such as oxygen, or protection against harmful radiation.For example, daylight. A disadvantage of these substrates and the packaging made from them is that the different polymer layers used make up a significant proportion of the entire multilayer composite, so that the recyclability of the multilayer composite materials is only possible with great effort or not at all. According to international patent application WO 2022 / 1165290 A1, improved paper-based substrates are said to have, in addition to a paper layer, an aluminum layer and a nanoclay barrier layer in which the nanoclay is embedded in a PVOH polyacrylate layer. The aluminum layer is to be applied to the paper layer using a vacuum deposition process. A disadvantage of this substrate is that additional polymer layers are used to print the substrate.This reduces recyclability. Vacuum deposition of aluminum is also time-consuming and expensive. International patent application WO 2022 / 023077 A1 also proposes a vacuum-deposited aluminum layer for paper-based substrates, with the paper layer first being provided with a pre-metallization layer for smoothing. H / SH 230838WOAugust 26, 2024 German patent application DE 2907186 A1 discloses a process for producing printed substrates for paper-based packaging using transfer metallization. In this process, a very thin metal coating is applied to a polypropylene film, which serves solely as a carrier film for the metal layer. The metal layer is then coated, for example, on the carrier film with a lacquer coating, such as polyurethane lacquer. The metal-coated carrier film and the object to be coated are then combined to form a laminate. The lacquer coating is cured, and then the transfer-metallized object and the carrier film are separated again. The metal layer remains on the carrier, resulting in a mirror-like, shiny metallic surface with a highly polished appearance. The drying process for the lacquer coating takes several days.The metal layer can be printed using the offset printing process according to the teaching of German patent application DE 2907186 A1. werden.In the transfer metallization of laminates, so-called "release lacquers" are frequently used, which simplify the separation of the carrier film and the metal layer. These are applied to the carrier film before coating the carrier film with metal and remain on the metal layer. The release lacquers, for example, provide higher bonding forces to the metal layer than to the carrier film, so that the two can be reliably separated. Based on this prior art, the object of the present invention is to provide a printed substrate for the production of packaging, which, while being very economical to produce and easy to recycle, can also provide other functional properties of today's printed substrates for the production of packaging. Furthermore, corresponding packaging and a production process for the substrate according to the invention are to be proposed. H / SH 230838WOAugust 26, 2024. The stated object is achieved for a substrate for paper-based packaging mentioned above in that the carrier layer is printed at least partially with at least one electron-beam-curable printing ink on the first transfer-metallized metal layer and / or on the optional release varnish coating provided at least partially on the first transfer-metallized metal layer, and at least one electron-beam-curable coating consisting of an overprint varnish is provided on the printed side of the carrier layer, provided at least partially. Surprisingly, it has been found that the transfer-metallized substrate can be printed economically on the transfer-metallized side with at least one electron-beam-curable printing ink, and the print can subsequently be protected with at least one electron-beam-curable overprint varnish.This is surprising, given that the surface is metallized. The same applies to printing the optional, at least partially provided coating with a release varnish due to the underlying transfer metal layer. To achieve excellent visual appearance, a variety of electron-beam-curable printing inks, for example, at least four electron-beam-curable printing inks in the CMYK color model and at least one additional special printing ink, can be provided on the substrate. The arrangement of at least two different electron-beam-curable overprint varnishes allows additional optical effects to be achieved on the printed substrate. Of course, only one electron-beam-curable printing ink can be used with an at least partially provided overprint varnish. A partial transfer metallization is conceivable for the printed substrate, for example, in the form of at least one transfer metallization-free stripe.Other repeating patterns, for example, are also feasible. H / SH 230838WOAugust 26, 2024. The printed substrate constructed in this way has excellent recyclability due to the use of electron-beam-curing printing ink and overprint varnishes, as well as excellent optical properties thanks to the high-gloss transfer metallized metal layer. During electron-beam curing, the printing ink and overprint varnish are completely cured by radical polymerization in a very short time. After electron-beam curing, electron-beam-curable printing inks and overprint varnishes no longer contain any solvents, plasticizers, or photoinitiators and are therefore extremely low-migration. The metal layer can also provide barrier properties, for example, as a water vapor barrier, aroma, oxygen, oil, or grease barrier. It also serves to shield against harmful radiation, such as sunlight. The printed substrate is therefore also ideal for food packaging.Electron-beam curable printing inks and coating varnishes allow the use of the highly economical offset printing process with electron beam curing, so that the printed substrate can be provided with virtually no curing time and therefore particularly economically. According to a first embodiment, the at least one paper layer is preferably suitable for processing in the offset printing process and optionally has a grammage of 20 to 150 g / m². The paper layer contains pulp, usually from wood fibers, which can originate from various sources and processing stages. The printed substrate can be of any paper quality. The carrier layer can even comprise transparent paper layers consisting of glassine. Recycled paper layers can also be used without any problems to achieve a high level of sustainability of the substrate without significantly affecting its appearance. H / SH 230838WOAugust 26, 2024 The offset printing process, especially the continuous offset process, is particularly suitable for printing a large quantity of substrates with very high graphic quality. Therefore, the printed substrate is preferably in strip form after printing and can be wound into a roll and, for example, fed into a device for producing the actual packaging. The grammage of paper layers ranges from 7 g / m² to 225 g / m². Higher grammages are referred to as cardboard according to DIN 6730. A preferred grammage of 20 g / m² to 150 g / m² ensures excellent processability in the offset printing process, especially in the continuous offset printing process with very high production speeds.If the at least one adhesive layer arranged between the paper layer and the metal layer is designed for chemical curing, thermal curing, UV curing, or electron beam curing, whereby the adhesive layer can be provided via one component or optionally by mixing at least two components, rapid production cycles can be achieved in the transfer metallization of the paper layer according to one embodiment. In principle, all possible crosslinking processes can be used to cure an adhesive layer, particularly provided they combine low layer thicknesses with good adhesion of the metal layer. Two-component adhesives or lacquers are preferably used, since these can be easily adjusted with regard to the curing time.Even shorter curing cycles are achieved when the adhesive layer is designed for curing using UV rays or electron beam curing. The adhesive layer designed for electron beam curing is preferably provided via a single component and, after electron beam curing, allows the creation of particularly low-migration adhesive layers that are free of solvents, plasticizers, or photoinitiators. Printed substrates with these adhesive layers are therefore particularly well suited for contact with consumer goods in the food sector. H / SH 230838WOAugust 26, 2024. According to a further embodiment of the printed substrate, the adhesive layer provided between the at least one paper layer and the metal layer has a thickness of 1 µm to 5 µm, preferably 1.5 µm to 4 µm, particularly preferably 1.5 µm to 3.5 µm. The low thickness of the adhesive layer between the transfer-metallized metal layer and the paper layer enables particularly good recycling properties, since the majority of the printed substrate consists of paper, which inherently has a high recyclability. The separation of paper and printing ink, as well as the metal layer, is achieved in conventional processes from paper recycling. Einsatz.According to a next embodiment, the metal layer provided at least in regions preferably has a thickness of 10 nm to 100 nm, preferably 20 nm to 50 nm, wherein the metal layer optionally consists of gold, silver, copper, nickel, tin, aluminum, or alloys of the metals. Aluminum or an aluminum alloy is preferably used because it is cost-effective and has good properties with regard to the flexibility and chemical stability of the coating. The extremely thin metal layer already provides very good barrier properties for water vapor due to the transfer metallization.According to a further embodiment, the barrier properties of the printed substrate can be further improved by providing at least one second transfer-metallized metal layer on the second side of the carrier layer opposite the first transfer-metallized metal layer, which is bonded to the carrier layer via at least one second adhesive layer, preferably a lacquer layer, wherein the second metal layer optionally has at least one coating with a release lacquer on the side opposite the carrier layer. The metals gold, silver, copper, nickel, tin, aluminum, and their alloys mentioned above can also be used for the at least one second transfer-metallized metal layer. The same applies to the selection of the S. H / SH 230838WOAugust 26, 2024 Adhesive layers. Reference is made to the explanations regarding the first transfer-metallized layer. An electron-beam-curable adhesive layer is particularly preferably used, so that the two-sided transfer-metallized substrate also achieves the advantages in terms of recyclability and low migration of the substrate. Finally, according to a next embodiment, the substrate can be further improved by printing the side of the second, transfer-metallized metal layer opposite the second adhesive layer at least partially with at least one electron-beam-curable printing ink and / or by providing at least one electron-beam-curable coating comprising an overprint varnish on the second side of the carrier layer, at least partially provided.This makes it possible to provide a substrate printed on both metal layers, which additionally has even further improved barrier properties due to the at least one second metal layer. Further advantages that arise from the provision of a variety of different electron-beam-curable printing inks and overprint varnishes already during printing on the first metal layer can also be achieved on the second side of the carrier layer. According to a further embodiment of the printed substrate, at least one further functional, at least partial-area coating is provided on the carrier layer and / or as an outer coating of the printed substrate, which can additionally provide specific properties adapted to the packaging to be produced. For example, an additional functional coating on the carrier layer can further protect the paper layer of the single-sided printed substrate from moisture.The provision of heat-sealing properties on the side intended as the outer coating of the printed substrate can be used to prepare the printed substrate for packaging. In addition, additional coatings are possible on both the carrier layer and the outer side of the printed substrate. H / SH 230838WOAugust 26, 2024, which can, for example, partially change the mechanical properties of the packaging to be produced. According to a further embodiment, the printed substrate can also have means for recognizing the printed substrate for devices for producing packaging. The means for recognizing the printed substrate for devices for producing packaging can, for example, be certain recognition areas that are left out, for example, during transfer metallization, so that the device can recognize the paper material at this point, for example. Other embodiments, for example information readable by corresponding devices, are also conceivable as recognition means. Finally, the printed substrate preferably has a total thickness of 10 µm to 200 µm, preferably 15 µm to 150 µm, particularly preferably 30 µm to 130 µm.The layer sequence of the printed substrate allows, apart from the paper layer, only minimal layer thicknesses of other materials to be used while still achieving the desired effects, such as high adhesion of the metal layer to the paper layer or a good barrier effect with minimal metal layer thickness. According to DIN 131430, the recyclable material content of the substrate is preferably at least 50 wt.%, preferably at least 80 wt.%, so that the printed substrate has good recycling properties. aufweist.According to a further teaching of the present invention, the stated object is achieved by a method for producing a printed substrate mentioned at the outset in that (iii) the carrier layer is printed on the first side with the first transfer-metallized metal layer and / or on the optional release lacquer layer provided at least in regions with at least one electron beam-curable printing ink, S H / SH 230838WOAugust 26, 2024 (iv) the printed first metal layer and / or the optionally printed release varnish layer is coated at least partially with at least one electron beam curable overprint varnish and (v) the at least one printing ink and the at least one overprint varnish are cured by electron beam curing. As already mentioned with regard to the printed substrate, it has surprisingly been found that electron beam curing of printing ink and electron beam curing of an overprint varnish can also be carried out on a transfer-metallized surface of a substrate, even though it is a metallized surface.The combination of the steps of transfer metallization of a carrier layer with at least one paper layer and subsequent printing of the metallized layer and / or the optional release varnish layer provided at least in part with at least one electron-beam-curable printing ink, as well as at least partially coating the printed side with at least one electron-beam-curable overprint varnish, provides the outstanding product properties in terms of recyclability, appearance, and barrier properties of the printed substrate combined with an efficient manufacturing process. After electron-beam curing of the overprint varnish, the printed substrate is completely produced and can be immediately further processed, for example, for the production of packaging. No curing times are required.The process steps (iii), (iv), and (v) mentioned here do not necessarily refer to a sequence of process steps (iii), (iv), and (v). Rather, the following sequence is also understood to be included: first, the at least one printing ink is applied and cured by electron beam curing. Subsequently, the at least one area-specific coating is applied with an overprint varnish and then cured by electron beam curing. H / SH 230838WOAugust 26, 2024. According to one embodiment of the method, the printing of the first transfer-metallized metal layer and / or the optional release lacquer layer provided at least in some regions is carried out using an offset printing process, preferably a continuous offset printing process. Preferably, the printing with at least one electron-beam-curing printing ink and the at least partially coating with at least one electron-beam-curing overprint varnish can then be carried out, for example, in an offset printing device. The offset printing process has the advantage that it can deliver large quantities of substrate with consistent, very high print quality in a particularly economical manner. Preferably, a continuous offset printing process is used, which has a web-shaped, printed substrate as the end product.If, in this process, the printing of at least one electron-beam-curable printing ink and the at least partial coating with at least one electron-beam-curable overprint varnish are carried out in an offset printing device, the applied printing inks and overprint varnishes can be cured together in a downstream electron-beam curing unit. The printing with at least one electron-beam-curable printing ink and the at least partial coating with at least one overprint varnish are carried out, for example, in dedicated offset printing units. In the continuous offset printing process, a large number of such printing units, for example, 8 or 10, can be used. Due to the modular design of offset printing presses, there is usually no limitation on the number of offset printing units per offset printing device.Typically, after printing and curing, the finished substrate is wound into a roll to feed it into devices for the production of corresponding packaging or subsequent processing steps. Preferably, the processing steps (iii) and (iv), (iii) to (v), or even (ii) to (v) are integrated into an offset printing device, thus enabling a compact production line design with very high production rates. Metallization of the second side of the S is also conceivable. H / SH 230838WOAugust 26, 2024. The carrier layer and its printing and coating are to be integrated into an offset printing device. According to a further embodiment of the method, the finished printed substrate is transfer-metallized at least partially on the second side of the carrier layer opposite the first transfer-metallized metal layer with at least one second metal layer using step (ii), with steps (iii) and (v) and / or (iv) and (v) optionally subsequently being carried out on the second side of the carrier layer. This allows the production of a printed substrate with a carrier layer having at least one transfer-metallized metal layer on each side. Steps (iii) and (iv) can again be carried out using the offset printing process, preferably the continuous offset printing process, with electron-beam-curable printing inks and overprint varnishes.Of course, steps (iii) and (v) and / or (iv) and (v) can also be carried out in an offset printing device. According to a further embodiment of the process, the adhesive layer, preferably a lacquer layer, used in the transfer metallization according to step (ii) between the at least one paper layer and the metal layer is an electron-beam-curable adhesive layer, which is cured by electron-beam curing. The use of electron-beam-curable adhesive layers in transfer metallization allows the transfer metallization to be carried out at a very high production rate compared to conventional two-component adhesives. It allows integration into offset printing machines. Furthermore, it can provide a low-migration bonding layer to the paper layer of the carrier layer, which offers advantages with regard to suitability for food packaging.Finally, the method is advantageously further developed by applying at least one further functional, at least partial, coating to the finished printed substrate. This allows the printed substrate, S. H / SH 230838WOAugust 26, 2024, as already explained above, can be equipped with additional functions, for example, heat-sealing areas adapted to the production of the packaging, areas with specific mechanical properties, or barrier properties. According to a further teaching of the present invention, the above-mentioned object is achieved by a packaging comprising a printed substrate according to the invention, wherein the packaging is preferably a packaging for consumer goods from the food or non-food sector. These packagings in particular are usually dominated by plastic packaging. Thanks to the recycling-friendly, paper-based packaging comprising the printed substrate according to the invention, food packaging and packaging for consumer goods from the non-food sector can be recycled.Particularly preferred packages comprising the printed substrate according to the invention are flat bags, block-bottom bags, cross-bottom bags, stand-up pouches, or tubular bags. These packages, equipped with the printed substrate, can be used for entirely new product groups, particularly in the food or non-food sectors, although specific packaging properties such as resistance to certain substances or barrier properties against gaseous substances are required. Other types of packages, such as simply packaging lids, can also be provided using the printed substrate. werden. There are now numerous possibilities for embodying the invention. Reference is made to the patent claims and the description of exemplary embodiments in conjunction with the drawing. The drawing shows in H / SH 230838WOAugust 26, 2024 Fig. 1 shows a schematic representation of a method for at least partially transfer-metallizing a carrier layer with a paper layer. Fig. 2 shows a schematic representation of a method for producing a printed substrate with one transfer-metallized side of a carrier layer according to an exemplary embodiment of the invention. Fig. 3 shows a schematic representation of a method for producing a printed substrate with a second transfer-metallized side of a carrier layer according to an exemplary embodiment of the invention. Fig. 4 shows a schematic representation of a method for assembling the substrate to various packaging. Fig. 5 shows schematic views of packaging comprising the printed substrate. Fig. 1 first shows a method for producing a substrate with a carrier layer 1 with at least one paper layer 2, which is transfer-metallized on one side.For this purpose, a carrier layer 1 with at least one paper layer 2 is first provided. The carrier layer 1 is preferably web-shaped and is provided as a roll. Additionally, a carrier film 2 is provided. In addition to an optional layer with a release lacquer 4, the carrier film 2 has a metal layer 5 provided at least in some areas. The carrier film 3 usually consists of a plastic film and can be used again for transfer metallization after transfer metallization. H / SH 230838WOAugust 26, 2024. Additionally, an adhesive layer 6, for example, as a lacquer layer, is applied to the carrier layer 1 or to the metal layer 5 of the carrier film for lamination. The adhesive layer 6 is designed for thermal curing, UV curing, or electron beam curing, whereby the adhesive layer is provided via one component or optionally by mixing at least two components. The layer thickness of the adhesive layer 6 is 1 µm to 4 µm, preferably 1.5 µm to 3.5 µm. The metal layer provided at least in some areas can have a thickness of 10 nm to 100 nm, preferably 20 nm to 50 nm, whereby the metal layer optionally consists of gold, silver, copper, nickel, tin, aluminum, or alloys of the metals. The carrier film is also provided as a roll. The carrier layer 1 is then transfer-metallized at least in some areas.For this purpose, the carrier layer 1 is laminated to the carrier film 3 in step A, for example, so that the adhesive layer 6 of the carrier film 3 is in contact with the paper layer 2. In step A, the adhesive layer 6 is cured using the curing process specific to the adhesive layer. Both steps A and B can be performed in quick succession. After the adhesive layer has cured, the carrier film 3 is separated from the carrier layer 1, so that the adhesive layer 6 with the metal layer 5 provided at least in some areas remains on the carrier layer 1. For example, according to one embodiment, the adhesive layer 6 is designed as an electron beam-curable adhesive layer, so that economical electron beam curing can be used to cure the adhesive layer.After the at least partial transfer metallization of the carrier layer 1, it comprises, in addition to the paper layer 2, an adhesive layer 6, a metal layer 5 provided at least partially, and an optional coating with a release varnish 4 provided on the metal layer 5. The transfer metallized carrier layer 1a is then fed to the printing process.S. H / SH 230838WOAugust 26, 2024. Fig. 2 now shows an embodiment of the present invention in which the transfer-metallized carrier layer 1 is printed on the first side, at least in regions, with at least one electron-beam-curable printing ink according to step C. As shown in Fig. 2, in the present embodiment, the optional coating is printed with a release varnish 4. Furthermore, in step C, at least one overprint varnish is applied, at least in regions. Several overprint varnishes can also be used, for example, a glossy and a matte overprint varnish, to provide additional optical effects on the substrate. Subsequently, according to step D, the at least one printing ink and the at least one overprint varnish are cured on the first metal layer 5 by electron beam curing.The first transfer-metallized metal layer 5 is preferably printed using an offset printing process, preferably a continuous offset printing process, with the region-specific printing preferably taking place with at least one printing ink and at least one overprint varnish in one device, preferably an offset printing device. Subsequently, the at least one printing ink and the at least one overprint varnish are cured by electron beam curing. The substrate 1b, thus transfer-metallized and printed on one side, can then be subjected to a further transfer metallization step. This is shown schematically in Fig. 3. According to Fig.3, the finished printed substrate 1b is, according to a preferred embodiment, transfer-metallized on the second side of the carrier layer 1 opposite the first transfer-metallized metal layer 5 with at least a second metal layer 5' using steps A and B and separating the carrier film 3, at least in some areas, wherein the aforementioned steps C and D are optionally subsequently carried out on the second side of the carrier layer 1. As a result, the carrier layer on the second side has either only an adhesive layer 6', a metal layer 5' provided at least in some areas, a coating with a release varnish 4' and an S. H / SH 230838WOAugust 26, 2024 Coating with an electron beam-curable overprint varnish 8'. Alternatively, in addition to the layers mentioned, at least one electron beam-curable printing ink 7' can also be provided. The printed substrates 1b, 1c, and 1d can be subjected to further work steps 10 in roll form. For example, the printed substrates 1b, 1c, 1d can be provided with further functional coatings. This is shown schematically in Fig. 4. Here, according to a further embodiment, the printed substrates 1b, 1c, 1d are provided with at least one further functional, at least partially surface coating in step E and then preferably returned to roll form.The at least one further functional, at least partially surface coating 10 is provided on the carrier layer 1 and / or as an outer coating 9, 9' of the printed substrate 1b', 1c', or 1d', which can provide specific properties adapted to the packaging to be produced. For example, the printed substrate 1b' can have coatings adapted to the packaging shape of a block-bottom bag 11 to provide a heat seal. Likewise, as Fig. 4 shows, the printed substrates 1c', 1d' can be equipped with additional functions, for example, heat seal areas adapted to the production of the packaging, areas with specific mechanical properties, or even additional barrier properties. Furthermore, it is conceivable to incorporate means for recognizing the printed substrate 1b, 1c, 1d for packaging production devices in step E. Mechanical or optical features can also be incorporated here.In principle, it is also possible to not provide partial areas of the carrier layer with a transfer-metallized metal layer 5, 5' in order to enable recognition as a paper-based substrate. It is also conceivable to introduce perforations adapted to the packaging for the production of corresponding packaging. Therefore, the S are shown in Fig. 4. H / SH 230838WO August 26, 2024. Substrates 1b', 1c', and 1d' are adapted to further packages such as the stand-up pouch 12 and the block-bottom pouch 13. Fig. 5 additionally shows further packages that can comprise the substrate 1b, 1c, 1d printed according to the invention. Compared to Fig. 4, Fig. 5 additionally shows the tubular bag 14 and the cross-bottom pouch 15 as exemplary packages. H / SH 230838WO August 26, 2024

Claims

August 26, 2024 Patent Claims 1. Printed substrate (1b, 1c, 1d), preferably for the production of paper-based packaging, with a carrier layer (1) which has at least one paper layer (2), wherein a first transfer-metallized metal layer (5) is provided on a first side of the carrier layer (1), which is connected to the carrier layer (1) via at least one adhesive layer (6), preferably at least one lacquer layer, wherein the first metal layer (5) optionally has at least one coating with a release lacquer (4) on the side opposite the carrier layer (1), characterized bythe carrier layer (1) is printed on the first transfer-metallized metal layer (5) and / or on the coating optionally provided at least in regions on the first transfer-metallized metal layer with a release varnish, at least in regions with at least one electron-beam-curable printing ink (7), and at least one electron-beam-curable coating, provided at least in regions, with an overprint varnish (8) is provided on the printed side of the carrier layer (1).

2. Printed substrate according to claim 1, characterized in that the at least one paper layer (2) is suitable for processing by offset printing, preferably continuous offset printing, and optionally has a grammage of 20 to 150 g / m², preferably 35 to 120 g / m².

3. Printed substrate according to claim 1 or 2, characterized in that - 2 - the at least one adhesive layer (6, 6'), which is arranged between the paper layer (2) and the metal layer (5, 5'), is designed for thermal curing, for curing by UV rays or for electron beam curing, wherein the adhesive layer (6, 6') can be provided via one component or optionally by mixing at least two components.

4. Printed substrate according to one of claims 1 to 3, characterized in that the adhesive layer (6, 6') provided between the at least one paper layer (2) and the metal layer (5, 5') has a thickness of 1 µm to 5 µm, preferably 1.5 µm to 4 µm, particularly preferably 1.5 µm to 3 µm.5.Printed substrate according to one of claims 1 to 4, characterized in that the metal layer (5, 5') provided at least in regions has a thickness of 10 nm to 100 nm, preferably 20 nm to 50 nm, wherein the metal layer (5, 5') optionally consists of gold, silver, copper, nickel, tin, aluminum, or alloys of the metals.

6. Printed substrate according to one of claims 1 to 5, characterized in that on the second side of the carrier layer (1), opposite the first transfer-metallized metal layer (5), at least one second transfer-metallized metal layer (5') is provided, which is connected to the carrier layer (1) via at least one second adhesive layer (6), preferably a lacquer layer, wherein the second metal layer (5') optionally has at least one coating with a release lacquer (4') on the side opposite the carrier layer (1). H / SH 230838WO August 26, 2024 - 3 -7. Printed substrate according to claim 6, characterized in that the side of the second, transfer-metallized metal layer (5') opposite the second adhesive layer (6') is printed at least partially with at least one electron-beam-curable printing ink (7') and / or at least one electron-beam-curable coating comprising an overprint varnish (8') is provided on the second side of the carrier layer (1), provided at least partially.

8. Printed substrate according to one of claims 1 to 7, characterized in that at least one further functional, at least partial-area coating (10) is provided on the carrier layer (1) and / or as an outer coating (9') of the printed substrate (1b', 1c', 1d'), which can provide specific properties adapted to the packaging to be produced.9.Printed substrate according to one of claims 1 to 8, characterized in that means for detecting the printed substrate (1b, 1c, 1d) are provided for devices for producing packaging.

10. Printed substrate according to one of claims 1 to 9, characterized in that the printed substrate preferably has a total thickness of 10 µm to 200 µm, preferably 15 µm to 150 µm, particularly preferably 30 µm to 130 µm.

11. Method for producing a printed substrate according to claims 1 to 10, comprising the steps of: (i) providing a carrier layer (1) with at least one paper layer (2), (ii) at least regionally transfer-metallizing the at least one carrier layer (1) on one side with at least one first metal layer (5). H / SH 230838WO August 26, 2024 - 4 - comprising the steps a) laminating the carrier layer (1) with a carrier film (3) which has at least one optional release lacquer layer (4) and at least one metal layer (5) provided at least in regions on the release lacquer layer (4) or directly on the carrier film (3), wherein an adhesive layer (6) is provided between the metal layer (5) of the carrier film (3) and the carrier layer (1), and the carrier layer (1) and metal layer (5) are brought into contact with one another via the at least one adhesive layer (6) werden,b) curing the at least one adhesive layer (6), and c) separating the carrier film (3) from the carrier layer (1), so that the adhesive layer (6) with the at least partially provided metal layer (5) remains on the carrier layer (1), wherein optionally the metal layer (5) has at least one coating with a release lacquer (4) on the side opposite the carrier layer (1), characterized in that (iii) the carrier layer (1) is printed on the first side with the first transfer-metallized metal layer (5) and / or on the optional at least partially provided release lacquer layer (4) at least partially with at least one electron beam curable printing ink (7),(iv) the printed first metal layer (5) and / or the optionally printed release lacquer layer (4) is coated at least in regions with at least one electron beam curable overprint lacquer (8), and (v) the at least one printing ink (7) and the at least one overprint lacquer (8) are cured by electron beam curing.

12. Method according to claim 11, characterized in that the printing of the first transfer-metallized metal layer (5) and / or the optional release lacquer layer provided at least in regions is carried out under S, H / SH 230838WO August 26, 2024 - 5 - An offset printing process, preferably a continuous offset printing process, is used, wherein the printing with printing ink (7) and the at least regional coating with overprint varnish (8) are preferably carried out sequentially in an offset printing device.

13. Method according to claim 11 or 12, characterized in that the completely printed substrate (1b) is transfer-metallized at least regionally on the second side of the carrier layer (1) opposite the first transfer-metallized metal layer (5) with at least one second metal layer (5') using step (ii), wherein steps (iii) and (v) and / or (iv) and (v) are optionally subsequently carried out on the second side of the carrier layer (1).14.Method according to one of claims 11 to 13, characterized in that the adhesive layer (6, 6'), preferably a lacquer layer, used in the transfer metallization according to step (ii) between the at least one paper layer (2) and the metal layer (5, 5') is an electron beam curable adhesive layer (6, 6'), which is cured in step b) by electron beam curing.

15. Method according to one of claims 11 to 14, characterized in that the completely printed substrate (1b, 1c, 1d) undergoes at least one further processing step, which preferably comprises the coating of a further functional, at least partial surface coating and / or the introduction of at least one microperforation provided at least in some areas.

16. Packaging comprising a printed substrate according to one of claims 1 to 10, wherein the printed substrate is preferably produced using a method according toS. H / SH 230838WO August 26, 2024 - 6 - Claims 11 to 15, wherein the packaging is preferably a packaging of consumer goods from the food or non-food sector.

17. Packaging according to claim 16, characterized in that the packaging is a flat bag, a block-bottom bag (11), a stand-up bag (12), a block-bottom bag (13), a tubular bag (14) or a cross-bottom bag (15). H / SH 230838WO August 26, 2024

Images