Method and device for sealing and / or adhesively bonding a substrate

Abstract

The invention relates to a method for sealing and / or adhesively bonding a substrate, the method comprising the following steps: a) providing a first substrate; b) applying a one-component thermally cross-linking polyurethane to the first substrate; c) providing a second substrate, wherein the first substrate, the second substrate and the polyurethane applied in step b) are pressed together, and cross-linking the polyurethane; and d) obtaining a sealed and / or adhesively bonded substrate, wherein the substrate is an electronic device, an electrical component, a housing, a printed circuit board, a semiconductor wafer, a bipolar cell, a fuel cell, a chip, a solar cell, a battery, a rechargeable battery, an electrolyser and / or a combination thereof. The invention also relates to a device for sealing and / or adhesively bonding a substrate and to the use of a one-component thermally cross-linking polyurethane as a sealant and / or adhesive for a substrate.

Description

[0001] August 21, 2024

[0002] 'Method and device for sealing and / or bonding a substrate'

[0003] The invention relates to a method for sealing and / or bonding a substrate according to the preamble of claim 1, a device for sealing and / or bonding a substrate according to the preamble of claim 10 and the use of a one-component, heat-curing polyurethane as a sealant and / or adhesive for a substrate according to the preamble of claim 16.

[0004] For sealing and / or bonding electronic components, housings, fuel cells, and / or batteries, it is known in the art to use solvent-based printing pastes, which are applied, for example, using screen printing processes. However, it has proven disadvantageous that the solvents contained in the printing paste must be evaporated, which is time-consuming, costly, and energy-intensive. This makes this prior-art method of sealing and / or bonding electronic components and the like not only expensive but also inefficient.

[0005] Furthermore, it is known from the prior art to fix the bipolar plates and membrane electrode assemblies used for fuel cells, which are mechanically sensitive, in a stacked housing. Fixing in the stacked housing must be such that slippage of the individual cell and the entire fuel cell stack is essentially impossible. Therefore, it is known from the prior art to use clamping for fixation, with mechanical systems or sealing systems being used for the clamping. This is also ineffective in terms of time and cost efficiency due to the complex pre-assembly. An example in this context is the German patent application

[0006] DE 10 2016 1 15 828 Al is to be mentioned, which proposes a prestressing device formed in one piece, adhesively in one piece or integrally on the basis of an epoxy resin, silicone or unfoamed polyurethane.

[0007] German patent DE 197 37 685 C2 proposes an elastomeric base seal for shielding electronic components and devices, which preferably consists of a foam seal, especially a polyurethane foam seal. It is proposed that a solvent-based conductive ink be used. Due to the preferred use of an aqueous conductive ink, it is possible to use it as a shielding seal for electrical devices, components, housings, and / or cabinets. However, this also requires increased time and / or energy due to the evaporation of the solvent contained within.

[0008] A disadvantage of the polyurethane-based sealants and / or adhesives known from the prior art is that the multi-component polyurethanes used have only a limited processing time and react very slowly under extended contact times. Furthermore, the diisocyanates contained in the polyurethanes are considered problematic from an ecological and health perspective. Therefore, there is a great need for a method and device for sealing and / or bonding a substrate based on a polyurethane that cures quickly, reliably, permanently, evenly, and evenly. Furthermore, the polyurethane used should have a shorter curing time compared to the prior art, be environmentally friendly and harmless to health, and ensure reliable and continuous sealing and / or bonding of the substrates to the environment.Furthermore, the method should be cost-effective to implement and the device should be cost-effective to manufacture, with a further focus on carrying out the method as quickly as possible. The invention therefore aims to provide a method and a device for sealing and / or bonding a substrate in order to overcome the aforementioned difficulties and, above all, to ensure reliable sealing and / or bonding of the substrate with the least possible expenditure of time, cost, and / or energy.

[0009] This object is achieved in a surprisingly simple but effective manner by a method for sealing and / or bonding a substrate according to the teaching of the independent main claim 1.

[0010] According to the invention, a method for sealing and / or bonding a substrate is proposed, wherein the method comprises the following steps: a) providing a first substrate; and b) applying a one-component, heat-curing polyurethane to the first substrate; and c) providing a second substrate, wherein the first substrate, the second substrate and the polyurethane applied in step b) are pressed together, and crosslinking the polyurethane; and d) obtaining a sealed and / or bonded substrate, wherein the substrate is an electronic device, an electrical component, a housing, a printed circuit board, a semiconductor plate, a bipolar cell, a fuel cell, a chip, a solar cell, a battery, an accumulator, an electrolyzer and / or a combination thereof.

[0011] The method according to the invention is based on the fundamental idea that an environmentally friendly, non-toxic, and also rapidly and reliably crosslinking, one-component polyurethane is applied to a first substrate. Due to the introduction of thermal energy, this polyurethane crosslinks and cures evenly, precisely, and reliably, thus enabling a shielding, equalizing, insulating, uniform, consistent, equalizing, resistant, reliable, and / or permanent sealing and / or bonding of the first substrate to the second substrate. Furthermore, due to the polyurethane according to the invention, described elsewhere, the curing time is drastically reduced compared to the prior art method, so that cycle times are in the range of a few seconds.Furthermore, no solvents, especially flammable ones, are released, which significantly shortens the drying process and thus reduces costs. For this reason, significantly smaller and more cost-effective curing devices are required, which also impacts the time and / or cost efficiency of the process.

[0012] In the first step, a substrate, in particular a first substrate, is provided. The term “substrate” is known to a person skilled in the art and relates to an electronic device, electrical component, housing, a printed circuit board, a semiconductor plate, a bipolar cell, a fuel cell, a chip, in particular a microchip or a nanochip, a solar cell, a battery, in particular a lithium-ion battery, a rechargeable battery, an electrolyzer, in particular a membrane in the electrolyzer, and / or a combination thereof, consisting of at least two, preferably more, parts. The person skilled in the art knows that the substrate has at least a first substrate and a second substrate.The substrate is therefore preferably at least two-part, three-part, four-part, five-part, six-part, seven-part, eight-part, nine-part, ten-part, eleven-part, twelve-part, thirteen-part, fourteen-part, fifteen-part, sixteen-part, seventeen-part, eighteen-part, nineteen-part, twenty-part, 25-part, 30-part, 35-part, 40-part, 45-part, 50-part, 55-part, 60-part, 65-part, 70-part, 75-part, 80-part, 85-part, 90-part, 95-part, 100-part or more, wherein the parts can be of the same or different design. More preferably, at least one substrate is sealable and / or adhesively bondable, more preferably two, three, four, five, six, seven, eight, nine, ten, eleven, twelve, thirteen, fourteen, fifteen, sixteen, seventeen, eighteen, nineteen, twenty, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56,.

[0013] 57, 58, 59, 60, 61 , 62, 63 , 64, 65 , 66, 67, 68, 69, 70, 71 , 72, 73 , 74, 75,

[0014] 76, 77, 78, 79, 80, 81 , 82, 83 , 84, 85, 86, 87, 88, 89, 90, 91 , 92, 93 , 94,

[0015] 95, 96, 97, 98, 99, 100 or more substrates of the same or different configurations.

[0016] In the next step, a one-component, heat-curing polyurethane is applied to the first substrate. It is known to those skilled in the art that the application can be partial or complete, region-by-region, spot-by-spot, and / or surface-wide. Suitable means for applying the polyurethane are known to those skilled in the art, as described elsewhere.

[0017] Within the scope of the invention, it has been recognized that the one-component, heat-curing polyurethane according to the invention is particularly suitable for sealing and / or bonding a substrate. The one-component, heat-curing polyurethane preferably consists of: 1. a prepolymer as a reaction product, wherein the prepolymer has a proportion of 50 wt.% to 65 wt.%. The prepolymer is preferably synthesized from 1,6-hexamethylene diisocyanate (HDI), isophorone diisocyanate (IPDI), a polyol component from the group of polypropylene oxide glycols, preferably with a molecular weight of 11,000 g / mol, and / or a monoalcohol butoxypolypropylene glycol, and

[0018] 2. a plasticizer from the group of alkylsulfonic acid esters or phthalates, in particular diisononyl phthalate, the plasticizer having a proportion of 20 wt.% to 30 wt.%, and

[0019] 3. at least one inorganic filler known to the person skilled in the art, in particular calcium carbonate, chalk, chalk, lime powder, calcium-magnesium carbonates, aluminum oxides, zeolites, bentonites, glass, hollow spheres, and / or ground minerals, wherein the at least one inorganic filler has a proportion of 8 wt.% to 12 wt.%. Preferably, two, three, four, five, six, seven, eight, nine, ten, or more, identical or different, inorganic fillers are conceivable in the stated wt.%, and

[0020] 4. a thixotropic agent from the group of pyrogenic silicas, wherein the thixotropic agent has a proportion of 5 wt.% to

[0021] 8 wt.%, and optionally

[0022] 5. at least one additive, wherein the at least one additive has a proportion of 0 wt.% to 5 wt.%. The term “additive” is known to a person skilled in the art and refers to a substance added in small amounts to adjust and / or change the properties of the polyurethane according to the invention, such as, for example, the color, the processability, the storage life, the fluidity and / or the viscosity. The additive is, for example, a leveling agent, a deaerator, a catalyst, an ageing inhibitor, for example against oxidation and / or the influence of UV light, a dye, for example for coloring and / or adjusting the color, a drying agent, a flame retardant, a solvent and / or a wetting agent. Preference is given to two, three, four, five, six, seven, eight, nine, ten, eleven, twelve, thirteen, fourteen, fifteen, sixteen, seventeen, eighteen, nineteen, twenty or more, identical or different, additives in the stated wt.-% is conceivable, whereby the sum of the weight percentages should amount to 100%.

[0023] Within the scope of the invention, it has further been recognized that the one-component, heat-curing polyurethane material contains less than 0.001 wt. % free diisocyanate, i.e. free diisocyanate is below the detection limit. Thus, the polyurethane according to the invention does not fall under the regulations of chemicals law, which regulates the handling of harmful diisocyanates. Furthermore, the one-component, heat-curing polyurethane according to the invention is free or largely free of organic and / or inorganic solvents. For this reason, crosslinked and cured polyurethane is not a hazardous substance and can be disposed of with normal waste. In other words, this means that further cost savings are achieved by avoiding hazardous waste. In addition, the polyurethane material does not contain any silicones, conflict minerals, SVHCs or PFOA and is therefore compliant with REACH and RoHS standards.

[0024] The next step involves providing a second substrate, pressing the first substrate, the second substrate, and the applied polyurethane together as required, and crosslinking the polyurethane. Suitable means for pressing are known to a person skilled in the art, as described elsewhere. Suitable methods and means for pressing at least three components are known to a person skilled in the art, as described elsewhere. Suitable means for crosslinking are known to a person skilled in the art, as described elsewhere. The term “crosslinking” or “condensing” is known to a person skilled in the art and relates to the linking of the molecules contained in the polyurethane to form a three-dimensional network. Within the scope of the invention, the one-component polyurethane is heat-crosslinking, which means that the linking of the molecules contained to form a three-dimensional network occurs when a certain temperature is reached.It is known to those skilled in the art that the crosslinking process can change the properties of the crosslinked polyurethane. It is conceivable that the change affects the hardness, toughness, melting point, and / or solubility of the crosslinked polyurethane. The "change" can be an improvement or a deterioration. Furthermore, it is known to those skilled in the art that the crosslinking and / or the specific temperature depend, among other things, on the composition of the polyurethane, as described elsewhere.

[0025] Within the scope of the invention, it has further been recognized that the foaming volume of the polyurethane before and / or during crosslinking is up to twice, three times, four times, five times, six times, seven times or eight times the volume.

[0026] Within the scope of the invention, it has also been recognized that the density of the crosslinked, non-foamed polyurethane is 0.9 g / ccm to 1.3 g / ccm. Preferably, the density is at least 0.90 g / ccm, 0.95 g / ccm, 1.00 g / ccm, 1.05 g / ccm, 1.10 g / ccm, 1.15 g / ccm, 1.20 g / ccm, 1.25 g / ccm or 1.30 g / ccm and / or at most 1.30 g / ccm, 1.25 g / ccm, 1.20 g / ccm, 1.15 g / ccm, 1.10 g / ccm, 1.05 g / ccm, 1.00 g / ccm, 0.95 g / ccm or 0.90 g / ccm. The density of the foamed polyurethane is 0.10 g / ccm to 1.30 g / ccm, preferably at least 0.20 g / ccm, 0.30 g / ccm, 0.40 g / ccm, 0.50 g / ccm, 0.60 g / ccm, 0.70 g / ccm, 0.80 g / ccm, 0.90 g / ccm, 1.00 g / ccm, 1.10 g / ccm, 1.20 g / ccm or 1.30 g / ccm.

[0027] In the next step, a sealed and / or bonded substrate with the desired and / or required properties is obtained. The term "method for sealing and / or bonding a substrate" refers to an energy-efficient, cost- and energy-saving, resource-conserving, efficient, time-saving, and sustainable process in which a one-component, heat-curing polyurethane is used as a sealant and / or adhesive. Within the scope of the invention, it is conceivable that the heat and / or energy required to carry out the process originates from renewable and / or regenerable energy sources. The process according to the invention can contain additional steps that lie after or between the explicitly listed essential steps a) to d). Furthermore, it is conceivable that individual steps can be repeated as often as desired. The process is preferably partially or fully automated.

[0028] The term “sealing” describes a degree of tightness of the substrate with respect to the environment, i.e. with respect to an external influence, i.e. a substance, a fluid and / or a mixture thereof, and / or a pressure difference. The term “external influence” refers, for example, but by no means exclusively, to all influences that cause damage to the substrate and / or the environment. In this regard, fluids such as moisture and / or gases, operating materials such as oil and / or lubricants, dust particles and / or other contaminants are conceivable. It is also conceivable that the term describes a degree of tightness within the substrate. For example, it is conceivable that several cells contained in a stacked housing, such as fuel cells, are reliably fixed and protected from slipping.

[0029] The term "bonding" describes a measure of the impermeability of the substrate to the environment and / or the substrate's interior. A person skilled in the art will understand that bonding can be achieved through adhesion and / or cohesion and reliably prevents and / or impedes the penetration or entry of external influences to such an extent that impermeability can be achieved. It is therefore conceivable that bonding may perform additional functions, such as load-transferring, vibration damping, sealing against external influences and / or pressure differences, balancing different partial dynamics, corrosion protection, thermal and / or electrical insulation, and / or conductivity.

[0030] A person skilled in the art will understand that the term “tightness” is a relative term and that there is no such thing as absolute tightness of substrates with respect to the environment. Within the scope of the invention, tightness is therefore to be understood as always relating to previously determined, required and / or predetermined framework conditions so that the substrate is reliably protected from external influences. This is possible due to the substrate-sealing and / or bonding properties of the cross-linked polyurethane, which are also shielding, compensating, insulating, uniform, consistent, balancing, resistant and / or durable. It is understandable that due to the movement of the substrate occurring at a later point in time, it may be possible for external influences to penetrate to a large extent to or from the substrate.The possibility of such a short-term penetration of external influence is of secondary importance.

[0031] It is therefore obvious to a person skilled in the relevant field that the method is not intended to achieve absolute tightness. Rather, it is preferred that the passage of external influences is impeded as far as possible and / or the insulation, vibration damping, and / or fixation within the substrate is maximized as far as possible in order to prevent damage to the substrate and / or contamination of the environment. Even more preferably, the passage is completely impeded in one of the aforementioned directions, so that absolute tightness can be achieved at least partially and / or temporarily. The tightness can also be adapted through the structural design of the substrate. The tightness is preferably in a temperature range from 0°C to 120°C, that is to say at least 0°C, 5°C, 10°C, 15°C, 20°C, 25°C, 30°C, 35°C, 40°C, 45°C, 50°C, 55°C, 60°C, 65°C, 70°C, 75°C, 80°C, 85°C, 90°C, 95°C, 100°C, 105°C, 110°C, 115°C, 120°C and / or max.120°C, 1 15°C, 1 10°C, 105°C, 100°C, 95°C, 90°C, 85°C, 80°C, 75°C, 70°C, 65°C, 60°C, 55°C, 50°C, 45°C, 40°C, 35°C, 30°C, 25°C, 20°C, 15°C, 10°C, 5°C reachable. More preferably, the tightness can be achieved at pressures up to max. 40 bar, more preferably up to max. 39.5 bar, 39 bar, 38.5 bar, 38 bar, 37.5 bar, 37 bar, 36.5 bar, 36 bar, 35.5 bar, 35 bar, 34.5 bar, 34 bar, 33.5 bar, 33 bar, 32.5 bar.

[0032] 32 bar, 31.5 bar, 31 bar, 30.5 bar, 30 bar, 29.5 bar, 29 bar, 28.5 bar,

[0033] 28 bar, 27.5 bar, 27 bar, 26.5 bar, 26 bar, 25.5 bar, 25 bar, 24.5 bar,

[0034] 24 bar, 23.5 bar, 23 bar, 22.5 bar, 22 bar, 21.5 bar, 21 bar, 20.5 bar,

[0035] 20 bar, 19.5 bar, 19 bar, 18.5 bar, 18 bar, 17.5 bar, 17 bar, 16.5 bar,

[0036] 16 bar, 15.5 bar, 15 bar, 14.5 bar, 14 bar, 13.5 bar, 13 bar, 12.5 bar,

[0037] 12 bar, 1 1 .5 bar, 1 1 bar, 10.5 bar, 10 bar, 9.5 bar, 9 bar, 8.5 bar, 8 bar,

[0038] 7.5 bar, 7 bar, 6.5 bar, 6 bar, 5.5 bar, 5 bar, 4.5 bar, 4 bar, 3.5 bar, 3 bar,

[0039] 2.5 bar, 2 bar, 1.5 bar, 1 bar, 0.5 bar or less.

[0040] In the context of the present invention, the degree of sealing and / or bonding is at least 90%, preferably at least 91%, 92%,

[0041] 93%, 94%, 95%, 96%, 97%, 98%, 99%, 99.5%, 99.6% 99.7%, 99.8%

[0042] 99.9% or more.

[0043] Within the scope of the invention, it must be considered that achieving and / or maintaining the required sealing and / or bonding of the substrate against the environment and / or within the substrate depends significantly on the material used, the structure, the location, the operating conditions, and / or the intended use of the substrate. This is known to a person skilled in the art.

[0044] By means of the method according to the invention, it is thus possible to ensure a uniform, consistent, compensating, resistant, reliable, shielding, compensating, insulating, and / or permanent sealing and / or bonding of the substrate, as well as to reliably seal the substrate against external influences and / or against influences from the environment during use and / or to achieve reliable fixation. At the same time, the accelerated curing process makes the method more efficient and cost-effective compared to previous, solvent-based materials. Furthermore, the investment in special solvent drying ovens and / or air extraction systems and the risk of environmentally polluting and / or hazardous exhaust gases are eliminated, and the risk of fire and / or explosion is completely avoided.At the same time, the equipment and resources required to carry out the process can be smaller and more cost-effective. This makes it possible to achieve significant savings in manufacturing and / or material costs, particularly due to the simplicity of the process, without the need to consider the extraction of evaporating solvents and the associated risks, allowing for the production of larger quantities in the same time.

[0045] Advantageous further developments of the invention, which can be implemented individually or in combination, are presented in the subclaims.

[0046] In a further development, it is conceivable that the application in step b) takes place by means of an additive process, such as 3D printing, by printing, such as screen printing, by application, such as spray application, roller application and / or nozzle application, and / or by means of a dosing device and / or a combination thereof. A person skilled in the art will know how the polyurethane is applied in step b). The application is preferably carried out manually, semi-automatically and / or fully automatically. For example, it is conceivable to apply the polyurethane directly to the first substrate using a dosing device, nozzle or roller known from the prior art, for example as a bead, in a point-by-point manner or over a large area. Furthermore, it is conceivable to apply the polyurethane to a screen printing device, such as a squeegee, using a dosing device, nozzle or roller and to transfer the polyurethane to the substrate by screen printing.It is also conceivable to print the polyurethane using rapid prototyping. Further preferably, the application takes place at ambient temperatures below 50°C, especially below 40°C, and especially at approximately room temperature between 15°C and 30°C. This makes it possible to distribute the polyurethane evenly and reliably as required. The polyurethane is preferably applied to the first substrate directly or indirectly using the methods mentioned above.

[0047] Furthermore, it is conceivable that the crosslinking in step c) takes place before, simultaneously with, and / or after the pressing process. This allows for the best possible adaptation of the process to the desired substrate.

[0048] Furthermore, it is conceivable that the crosslinking in step c) takes place before, simultaneously with, and / or after the provision of the second substrate. This further allows for the best possible adaptation of the process to the substrate to be obtained.

[0049] In another embodiment, it is conceivable that the crosslinking in step c) takes place using a heating element, a heater, a microwave, infrared light, ultraviolet light, induction, and / or a combination thereof. Preferably, each of the aforementioned means may be present singly or in multiple quantities. Within the scope of the invention, it has been recognized that the one-component, heat-curing polyurethane crosslinks by applying energy in the form of heat.

[0050] In a further development, it is conceivable that the crosslinking in step c) takes place at a crosslinking temperature of at least 50°C to 150°C and for a duration of at least 1 second to 10 minutes. Within the scope of the invention, it has been recognized that the crosslinking temperature is at least 50°C to 150°C. Preferably, the crosslinking temperature is at least 50°C, 51°C, 52°C, 53°C, 54°C, 55°C, 56°C, 57°C, 58°C, 59°C, 60°C, 61°C, 62°C, 63°C, 64°C, 65°C, 66°C, 67°C, 68°C,

[0051] 69°C, 70°C, 71°C, 72°C, 73°C, 74°C, 75°C, 76°C, 77°C, 78°C, 79°C,

[0052] 80°C, 81 °C, 82°C, 83°C, 84°C, 85°C, 86°C, 87°C, 88°C, 89°C, 90°C,

[0053] 91 °C, 92°C, 93 °C, 94°C, 95°C, 96°C, 97°C, 98°C, 99°C, 100°C, 101 °C,

[0054] 102°C, 103°C, 104°C, 105°C, 106°C, 107°C, 108°C, 109°C, 110°C,

[0055] 111°C, 1 12°C, 113°C, 114°C, 115°C, 116°C, 117°C, 118°C, 119°C,

[0056] 120°C, 121°C, 122°C, 123 °C, 124°C, 125°C, 126°C, 127°C, 128°C,

[0057] 129°C, 130°C, 131°C, 132°C, 133°C, 134°C, 135°C, 136°C, 137°C,

[0058] 138°C, 139°C, 140°C, 141 °C, 142°C, 143°C, 144°C, 145°C, 146°C,

[0059] 147°C, 148°C, 149°C, 150°C. More preferably, the crosslinking temperature is at most 150°C, 149°C, 148°C, 147°C, 146°C, 145°C, 144°C, 143°C, 142°C, 141°C, 140°C, 139°C, 138°C, 137°C, 136°C, 135°C, 134°C, 133°C, 132°C, 131°C, 130°C, 129°C, 128°C, 127°C, 126°C, 125°C, 124°C, 123°C, 122°C, 121°C, 120°C, 119°C, 118°C, 117°C, 116°C, 1 15°C, 114°C, 113°C, 112°C, 111°C, 110°C, 109°C, 108°C, 107°C, 106°C, 105°C, 104°C, 103°C, 102°C, 101°C, 100°C, 99°C, 98°C, 97°C, 96°C, 95°C, 94°C, 93°C, 92°C, 91°C, 90°C, 89°C, 88°C, 87°C,

[0060] 86°C, 85°C, 84°C, 83°C, 82°C, 81°C, 80°C, 79°C, 78°C, 77°C, 76°C,

[0061] 75°C, 74°C, 73°C, 72°C, 71°C, 70°C, 69°C, 68°C, 67°C, 66°C, 65°C,

[0062] 64°C, 63°C, 62°C, 61°C, 60°C, 59°C, 58°C, 57°C, 56°C, 55°C, 54°C,

[0063] 53°C, 52°C, 51°C, 50°C. Furthermore, it has been recognized that crosslinking takes place for a duration of at least 1 second to a maximum of 10 minutes. A person skilled in the art will understand that the crosslinking duration depends on the selected means of crosslinking, as described elsewhere. For example, it is conceivable that crosslinking by means of heat input in the form of a heater and / or warm air has a crosslinking duration of at least 1 minute to a maximum of 10 minutes. Preferably, the crosslinking duration is at least 1 minute, 1.5 minutes, 2 minutes, 2.5 minutes, 3 minutes, 3.5 minutes, 4 minutes.

[0064] 4.5min, 5min, 5.5min, 6min, 6.5min, 7min, 7.5min, 8min,

[0065] 8.5 min., 9 min., 9.5 min. or 10 min. More preferably, the crosslinking time is a maximum of 10 min., 9.5 min., 9 min., 8.5 min., 8 min., 7.5 min., 7 min., 6.5 min., 6 min., 5.5 min., 5 min., 4.5 min., 4 min.,

[0066] 3.5 min., 3 min., 2.5 min., 2 min., 1.5 min. or 1 min. It is further conceivable that the crosslinking time using a microwave, induction, infrared light and / or ultraviolet light has a crosslinking time of at least 1 second to a maximum of 90 seconds. Preferably, the crosslinking time is at least 1 second, 2 seconds, 3 seconds, 4 seconds, 5 seconds, 6 seconds, 7 seconds, 8 seconds, 9 seconds, 10 seconds, 11 seconds, 12 seconds, 13 seconds, 14 seconds, 15 seconds, 16 seconds, 17 seconds, 18 seconds, 19 seconds, 20 seconds, 21

[0067] sec, 22 sec, 23 sec, 24 sec, 25 sec, 26 sec, 27 sec, 28 sec, 29

[0068] sec, 30 sec, 41 sec, 42 sec, 43 sec, 44 sec, 45 sec, 46 sec, 47

[0069] sec, 48 sec, 49 sec, 50 sec, 51 sec, 52 sec, 53 sec, 54 sec, 55

[0070] sec, 56 sec, 57 sec, 58 sec, 59 sec, 60 sec, 61 sec, 62 sec, 63

[0071] sec, 64 sec, 65 sec, 66 sec, 67 sec, 68 sec, 69 sec, 70 sec, 71

[0072] sec, 72 sec, 73 sec, 74 sec, 75 sec, 76 sec, 77 sec, 78 sec, 79

[0073] sec, 80 sec, 81 sec, 82 sec, 83 sec, 84 sec, 85 sec, 86 sec, 87

[0074] Sec., 88 Sec., 89 Sec. or 90 Sec. More preferably, the crosslinking time is a maximum of 90 Sec., 89 Sec., 88 Sec., 87 Sec., 86 Sec., 85 Sec., 84 Sec., 83 Sec., 82 Sec., 81 Sec., 80 Sec., 79 Sec., 78 Sec., 77 Sec., 76

[0075] sec, 75 sec, 74 sec, 73 sec, 72 sec, 71 sec, 70 sec, 69 sec, 68

[0076] sec, 67 sec, 66 sec, 65 sec, 64 sec, 63 sec, 62 sec, 61 sec, 60

[0077] sec, 59 sec, 58 sec, 57 sec, 56 sec, 55 sec, 54 sec, 53 sec, 52

[0078] sec, 51 sec, 50 sec, 49 sec, 48 sec, 47 sec, 46 sec, 45 sec, 44

[0079] sec, 43 sec, 42 sec, 41 sec, 40 sec, 39 sec, 38 sec, 37 sec, 36

[0080] sec, 35 sec, 34 sec, 33 sec, 32 sec, 31 sec, 30 sec, 29 sec, 28

[0081] sec, 27 sec, 26 sec, 25 sec, 24 sec, 23 sec, 22 sec, 21 sec, 20

[0082] sec, 19 sec, 18 sec, 17 sec, 16 sec, 15 sec, 14 sec, 13 sec, 12

[0083] sec, 1 1 sec, 10 sec, 9 sec, 8 sec, 7 sec, 6 sec, 5 sec, 4 sec, 3 sec, 2 sec or 1 sec.

[0084] Furthermore, it is conceivable that the one-component, heat-curing polyurethane, particularly in step b), c), c1) and / or d), has a viscosity of at least 30,000 mPas to 250,000 mPas. Preferably, the polyurethane is a shear-thinning material with a viscosity range of 50,000 mPas to 250,000 mPas at a shear rate of 10 [1 / s], even more preferably from 30,000 mPas to 100,000 mPas at a shear rate of 100 [1 / s], most preferably a thixotropic material.

[0085] Furthermore, it is conceivable that after step c) a step cl ) takes place: cl ) curing of the polyurethane crosslinked in step c).

[0086] To increase and / or improve the crosslinked foam, it is additionally cured using a suitable device known to a person skilled in the art. Curing is preferably carried out for at least 5 minutes, preferably at least 5.5 min., 6 min., 6.5 min., 7 min., 7.5 min., 8 min., 8.5 min., 9 min., 9.5 min. or 10 min., at at least 50°C, preferably at least 51°C, 52°C, 53°C, 54°C, 55°C, 56°C, 57°C, 58°C, 59°C, 60°C, 61°C, 62°C, 63°C, 64°C, 65°C, 66°C,

[0087] 67°C, 68°C, 69°C, 70°C, 71°C, 72°C, 73°C, 74°C, 75°C, 76°C, 77°C,

[0088] 78°C, 79°C, 80°C, 81°C, 82°C, 83°C, 84°C, 85°C, 86°C, 87°C, 88°C, 89°C, 90°C, 91°C, 92°C, 93°C, 94°C, 95°C, 96°C, 97°C, 98°C, 99°C or 100°C.

[0089] Furthermore, it is conceivable that the layer thickness of the polyurethane in step b), c), c1) and / or d) is 1 pm to 1,000 pm. In the context of the invention, it has been found to be advantageous for the layer thickness of the polyurethane in the non-crosslinked state in step b), in the crosslinked and not yet pressed state in step c) and / or c1), in the non-crosslinked and pressed state in step c) and / or c1) or during crosslinking and / or pressing in step c) and / or c1) and / or in the crosslinked and pressed state in step d) to be 1 pm to 1,000 pm, preferably 10 pm to 750 pm, more preferably 20 pm to 500 pm. Preferably, the layer thickness is at least 1 pm, 5 pm, 10 pm, 15 pm, 20 pm, 25 pm, 30 pm, 35 pm, 40 pm, 45 pm, 50 pm, 55 pm, 60 pm, 65 pm, 70 pm, 75 pm, 80 pm, 85 pm, 90 pm, 95 pm, 100 pm, 105 pm, 110 pm, 115 pm, 120 pm, 125 pm, 130 pm, 145 pm, 150 gm, 155 gm, 160 gm, 165 gm, 170 gm, 175 gm, 180 gm, 185 gm, 190 gm, 195 gm, 200 gm, 205 gm,210 gm, 215 gm, 220 gm, 225 gm, 230 gm, 235 gm, 240 gm, 245 gm, 250 gm, 255 gm, 260 gm, 265 gm, 270 gm, 275 gm, 280 gm, 285 gm, 290 gm, 295 gm, 300 gm, 305 gm, 3 10 gm, 315 gm, 320 gm, 325 gm, 330 gm, 335 gm, 340 gm, 345 gm, 350 gm, 355 gm, 360 gm, 365 gm, 370 gm, 375 gm, 380 gm, 385 gm, 390 gm, 395 gm, 400 gm, 405 gm, 410 gm, 415 gm, 420 gm, 425 gm, 430 gm, 435 gm, 440 gm, 445 gm, 450 gm, 455 gm, 460 gm, 465 gm, 470 gm, 475 gm, 480 gm, 485 gm, 490 gm, 495 gm, 500 gm, 505 gm, 510 gm, 515 gm, 520 gm, 525 gm, 530 gm, 535 gm, 540 gm, 545 gm, 550 gm, 555 gm, 560 gm, 565 gm, 570 gm, 575 gm, 580 gm, 585 gm, 590 gm, 595 gm, 600 gm, 605 gm, 610 gm, 615 gm, 620 gm, 625 gm, 630 gm, 635 gm, 640 gm, 645 gm, 650 gm, 655 gm, 660 gm, 665 gm, 670 gm, 675 gm, 680 gm, 685 gm, 690 gm, 695 gm, 700 gm, 705 gm, 710 gm, 715 gm, 720 gm, 725 gm, 730 gm, 735 gm, 740 gm, 745 gm, 750 gm, 755 gm, 760 gm, 765 gm, 770 gm, 775 gm, 780 gm, 785 gm, 790 gm, 795 gm, 800 gm, 805 gm, 810 gm, 815 gm, 820 gm, 825 gm, 830 gm,835 gm, 840 gm, 845 gm, 850 gm, 855 gm, 860 gm, 865 gm, 870 gm, 875 gm, 880 gm, 885 gm, 890 gm, 895 gm, 900 gm, 905 gm, 910 gm, 915 gm, 920 gm, 925 gm, 930 gm, 935 gm, 940 gm, 945 gm, 950 gm, 955 gm, 960 gm, 965 gm, 970 gm, 975 gm, 980 gm, 985 gm, 990 gm, 995 gm, 1,000 gm. More preferably the maximum layer thickness 1,000 gm, 995 gm, 990 gm, 985 gm, 980 gm, 975 gm, 970 gm, 965 gm, 960 gm, 955 gm, 950 gm, 945 gm, 940 gm, 935 gm, 930 gm,

[0090] 925gm, 920gm, 915gm, 910gm, 905gm, 900gm, 895gm, 890gm,

[0091] 885gm, 880gm, 875gm, 870gm, 865gm, 860gm, 855gm, 850gm,

[0092] 845gm, 840gm, 835gm, 830gm, 825gm, 820gm, 815gm, 810gm,

[0093] 805gm, 800gm, 795gm, 790gm, 785gm, 780gm, 775gm, 770gm,

[0094] 765gm, 760gm, 755gm, 750gm, 745gm, 740gm, 735gm, 730gm,

[0095] 725gm, 720gm, 715gm, 710gm, 705gm, 700gm, 695gm, 690gm,

[0096] 685 gm, 680 gm, 675 gm, 670 gm, 665 gm, 660 gm, 655 gm, 650 gm,

[0097] 645 gm, 640 gm, 635 gm, 630 gm, 625 gm, 620 gm, 615 gm, 610 gm, 605 pm, 600 pm, 595 pm, 590 pm, 585 pm, 580 pm, 575 pm, 570 pm, 565 pm, 560 pm, 555 pm, 550 pm, 545 pm, 540 pm, 535 pm, 530 pm, 525 pm, 520 pm, 515 pm, 510 pm, 505 pm, 500 pm, 495 pm, 490 pm, 485 pm, 480 pm, 475 pm, 470 pm, 465 pm, 460 pm, 455 pm, 450 pm, 445 pm, 440 pm, 435 pm, 430 pm, 425 pm, 420 pm, 415 pm, 410 pm, 405 pm, 400 pm, 395 pm, 390 pm, 385 pm, 380 pm, 375 pm, 370 pm, 365 pm, 360 pm, 355 pm, 350 pm, 345 pm, 340 pm, 335 pm, 330 pm, 325 pm, 320 pm, 315 pm, 310 pm, 305 pm, 300 pm, 295 pm, 290 pm, 285 pm, 280 pm, 275 pm, 270 pm, 265 pm, 260 pm, 255 pm, 250 pm, 245 pm, 240 pm, 235 pm, 230 pm, 225 pm, 220 pm, 215 pm, 210 pm, 205 pm, 200 pm, 195 pm, 190 pm, 185 pm, 180 pm, 175 pm, 170 pm, 165 pm, 160 pm, 155 pm, 150 pm, 145 pm, 140 pm, 135 pm, 130 pm, 125 pm, 120 pm, 1 15 pm, 1 10 pm, 105 pm, 100 pm, 95 pm, 90 pm, 85 pm, 80 pm, 75 pm, 70 pm, 65 pm, 60 p m, 55 pm, 50 pm, 45 pm, 40 pm, 35 pm, 30 pm, 25 pm, 20 pm,3 pm, 10 pm, 5 pm or 1 pm.,

[0098] It is assumed that the definitions and / or the embodiments of the above terms apply to all aspects described below in this description, unless otherwise stated.

[0099] According to the invention, a device for sealing and / or bonding a substrate is further proposed, wherein the device comprises a first means suitable for applying a one-component, heat-curing polyurethane to a first substrate, a second means for crosslinking the polyurethane, and a third means suitable for pressing the first substrate, a second substrate, and the crosslinked polyurethane. The device is characterized in that the substrate is an electrical device, an electrical component, a housing, a printed circuit board, a semiconductor plate, a bipolar cell, a fuel cell, a chip, a solar cell, a battery, an accumulator, an electrolyzer, and / or a combination thereof. The device according to the invention is suitable for use in the method for sealing and / or bonding a substrate described in detail elsewhere.

[0100] Advantageous developments of the invention, which can be realized individually or in combination, are shown in the subclaims.

[0101] Furthermore, it is conceivable that the first means is a dosing device, a membrane, a plate, a roller, such as an applicator roller, a nozzle, a printer, such as a 3D printer, and / or a combination thereof. These first means are known to a person skilled in the art and are particularly suitable for the precise application of the polyurethane.

[0102] In a further development, it is conceivable that the second means is a heating element, a heater, a microwave, infrared light, ultraviolet light, an induction device, and / or a combination thereof. These second means are known to a person skilled in the art and are particularly suitable for crosslinking the polyurethane.

[0103] Furthermore, it is conceivable that the third means is a press, a clamp such as a screw clamp, a stamp, a cushion such as a fluid cushion, a roller, and / or a combination thereof, as well as any suitable means for applying partial or complete, extensive, regional, and / or punctual, as well as static or changing pressure for a required duration. The third means can be manually, electrically, hydraulically, pneumatically, and / or mechanically driven. Such suitable means and third means are known to a person skilled in the art and are particularly suitable for pressing.

[0104] Furthermore, it is conceivable that the one-component, heat-curing polyurethane has a viscosity of at least 30,000 mPas to 250,000 mPas, as described elsewhere. Furthermore, it is conceivable that the layer thickness of the polyurethane is 1 pm to 1,000 pm, as described in detail elsewhere.

[0105] According to the invention, a one-component, heat-curing polyurethane for use as a sealant and / or as an adhesive for a substrate is further proposed, wherein the one-component, heat-curing polyurethane, as described elsewhere, has a viscosity of at least 30,000 mPas to 250,000 mPas, and wherein the substrate is an electrical device, an electrical component, a housing, a printed circuit board, a semiconductor plate, a bipolar cell, a fuel cell, a chip, a solar cell, a battery, an accumulator, an electrolyzer and / or a combination thereof.

Claims

Patent claims 1. A method for sealing and / or bonding a substrate, the method comprising the following steps: a) providing a first substrate; and b) applying a one-component, heat-curing polyurethane to the first substrate; and c) providing a second substrate, wherein the first substrate, the second substrate, and the polyurethane applied in step b) are pressed together, and crosslinking the polyurethane; and d) obtaining a sealed and / or bonded substrate, wherein the substrate is an electronic device, an electrical component, a housing, a printed circuit board, a semiconductor plate, a bipolar cell, a fuel cell, a chip, a solar cell, a battery, an accumulator, an electrolyzer, and / or a combination thereof.

2. The method according to claim 1, wherein the application in step b) is carried out by means of an additive method, by printing, by application, in particular spray application, roller application and / or nozzle application, and / or by means of a dosing device.

3. The method according to claim 1 or 2, wherein the crosslinking in step c) takes place before, simultaneously with and / or after the pressing.

4. The method according to any one of claims 1 to 3, wherein the crosslinking in step c) takes place before, simultaneously with and / or after the provision of the second substrate.

5. The method according to any one of claims 1 to 4, wherein the crosslinking in step c) is carried out by means of a heating element, a heater, a microwave, an infrared light, an ultraviolet light, induction and / or a combination thereof.

6. The method according to any one of claims 1 to 5, wherein the crosslinking in step c) is carried out at a crosslinking temperature of at least 50°C to 150°C and for a period of at least 1 sec. to 10 min.

7. The process according to any one of claims 1 to 6, wherein the polyurethane has a viscosity of at least 30,000 mPas to 250,000 mPas.

8. The method according to any one of claims 1 to 7, wherein step c) is followed by a step c1): c1) curing the polyurethane crosslinked in step c).

9. The method according to any one of claims 1 to 8, wherein the layer thickness of the polyurethane in step b), step c), step c1) and / or step d) is 1 pm to 1,000 pm.

10. Device for sealing and / or bonding a substrate with a first means suitable for applying a one-component, heat-curing polyurethane to a first substrate, a second means for cross-linking the polyurethane and a third means for pressing the first substrate a second substrate and the crosslinking polyurethane, characterized in that the substrate is an electrical device, an electrical component, a housing, a printed circuit board, a semiconductor plate, a bipolar cell, a fuel cell, a chip, a solar cell, a battery, an accumulator, an electrolyzer and / or a combination thereof.

11. Device according to claim 10, characterized in that the first means is a metering device, a membrane, a plate, a roller, a nozzle, a printer and / or a combination thereof.

12. Device according to claim 10 or 11, characterized in that the second means is a heating element, a heater, a microwave, an infrared light, an ultraviolet light, an induction device and / or a combination thereof.

13. Device according to one of claims 10 to 12, characterized in that the third means is a press, a clamp, a stamp, a pad, a roller and / or a combination thereof.

14. Device according to one of claims 10 to 13, characterized in that the one-component, heat-curing polyurethane has a viscosity of at least 30,000 mPas to 250,000 mPas.

15. Device according to one of claims 10 to 14, characterized in that the layer thickness of the polyurethane is 1 pm to 1,000 pm.

16. Use of a one-component, heat-curing polyurethane as a sealant and / or adhesive for a substrate, wherein the polyurethane has a viscosity of at least 30,000 mPas to 250,000 mPas, and wherein the substrate is an electrical device, an electrical component, a housing, a printed circuit board, a semiconductor plate, a bipolar cell, a fuel cell, a chip, a solar cell, a battery, an accumulator, an electrolyzer and / or a combination thereof.