Device concept comprising modules
Patent Information
- Authority / Receiving Office
- EP · EP
- Patent Type
- Applications
- Current Assignee / Owner
- NETMODULE AG
- Filing Date
- 2024-08-20
- Publication Date
- 2026-07-08
Smart Images

Figure EP2024073270_06032025_PF_FP_ABST
Abstract
Description
[0001] Device concept with modules
[0002] Description
[0003] The invention relates to an electronic device such as a router, a switch or the like, according to the features of the preamble of patent claim 1.
[0004] A circuit board containing electrical, electronic, and mechanical components that implement the device's functions is housed in the device's housing. Inputs and outputs are also provided, as is well known, so that the device can, for example, be connected to a network port for internet access via an input. On the output side, wired and / or wireless connections can be established with other devices, such as sensors, actuators, computers, controllers, and the like.
[0005] This variety of connection options at the device's inputs and / or outputs requires a wide variety of circuit board variants and their components to accommodate this diversity. For example, one version of the circuit board would have to be provided with electrical and electronic components to enable data exchange between the device and other devices via cellular network, whereas another version of the circuit board would have to be provided with electrical and electronic components to enable data exchange between the device and other devices via Wi-Fi.
[0006] In order to accommodate this variety of connection options, while at the same time minimizing the number of circuit board variants, the idea of providing a circuit board with basic functions and equipping this with interfaces, with a module with different components plugged into each interface to implement different functions or services. With reference to the previous example, this means that a universal base circuit board is provided with which the device can be connected to the Internet via a network connection on the input side. If additional devices are to communicate with this device via mobile communications, a mobile communications module is plugged into one of the interfaces on the base circuit board. Data and control information can be exchanged between the module and the base circuit board via the interface between the module and the base circuit board.The same applies to the module's power supply. However, if data exchange between the device and other devices is to take place via WLAN, a WLAN module is plugged into the corresponding interface on the base circuit board instead of the cellular module. While this somewhat reduces the variety of parts and thus the variety of variants for the base circuit board, a corresponding, specific interface must still be provided on the base circuit board for each application of a respective module, corresponding to the interface of the pluggable module.
[0007] An electronic device is known, for example, from DE 10 2007 034 250 A1. The invention is therefore based on the object of improving an electronic device as described above in such a way that the variety of variants, in particular of the base circuit board, is further reduced while maintaining the variety of functions.
[0008] This problem is solved by the features of patent claim 1.
[0009] According to the invention, the base circuit board has at least one interface, independent of the module or the function of the module, wherein at least one main board is provided which has an interface corresponding to the at least one interface of the base circuit board, so that the main board can be connected (plugged in) to the base circuit board via this interface. If two or more interfaces are present, these can be identical or different from one another. In addition, at least one further interface is provided on the main board, which corresponds to the interface of a module to be used.While the interface between the base circuit board and the mainboard always remains the same (for example, either a standardized or a proprietary interface), at least one additional interface on the mainboard can be adapted to the interface of the module to be used. For example, a mainboard with one interface can be used, whereby the interface corresponds, for example, to the cellular module, which can be arranged and mounted on the mainboard. If a WLAN module with a different interface than that of the cellular module is to be used, a mainboard with one interface is used, whereby this interface corresponds to the interface of the WLAN module.Overall, the invention therefore offers a reduction in the variety of variants of the base circuit board by always using the same interface, and this corresponds to the interface of the main board, so that main boards with this always identical interface can be used, which have at least one further interface or exactly one interface that corresponds to the interface of the module to be used.
[0010] In a further development of the invention, a microcontroller with adaptable software is arranged on the respective mainboard. The use of adaptable software (also called firmware) enables, on the one hand, the intended data exchange between the mainboard and the respective module, in particular their correct control. This application also has the advantage that it can be quickly and easily adapted to the use of modules whose functionality is not yet known or defined, without having to replace expensive components of the electronic device, such as the base circuit board or the mainboard. All that is required is to insert the respective module, preferably plug it into the interface on the respective mainboard, and then put it into operation via the microcontroller on the mainboard by adapting the firmware.The firmware advantageously takes over, for example, the conversion of known, disadvantageous legacy signals (such as digital audio interfaces, SIM cards, and the like) into preferably USB signals or other comparable applicable standards. Depending on the functional use of the electronic device, a further development of the invention provides for a heat sink to be mounted between each module and the mainboard to dissipate the heat generated during module operation. Additionally or alternatively, a heat sink can also be arranged on the top of the respective module. This realizes thermal integration of the modules into the housing concept of the electronic device.This means that in modern modules, particularly today's radio modules, which require a lot of power and therefore get extremely hot, the heat generated is dissipated away from the respective module within the housing of the electronic device, thereby significantly increasing the performance of the module and thus the overall function of the electronic device. In addition, it is conceivable that this heat generated can be dissipated from the housing of the electronic device through other suitable measures (such as openings in the housing). Alternatively or additionally, it is conceivable that the heat sink of a respective module protrudes outwards from the housing of the electronic device so that the heat generated by the respective module can be dissipated directly outside the housing into the environment.
[0011] In a further development of the invention, at least one sensor is integrated into the electronic device. With such at least one sensor, operating variables such as temperature, current, voltage and power (and optionally other operating variables) of electronic components of the electronic device can be measured. Preferably, the at least one sensor is arranged on the main board so that, for example, when using one main board with at least one sensor arranged thereon, an operating variable (such as temperature) can be measured if necessary. If a different main board is used, at least one other sensor can be arranged directly on it, which measures a different operating variable (such as current and voltage to determine energy consumption).This generally means that either the same sensor(s) or different sensors (possibly even just a single sensor) can be arranged on the respective main boards. Particularly preferably, the at least one sensor is arranged directly near the respective module on the main board, so that its at least one operating variable, but possibly also several operating variables, can be measured.
[0012] The measurement of at least one operating variable within the electronic device enables the determination of operating conditions that provide information about the current status of the electronic device. These data can be transmitted to a control center via the network connection, for example, for remote recording. Furthermore, control measures or remote maintenance can be carried out based on the determination of the operating variables on site and, if necessary, forwarding them to the control center via the network connection. For example, a reduction in the functionality of the electronic device or its complete shutdown, for example, in the event of imminent overheating, etc., are possible. Another application based on the recorded operating variables is so-called "predictive maintenance," i.e.Determining the remaining service life of the electronic device or an impending failure as a function of, for example, time, temperature, and power. If, for example, it becomes apparent that an electronic device in use is threatening to fail, this determination can be used to configure a comparable electronic device in the control center with regard to its hardware and software, in order to provide a replacement device (so-called "digital twin") and replace it in the event that the electronic device in use actually fails. The invention is illustrated by way of example with reference to two figures.
[0013] Figure 1 shows a first embodiment of a motherboard 10, which has at least one interface 1, with which the motherboard 10 is connected to a base circuit board 11 of the electronic device. This means that the motherboard 10 is plugged into the corresponding interface of the base circuit board 11 via the at least one interface 1. This establishes data transmission, control, and also the power supply between the base circuit board 11 of the electronic device and the motherboard 10.
[0014] The schematically drawn base circuit board 11 with electrical, electronic, and mechanical components (not shown) is arranged within a housing (also not shown). The components at least partially implement the function of this device, with inputs and outputs being provided on the base circuit board 11 so that the device can be connected to a network connection for internet access via an input and can be connected to other devices via a wired and / or wireless connection on the output side. To complement the function of the device, the main circuit board 10 also has components, with the base circuit board 11, together with a respective main circuit board used and a respective module connected to it, implementing the function of the electronic device.
[0015] Furthermore, fastening openings 12 and at least one recess 13 can be provided in the main board 10, but this is not required. A module A can be fastened directly onto or to the main board 10 via the fastening opening(s) 12. A heat sink can also be mounted between module A and the main board 10, which heat sink dissipates the heat generated during operation of module A. This can advantageously be done via the at least one recess 13 in the main board 10. Additionally or alternatively, a heat sink can also be arranged on the top side of module A. To fasten the main board 10 in the housing of the electronic device, a fastening tab 14 is provided on each of the side edges of the main board 10. This tab can also be present on the front edge of the main board 10 or only on the front edge.
[0016] In addition, the mainboard 10 has an interface 3 into which the module A, shown schematically (dashed), can be plugged. This interface 3 is, for example, an M.2 interface, which corresponds to the interface of module A.
[0017] A nearly identical version of the main circuit board 10 is shown in Figure 2. The base circuit board 11 in Figure 2 is the same base circuit board 11 as in Figure 1 (identical structure and identical function). It can be seen that this main circuit board 10 has at least one interface 1 (and possibly further interfaces 2 and more, if necessary), with which this main circuit board 10 according to Figure 2 can also be plugged into the corresponding interface of the base circuit board 11 of the electronic device. This main circuit board 10 can also have fastening openings 12, at least one recess 13 and the like, but this is not required.Alternatively or in addition to the at least one fastening tab 14, which protrudes laterally from a side edge of the mainboard 10 according to Figure 1, the mainboard according to Figure 2 is provided with at least one opening, in particular a mounting opening 15 (here exactly two mounting openings 15), which is arranged within the outer circumference of the mainboard 10 in order to save mounting space. The difference between the mainboard 10 according to Figure 2 and the mainboard 10 according to Figure 1 can be seen in the interface 4, which corresponds to the interface, for example a PCI Express interface, of a plug-in module B. This module B is also shown only schematically (dashed) in other dimensions to show that modules A and B can differ both geometrically and in terms of their function.For example, module A is a mobile radio module and module B is a WLAN module. This is purely an example, so that modules can also be used that are not wireless, but can alternatively or additionally be connected to the electronic device via a wired connection with other devices.
[0018] In addition to the various interfaces 3, 4 on the main boards 10 for adaptation to the interfaces of the various modules A, B and others to be used, the respective main board 10 also contains electrical and electronic components via which the respective interface 1, 2 on the main board 10 is connected to interface 1 (and possibly other interfaces) on the base circuit board 11 of the electronic device. These components are used to assign the pin assignment of interface 1, 2 on the main board 10 of the respective module to the pin assignment of interface 1 (and possibly other interfaces). Furthermore, these components can also be used for adaptation, processing, modification and the like during control and / or data transmission between interface 1 and the individual interface (interface 3, 4 and others).
[0019] The base circuit board of the electronic device may only have a single slot with an interface for a single motherboard. In practice, it is sensible for the base circuit board of the electronic device to have several similar interfaces, via which a motherboard with similar and / or usually different plugged-in modules can be connected. The base circuit board is housed in a housing of the electronic device together with at least one motherboard with the installed module (or with several motherboards with their installed modules). In practice, the respective module is plugged into the interface on the motherboard, as this enables quick installation and, in the event of a defect, rapid replacement. However, it is also conceivable to connect the respective module directly to its motherboard via a solder connection or via a cable (e.g., a ribbon cable).
[0020] The interfaces on the respective motherboard can be M.2 or Mini PCI Express interfaces. Other standardized or proprietary interfaces can, of course, also be considered as supplements or alternatives.
[0021] The various modules A, B, and possibly others can be wireless modules (e.g., cellular, Wi-Fi, etc.). However, they can also be modules for any other application with a PCIe or USB3 interface (such as memory cards, AI accelerators, GNSS, GPS, etc.).
[0022] The invention replaces legacy interfaces (such as SIM, PCM audio, and similar) with a USB-based microprocessor interface. This means that active components (and thus software for protocol conversion) are replaced, as opposed to passive / mechanical / trivial standalone hardware solutions (as known, for example, from WO 1993 / 020517A1).
[0023] 1. Interface
[0024] 2. Interface
[0025] 3. Interface
[0026] 4. Interface
[0027] 10. Motherboard
[0028] 11. Base circuit board
[0029] 12. Mounting opening
[0030] 13. Recess
[0031] 14. Mounting tab
[0032] 15. Mounting opening
[0033] A first module
[0034] B another, different module
Claims
Patent claims 1. An electronic device comprising a housing, wherein a base circuit board (11) is arranged within said device with electrical, electronic, and mechanical components with which the function of said device is realized, wherein inputs and outputs are provided so that the device can be connected to a network connection for access to the Internet via an input and can be connected to other devices via a wired and / or wireless connection on the output side, wherein a universal main board (10) is provided which is connected to the base circuit board (11) via an interface (1, 2), wherein at least one module (A, B) is further provided which is connected to the base circuit board (11) via one of the interfaces (1, 2), characterized in that the base circuit board (11) has at least one interface (1, 2) independent of the module (A, B) or the function of the module (A, B),wherein at least one main board (10) is provided which has an interface corresponding to the at least one interface (1, 2) of the base circuit board (11), so that the main board (10) can be connected to the base circuit board (11) via this interface.
2. Electronic device according to claim 1, characterized in that a microcontroller with adaptable software is arranged on the main board (11).
3. Electronic device according to claim 1 or 2, characterized in that a heat sink is mounted between a respective module (A, B) and the main board (10), which heat sink dissipates the heat generated during operation of the respective module (A, B).
4. Electronic device according to claim 1, 2 or 3, characterized in that a heat sink is arranged on the top side of the respective module (A, B).
5. Electronic device according to one of the preceding claims, characterized in that at least one sensor is integrated in the electronic device.
6. Electronic device according to claim 5, characterized in that the sensor is arranged on the main board (10) 7. Electronic device according to claim 6, characterized in that the sensor is arranged on the main board (10) in direct proximity to the respective module (A, B).