Meshed patch antenna array

Abstract

An example wireless communication device includes a plurality of multi-layer substrates attached to each other with layers of a first substrate of the plurality of substrates being substantially parallel to layers of a second substrate of the plurality of substrates; and a plurality of antenna arrays that each have planes formed by features of the plurality of substrates, wherein the features of the plurality of substrates that form planes of a first antenna array include a plurality of vias and a plurality of traces arranged in a mesh structure.

Description

MESHED PATCH ANTENNA ARRAYBACKGROUND

[0001] Computing devices such as mobile computing devices, tablets, and the like may include antennas to transmit signals using wireless protocols such as 5thgeneration (5G) millimeter wave (MM wave) protocols.SUMMARY

[0002] Electronic devices, such as mobile computing devices (e.g., phones, tablets, etc.), with 5G MM wave capabilities may need to meet spatial coverage requirements stated by third-generation partnership project (3 GPP) and carrier requirements. In some examples, such requirements may be met with designs having at least two antenna arrays facing different directions (e.g., to enhance coverage). Some of such designs may utilize multiple phase array integrated circuits (IC) and multiple antenna in package (AiP) modules. A mobile computing device having at least two antenna arrays facing different directions with different multiple phase array ICs and multiple AiP modules may face high insertion losses at 24 to 40 GHz frequency range. Such high insertion losses may be undesirable. In addition, the AiP modules in these designs may connect to the mobile computing device’s main logic board (MLB) through a cable to bring power and radio frequency (RF) signals to the AiP modules for up / down-conversion and amplification, which may lead to increased cost (e.g., cost of cable) and / or signal loss as signals are transmitted through a respective cable.

[0003] In accordance with one or more aspects of this disclosure, a mobile computing device may include a plurality of antenna arrays that each include a plurality of planes (e.g., a ground plane and / or a patched plane), with at least one plane of the plurality of planes of at least one antenna array being formed by a meshed patch structure. The meshed patch structure may include a plurality of vias and traces arranged in a mesh-like structure. The mobile computing device may further comprise an integrated circuit (e.g., a single IC) configured to drive the plurality of antenna arrays.

[0004] Utilizing the aforementioned mesh patch structure may provide various advantages. As one example, the meshed patch structure may enable the plurality of antenna arrays to use the same IC to drive the transmission of signals (e.g., as opposed to using a dedicated phase array IC and cables for each respective antenna array). In thisway, aspects of this disclosure may reduce insertion losses, enhance coverage and / or reduce costs to produce a mobile computing device.

[0005] An example device includes a plurality of multi-layer substrates attached to each other with layers of a first substrate of the plurality of substrates being substantially parallel to layers of a second substrate of the plurality of substrates; and a plurality of antenna arrays that each have planes formed by features of the plurality of substrates, wherein the features of the plurality of substrates that form planes of a first antenna array include a plurality of vias and a plurality of traces arranged in a mesh structure.

[0006] The details of one or more examples are set forth in the accompanying drawings and the description below. Other features, objects, and advantages of the disclosure will be apparent from the description and drawings, and from the claims.BRIEF DESCRIPTION OF DRAWINGS

[0007] FIG. 1 is a schematic view of an example computing device 100 that includes an antenna module with at least one mesh patch antenna, in accordance with one or more aspects of this disclosure.

[0008] FIG. 2 is a schematic view of an example antenna module, in accordance with one or more aspects of this disclosure.

[0009] FIGS. 3A-3C are conceptual diagram illustrating an example mesh patch antenna, in accordance with one or more aspects of this disclosure.

[0010] FIG. 4 is a conceptual diagram of an antenna module that includes a pair of antenna arrays, in accordance with one or more aspects of this disclosure.

[0011] FIG. 5 is a conceptual diagram of an antenna module that includes a pair of antenna arrays, in accordance with one or more aspects of this disclosure.DETAILED DESCRIPTION

[0012] FIG. 1 is a schematic view of an example computing device 100 that includes an antenna module with at least one mesh patch antenna, in accordance with one or more aspects of this disclosure. Examples of computing device 100 include a mobile phone, a tablet computer, a laptop computer, a wearable device (e.g., a computerized watch, computerized eyewear, computerized headphones, computerized gloves, etc.), a home automation device or system (e.g., an intelligent thermostat or home assistant device), a gaming system, a media player, an e-book reader, a mobile television platform, or anyother type of mobile, wearable, and non-wearable computing device. Computing device 100 may be an individual mobile computing device.

[0013] In some examples, computing device 100 may have 5G MM wave capabilities. Computing device 100 may include one or more of a battery 102, main logic board (MLB) 104, integrated circuit (IC) 106, interconnect components 107, a plurality of antenna arrays 108 A and 108B (collectively, “antenna arrays 108”), and / or a transceiver 110.

[0014] Battery 102 may store electrical power and provide the stored electrical power to other components of computing device 100. Examples of battery 102 include, but are not limited to, lithium-ion, a nickel-cadmium, nickel-metal hydride, lead acid, and lithium- ion polymer batteries. In some examples, battery 102 may include a single battery. In other examples, battery 102 may include multiple batteries (e.g., to increase capacity and / or due to internal geometry). Battery 102 may, in some examples, be generally a rectangular prism having a top, sides, and a bottom.

[0015] MLB 104 may be a circuit board that carries one or more components of computing device 100. As shown in FIGS. 1 A and IB, MLB 104 may carry transceiver 110. Other components that may be carried by MLB 104 include, but are not limited to, a system on a chip (SoC), one or more processors (e.g., application processors), data storage, data memory, display drivers, and the like.

[0016] Transceiver 110 may include components configured to transmit and receive signals. In some examples, transceiver 110 may include a mmWave transceiver (e.g., a transceiver capable of transmitting and receiving signals having mm range wavelengths.

[0017] Antenna arrays 108 may transmit and receive wireless signals. As shown in FIGS. 1 A and IB, antenna arrays 108 may be positioned to transmit and receive wireless signals in different directions. For instance, antenna array 108A may be positioned within computing device 100 to transmit and receive wireless signals in a first direction and antenna array 108B may be positioned within computing device 100 to transmit and receive wireless signals in a second direction perpendicular to the first direction. As shown in FIGS. 1 A and IB, the first direction may be through a top of computing device 100 (direction 120T) and the second direction may be through a back of computing device 100 (direction 120B). As such, antenna array 108A may be referred to as a top firing antenna array and antenna array 108B may be referred to as a back firing antenna array.

[0018] IC 106 may control operations of antenna arrays 108. For instance, IC 106 may be a phased array and / or power management IC that controls signals being output by antenna arrays 108. As shown in FIGS. 1 A and IB, IC 106 may be connected to transceiver 110 via interconnect components 107.

[0019] In accordance with one or more aspects of this disclosure, antenna arrays 108 and IC 106 may be located on an antenna module, such as antenna module 109. For instance, antenna array 108A, antenna array 108B, and IC 106 may all be located on antenna module 109, which may be connected to transceiver 110 via interconnection components 107. By using such an antenna module, multiple antenna arrays (i.e., antenna array 108A and 108B) may be driven by a single IC (i.e., IC 106). In this way, aspects of this disclosure may reduce a cost and / or part count of computing device 100. Furthermore, as antenna module 109 may be separate from MLB 104, utilizing such an antenna module may desirably enable more placement freedom of MLB 104, battery 102, and other components within a housing of computing device 100. With respect to battery 102, such placement freedom may enable inclusion of a physically larger (e.g., and thus higher capacity) battery within the housing of computing device 100 without increasing a size of the housing.

[0020] Interconnection component(s) 107 may include one or more cables or other electrical connectors. Interconnection components 107 may transport any combination of power, data, and IF signals between components of computing device 100. For example, interconnection components 107 may carry such signals between transceiver 110 of MLB 104 and IC 106 of antenna module 109.

[0021] In some examples, one or more of antenna arrays 108 may comprise a meshed patch structure. For instance, antenna array 108A may be formed of a mesh of vias and traces on a multi-layer printed circuit board. Further details of one example of antenna arrays 108 are discussed below.

[0022] While FIG. 1 shows computing device 100 having an antenna system including one or more of first antenna array 108 A or second antenna array 108B, computing device 100 may have multiple antenna systems. The computing device 100 may be, for example, a smartphone, tablet, laptop, smartwatch or other mobile computing device, or may be any other computing device that may include multiple radios and antenna systems for communication over different wireless links. For example, a smartphone may include a 5G NR radio, a 4G LTE radio, and a Wi-Fi radio. The 5G radio may include an antenna system including one or more antenna arrays 108 for use in two frequencyranges, frequency range 1 (FR1) which may include sub-6 GHz frequency bands, and frequency range 2 (FR2), which may include bands above 24 GHz including frequencies in the mm Wave band.

[0023] FIG. 2 is a schematic view of an example antenna module, in accordance with one or more aspects of this disclosure. As shown in FIG. 2, antenna module 209 may include IC 206, and substrates 205A and 205B (collectively, “substrates 205”). Antenna module 209 and IC 206 of FIG. 2 may be examples of antenna module 109 and IC 106 of FIGS. 1A and IB.

[0024] Substrates 205 may be circuit boards, such as printed circuit boards (PCBs), that carry antenna arrays 208A and 208B (collectively, “antenna arrays 208”). Substrates 205 may be multi-layer circuit boards. For instance, as shown in FIG. 2, substrate 205A may include layers 207A-207K (collectively, “layers 207”). While illustrated as including a particular number of layers, substrates 205 are not so limited (e.g., may include more or fewer layers than shown in FIG. 2).

[0025] As shown in FIG. 2, substrates 205A and 205B may be attached to each other. Similarly, IC 206 may be attached to one or both of substrates 205. For instance, as shown in FIG. 2, IC 206 may be attached to substrate 205B. In some examples, substrates 205 may be interconnected, and IC 206 may be attached to substrate 205B, via surface mount technology (SMT). For instance, as shown in FIG. 2, substrate 205A may be attached to substrate 205B with SMT via solder deposits 233A. Similarly, as shown in FIG. 2, IC 206 may be attached to substrate 205B with SMT via solder deposits 233B.

[0026] Antenna arrays 208 of FIG. 2 may be examples of antenna arrays 108 of FIGS. 1A and IB. Antenna array 208A may include one or more planes 214, such as ground plane 214A and patch plane 214B. In some examples, one or more planes 214 of first antenna array 208A may be substantially planar type of plane. In some examples, the second antenna array 208B may also include one or more planes 214, such as a ground plane and a patch plane shown in the first antenna array 208A.

[0027] In some examples, the planes of the first antenna array 208A may be positioned vertically and the planes of the second antenna array 208B may be positioned horizontally (e.g., at least one plane of first antenna array 208 A may be perpendicular to at least one plane of second antenna array 208B). In some examples, the planes of the first antenna array 208A may be positioned in a substantially perpendicular direction to the planes of the second antenna array 208B. For example, substantially perpendicular may be + / - 5 degrees of being perpendicular. As such, first antenna array 208 A and second antennaarray 208B may form an “L” shape. Positioning the respective planes 214 of an antenna array 208, such as the first antenna array 208A or the second antenna 208B, horizontally or vertically may change a direction a beam is transmitted by the respective antenna array 208. Accordingly, a direction a beam may be transmitted by a respective antenna array 208 may be manipulated by the alignment of the positioning of the planes of the antenna array 208, such as the planes being horizontally aligned or vertically aligned. In some examples, the planes 214 of an antenna array 208 being horizontally aligned would have the planes 214 aligned to extend in the z-direction and y-direction, as shown in FIG. 2. In some examples, the planes 214 of an antenna array 208 being vertically aligned would have the planes 214 aligned to extend in the x-direction and z-direction, as shown in FIG. 2.

[0028] In the example as shown FIG. 2, second antenna array 208B may be a back transmitting array that is configured to transmit signals in back direction (e.g., in a negative direction along the Z axis) and first antenna array 208A may be a top transmitting antenna array that is configured to transmit signals in a top direction 220A (e.g., in a positive direction along the X axis).

[0029] As discussed above, and in accordance with one or more aspects of this disclosure, one or more of antenna arrays 208 may comprise a meshed patch structure. For instance, antenna array 208B may be formed of a meshed patch structure that is formed of a plurality of traces and vias distributed across one or more of substrates 205. As shown in FIG. 2, portions of one or more of planes 214 of antenna array 208 A may be in multiple substrates of substrates 205 (e.g., parts of at least plane 214A are shown in both substrate 205A and 205B). While shown as being in two substrates, antenna array 208A is not so limited and may be positioned in a single substrate, three substrates, or greater than three substrates. As shown in FIG. 2, the meshed patch structure that forms one or more of planes 214 may be distributed across substrates 205.

[0030] As discussed above, IC 206 may drive antenna arrays 208. As shown in FIG. 2, antenna module 209 may include connections between IC 206 and planes of antenna arrays 208. For instance, IC 206 may output a first signal (e.g., a ground signal) to ground plane 214A of antenna array 208 A via signal line 215 A and output a second signal (e.g., a data signal) to patch plane 214B of antenna array 208 A via signal line 215B. In some examples, signal lines may cross between substrates 205. For instance, as shown in FIG.2, signal line 215 A may cross from substrate 205B to substrate 205 A.Antenna module 209 include similar signal lines between IC 206 and antenna array 208B.As such, RF signals may be routed through substrates 205 to feed elements of antenna arrays 208.

[0031] FIGS. 3A-3C are conceptual diagrams illustrating an example mesh patch antenna, in accordance with one or more aspects of this disclosure. Antenna array 308, substrates 305A-305C (collectively, “substrates 305”), and planes 314 of FIGS. 3A-3C may be examples of antenna array 208A, substrates 205, and planes 214 of FIG. 2.

[0032] One or more of the planes 314 of antenna array 308 A may include a meshed patch structure that includes a plurality of vias 312 and traces 313 arranged in a mesh-like structure, as shown in FIGS. 3A-3C. In some examples, the plurality of traces 313 may be on layers of substrates 305 (e.g., on layers of layers 207).

[0033] FIG. 3 A is a schematic perspective view of an example configuration of an antenna array 308. In some examples, the antenna array 308 may include one or more planes 314. The antenna array 308 includes a ground plane 314A and a patched plane 314B. A plane, 314, such as ground plane 314A or a patched plane 314B, may include a plurality of traces 313 and a plurality of vias 312 (e.g., spaces, holes, and / or through holes) arranged between the respective traces 313 to form the meshed patch structure. For example, drilling a board, such as an aluminum or copper board, of a plane 314 forms through holes to generate the vias 312 of a plane 314. In some examples, the drilled through holes (e.g., vias 312) may be coated with a conductive material. In some examples, one or more the plurality of vias 312 may provide an electrical connection between traces 313 of a respective plane 314. For example, the ground plane 314A may include a plurality of traces 313 and a plurality of vias 312 arranged between the respective traces 313 to form the meshed patch structure of the ground plane 314A. For example, the patched plane 314B may include a plurality of traces 313 and a plurality of vias 312 arranged between the respective traces 313 to form the meshed patch structure of the patched plane 314B.

[0034] FIG. 3A further shows an example configuration of an antenna array 308, such as the first antenna array 308A and / or the second antenna array 108B. FIG. 3 A vias 312 and traces 313 of antenna array 308 being distributed across three substrates 305A, 305B, and 305C. In some examples, substrates 305 may all be a same type of substrate. In some examples, a first substrate of substrates 305 and a second substrate of substrates 305 may be different types of substrates. Examples of substrates include, but are not limited to, high frequency PCBs, laminated circuit boards (e.g., an FR4 type board or polytetrafluoroethylene (PTFE) board), and the like.

[0035] As shown in FIG. 3A, substrates 305A-305C respectively have thicknesses T1-T3. In some examples, thicknesses T1-T3 may be equal to each other. In other examples, thickness T1 may be different than thickness T2 and / or different than thickness T3. Utilizing one or more substrates with different thicknesses may provide various advantages. As one example, such an arrangement may enable a height of a combination of substrates 305 (e.g., in the Z axis of FIG. 2) to be tailored to more closely match a height of antenna array 308 without unduly increasing a thickness an antenna module, such as antenna module 209.

[0036] FIG. 3B is a schematic side view of an example configuration of an antenna array 308, such as the first antenna array 308A and / or the second antenna array 308B. The antenna array 308 includes a ground plane 314A and a patched plane 314B. The ground plane 314A and the patched plane 314B of the antenna array 308 each respectively include a plurality of traces 313 and a plurality of vias 312 arranged between the respective traces 313. The antenna array may include a connector 315 that connects the ground plane 314A and the patched plane 314B. In some examples, the antenna array 308 may include a plurality of connectors 315 (e.g., which may carry signals from an IC, such as IC 206).

[0037] FIG. 3C is a schematic front or rear view of an example configuration of a plane 314 of an antenna array 308, such as the first antenna array 308A and / or the second antenna array 308B. The plane 314 shown in FIG. 3C may be an example of a ground plane 314A and / or a patched plane 314B of the antenna array 308. The plane 314 includes a plurality of traces 313 and a plurality of vias 312 arranged between the respective traces 313. In some examples, a plane 314 may include a plurality of rows 316 A, 316B ...316N of vias 312 with traces 313 arranged between the respective rows of vias 312. A row 116, such as any of rows 316A, 316B. . .316N, may include one or more traces 313 and one or more vias 312. In some examples, the vias 312 of a particular row, such as row 316A, may be arranged in an off-set position from the vias 312 in a neighboring row, such as row 316B. In some examples, the vias 312 of a plane 314 may be arranged in a grid like fashion. In some examples, the vias 312 of a particular row, such as row 316A, may be arranged in an off-set position from the vias 312 in a neighboring row, such as row 316B, but arranged to correspond to the arrangements of the vias 312 of an alternating row, such as row 316C, as shown in FIG. 3C. In some examples, a plane 314 may include a plurality of traces 313. One or more of the rows 316 may have a trace 313 on top and on the bottom of a particular row. In some examples, atrace 313 may serve as a bottom trace for a particular row, but serve as a top trace for a neighboring row. For example, a trace 313 may serve as a bottom trace for row 316B and a top trace for row 316C.

[0038] The planes 314 of an antenna array 308 having a meshed patch structure including a plurality of traces 313 and a plurality of vias 312, such as shown in FIGS. 3 A-3C, may enable a plurality of antenna arrays to use the same IC to drive the transmission of signals (e.g., as opposed to using a dedicated phase array IC and cables for each respective antenna array). In this way, the planes 314 of an antenna array 308 having a meshed patch structure may reduce insertion losses, enhance coverage and / or reduce costs to produce a mobile computing device.

[0039] As can be seen from FIG. 2, antenna module 209 may include a plurality of multilayer substrates attached to each other with layers of a first substrate of the plurality of substrates being substantially parallel to layers of a second substrate of the plurality of substrates (e.g., substrates 205); and a plurality of antenna arrays (e.g., antenna arrays 208) that each have planes formed by features of the plurality of substrates. As can be seen from FIGS. 3A-3C, the features of the plurality of substrates that form planes of a first antenna array may include a plurality of vias and a plurality of traces arranged in a mesh structure.

[0040] FIG. 4 is a conceptual diagram of an antenna module that includes a pair of antenna arrays, in accordance with one or more aspects of this disclosure. Antenna module 409 of FIG. 4 may be an example of any of antenna modules 109 of FIGS. 1A and IB or antenna module 209 of FIG. 2. Substrates 405 A and 405B (collectively, “substrates 405”) may be examples of substrates 205 of FIG. 2 or substrates 305 of FIG. 3

[0041] Similarly, antenna arrays 408A and 408B (collectively, “antenna arrays 408”) may be examples of antenna arrays 108 of FIGS. 1A and IB, antenna arrays 208 of FIG. 2, or antenna array 308 of FIGS. 3A-3C. One or both of antenna arrays 408 may include or more antennas. Each antenna may include features in multiple planes. For instance, as shown in FIG. 4, antenna array 408B may include four antennas, each having features in a ground and a patch plane. Similarly, antenna array 408A may include four antennas, each having features in a ground and a patch plane. One or more of the features of the antennas of antenna array 408 A may extend through both substrate 405 A and 405B.

[0042] An IC, such as IC 106 of FIGS. 1A and IB or IC 206 of FIG. 2, may control antenna arrays 408. For instance, the IC may control one or both of antenna arrays 408 to operate as phased arrays. As discussed above, by forming antenna arrays 408 asdescribed herein, a single IC may drive multiple arrays of antenna arrays 408. In this way, aspects of this disclosure may reduce and cost and / or part count of a device that includes antenna array 409.

[0043] FIG. 5 is a conceptual diagram of an antenna module that includes a pair of antenna arrays, in accordance with one or more aspects of this disclosure. Antenna module 509 of FIG. 5 may be an example of any of antenna modules 109 of FIGS. 1A and IB, antenna module 209 of FIG. 2, or antenna module 409 of FIG. 4. Substrates 505A and 505B (collectively, “substrates 505”) may be examples of substrates 505 of FIG. 2, substrates 305 of FIG. 3, or substrates 405 of FIG. 4. Antenna arrays 508A and 508B (collectively, “antenna arrays 508”) of FIG. 5 may be examples of antenna arrays 108 of FIGS. 1A and IB, antenna arrays 208 of FIG 2, antenna array 308 of FIG. 3, or antenna arrays 408 of FIG. 4.

[0044] The following numbered examples may illustrate one or more aspects of the disclosure.

[0045] Example 1. A mobile computing device comprising: a main logic board comprising a transceiver; an antenna module comprising: a plurality of multi-layer substrates attached to each other, wherein layers of a first substrate of the plurality of multi-layer substrates are substantially parallel to layers of a second substrate of the plurality of substrates; and a plurality of antenna arrays that each have planes formed by features of the plurality of substrates, wherein the features of the plurality of substrates that form planes of a first antenna array include a plurality of vias and a plurality of traces arranged in a mesh structure; and an interconnection component connecting the transceiver of the main logic board with the antenna module.

[0046] Example 2. The mobile computing device of example 1, wherein at the plurality of vias and the plurality of traces that form the first antenna array are distributed across the plurality of multi-layer substrates.

[0047] Example 3. The mobile computing device of example 1, wherein the first antenna array is positioned to transmit signals in a first direction, wherein the plurality of antenna arrays includes a second antenna array positioned to transmit signals in a second direction that is different from the first direction.

[0048] Example 4. The mobile computing device of example 3, wherein the second direction is substantially perpendicular to the first direction.

[0049] Example 5. The mobile computing device of example 3, wherein the second direction is substantially perpendicular to the layers of the second substrate.

[0050] Example 6. The mobile computing device of example 1, wherein the antenna module further comprises an integrated circuit (IC) positioned on a particular multi-layer substrate of the plurality of multi-layer substrates, wherein the IC drives transmission of signals from the plurality of antenna arrays.

[0051] Example 7. The mobile computing device of example 6, wherein the particular multi-layer substrate is a second substrate of the plurality of multi-layer substrates.

[0052] Example 8. The mobile computing device of example 1, wherein the interconnection component connects the transceiver with the IC of the antenna module.

[0053] Example 9. The mobile computing device of example 1, wherein the transceiver comprises a mmWave transceiver.

[0054] Example 10. The mobile computing device of example 1, wherein the plurality of multi-layer substrates are attached to each other with surface mount technology.

[0055] Example 11. The mobile computing device of example 1, wherein the plurality of vias and a plurality of traces arranged in the mesh structure that form the planes of the first antenna array are distributed across the plurality of multi-layer substrates.

[0056] Various aspects have been described in this disclosure. These and other aspects are within the scope of the following claims.

Claims

CLAIMS:

1. A mobile computing device comprising: a main logic board comprising a transceiver; an antenna module comprising: a plurality of multi-layer substrates attached to each other, wherein layers of a first substrate of the plurality of multi-layer substrates are substantially parallel to layers of a second substrate of the plurality of substrates; and a plurality of antenna arrays that each have planes formed by features of the plurality of substrates, wherein the features of the plurality of substrates that form planes of a first antenna array include a plurality of vias and a plurality of traces arranged in a mesh structure; and an interconnection component connecting the transceiver of the main logic board with the antenna module.

2. The mobile computing device of claim 1, wherein at the plurality of vias and the plurality of traces that form the first antenna array are distributed across the plurality of multi-layer substrates.

3. The mobile computing device of claim 1 or claim 2, wherein the first antenna array is positioned to transmit signals in a first direction, wherein the plurality of antenna arrays includes a second antenna array positioned to transmit signals in a second direction that is different from the first direction.

4. The mobile computing device of claim 3, wherein the second direction is substantially perpendicular to the first direction.

5. The mobile computing device of claim 3 or claim 4, wherein the second direction is substantially perpendicular to the layers of the second substrate.

6. The mobile computing device of any of claims 1-5, wherein the antenna module further comprises an integrated circuit (IC) positioned on a particular multi-layer substrate of the plurality of multi-layer substrates, wherein the IC drives transmission of signals from the plurality of antenna arrays.

7. The mobile computing device of claim 6, wherein the particular multi-layer substrate is a second substrate of the plurality of multi-layer substrates.

8. The mobile computing device of any of claims 1-7, wherein the interconnection component connects the transceiver with the IC of the antenna module.

9. The mobile computing device of any of claims 1-8, wherein the transceiver comprises a mmWave transceiver.

10. The mobile computing device of any of claims 1-9, wherein the plurality of multilayer substrates are attached to each other with surface mount technology.

11. The mobile computing device of any of claims 1-10, wherein the plurality of vias and a plurality of traces arranged in the mesh structure that form the planes of the first antenna array are distributed across the plurality of multi-layer substrates.

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