Electrical power converter for an industrial process assembly, preferably plasma process assembly or heating assembly
Patent Information
- Authority / Receiving Office
- EP · EP
- Patent Type
- Applications
- Current Assignee / Owner
- TRUMPF PATENTABTEILUNG
- Filing Date
- 2024-08-30
- Publication Date
- 2026-07-08
Smart Images
Figure EP2024074319_06032025_PF_FP_ABST
Abstract
Description
[0001] Electrical power converter for an industrial process arrangement, preferably a plasma process arrangement or heating arrangement
[0002] Description
[0003] The invention relates to an electrical power converter for an industrial process system, preferably a plasma process system or heating system. Furthermore, the invention relates to a method for assembling such an electrical power converter.
[0004] The development lies in the field of electrical power conversion for special power-intensive industrial processes that are prone to instability, such as plasma excitation, plasma coating processes, gas laser excitation, particle accelerators, charging and discharging devices for large batteries, such as flow batteries, melting of solids, heating and / or gasification of liquid substances using, for example, microwave energy or induction heating. All of these processes have in common that they are designed to generate and accelerate charged atomic particles in a gas and / or plasma environment or liquid. All of these processes also have in common that they have a high power consumption, in the range of 1 kW or more, in particular 10 kW or more, preferably 100 kW or more. Many of these processes also have very high requirements for the stability of the power supply because the processes are highly complex, such as:Semiconductor production using plasma processes and / or heating by electromagnetic fields. Typically, this involves converting power from a mains frequency in the range of approximately 50 Hz to 60 Hz to different frequencies, which can be in the range of 1 kHz to 200 MHz. Conversion to direct current power, also known as DC power, is also conceivable. This conversion of electrical power into other frequencies requires a large number of electronic components and assemblies, in particular power semiconductor components such as transistors or diodes designed for currents > 10 A and voltages > 400 V. These electronic components and assemblies generate heat loss during operation. This heat loss is often generated in a very limited area of just a few mm. 2It is a particular challenge to dissipate this waste heat in order to protect the components and / or assemblies from being destroyed by overheating. Very large and material-intensive heat sinks are often provided for this purpose, the production of which is very expensive. In the prior art, this amount of heat is dissipated by cooling using a cold plate. When cooling with such a conventional cold plate, the heat transfer from the electrical component, which may have a copper layer, to the cooling medium is achieved by applying a material such as thermal paste in the thermal interface, which dissipates the generated heat. However, this type of thermal interface material proves to be disadvantageous. On the one hand, it represents a further heat transfer with thermal resistance, and on the other hand, it is subject to wear, which gradually deteriorates its effectiveness during operation.The surface area of the cooling plate is also increased, or the number and performance of the components is reduced in order to dissipate a greater amount of heat or generate a smaller amount of heat. Both options prove insufficient. Since the space in the housing of such a power supply is limited, expanding the cooling surface is not possible indefinitely. Reducing the performance of individual components is also not effective. Overall, inadequate cooling of the electrical components results in costs.
[0005] In a variety of technical applications, particularly in the field of power electronics, there is a need to detach a unit to be cooled, for example a semiconductor element or a semiconductor arrangement, from the rest of the assembly when necessary. In order to enable detachable attachment of the unit to be cooled to the heat sink, the units to be cooled are often detachably attached to the associated heat sinks, for example using thermal paste. This results in the disadvantage of comparatively low thermal coupling between the unit to be cooled and the heat sink. The object of the invention is to provide an electrical power converter that enables improved thermal coupling between the heat sink and a unit to be cooled and improves ease of maintenance.
[0006] The stated problem is solved by an electrical power converter according to claim 1. Accordingly, an electrical power converter for an industrial process arrangement, preferably a plasma process arrangement or heating arrangement, is disclosed. The electrical power converter comprises:
[0007] - a heat sink,
[0008] - a unit to be cooled, in particular an electrical unit, preferably a semiconductor device, preferably comprising a power semiconductor component,
[0009] - a circuit board,
[0010] - further electronic components, wherein these further electronic components and the unit to be cooled are arranged on or at the circuit board and are connected by electrical contacts, wherein the unit to be cooled has a fixed, in particular material-to-material connection with the heat sink, and wherein the heat sink is configured to dissipate heat from the unit to be cooled, in particular an electrical unit, preferably a semiconductor device. The heat sink comprises a cooling channel and in particular a first cooling wall, arranged on the side of the cooling channel facing the unit to be cooled. In addition, the heat sink comprises a coolant supply and a coolant discharge, both of which are fluidically connected to the cooling channel, for supplying and discharging coolant, in particular cooling liquid, preferably cooling water. The heat sink is constructed monolithically from one material.The heat sink is mechanically and thermally connected to the unit to be cooled. Furthermore, the heat sink is detachably fastened to a cooling unit comprising a first fluid port and, in particular, additionally to a second fluid port. When the heat sink is fastened to the cooling unit, a first fluidic connection is formed between the coolant supply of the heat sink and the first fluid port of the cooling unit, and, in particular, an additional second fluidic connection is formed between the coolant discharge of the heat sink and the second fluid port of the cooling unit. The heat sink is preferably further configured such that, when the heat sink is fastened to the cooling unit, a fluid-tight seal is simultaneously formed between the first fluidic connection and, in particular, also between the second fluidic connection.
[0011] In one aspect, the electrical power converter further comprises:
[0012] - another heat sink,
[0013] - a further unit to be cooled, in particular an electrical unit, preferably a semiconductor arrangement, preferably comprising a power semiconductor component, wherein the further unit to be cooled has a fixed, in particular material-locking, connection with the further heat sink, and wherein the further heat sink is configured to dissipate heat from the further unit to be cooled.
[0014] In one aspect, the electrical power converter further comprises:
[0015] - multiple heat sinks,
[0016] - a plurality of units to be cooled, in particular electrical units, preferably semiconductor devices, preferably each having one or more power semiconductor components, wherein the units to be cooled each have a fixed, in particular materially bonded, connection to one of the heat sinks, and wherein the heat sinks are designed to dissipate heat from the units to be cooled connected to them.
[0017] The heat sinks feature all the aspects mentioned above and below:
[0018] - a cooling channel, - a coolant supply and a coolant discharge, both of which are fluidically connected to the cooling channel, for supplying and discharging coolant, in particular cooling liquid, preferably cooling water, wherein
[0019] - the heat sinks are each constructed monolithically from one material,
[0020] - the heat sinks are each mechanically and thermally connected to the unit to be cooled,
[0021] - the heat sinks are each detachably attached to a cooling unit comprising a plurality of fluid ports, when the heat sinks are attached to the cooling unit, a fluidic connection is formed between the coolant supply of the heat sink and the respectively assigned fluid port of the cooling unit, and when the heat sinks are attached to the cooling unit, a fluid-tight seal of the fluidic connections is simultaneously formed.
[0022] The properties disclosed below for "the heat sink" and "the unit to be cooled" and their connections and interaction with other units or devices also apply mutatis mutandis to all of the further and multiple heat sinks and units to be cooled disclosed here.
[0023] Monolithic means that the heat sink is made from a single material that forms atomic bonds at all connection points. This can be achieved using different processes. One manufacturing process can be additive, e.g. using laser melting. In another process, the heat sink can be produced by pressing multiple layers together at very high pressure. In yet another process, the heat sink can be manufactured entirely by pressing into a melted mold. Such an arrangement allows very high levels of power to be dissipated in a very small space. This means that dimensions, particularly for conductor tracks, can be kept very short. The arrangement is also particularly easy to maintain. The heat sink allows for detachable attachment of the heat sink in a cooling unit. The cooling unit is designed to supply coolant to and remove coolant from the heat sink.The heat sink can, for example, be designed such that, when the heat sink is mounted in the cooling unit, fluid-tight fluidic connections can be formed between the heat sink and the cooling unit. This makes it possible to remove the heat sink, together with the unit to be cooled attached to the heat sink, from the cooling unit as needed. This is advantageous, particularly from the point of view of maintenance and repair. According to the described embodiments, the unit to be cooled can, for example, be removed from the cooling unit together with the heat sink.
[0024] This development enables the unit to be cooled to be firmly mechanically connected to the heat sink, for example. The result of the development is preferably to create the connection between the unit to be cooled and the heat sink using as little additional material and as thin as possible. During the considerations, simulations and tests for this development, it became clear that this is particularly possible if the heat sink through which fluid flows is firmly connected, in particular by a material bond, to the unit to be cooled. This can be achieved, for example, by soldering, sintering, pressing or direct copper bonding (DCB). By "firmly" here we mean "can only be removed by destruction". In other words, by means of a connection that cannot be removed even with tools without destroying either the unit 10 to be cooled or the heat sink 5 or both components.In this case, too, it would be possible to remove the unit to be cooled from the cooling unit along with the heat sink, for example, for maintenance purposes. By mechanically attaching the unit to be cooled to the heat sink, improved thermal coupling between the unit to be cooled and the heat sink, as well as better heat transfer from the unit to be cooled to the heat sink, can be achieved.
[0025] In addition, the electrical power converter may comprise an electronic assembly comprising a heat sink as described above and a unit to be cooled that is mechanically firmly connected to the heat sink.
[0026] The electronic assembly, which includes the heat sink and the unit to be cooled, which is mechanically firmly connected to the heat sink, can, for example, be inserted into and removed from the cooling unit as a whole. This allows access to the unit to be cooled.
[0027] The electrical power converter may further comprise: a cooling unit for supplying a heat sink, which has a coolant supply and a coolant discharge, with coolant, in particular coolant liquid, preferably cooling water. The cooling unit may comprise a first flow channel and a second flow channel. Furthermore, the cooling unit may comprise a first fluid port, which is fluidically connected to the first flow channel, and in particular a second fluid port, which is fluidically connected to the second flow channel.The cooling unit can be configured such that the heat sink can be detachably attached to the cooling unit, and such that, upon attachment of the heat sink to the cooling unit, a first fluidic connection can be formed between the coolant supply of the heat sink and the first fluid port of the cooling unit, as well as a second fluidic connection between the coolant discharge of the heat sink and the second fluid port of the cooling unit. Furthermore, the heat sink can be configured in particular such that, upon attachment of the heat sink to the cooling unit, a fluid-tight seal is simultaneously formed between the first fluidic connection and the second fluidic connection.
[0028] The cooling unit can be designed, for example, to supply a single heat sink with coolant, but it can also be designed, for example, to supply a plurality of heat sinks with coolant and to discharge the coolant again after flowing through the heat sinks. In this way, a cooling system is created that allows access to the cooling units when needed. The electrical power converter can comprise a cooling device that includes a cooling unit as described above and a heat sink detachably connected to the cooling unit as described above.
[0029] The electrical power converter may further comprise
[0030] - a circuit board,
[0031] - further electronic components, wherein the further electronic components and the unit to be cooled are arranged on or at a printed circuit board and are connected by electrical contacts.
[0032] A preferred result of the development is to create a connection between the unit to be cooled and the heat sink with as little additional material and as thin as possible. During the considerations, simulations and tests for this development it became clear that this is particularly possible if the heat sink through which fluid flows is firmly connected, in particular by a material bond, to the unit to be cooled. This can be achieved, for example, by soldering, sintering, pressing or direct copper bonding (DCB). By "firm" here we mean "can only be removed by destruction". In other words, by means of a connection that cannot be removed even with tools without destroying either the unit to be cooled or the heat sink or both components.
[0033] The object is also achieved by a method for assembling an electrical power converter for an industrial process arrangement, preferably a plasma process arrangement or heating arrangement, in particular as described above or below, starting from a heat sink for cooling a unit to be cooled, in particular an electrical unit, preferably a semiconductor arrangement, and a cooling unit. The heat sink has a cooling channel, a coolant supply fluidly connected to the cooling channel, and a coolant discharge fluidly connected to the cooling channel. The cooling unit comprises a first fluid port and a second fluid port.The method comprises a step of releasably attaching the heat sink to the cooling unit. Upon attachment of the heat sink to the cooling unit, a first fluidic connection is formed between the coolant supply of the heat sink and the first fluid port of the cooling unit, and a second fluidic connection is formed between the coolant discharge of the heat sink and the second fluid port of the cooling unit. Upon attachment of the heat sink to the cooling unit, a fluid-tight seal is simultaneously formed between the first fluidic connection and the second fluidic connection.
[0034] Advantageous training and further developments, which can be used individually or in combination with one another, are the subject of the dependent claims and the following description.
[0035] The electrical power converter can be used in particular for power conversion for special power-intensive industrial processes that are prone to instability, such as plasma excitation, plasma coating processes, gas laser excitation, particle accelerators, charging and discharging devices for large batteries, such as flow batteries, melting of solids, heating and / or gasification of liquid substances using, for example, microwave energy or induction heating. All of these processes have in common that they are designed to generate and accelerate charged atomic particles in a gas and / or plasma environment or liquid. The electrical power converter can be designed in particular for high power consumption, which is in the range of 1 kW or more, in particular 10 kW or more, preferably 100 kW or more. For loads of this type, very high requirements exist for the stability of the power supply because the processes are highly complex, such asSemiconductor production using plasma processes and / or heating by electromagnetic fields. Typically, this involves converting power from a mains frequency in the range of approximately 50 Hz to 60 Hz to different frequencies, which can be in the range of 1 kHz to 200 MHz. Conversion to direct current power, also known as DC power, is also conceivable. This conversion of electrical power into other frequencies requires a large number of electronic components and assemblies, in particular power semiconductor components such as transistors or diodes designed for currents > 10 A and voltages > 400 V. These electronic components and assemblies generate high levels of heat loss during operation. Dissipating this heat efficiently is always a major challenge, which is solved very effectively with the devices and methods described.
[0036] The electrical power converter is preferably designed to excite a plasma process, in particular a plasma process for semiconductor production.
[0037] In one aspect, such an electrical power converter will improve the properties of a power supply system that has LDMOS transistors as the element to be cooled, as disclosed, for example, in DE 10 2013 226 537A1, EP 3 317 964 B1, EP3 317 965 B1. The load capacity of the LDMOS transistors in such power supply systems often reaches its limits because they become too hot, even though neither their maximum voltage carrying capacity nor their maximum current carrying capacity has been reached. This means that with a cooling improvement as described above and below, such power supply systems can be operated much more reliably.
[0038] In one aspect, such an electrical power converter will improve the properties of a power supply system which provides very high voltages at its output, in particular voltages greater than or equal to 1 kV, particularly preferably greater than or equal to 2 kV, in particular greater than or equal to 4 kV. This is particularly preferred if these are also provided in pulsed form, as described, for example, in EP 4 235 737 A1 as a 'high power generator'. Since the switching elements described therein must switch on even when a voltage is applied to their power terminals, these switching operations are particularly lossy. EP 4 235 737 A1 describes a very complex cooling process which can be improved with the device and / or method described here.
[0039] The patent publications DE 10 2013 226 537A1, EP 3 317 964 Bl, EP3 317 965 Bl and EP 4 235 737 A1 are incorporated in their entirety by reference into this application.
[0040] In one aspect, the coolant supply and coolant discharge of the heat sink are arranged on the side of the heat sink facing away from the unit to be cooled. This makes it possible, for example, to fluidically contact the heat sink on the side of the heat sink facing away from the unit to be cooled.
[0041] In one aspect, the heat sink can be releasably attached to the cooling unit by means of at least one fastening means, preferably at least one screw. The at least one fastening means can preferably be designed to form the fluidic connections between the heat sink and the cooling unit in such a way that a fluid-tight seal is achieved.
[0042] It is advantageous if the fluid-tight seal between the first fluidic connection and the second fluidic connection can be established with at least one fastening means accessible from the side of the first cooling wall. Because the at least one fastening means is accessible from the side of the first cooling wall, handling of the heat sink during insertion and removal from the cooling unit is facilitated, for example.
[0043] In one aspect, the heat sink can be pressed against the cooling unit by means of the at least one fastening means such that liquid-tight fluidic connections can be formed between the first fluid port of the cooling unit and the coolant supply of the heat sink, and between the second fluid port of the cooling unit and the coolant discharge of the heat sink. For example, the at least one fastening means can be configured such that, when the heat sink is attached to the cooling unit, a contact force can be generated that presses the first and second fluid ports of the cooling unit against the coolant supply and discharge of the heat sink.
[0044] It is advantageous if the cooling device comprises a first sealing element designed to form the first fluidic connection in a liquid-tight manner when the heat sink is attached to the cooling unit. For example, a fluid-tight first fluidic connection can be formed by means of the first sealing element when the heat sink is attached to the cooling unit. For example, the sealing element can be deformed when the heat sink is pressed against the cooling unit such that the connection between the first cooling port and the coolant supply is sealed. The first sealing element is preferably a first sealing ring that surrounds the first fluid port.
[0045] In one aspect, the cooling device comprises a second sealing element designed to form the second fluidic connection in a liquid-tight manner when the heat sink is attached to the cooling unit. For example, a fluid-tight second fluidic connection can be formed by means of the second sealing element when the heat sink is attached to the cooling unit. The second sealing element is preferably a second sealing ring that surrounds the second fluid port.
[0046] In one aspect, the heat sink is configured such that, when the heat sink is attached to the cooling unit, a cooling flow can be formed from the first fluid port to the coolant supply via the cooling channel and the coolant discharge to the second fluid port. In this way, the heat sink can be supplied with coolant, for example, from the cooling unit.
[0047] In one aspect, the heat sink is made of metal, preferably copper. Due to the high thermal conductivity of copper, effective heat dissipation of the unit to be cooled is enabled. The element to be cooled, in particular the semiconductor device, can comprise a power semiconductor component, wherein the power converter is configured such that the power semiconductor component can be operated at a frequency greater than 20 kHz in switching or amplifier mode and can generate an electrical power loss of > 500 W.
[0048] In one aspect, the heat sink has a cooling channel through which coolant, in particular cooling liquid, preferably cooling water, can flow in a predetermined flow direction. The cooling channel can preferably have a first cooling wall on the side of the cooling channel facing the unit to be cooled. A plurality of cooling pins can further preferably be arranged in the cooling channel or in a partial region of the cooling channel, which cooling pins extend, in particular from the first cooling wall, into the cooling channel. The plurality of cooling pins can further preferably comprise at least one cooling pin of a first category, which is oriented in a first inclination direction that is inclined obliquely relative to a perpendicular to the first cooling wall. The cooling pins of the plurality of cooling pins can further preferably be arranged such that one cooling pin of the plurality of cooling pins does not intersect any other cooling pin of the plurality of cooling pins.
[0049] Such a device is described, for example, in the German patent application with the official file number 10 2023 123 660.1, filed on September 1, 2023, entitled: "Heat sink with pressure loss-optimized arrangement of cooling pins within the cooling channel," which is incorporated in its entirety by reference into this patent application.
[0050] In one aspect, a plurality of cooling pins can be arranged in the cooling channel or in a partial region of the cooling channel in the heat sink, said cooling pins extending from the first cooling wall into the cooling channel. A cooling pin is understood to be a cooling element whose length is greater than the average width or the average diameter of the cooling element. In particular, a cooling pin can be designed, for example, with a cylindrical or tapered geometry. The directional extension of the cooling pin can preferably be represented by a center line of the cooling pin. According to an exemplary embodiment, to determine such a center line, for example, a line could be drawn through the centers of the cross sections along the cooling pin. The center line of a cooling pin can, for example, be designed as a straight line, but it can also, for example, be slightly curved or slightly kinked.
[0051] In one aspect, cooling pins of the first category can be aligned at an angle to a perpendicular to the first cooling wall. "Angle-angled" here means that the cooling pins of the first category are neither parallel nor perpendicular to the first cooling wall. It has been found that the angled arrangement of the cooling pins allows for particularly good coolant flow and improved thermal contact between the cooling pin and the coolant.
[0052] In one aspect, the cooling pins of the plurality of cooling pins can be arranged such that no cooling pin intersects any other cooling pin of the plurality of cooling pins. This overlap-free arrangement of the cooling pins in the cooling channel or in a partial region of the cooling channel achieves improved flow through the cooling channel and a reduction in pressure loss. The pressure required to convey the coolant through the cooling channel has proven to be particularly low during development. In one aspect, each cooling pin of the plurality of cooling pins is arranged such that coolant can flow around it all around. This enables high heat transfer from the cooling pins to the coolant.
[0053] It is advantageous if the cooling pins of the plurality of cooling pins are arranged such that one cooling pin of the plurality of cooling pins does not touch any other cooling pin of the plurality of cooling pins. In this way, a distance is created between the cooling pins. In this way, the flow through the cooling channel is facilitated; the pressure loss is reduced. In one aspect, the cooling pins are rod-shaped. Further preferably, the cooling pins have a substantially cylindrical shape. The rod-shaped or cylindrical design of the cooling pins creates a large contact surface for the heat transfer from the cooling pins to the coolant.
[0054] In one aspect, the cooling pins have a round or oval cross-section. This can further reduce flow resistance.
[0055] It is advantageous if the cooling channel has a second cooling wall on the side of the cooling channel opposite the first cooling wall.
[0056] In one aspect, the cooling pins of the plurality of cooling pins extend continuously from the first cooling wall to the second cooling wall. In this way, heat can be supplied to the cooling pins from both the first cooling wall and the second cooling wall. This achieves improved heat dissipation.
[0057] In one aspect, the first cooling wall is arranged substantially parallel to the second cooling wall. The parallel alignment of the first cooling wall and the second cooling wall ensures a homogeneous flow through the cooling channel with turbulent flow conditions inside.
[0058] It is advantageous if the cooling channel has a substantially constant cross-section across the entire heat sink. This results in a constant coolant flow velocity throughout the cooling channel. This is advantageous with a local dependence of the flow velocity, which leads to a desired turbulent system.
[0059] In one aspect, the cooling channel has a substantially rectangular cross-section. Furthermore, it is advantageous if the cooling channel is configured as a substantially cuboid-shaped cooling channel. Such geometries simplify the formation of flat contact surfaces for thermally connecting the units to be cooled.
[0060] It is advantageous if the heat sink is a micro heat sink and the unit to be cooled is an electronic component. According to this embodiment, a separate micro heat sink can be provided for each electronic component. This enables heat dissipation that is individually tailored to the respective electronic component. The unit to be cooled is preferably an electronic assembly.
[0061] In one aspect, the heat sink has an inlet, wherein coolant can be supplied via the inlet at a first end of the cooling channel. Further preferably, the heat sink has an outlet, wherein coolant can be discharged via the outlet at a second end of the cooling channel, wherein the second end of the cooling channel is arranged opposite the first end of the cooling channel. This allows coolant to flow through the entire heat sink.
[0062] In one aspect, the heat sink is made of metal. Metals generally have high thermal conductivity. According to a preferred embodiment, the heat sink is made of copper. Copper is a metal with very high thermal conductivity and is therefore preferably used for the construction of heat sinks. According to an alternative preferred embodiment, the heat sink is made of one of molybdenum, stainless steel, and nickel.
[0063] In one aspect, the cooling pins of the heat sink are manufactured using an additive manufacturing process, in particular selective laser melting (SLM). Using such additive manufacturing processes, the cooling pins can be applied to the first cooling wall of the heat sink in virtually any orientation. Even with additive manufacturing, certain restrictions must be observed in the structure, for example, on the inside, such as:
[0064] The mounting angle should be less than 45°, which would otherwise be impossible without a support structure. In one aspect, the unit to be cooled is mechanically and thermally connected to the heat sink.
[0065] In one aspect, the unit to be cooled is connected to the heat sink by at least one of the following: by at least one soldered joint, by at least one welded joint, or by sintering. For example, if the heat sink is firmly soldered to the unit to be cooled, the soldering enables improved thermal coupling. Improved thermal coupling between the heat sink and the unit to be cooled can also be achieved by means of a welded joint or by sintering, for example.
[0066] In one aspect, the unit to be cooled is connected to the heat sink by means of a layer of thermal paste. In this case, too, it can be advantageous to be able to remove the heat sink from the cooling unit when needed.
[0067] In one aspect, the electronic assembly described above comprises a circuit board to which the unit to be cooled has a fixed mechanical connection. This fixed mechanical connection can be achieved, for example, by soldering electrical connections of the unit to be cooled to the circuit board. In this embodiment, the circuit board, the unit to be cooled, and the heat sink form a structural unit that can, for example, be inserted in its entirety into the cooling unit.
[0068] In one aspect, the electronic assembly comprises a plurality of units to be cooled, which have a fixed mechanical connection to the circuit board, as well as a plurality of heat sinks. The electronic assembly with the plurality of heat sinks can be inserted in its entirety into the cooling unit. The cooling unit preferably has a plurality of receptacles designed to accommodate the plurality of heat sinks. The fact that the electronic assembly is removable from the cooling unit facilitates maintenance, for example.
[0069] In one aspect, the cooling unit comprises at least one receiving device for at least one fastening means.
[0070] In one aspect, the heat sink can be secured by means of at least one fastening means accessible from the side of the first cooling wall, which engages with the at least one receiving device. If the at least one fastening means engages with the at least one receiving device on the side of the cooling unit, the heat sink can thus be secured to the cooling unit, for example.
[0071] In one aspect, the fluid-tight seal between the first fluidic connection and the second fluidic connection can be established with at least one fastening means accessible from the side of the unit to be cooled. If the at least one fastening means is accessible from the side of the unit to be cooled, inserting and removing the heat sink into the cooling unit can be facilitated.
[0072] It is advantageous if the cooling unit has a mount for the heat sink into which the heat sink can be inserted. This allows, for example, a precise fixation of the heat sink in the cooling unit.
[0073] In one aspect, the cooling unit is configured to supply coolant to a plurality of heat sinks and to remove coolant from the plurality of heat sinks.
[0074] In one aspect, the cooling unit has a plurality of receptacles into which a plurality of heat sinks can be inserted. This makes it possible, for example, to insert an electronic assembly comprising a plurality of heat sinks in its entirety into the receptacles of the cooling unit. In one aspect, the cooling unit is made entirely or partially of metal or entirely or partially of plastic.
[0075] In one aspect, grooves are provided within the cooling unit into which pipes can be pressed. The pipes can, for example, comprise a first flow channel for supplying coolant and a second flow channel for discharging coolant.
[0076] In one aspect, the walls of the pipes consist entirely or predominantly of a material, preferably copper, that has a higher thermal conductivity compared to other areas of the cooling unit. The high thermal conductivity of the pipe walls can, for example, further improve the heat dissipation of the unit to be cooled.
[0077] In one aspect, the cooling unit comprises a distribution unit having the first fluid port and the second fluid port. The distribution unit is preferably configured to supply at least one heat sink with coolant and to discharge the returning coolant.
[0078] It is advantageous if the distribution unit is designed as a cooling insert made of a material with higher thermal conductivity than other areas of the cooling unit, preferably copper. For example, the cooling insert can be in thermal contact with the heat sink, so that the heat dissipation of the heat sink is improved by the thermal contact with the cooling insert. This saves costs and weight, as the entire support unit does not have to be made of the more expensive and usually heavier material, such as copper.
[0079] In one aspect, the cooling unit comprises a support unit. The distribution unit can be inserted into the support unit.
[0080] In one aspect, the support unit is made entirely or partially of metal, preferably aluminum. In one aspect, a cooling flow can be formed within the cooling device from the first fluid port for the coolant supply via the cooling channel and the coolant discharge to the second fluid port. This cooling flow can be used, for example, to dissipate the heat generated by the unit to be cooled.
[0081] In one aspect, the cooling unit is designed to supply coolant, in particular cooling liquid, preferably cooling water, to the heat sink via the first fluid port and to discharge coolant from the heat sink via the second fluid port.
[0082] Further advantageous embodiments are described in more detail below with reference to several exemplary embodiments shown in the drawings, to which, however, the development is not limited. They show schematically:
[0083] Fig. 1 shows an electrical power converter in an industrial process arrangement, preferably a plasma process arrangement or heating arrangement.
[0084] Fig. 2 shows a longitudinal section through the unit to be cooled, the heat sink and the cooling unit that supplies the heat sink with coolant.
[0085] Fig. 3 is a representation of a printed circuit board with two units to be cooled arranged on the printed circuit board, wherein the printed circuit board can be detachably attached to a cooling unit.
[0086] Fig. 4a is a sectional view of the circuit board with the units to be cooled arranged thereon together with a carrier unit.
[0087] Fig. 4b shows a view of the entire carrier unit with the printed circuit board arranged on it. Fig. 5 shows another view of the carrier unit in longitudinal section.
[0088] Fig. 6 is a sectional view of the support unit obliquely from the underside, in which a cooling insert and pipes for supplying fluid to the cooling insert can be seen.
[0089] Fig. 7 is a sectional view of the entire support unit obliquely from the underside, in which the cooling insert, the pipes and the coolant connections can be seen.
[0090] In the following description of preferred embodiments of the present development, like reference numerals designate like or comparable components.
[0091] Fig. 1 shows an industrial process arrangement 1, preferably a plasma process arrangement or heating arrangement.
[0092] The industrial process arrangement 1 has:
[0093] - an electrical power converter 4,
[0094] - a load 2, preferably a plasma process or heating process, e.g. an induction or microwave heating process, wherein the load 2 is electrically connected to the electrical power converter 4 so that the electrical power converter 4 can supply the load 2 with the required electrical power,
[0095] - optionally an additional adaptation unit 3, which is connected between the power converter 4 and the load 2.
[0096] The power converter 4 has:
[0097] - a heat sink 5, and another heat sink 85, as described above and below,
[0098] - a cooling unit 22 comprising, as described above and below, one or more distribution units 20 and a carrier unit 21,
[0099] - a printed circuit board 75, - a unit 10 to be cooled, in particular an electrical unit, preferably a semiconductor device, preferably comprising a power semiconductor component,
[0100] - further electronic components 8a, 8b, 8c, wherein the further electronic components 8a, 8b, 8c and the unit 10 to be cooled are arranged on or at a printed circuit board 75 and are connected to electrical contacts, wherein the unit 10 to be cooled has a fixed, in particular material-locking, connection with the heat sink 5, 85.
[0101] From Fig. 2 it can be seen that a plurality of cooling pins 65 can be arranged in the cooling channel 35 or in a partial region of the cooling channel 35, which extend from the first cooling wall 50 into the cooling channel 35.
[0102] From Fig. 2 it can further be seen that the plurality of cooling pins 65 may comprise at least one cooling pin of a first category which is oriented in a first inclination direction which is inclined relative to a perpendicular to the first cooling wall 50.
[0103] From Fig. 2 it can further be seen that the cooling pins of the plurality of cooling pins 65 can be arranged such that one cooling pin of the plurality of cooling pins 65 does not intersect another cooling pin of the plurality of cooling pins 65.
[0104] From Fig. 2 it is further apparent that the plurality of cooling pins 65 can comprise at least one cooling pin of a second category oriented in a second inclination direction that is inclined relative to the perpendicular to the first cooling wall, wherein the second inclination direction is different from the first inclination direction. In this embodiment, the plurality of pins 65 comprises cooling pins of the first category oriented in a first inclination direction and cooling pins of the second category oriented in a second inclination direction. The different orientation of the cooling pins creates a flow pattern in the cooling channel 35 that has proven advantageous for efficient heat dissipation. From Fig.2 further shows that the plurality of cooling pins 65 can be arranged such that a cooling pin of the first category overlaps with a cooling pin of the second category at a viewing angle parallel to the cooling wall, in particular at a viewing angle of the coolant flow direction. "Overlapping" here means that at least one cooling pin of the first category at least partially obscures another cooling pin of the second category in the predetermined viewing direction. Such an arrangement can improve the turbulence of the coolant at the cooling pins and, consequently, the heat transfer from the cooling pins to the coolant.
[0105] From Fig. 2, it is further apparent that the plurality of cooling pins 65 can be arranged such that a cooling pin of the first category is intertwined with two cooling pins of the second category at a viewing angle parallel to the cooling wall, in particular at a viewing angle of the coolant flow direction. "Intertwined" here means that at least one first cooling pin of the first category at least partially obscures a second cooling pin of the second category in the given viewing direction, and the first cooling pin itself is also at least partially obscured by another cooling pin of the second category in the given viewing direction. Such an arrangement can further improve the turbulence of the coolant at the cooling pins and, consequently, the heat transfer from the cooling pins to the coolant.
[0106] Fig. 2 shows a cooling device in longitudinal section. The cooling device comprises a heat sink 5, 85, which is designed to cool a unit 10 to be cooled, which is attached to the heat sink 5, 85. The unit 10 to be cooled can, in particular, be an electrical unit, preferably a semiconductor device.
[0107] The heat sink 5, 85 is detachably connected to a cooling unit 22. In the example shown in the figures, the cooling unit 22 comprises a distribution unit 20 designed to supply the heat sink 5, 85 with coolant. The cooling unit 22 also comprises a support unit 21 into which the distribution unit 20 is inserted. The cooling unit 22 has a receptacle 23 into which the heat sink 5, 85 can be detachably inserted. The heat sink 5, 85 is then fastened to the cooling unit 22 by means of at least one fastening means 15, preferably by means of one or more screws. The cooling unit 22 has at least one receiving device 16 for the at least one fastening means 15. In order to separate the heat sink 5 from the cooling unit 22 again, the at least one fastening means 15 is first released.The heat sink 5 can then be removed from the holder 23 of the cooling unit 22 together with the unit 10 to be cooled mounted thereon.
[0108] Preferably, the unit 10 to be cooled is mechanically and thermally connected to the heat sink 5, 85. The unit 10 to be cooled can be connected to the heat sink 5, 85, for example, by means of one or more soldered connections. Another possibility is to connect the unit 10 to be cooled to the heat sink 5, 85, for example, by sintering. Alternatively, it is possible to weld the unit 10 to be cooled to the heat sink 5, 85. As a further, albeit less advantageous, alternative, the unit 10 to be cooled could also be connected to the heat sink 5, 85 by means of a layer of thermal paste. The result of the development, however, is to realize the connection between the unit 10 to be cooled and the heat sink 5, 85 with as few additional materials and as thin as possible.During the considerations, simulations, and tests for this development, it became clear that this is particularly possible when the fluid-flowing heat sink is firmly, in particular materially, connected to the unit 10 to be cooled. This can be achieved, for example, by soldering, sintering, pressing, or direct copper bonding (DCB). "Solidly" here can mean "can only be removed by destruction." That is, by means of a connection that cannot be removed even with tools without destroying either the unit 10 to be cooled or the heat sink 5, 85, or both components. It was further recognized that such a solution will only be feasible if a new solution can be found for the interchangeability of the printed circuit board component with electronic components and, in particular, with the unit 10 to be cooled attached to it. This has been achieved with the proposed heat sink 5.
[0109] The heat sink 5, 85 and the unit 10 to be cooled, which is mechanically firmly connected to the heat sink 5, 85, together form an electronic assembly 24. This electronic assembly 24 can be inserted into the receptacle 23 of the cooling unit 22 and removed again from this receptacle 23.
[0110] The cooling unit 22 is designed to supply coolant to the heat sink 5, 85 attached to the cooling unit 22 and to discharge the coolant again after the coolant has flowed through the heat sink 5, 85. Within the cooling unit 22, a first flow channel 25 can be seen, via which coolant can be supplied to the heat sink 5, 85. Within the cooling unit 22, a second flow channel 30 can be seen, via which the coolant can be discharged. The heat sink 5, 85 has a cooling channel 35 through which the coolant can flow. A coolant inlet 40 is provided at a first end of the cooling channel 35, and a coolant outlet 45 is provided at the second end of the cooling channel 35 opposite the first end. The coolant inlet 40 and the coolant outlet 45 are fluidically connected to the cooling channel 35.
[0111] The cooling unit 22 comprises a first fluid port 41, which is fluidically connected to the first flow channel 25, and a second fluid port 46, which is fluidically connected to the second flow channel 30. When the heat sink 5 is inserted and subsequently secured in the receptacle 23, a first fluid connection is formed between the first fluid port 41 and the coolant supply 40, and a second fluid connection is formed between the second fluid port 46 and the coolant discharge 45.
[0112] To seal the first fluidic connection, a first sealing ring 42 is arranged in a groove 43 between the cooling unit 22 and the heat sink 5, wherein the sealing ring 42 completely surrounds the first fluid port 41. Likewise, a second sealing ring 44 is provided on the second fluid port 46, which completely surrounds the second fluid port 46 and is arranged in a groove 43 between the cooling unit 22 and the heat sink 5. When the at least one fastening means 15 is attached, for example when tightening the at least one screw, the heat sink 5 is pressed against the first fluid port 41 and the first sealing ring 42 as well as against the second fluid port 46 and the second sealing ring 44. As a result of this pressing, a liquid-tight first fluidic connection and a liquid-tight second fluidic connection are formed between the cooling unit 22 and the heat sink 5.
[0113] As shown in Fig. 2, a cooling flow 36 can be formed within the cooling device. The coolant flows from the first flow channel 25 via the first fluid port 41 and the coolant supply 40 into the cooling channel 35. The coolant flows through the cooling channel 35 and is discharged again via the coolant discharge 45, the second fluid port 46, and the second flow channel 30.
[0114] The heat sink 5 has a first cooling wall 50 on the side facing the unit 10 to be cooled. On the side of the heat sink 5 facing away from the unit 10 to be cooled, the cooling channel 35 is delimited by a second cooling wall 55, which is opposite the first cooling wall 50.
[0115] Preferably, the second cooling wall 55 is formed parallel to the first cooling wall 50.
[0116] In the example shown in Fig. 2, the unit 10 to be cooled comprises an array of transistors 60. The heat generated during operation of the transistors 60 is dissipated via the coolant flowing in the cooling channel 35.
[0117] To improve the thermal exchange between the coolant flowing through the cooling channel 35 and the heat sink 5, a plurality of cooling pins 65 can be arranged inside the cooling channel 35, extending from the first cooling wall 50 and / or from the second cooling wall 55 into the cooling channel 35. Coolant flows around the cooling pins 65 and ensures improved thermal coupling between the heat sink 5 and the coolant.
[0118] In Fig. 2 it can also be seen that the unit 10 to be cooled, together with the heat sink 5 arranged underneath it, is arranged within a first recess 70 of a printed circuit board 75.
[0119] In Fig. 3, the arrangement of the unit 10 to be cooled within the first recess 70 of the circuit board 75 is clearly visible. Fig. 3 shows the circuit board 75 arranged on the cooling unit 22. Within the first recess 70 of the circuit board 75, the unit 10 to be cooled is shown in longitudinal section together with the associated heat sink 5. The heat sink 5 is inserted into the receptacle 23 of the cooling unit 22.
[0120] In addition to the unit 10 to be cooled, Fig. 3 shows a further unit 80 to be cooled together with a further heat sink 85 arranged underneath it. The further unit 80 to be cooled is arranged within a further recess 90 provided in the circuit board 75, and the associated further heat sink 85 is inserted into a further receptacle 92 of the cooling unit 22. The further heat sink 85 has a further cooling channel 95 through which coolant flows. In addition, electrical connection terminals 105 can be seen on the further unit 80 to be cooled, which are provided for forming electrical connections between the further unit 80 to be cooled and the circuit board 75. The unit 10 to be cooled also has electrical connection terminals for connection to the circuit board 75, although these are not shown in Fig. 3.
[0121] The cooling unit 22 shown in Fig. 3 is designed to supply coolant to a plurality of heat sinks and to discharge the coolant again after flowing through the heat sinks. In the example of Fig. 3, the cooling unit 22 is designed to supply coolant to both the heat sink 5 and the additional heat sink 85 and then to discharge it again from both the heat sink 5 and the additional heat sink 85. In particular, the cooling unit 22 is designed to distribute the coolant evenly among the various heat sinks.
[0122] The additional heat sink 85 is also fluidically connected to the cooling unit 22 when fastened in the additional receptacle 92. The sectional view of Fig. 3 shows that the additional cooling channel 95 is connected via the additional coolant discharge 100 and the additional second fluid port 102 to the second flow channel 30, through which the coolant is discharged.
[0123] The printed circuit board 75 shown in Fig. 3, together with the units 10 and 80 to be cooled and the heat sinks 5 and 85 fastened to the printed circuit board 75, forms a structural unit which, in its entirety, can be placed on the cooling unit 22 and also removed again, i.e., which can be detachably connected to the cooling unit 22. When this structural unit is placed on the cooling unit 22, the heat sinks 5, 85 attached to the units 10, 80 to be cooled are inserted into the corresponding receptacles 23, 92 of the cooling unit 22. The heat sinks 5, 85 are then fastened to the cooling unit 22 by means of the at least one fastening means 15, wherein, when the heat sinks 5, 85 are fastened to the cooling unit 22, fluidic connections for supplying and discharging coolant are formed between the respective heat sinks 5, 85 and the cooling unit 22.The cooling unit 22 is designed to supply all heat sinks 5, 85 of the structural unit evenly with coolant and to discharge the coolant again after flowing through the heat sinks 5, 85.
[0124] Fig. 4a shows a further view of the circuit board 75, taken obliquely from above, wherein part of the carrier unit 21 can be seen in Fig. 4a. Furthermore, the sectional view in Fig. 4a shows pipes 110, which are fitted into grooves 115 provided for this purpose on the underside of the carrier unit 21. The heat sinks 5, 85 are preferably made of metal, more preferably of copper. Alternatively, the heat sinks 5, 85 could be made of stainless steel, nickel, or molybdenum, for example. The carrier unit 21 can, for example, be made entirely or partially of metal, but the carrier unit can also be made entirely or partially of plastic. Preferably, the carrier unit 21 is made entirely or partially of aluminum. The walls of the pipes 110 are preferably made of copper.
[0125] In Figs. 4b and 5, the carrier unit 21 is shown in its entirety, wherein the circuit board 75 with the units 10 and 80 to be cooled can be seen. A first coolant connection 120 for supplying coolant and a second coolant connection 122 for discharging coolant are provided on the carrier unit 21. The longitudinal section through the unit 10 to be cooled shown in Fig. 5 also shows the heat sink 5, the first flow channel 25, and the second flow channel 30. Furthermore, some of the pipes 110 arranged on the underside of the carrier unit 21 can be seen in the sectional view of Fig. 5.
[0126] Figs. 6 and 7 show two views of the support unit 21, viewed obliquely from below. Fig. 6 shows the units 10 and 80 to be cooled, as well as the heat sinks 5 and 85. Figs. 6 and 7 show that the distribution unit is designed in the form of a cooling insert 132, wherein the cooling insert 132 is preferably made of a metal with high thermal conductivity, preferably copper. The cooling insert 132 is inserted into the support unit 21.
[0127] The receptacle 23 for the heat sink 5 and the further receptacle 92 for the further heat sink 85 are formed as part of the cooling insert 132. The heat sink 5 is fastened to the cooling insert 132 by means of the at least one fastening means 15. Preferably, the heat sink 5 is screwed firmly to the cooling insert 132. The use of a cooling insert 132 made of copper in the areas in which the heat sinks 5 and 85 are arranged enables improved heat dissipation of the heat sinks 5 and 85. When using a cooling insert 132 made of copper, the structures provided for fluidic contact between the heat sinks 5 and 85 are arranged within the cooling insert 132. In this respect, the first flow channel 25, the first fluid port 41, the second flow channel 30, the second fluid port 46 and the further second fluid port 102 are formed within the cooling insert 132. Furthermore, in Fig. 6 and Fig.7 shows the pipes 110, which are pressed into the grooves 115 provided for this purpose on the underside of the support unit 21. The pipe walls of the pipes 110 are preferably made of a metal with high thermal conductivity, preferably copper. Furthermore, the pipes 110 are preferably connected to the cooling insert 132 and designed to supply cold coolant to the cooling insert 132 and to discharge the heated coolant.
[0128] Fig. 7 shows the entire support unit 21 from the underside. In addition to the cooling insert 132 and the pipes 110 pressed into the grooves 115, Fig. 7 also shows the coolant connections 120 and 122 for supplying and discharging coolant.
[0129] The features disclosed in the above description, the claims and the drawings may be important both individually and in any combination for the realization of the development in its various forms.
Claims
PATENT CLAIMS 1. Electrical power converter (4) for an industrial process arrangement (1), preferably a plasma process arrangement or heating arrangement, comprising: - a heat sink (5), - a unit (10) to be cooled, in particular an electrical unit, preferably a semiconductor device, preferably comprising a power semiconductor component, - a printed circuit board (75), - further electronic components (8a, 8b, 8c), wherein these further electronic components (8a, 8b, 8c) and the unit to be cooled (10) are arranged on or at the printed circuit board (75) and are connected by electrical contacts, wherein the unit to be cooled (10) has a fixed, in particular material-locking, connection with the heat sink (5), and wherein the heat sink (5) is designed to dissipate heat from the unit to be cooled (10), wherein the heat sink (5) has: - a cooling channel (35), - a coolant supply (40) and a coolant discharge (45), both of which are fluidically connected to the cooling channel (35), for supplying and discharging coolant, in particular cooling liquid, preferably cooling water, wherein - the heat sink (5) is constructed monolithically from one material, - the heat sink (5) is mechanically and thermally connected to the unit (10) to be cooled, - the heat sink (5) is detachably attached to a cooling unit (22) comprising a first fluid port (41), when the heat sink (5) is attached to the cooling unit (22), a first fluidic connection is formed between the coolant supply (40) of the heat sink (5) and the first fluid port (41) of the cooling unit (22), when the heat sink (5) is fastened to the cooling unit (22) a fluid-tight seal of the first fluidic connection is simultaneously effected.
2. Electrical power converter (4) according to claim 1, characterized in that the heat sink (5) can be releasably fastened to the cooling unit (22) by means of at least one fastening means (15), preferably at least one screw.
3. Electrical power converter (4) according to claim 1 or claim 2, characterized in that the fluid-tight seal of the first fluidic connection can be produced with at least one fastening means (15) which is accessible from the side of the first cooling wall (50).
4. Electrical power converter (4) according to one of the preceding claims, characterized in that the heat sink (5) is designed such that when the heat sink (5) is fastened to the cooling unit (22), a cooling flow (36) can be formed from the first fluid port (41) to the coolant supply (40) via the cooling channel (35).
5. Electrical power converter (4) according to one of the preceding claims, characterized in that the electrical power converter (4) is designed to excite a plasma process, in particular a plasma process for semiconductor production.
6. Electrical power converter (4) according to one of the preceding claims, characterized in that the heat sink (5) has a cooling channel (35) through which coolant, in particular cooling liquid, preferably cooling water, can flow in an intended flow direction, wherein the cooling channel (35) has in particular a first cooling wall (50) on the side of the cooling channel (35) facing the unit to be cooled, wherein a plurality of cooling pins (65) are arranged in the cooling channel (35) or in a partial region of the cooling channel (35), which extend, in particular from the first cooling wall (50), into the cooling channel (35), wherein the plurality of cooling pins (65) comprises at least one cooling pin of a first category which is oriented in a first inclination direction which is inclined obliquely relative to a perpendicular to the first cooling wall (50), wherein the cooling pins of the plurality of cooling pins (65) are preferably arranged such that one cooling pin of the plurality of cooling pins (65) does not intersect any other cooling pin of the plurality of cooling pins (65).
7. Electrical power converter (4) according to one of the preceding claims, characterized in that the cooling pins of the heat sink (5) are manufactured by means of an additive manufacturing process, in particular by means of selective laser melting (SLM).
8. Electrical power converter (4) according to one of the preceding claims, characterized in that the heat sink (5) is manufactured by means of an additive manufacturing process, in particular by means of selective laser melting (SLM).
9. Electrical power converter (4) according to one of the preceding claims, characterized in that the unit to be cooled (10) has at least one LDMOS transistor, preferably two identical LDMOS transistors.
10. Electrical power converter (4) according to one of the preceding claims, characterized in that the electrical power converter (4) is designed to generate a high voltage greater than or equal to 1 kV, in particular greater than or equal to 2 kV, preferably with a pulsed high voltage.
11. Electrical power converter (4) according to one of the preceding claims, characterized in that the unit to be cooled (10) is provided with the heat sink (5) is connected by at least one of the following: by at least one soldered connection, by at least one welded connection, by sintering.
12. Electrical power converter (4) according to one of the preceding claims, further comprising a circuit board (75) with which the unit (10) to be cooled has a fixed mechanical connection.
13. Electrical power converter (4) for an industrial process arrangement (1), preferably a plasma process arrangement or heating arrangement, in particular according to one of the preceding claims, with a cooling unit (22) for supplying a cooling body (5), which has a coolant supply (40) and a coolant discharge (45), with coolant, in particular cooling liquid, preferably cooling water, wherein the cooling unit (22) has: - a first flow channel (25) and a second flow channel (30); - a first fluid port (41) which is fluidically connected to the first flow channel (25), - a second fluid port (46) which is fluidically connected to the second flow channel (30), wherein the cooling unit (22) is designed such that - the heat sink (5) can be detachably fastened to the cooling unit (22), when the heat sink (5) is fastened to the cooling unit (22), a first fluidic connection can be formed between the coolant supply (40) of the heat sink (5) and the first fluid port (41) of the cooling unit (22) and, in particular, additionally a second fluidic connection can be formed between the coolant discharge (45) of the heat sink (5) and the second fluid port (46) of the cooling unit (22), when the heat sink (5) is fastened to the cooling unit (22), a fluid-tight seal is simultaneously formed between the first fluidic connection and, in particular, additionally between the second fluidic connection, wherein the electrical power converter (4) further comprises: - - a printed circuit board (75), - - further electronic components (8a, 8b, 8c), wherein these further electronic components (8a, 8b, 8c) and the unit to be cooled (10) are arranged on or at the printed circuit board (75) and are connected to electrical contacts.
14. Electrical power converter (4) according to one of the preceding claims, comprising: - another heat sink (85), - a further unit (80) to be cooled, in particular an electrical unit, preferably a semiconductor device, preferably comprising a power semiconductor component, wherein the further unit (80) to be cooled has a fixed, in particular material-locking, connection with the further heat sink (85), and wherein the further heat sink (85) is designed to dissipate heat from the further unit (80) to be cooled, wherein the further heat sink (85) has: - a cooling channel ( 95), - a coolant supply and a coolant discharge, both connected to the Cooling channel (95) are fluidly connected for supplying and discharging coolant, in particular cooling liquid, preferably cooling water, wherein - the further heat sink (85) is constructed monolithically from one material, the further heat sink (85) is mechanically and thermally connected to the further unit (80) to be cooled, - the further heat sink (85) is detachably attached to a cooling unit (22) comprising a further fluid port, when the further heat sink (85) is attached to the cooling unit (22), a first fluidic connection is formed between the coolant supply (40) of the further heat sink (85) and the further fluid port of the cooling unit (22), when the further heat sink (85) is attached to the cooling unit (22), the further fluidic connection is simultaneously sealed fluid-tight.
15. Electrical power converter (4) according to claim 14, wherein the further heat sink (85) is configured with one or more features of the heat sink (5) according to one of the preceding claims.
16. Electrical power converter (4) according to claim 14 or 15, wherein the further unit to be cooled (80) is designed with one or more features of the unit to be cooled (10) according to one of the preceding claims.
17. Method for assembling an electrical power converter (4) for an industrial process arrangement (1), preferably a plasma process arrangement or heating arrangement, in particular according to one of the preceding claims, starting from: - a heat sink (5, 85) for cooling a unit (10, 80) to be cooled, in particular an electrical unit, preferably a semiconductor device, wherein the heat sink (5, 85) comprises a cooling channel (35, 95), a coolant supply (40) fluidically connected to the cooling channel (35, 95) and a coolant discharge (45) fluidically connected to the cooling channel (35, 95), and - a cooling unit (22) comprising a first fluid port (41) and a second fluid port (46), the method comprising: - releasably fastening the heat sink (5, 85) to the cooling unit (22), wherein upon fastening of the heat sink (5, 85) to the cooling unit (22), a first fluidic connection is formed between the coolant supply (40) of the heat sink (5, 85) and the first fluid port (41) of the cooling unit (22) and, in particular, a second fluidic connection is formed between the coolant discharge (45) of the heat sink (5, 85) and the second fluid port (46) of the cooling unit (22), wherein upon fastening of the Heat sink (5, 85) on the cooling unit (22) at the same time a fluid-tight Sealing of the first fluidic connection, and in particular the second fluidic connection, takes place.