Heat sink for releasably securing to a cooling unit, and cooling unit with releasably securable heat sinks
Patent Information
- Authority / Receiving Office
- EP · EP
- Patent Type
- Applications
- Current Assignee / Owner
- TRUMPF PATENTABTEILUNG
- Filing Date
- 2024-08-30
- Publication Date
- 2026-07-08
Smart Images
Figure EP2024074321_06032025_PF_FP_ABST
Abstract
Description
[0001] Heat sinks for detachable attachment to a cooling unit and cooling unit with detachably attachable heat sinks
[0002] Description
[0003] The invention relates to a heat sink for cooling a unit to be cooled, in particular an electrical unit, preferably a semiconductor device. The invention further relates to an electronic assembly, a cooling unit, and a cooling device for supplying a heat sink with coolant. Furthermore, the invention relates to a method for assembling a cooling device starting from a heat sink and a cooling unit. The invention also relates to an electrical power converter for an industrial process device, preferably a plasma process device or heating device.
[0004] The invention lies in the field of electrical power conversion for special power-intensive industrial processes that are prone to instability, such as plasma excitation, plasma coating processes, gas laser excitation, particle accelerators, charging and discharging devices for large batteries, such as flow batteries, melting of solids, heating and / or gasification of liquid substances using, for example, microwave energy or induction heating. All of these processes have in common that they are designed to generate and accelerate charged atomic particles in a gas and / or plasma environment or liquid. All of these processes also have in common that they have a high power consumption in the range of 1 kW or more, in particular 10 kW or more, preferably 100 kW or more. Many of these processes also have very high requirements for the stability of the power supply because the processes are highly complex, such as, for example,Semiconductor production using plasma processes and / or heating by electromagnetic fields. Typically, this involves converting power from a mains frequency in the range of approximately 50 Hz to 60 Hz to different frequencies, which can be in the range of 1 kHz to 200 MHz. Conversion to direct current power, also known as DC power, is also conceivable. This conversion of electrical power into other frequencies requires a large number of electronic components and assemblies, in particular power semiconductor components such as transistors or diodes designed for currents > 10 A and voltages > 400 V. These electronic components and assemblies generate heat loss during operation. This heat loss is often generated in a very limited area of just a few mm. 2It is a particular challenge to dissipate this waste heat in order to protect the components and / or assemblies from being destroyed by overheating. Very large and material-intensive heat sinks are often provided for this purpose, the production of which is very expensive. In the prior art, this amount of heat is dissipated by cooling using a cold plate. When cooling with such a conventional cold plate, the heat transfer from the electrical component, which may have a copper layer, to the cooling medium is achieved by applying a material such as thermal paste in the thermal interface, which dissipates the generated heat. However, this type of thermal interface material proves to be disadvantageous. On the one hand, it represents a further heat transfer with thermal resistance, and on the other hand, it is subject to wear, which gradually deteriorates its effectiveness during operation.The surface area of the cooling plate is also increased, or the number and performance of the components is reduced in order to dissipate a greater amount of heat or generate a smaller amount of heat. Both options prove insufficient. Since the space in the housing of such a power supply is limited, expanding the cooling surface is not possible indefinitely. Reducing the performance of individual components is also not effective. Overall, inadequate cooling of the electrical components results in costs.
[0005] In a variety of technical applications, particularly in the field of power electronics, there is a need to detach a unit to be cooled, such as a semiconductor element or semiconductor device, from the rest of the assembly when necessary. To enable detachable attachment of the unit to be cooled to the heat sink, the units to be cooled are often detachably attached to the associated heat sinks, for example, using thermal paste. This results in the disadvantage of comparatively low thermal coupling between the unit to be cooled and the heat sink.
[0006] It is an object of the invention to provide a heat sink, an electronic assembly, a cooling device and a cooling unit which enables improved thermal coupling between the heat sink and a unit to be cooled and improves ease of maintenance.
[0007] The stated object is achieved by a heat sink for dissipating heat from a unit to be cooled, in particular an electrical unit, preferably a semiconductor device. The heat sink comprises a cooling channel and a first cooling wall arranged on the side of the cooling channel facing the unit to be cooled. Furthermore, the heat sink comprises a coolant supply and a coolant discharge, both of which are fluidly connected to the cooling channel, for supplying and discharging coolant, in particular a cooling liquid, preferably cooling water. The heat sink is designed such that the unit to be cooled can be mechanically and thermally connected to the first cooling wall.Furthermore, the heat sink is designed such that the heat sink can be detachably fastened to a cooling unit comprising a first fluid port and a second fluid port, and such that, when the heat sink is fastened to the cooling unit, a first fluidic connection can be formed between the coolant supply of the heat sink and the first fluid port of the cooling unit, and a second fluidic connection can be formed between the coolant discharge of the heat sink and the second fluid port of the cooling unit. The heat sink is designed such that, when the heat sink is fastened to the cooling unit, a fluid-tight seal between the first fluidic connection and the second fluidic connection is simultaneously created. The heat sink is further designed such that it can be mechanically firmly connected to the unit to be cooled, which unit is firmly connected to a printed circuit board by means of one, in particular several, connections.In this way, the unit to be cooled can be cooled very effectively by the heat sink. The heat sink can remain attached to the unit to be cooled even if the circuit board is removed together with the unit to be cooled and, for example, separated from the cooling unit. This allows for very effective and reliable heat transfer between the unit to be cooled and the heat sink.
[0008] A 'fluidic connection' is a connection designed to allow a fluid to flow through it.
[0009] A 'fluid port' is an opening designed to allow a fluid to pass through it, and to allow a component having such an opening to be connected to it so that this fluid can pass through these openings.
[0010] The heat sink enables detachable attachment of the heat sink in a cooling unit. The cooling unit is designed to supply coolant to the heat sink and to remove coolant. The heat sink can, for example, be configured such that, when the heat sink is attached to the cooling unit, fluid-tight fluidic connections can be formed between the heat sink and the cooling unit. It is possible to remove the heat sink, together with the unit to be cooled attached to the heat sink, from the cooling unit as needed. This is particularly advantageous from the point of view of maintenance and repair. According to embodiments of the invention, the unit to be cooled could, for example, be removed from the cooling unit together with the heat sink.
[0011] This development makes it possible, for example, to firmly mechanically connect the unit to be cooled to the heat sink. The preferred result of the development is to create a connection between the unit to be cooled and the heat sink using as little additional material and as thin as possible. The considerations, simulations, and tests for this development have shown that this is particularly possible when the heat sink through which fluid flows is firmly connected, in particular by a material bond, to the unit to be cooled. This can be achieved, for example, by soldering, sintering, pressing, or direct copper bonding (DCB). 'Solid' here can mean 'can only be removed by destruction.' In other words, using connection methods that cannot be removed even with tools without destroying either the unit 10 to be cooled or the heat sink 5, or both components.In this case, too, it would be possible to remove the unit to be cooled from the cooling unit along with the heat sink, for example, for maintenance purposes. By mechanically attaching the unit to be cooled to the heat sink, improved thermal coupling between the unit to be cooled and the heat sink, as well as better heat transfer from the unit to be cooled to the heat sink, can be achieved.
[0012] Furthermore, the development concerns an electronic assembly comprising a heat sink as described above and a unit to be cooled that is mechanically firmly connected to the heat sink.
[0013] During development, the electronic assembly, which includes the heat sink and the unit to be cooled, which is mechanically firmly connected to the heat sink, can be inserted into and removed from the cooling unit in its entirety. This allows access to the unit to be cooled.
[0014] The development also relates to a cooling unit for supplying a heat sink, which has a coolant supply and a coolant discharge, with coolant, in particular coolant liquid, preferably cooling water. The cooling unit has a first flow channel and a second flow channel. Furthermore, the cooling unit comprises a first fluid port, which is fluidically connected to the first flow channel, and a second fluid port, which is fluidically connected to the second flow channel. The cooling unit is designed such that the heat sink can be detachably fastened to the cooling unit and that, when the heat sink is fastened to the cooling unit, a first fluidic connection can be formed between the coolant supply of the heat sink and the first fluid port of the cooling unit, and a second fluidic connection can be formed between the coolant discharge of the heat sink and the second fluid port of the cooling unit.In addition, the heat sink is designed in such a way that when the heat sink is attached to the cooling unit, the first fluidic connection and the second fluidic connection are simultaneously fluid-tight sealed. The heat sink is further designed in such a way that it can be mechanically firmly connected to the unit to be cooled, which unit is firmly connected to a printed circuit board by one, in particular by several, connections. In this way, the unit to be cooled can be cooled very effectively by the heat sink. The heat sink can therefore remain on the unit to be cooled if the printed circuit board is removed together with the unit to be cooled and, for example, separated from the cooling unit. This allows the heat transfer between the unit to be cooled and the heat sink to be designed very effectively and reliably.
[0015] The cooling unit can be designed, for example, to supply coolant to a single heat sink, but it can also be designed, for example, to supply coolant to a plurality of heat sinks and then discharge the coolant again after flowing through the heat sinks. This creates a cooling system that allows access to the cooling units when needed.
[0016] Furthermore, the development relates to a cooling device comprising a cooling unit as described above and a heat sink detachably connected to the cooling unit as described above.
[0017] The development also relates to an electrical power converter for an industrial process arrangement, preferably a plasma process arrangement or heating arrangement, comprising:
[0018] - a heat sink as described above and below,
[0019] - a printed circuit board, - a unit to be cooled, in particular an electrical unit, preferably a semiconductor device, preferably comprising a power semiconductor component,
[0020] - further electronic components, wherein the further electronic components and the unit to be cooled are arranged on or at a printed circuit board and are connected by electrical contacts, wherein the unit to be cooled has a fixed, in particular material-locking, connection with the heat sink and the unit to be cooled is simultaneously fixedly connected to the printed circuit board by a plurality of connections, in particular by soldering.
[0021] In one aspect, the electrical power converter includes a cooling unit as described herein.
[0022] In one aspect, the electrical power converter includes a cooling device as described herein.
[0023] In one aspect, the electrical power converter includes one or more of the heat sinks described herein as additional heat sinks.
[0024] In one aspect, the electrical power converter includes one or more of the electronic assemblies described herein as additional electronic assemblies.
[0025] A preferred result of the development is to create a connection between the unit to be cooled and the heat sink with as little additional material and as thin as possible. During the considerations, simulations and tests for this development it became clear that this is particularly possible if the heat sink through which fluid flows is firmly connected, in particular by a material bond, to the unit to be cooled. This can be achieved, for example, by soldering, sintering, pressing or direct copper bonding (DCB). By "firm" here we mean "can only be removed by destruction". In other words, by means of a connection that cannot be removed even with tools without destroying either the unit to be cooled or the heat sink or both components.
[0026] Furthermore, the development relates to a method for assembling a cooling device starting from a heat sink for dissipating heat from a unit to be cooled, in particular an electrical unit, preferably a semiconductor device, and a cooling unit. The heat sink has a cooling channel, a coolant supply fluidly connected to the cooling channel, and a coolant discharge fluidly connected to the cooling channel. The cooling unit comprises a first fluid port and a second fluid port. The method comprises a step of releasably attaching the heat sink to the cooling unit, wherein, upon attachment of the heat sink to the cooling unit, a first fluidic connection is formed between the coolant supply of the heat sink and the first fluid port of the cooling unit, and a second fluidic connection is formed between the coolant discharge of the heat sink and the second fluid port of the cooling unit.When the heat sink is attached to the cooling unit, a fluid-tight seal is created between the first fluidic connection and the second fluidic connection.
[0027] Advantageous training and further developments, which can be used individually or in combination with one another, are the subject of the dependent claims and the following description.
[0028] Preferably, the coolant supply and coolant discharge of the heat sink are arranged on the side of the heat sink facing away from the unit to be cooled. This makes it possible, for example, to fluidically contact the heat sink on the side of the heat sink facing away from the unit to be cooled.
[0029] In one aspect, the heat sink can be releasably attached to the cooling unit by means of at least one fastening means, preferably at least one screw. The at least one fastening means can preferably be designed to form the fluidic connections between the heat sink and the cooling unit in such a way that a fluid-tight seal is achieved. The fastening means can preferably be a fastening means that can be easily removed using tools or even without tools.
[0030] In particular, the connection between the heat sink and the cooling unit can be easier to remove than the connection between the heat sink and the unit to be cooled.
[0031] The connection between the heat sink and the cooling unit can be made in one step with the sealing of the fluid port(s).
[0032] It is advantageous if the fluid-tight seal between the first fluidic connection and the second fluidic connection can be established with at least one fastening means accessible from the side of the first cooling wall. Because the at least one fastening means is accessible from the side of the first cooling wall, handling of the heat sink during insertion and removal from the cooling unit is facilitated, for example.
[0033] In one aspect, the heat sink can be pressed against the cooling unit by means of the at least one fastening means such that liquid-tight fluidic connections can be formed between the first fluid port of the cooling unit and the coolant supply of the heat sink, and between the second fluid port of the cooling unit and the coolant discharge of the heat sink. For example, the at least one fastening means can be configured such that, when the heat sink is attached to the cooling unit, a contact force can be generated that presses the first and second fluid ports of the cooling unit against the coolant supply and discharge of the heat sink.
[0034] It is advantageous if the cooling device comprises a first sealing element designed to form the first fluidic connection in a liquid-tight manner when the heat sink is attached to the cooling unit. For example, a fluid-tight first fluidic connection can be formed by means of the first sealing element when the heat sink is attached to the cooling unit. For example, the sealing element can be deformed when the heat sink is pressed against the cooling unit such that the connection between the first cooling port and the coolant supply is sealed. The first sealing element is preferably a first sealing ring that surrounds the first fluid port.
[0035] In one aspect, the cooling device comprises a second sealing element designed to form the second fluidic connection in a liquid-tight manner when the heat sink is attached to the cooling unit. For example, a fluid-tight second fluidic connection can be formed by means of the second sealing element when the heat sink is attached to the cooling unit. The second sealing element is preferably a second sealing ring that surrounds the second fluid port.
[0036] In one aspect, the heat sink is configured such that, when the heat sink is attached to the cooling unit, a cooling flow can be formed from the first fluid port to the coolant supply via the cooling channel and the coolant discharge to the second fluid port. In this way, the heat sink can be supplied with coolant, for example, from the cooling unit.
[0037] In one aspect, the heat sink is made of metal, preferably copper. Due to the high thermal conductivity of copper, effective heat dissipation of the unit to be cooled is enabled.
[0038] In one aspect, the unit to be cooled is mechanically and thermally connected to the heat sink. An electronic assembly constructed in this way has the heat sink with one or more of the features described here. The unit to be cooled, which is mechanically firmly connected to the heat sink, is designed to be firmly connected, in particular to be connected, to a printed circuit board, in particular by soldering, at the same time, with one, in particular with several, connections. In one aspect, the unit to be cooled is connected to the heat sink by at least one of the following: by at least one soldered connection, by at least one welded connection, by sintering. If the heat sink is firmly soldered to the unit to be cooled, for example, the soldering enables improved thermal coupling.Improved thermal coupling between the heat sink and the unit to be cooled can also be achieved by means of a welded joint or by sintering, for example.
[0039] In one aspect, the unit to be cooled is connected to the heat sink by means of a layer of thermal paste. In this case, too, it can be advantageous to be able to remove the heat sink from the cooling unit when needed.
[0040] In one aspect, the electronic assembly described above comprises a circuit board to which the unit to be cooled has a fixed mechanical connection. This fixed mechanical connection can be achieved, for example, by soldering electrical connections of the unit to be cooled to the circuit board. In this embodiment, the circuit board, the unit to be cooled, and the heat sink form a structural unit that can, for example, be inserted in its entirety into the cooling unit.
[0041] In one aspect, the electronic assembly comprises a plurality of units to be cooled, which have a fixed mechanical connection to the circuit board, as well as a plurality of heat sinks. The electronic assembly with the plurality of heat sinks can be inserted in its entirety into the cooling unit. The cooling unit preferably has a plurality of receptacles designed to accommodate the plurality of heat sinks. The fact that the electronic assembly is removable from the cooling unit facilitates maintenance, for example.
[0042] In one aspect, the cooling unit has at least one receiving device for at least one fastening means. In one aspect, the heat sink can be fastened by means of at least one fastening means accessible from the side of the first cooling wall, which engages in the at least one receiving device. If the at least one fastening means engages in the at least one receiving device on the side of the cooling unit, the heat sink can thus be fastened to the cooling unit, for example.
[0043] In one aspect, the fluid-tight seal between the first fluidic connection and the second fluidic connection can be established with at least one fastening means accessible from the side of the unit to be cooled. If the at least one fastening means is accessible from the side of the unit to be cooled, inserting and removing the heat sink into the cooling unit can be facilitated.
[0044] It is advantageous if the cooling unit has a mount for the heat sink into which the heat sink can be inserted. This allows, for example, a precise fixation of the heat sink in the cooling unit.
[0045] In one aspect, the cooling unit is configured to supply coolant to a plurality of heat sinks and to remove coolant from the plurality of heat sinks.
[0046] In one aspect, the cooling unit has a plurality of receptacles into which a plurality of heat sinks can be inserted. This makes it possible, for example, to insert an electronic assembly comprising a plurality of heat sinks in its entirety into the receptacles of the cooling unit.
[0047] In one aspect, the cooling unit is made entirely or partially of metal or entirely or partially of plastic.
[0048] In one aspect, grooves are provided within the cooling unit into which pipes can be pressed. The pipes can, for example, comprise a first flow channel for supplying coolant and a second flow channel for discharging coolant.
[0049] In one aspect, the walls of the pipes consist entirely or predominantly of a material, preferably copper, that has a higher thermal conductivity compared to other areas of the cooling unit. The high thermal conductivity of the pipe walls can, for example, further improve the heat dissipation of the unit to be cooled.
[0050] In one aspect, the cooling unit comprises a distribution unit having the first fluid port and the second fluid port. The distribution unit is preferably configured to supply at least one heat sink with coolant and to discharge the returning coolant.
[0051] It is advantageous if the distribution unit is designed as a cooling insert made of a material with higher thermal conductivity than other areas of the cooling unit, preferably copper. For example, the cooling insert can be in thermal contact with the heat sink, so that the heat dissipation of the heat sink is improved by the thermal contact with the cooling insert. This saves costs and weight, as the entire support unit does not have to be made of the more expensive and usually heavier material, such as copper.
[0052] In one aspect, the cooling unit comprises a support unit. The distribution unit can be inserted into the support unit.
[0053] In one aspect, the carrier unit consists entirely or partially of metal, preferably of aluminum.
[0054] In one aspect, a cooling flow can be formed within the cooling device from the first fluid port for the coolant supply via the cooling channel and the coolant discharge to the second fluid port. This cooling flow can be used, for example, to dissipate the heat generated by the unit to be cooled.
[0055] In one aspect, the cooling unit is designed to supply coolant, in particular cooling liquid, preferably cooling water, to the heat sink via the first fluid port and to discharge coolant from the heat sink via the second fluid port.
[0056] Further advantageous embodiments are described in more detail below with reference to several exemplary embodiments shown in the drawings, to which, however, the development is not limited. They show schematically:
[0057] Fig. 1 shows a longitudinal section through the unit to be cooled, the heat sink and the cooling unit that supplies the heat sink with coolant.
[0058] Fig. 2 is a representation of a printed circuit board with two units to be cooled arranged on the printed circuit board, wherein the printed circuit board can be detachably attached to a cooling unit.
[0059] Fig. 3 an industrial process arrangement, preferably a plasma process arrangement or heating arrangement with a heat sink.
[0060] Fig. 4a is a sectional view of the circuit board with the units to be cooled arranged thereon together with a carrier unit.
[0061] Fig. 4b a view of the entire carrier unit with the circuit board arranged on it.
[0062] Fig. 5 shows another view of the carrier unit in longitudinal section.
[0063] Fig. 6 is a sectional view of the support unit, viewed diagonally from the underside, showing a cooling insert and the pipes for supplying fluid to the cooling insert. Fig. 7 is a sectional view of the entire support unit, viewed diagonally from the underside, showing the cooling insert, the pipes, and the coolant connections.
[0064] In the following description of preferred embodiments of the present development, like reference numerals designate like or comparable components.
[0065] Fig. 1 shows a cooling device in longitudinal section. The cooling device comprises a heat sink 5, which is designed to cool a unit 10 to be cooled, which is attached to the heat sink 5. The unit 10 to be cooled can, in particular, be an electrical unit, preferably a semiconductor device.
[0066] The heat sink 5 is detachably connected to a cooling unit 22. In the example shown in the figures, the cooling unit 22 comprises a distribution unit 20 designed to supply the heat sink 5 with coolant. The cooling unit 22 also comprises a support unit 21 into which the distribution unit 20 is inserted. The cooling unit 22 has a receptacle 23 into which the heat sink 5 can be detachably inserted. The heat sink 5 is then fastened to the cooling unit 22 by means of at least one fastening means 15, preferably by means of one or more screws. The cooling unit 22 has at least one receiving device 16 for the at least one fastening means 15. In order to separate the heat sink 5 from the cooling unit 22 again, the at least one fastening means 15 is first released.The heat sink 5 can then be removed from the holder 23 of the cooling unit 22 together with the unit 10 to be cooled mounted thereon.
[0067] Preferably, the unit 10 to be cooled is mechanically and thermally connected to the heat sink 5. The unit 10 to be cooled can be connected to the heat sink 5, for example, by means of one or more soldered connections. Another possibility is to connect the unit 10 to be cooled to the heat sink 5, for example, by sintering. Alternatively, it is possible to weld the unit 10 to be cooled to the heat sink 5. As a further, albeit less advantageous, alternative, the unit 10 to be cooled could also be connected to the heat sink 5 by means of a layer of thermal paste. The result of the development, however, is to realize the connection between the unit 10 to be cooled and the heat sink 5 with as few additional materials and as thin as possible.During the considerations, simulations, and tests for this development, it became clear that this is particularly possible when the fluid-flowing heat sink is firmly, in particular materially, connected to the unit 10 to be cooled. This can be achieved, for example, by soldering, sintering, pressing, or direct copper bonding (DCB). "Solidly" here can mean "can only be removed by destruction." That is, by means of a connection that cannot be removed even with tools without destroying either the unit 10 to be cooled or the heat sink 5, or both components. It was further recognized that such a solution will only be feasible if a new solution can be found for the interchangeability of the printed circuit board 75 component with electronic components and, in particular, with the unit 10 to be cooled attached to it. This has been achieved with the proposed heat sink 5.
[0068] The heat sink 5 and the unit 10 to be cooled, which is mechanically firmly connected to the heat sink 5, together form an electronic assembly 24. This electronic assembly 24 can be inserted into the receptacle 23 of the cooling unit 22 and removed again from this receptacle 23.
[0069] The cooling unit 22 is designed to supply coolant to the heat sink 5 attached to the cooling unit 22 and to discharge the coolant again after the coolant has flowed through the heat sink 5. Within the cooling unit 22, a first flow channel 25 can be seen, via which coolant can be supplied to the heat sink 5. Within the cooling unit 22, a second flow channel 30 can be seen, via which the coolant can be discharged. The heat sink 5 has a cooling channel 35 through which the coolant can flow. A coolant inlet 40 is provided at a first end of the cooling channel 35, and a coolant outlet 45 is provided at the second end of the cooling channel 35 opposite the first end. The coolant inlet 40 and the coolant outlet 45 are fluidically connected to the cooling channel 35.
[0070] The cooling unit 22 comprises a first fluid port 41, which is fluidically connected to the first flow channel 25, and a second fluid port 46, which is fluidically connected to the second flow channel 30. When the heat sink 5 is inserted and subsequently secured in the receptacle 23, a first fluid connection is formed between the first fluid port 41 and the coolant supply 40, and a second fluid connection is formed between the second fluid port 46 and the coolant discharge 45.
[0071] To seal the first fluidic connection, a first sealing ring 42 is arranged in a groove 43 between the cooling unit 22 and the heat sink 5, wherein the sealing ring 42 completely surrounds the first fluid port 41. Likewise, a second sealing ring 44 is provided on the second fluid port 46, which completely surrounds the second fluid port 46 and is arranged in a groove 43 between the cooling unit 22 and the heat sink 5. When the at least one fastening means 15 is attached, for example when tightening the at least one screw, the heat sink 5 is pressed against the first fluid port 41 and the first sealing ring 42 as well as against the second fluid port 46 and the second sealing ring 44. As a result of this pressing, a liquid-tight first fluidic connection and a liquid-tight second fluidic connection are formed between the cooling unit 22 and the heat sink 5.
[0072] As shown in Fig. 1, a cooling flow 36 can be formed within the cooling device. The coolant flows from the first flow channel 25 via the first fluid port 41 and the coolant supply 40 into the cooling channel 35. The coolant flows through the cooling channel 35 and is discharged again via the coolant discharge 45, the second fluid port 46 and the second flow channel 30. The heat sink 5 has a first cooling wall 50 on the side facing the unit 10 to be cooled. On the side of the heat sink 5 facing away from the unit 10 to be cooled, the cooling channel 35 is delimited by a second cooling wall 55, which is opposite the first cooling wall 50.
[0073] Preferably, the second cooling wall 55 is formed parallel to the first cooling wall 50.
[0074] In the example shown in Fig. 1, the unit 10 to be cooled comprises an array of transistors 60. The heat generated during operation of the transistors 60 is dissipated via the coolant flowing in the cooling channel 35.
[0075] To improve the thermal exchange between the coolant flowing through the cooling channel 35 and the heat sink 5, a plurality of cooling pins 65 can be arranged inside the cooling channel 35, extending from the first cooling wall 50 and / or from the second cooling wall 55 into the cooling channel 35. Coolant flows around the cooling pins 65 and ensures improved thermal coupling between the heat sink 5 and the coolant.
[0076] In Fig. 1 it can also be seen that the unit 10 to be cooled, together with the heat sink 5 arranged underneath it, is arranged within a first recess 70 of a printed circuit board 75.
[0077] In Fig. 2, the arrangement of the unit 10 to be cooled within the first recess 70 of the circuit board 75 is clearly visible. Fig. 2 shows the circuit board 75 arranged on the cooling unit 22. Within the first recess 70 of the circuit board 75, the unit 10 to be cooled is shown in longitudinal section together with the associated heat sink 5. The heat sink 5 is inserted into the receptacle 23 of the cooling unit 22.
[0078] In addition to the unit 10 to be cooled, Fig. 2 shows a further unit 80 to be cooled together with a further heat sink 85 arranged underneath. The further unit 80 to be cooled is arranged within a further recess 90 provided in the circuit board 75, and the associated further heat sink 85 is inserted into a further receptacle 92 of the cooling unit 22. The further heat sink 85 has a further cooling channel 95 through which coolant flows. In addition, electrical connection terminals 105 can be seen on the further unit 80 to be cooled, which are provided for forming electrical connections between the further unit 80 to be cooled and the circuit board 75. The unit 10 to be cooled also has electrical connection terminals for connection to the circuit board 75, although these are not shown in Fig. 2.
[0079] The cooling unit 22 shown in Fig. 2 is designed to supply coolant to a plurality of heat sinks and to discharge the coolant again after flowing through the heat sinks. In the example of Fig. 2, the cooling unit 22 is designed to supply coolant to both the heat sink 5 and the additional heat sink 85 and then discharge it again from both the heat sink 5 and the additional heat sink 85. In particular, the cooling unit 22 is designed to distribute the coolant evenly among the various heat sinks.
[0080] The additional heat sink 85 is also fluidically connected to the cooling unit 22 when fastened in the additional receptacle 92. The sectional view of Fig. 2 shows that the additional cooling channel 95 is connected via the additional coolant discharge 100 and the additional second fluid port 102 to the second flow channel 30, through which the coolant is discharged.
[0081] From Fig. 1, it can be seen that a plurality of cooling pins 65 can be arranged in the cooling channel 35 or in a partial region of the cooling channel 35, which extend from the first cooling wall 50 into the cooling channel 35. From Fig. 1, it can also be seen that the plurality of cooling pins 65 can comprise at least one cooling pin of a first category, which is oriented in a first inclination direction that is inclined obliquely relative to a perpendicular to the first cooling wall 50.
[0082] It is further apparent from Fig. 1 that the cooling pins of the plurality of cooling pins 65 can be arranged such that one cooling pin of the plurality of cooling pins 65 does not intersect another cooling pin of the plurality of cooling pins 65.
[0083] From Fig. 1, it is further apparent that the plurality of cooling pins 65 can comprise at least one cooling pin of a second category oriented in a second inclination direction that is inclined relative to the perpendicular to the first cooling wall, wherein the second inclination direction is different from the first inclination direction. In this embodiment, the plurality of pins 65 comprises cooling pins of the first category oriented in a first inclination direction and cooling pins of the second category oriented in a second inclination direction. The different orientation of the cooling pins creates a flow pattern in the cooling channel 35 that has proven advantageous for efficient heat dissipation.
[0084] From Fig. 1, it is further apparent that the plurality of cooling pins 65 can be arranged such that a cooling pin of the first category overlaps with a cooling pin of the second category at a viewing angle parallel to the cooling wall, in particular at a viewing angle of the coolant flow direction. "Overlapping" here means that at least one cooling pin of the first category at least partially obscures another cooling pin of the second category in the predetermined viewing direction. Such an arrangement can improve the turbulence of the coolant at the cooling pins and, consequently, the heat transfer from the cooling pins to the coolant.
[0085] From Fig. 1, it is further apparent that the plurality of cooling pins 65 can be arranged such that a cooling pin of the first category is intertwined with two cooling pins of the second category at a viewing angle parallel to the cooling wall, in particular at a viewing angle of the coolant flow direction. "Intertwined" here means that at least one first cooling pin of the first category at least partially obscures a second cooling pin of the second category in the given viewing direction, and the first cooling pin itself is also at least partially obscured by another cooling pin of the second category in the given viewing direction. Such an arrangement can further improve the turbulence of the coolant at the cooling pins and, consequently, the heat transfer from the cooling pins to the coolant.
[0086] The printed circuit board 75 shown in Fig. 2, together with the units 10 and 80 to be cooled and the heat sinks 5 and 85 fastened to the printed circuit board 75, forms a structural unit which, in its entirety, can be placed on the cooling unit 22 and also removed again, i.e. which can be detachably connected to the cooling unit 22. When this structural unit is placed on the cooling unit 22, the heat sinks 5, 85 attached to the units 10, 80 to be cooled are inserted into the corresponding receptacles 23, 92 of the cooling unit 22. The heat sinks 5, 85 are then fastened to the cooling unit 22 by means of the at least one fastening means 15, wherein, when the heat sinks 5, 85 are fastened to the cooling unit 22, fluidic connections for supplying and discharging coolant are formed between the respective heat sinks 5, 85 and the cooling unit 22.The cooling unit 22 is designed to supply all heat sinks 5, 85 of the structural unit evenly with coolant and to discharge the coolant again after flowing through the heat sinks 5, 85.
[0087] Fig. 3 shows an industrial process arrangement 1, preferably a plasma process arrangement or heating arrangement. The industrial process arrangement 1 comprises:
[0088] - an electrical power converter 4,
[0089] - a load 2, preferably a plasma process or heating process, e.g. an induction or microwave heating process, wherein the load 2 is electrically connected to the electrical power converter 4 so that the electrical power converter 4 can supply the load 2 with the required electrical power,
[0090] - optionally an additional adaptation unit 3, which is connected between the power converter 4 and the load 2.
[0091] The power converter 4 has:
[0092] - a heat sink 5 as described above and below,
[0093] - a cooling unit 22 comprising, as described above and below, one or more distribution units 20 and a carrier unit 21,
[0094] - a circuit board 75,
[0095] - a unit 10 to be cooled, in particular an electrical unit, preferably a semiconductor device, preferably comprising a power semiconductor component,
[0096] - further electronic components 8a, 8b, 8c, wherein the further electronic components 8a, 8b, 8c and the unit 10 to be cooled are arranged on or at a printed circuit board 75 and are connected by electrical contacts, wherein the unit 10 to be cooled has a fixed, in particular material-locking, connection with the heat sink 5.
[0097] Fig. 4a shows another view of the circuit board 75 obliquely from above, with a portion of the support unit 21 visible in Fig. 4a. Furthermore, the sectional view of Fig. 4a shows pipes 110, which are fitted into grooves 115 provided for this purpose on the underside of the support unit 21.
[0098] The heat sinks 5, 85 are preferably made of metal, more preferably of copper. Alternatively, the heat sinks 5, 85 could be made of stainless steel, nickel, or molybdenum, for example. The support unit 21 can, for example, be made entirely or partially of metal, but the support unit can also be made entirely or partially of plastic. Preferably, the support unit 21 is made entirely or partially of aluminum. The walls of the pipes 110 are preferably made of copper. In Figs. 4b and 5, the support unit 21 is shown in its entirety, wherein the circuit board 75 with the units 10 and 80 to be cooled can be seen. Provided on the support unit 21 are a first coolant connection 120 for supplying coolant and a second coolant connection 122 for discharging coolant. In the embodiment shown in Fig.The longitudinal section through the unit 10 to be cooled shown in Fig. 5 also shows the heat sink 5, the first flow channel 25, and the second flow channel 30. Furthermore, some of the pipes 110 arranged on the underside of the support unit 21 can be seen in the sectional view of Fig. 5.
[0099] Figs. 6 and 7 show two views of the support unit 21, viewed obliquely from below. Fig. 6 shows the units 10 and 80 to be cooled, as well as the heat sinks 5 and 85. Figs. 6 and 7 show that the distribution unit is designed in the form of a cooling insert 132, wherein the cooling insert 132 is preferably made of a metal with high thermal conductivity, preferably copper. The cooling insert 132 is inserted into the support unit 21.
[0100] The receptacle 23 for the heat sink 5 and the additional receptacle 92 for the additional heat sink 85 are formed as part of the cooling insert 132. The heat sink 5 is attached to the cooling insert 132 by means of the at least one fastening means 15. Preferably, the heat sink 5 is screwed to the cooling insert 132. The use of a copper cooling insert 132 in the areas where the heat sinks 5 and 85 are arranged enables improved heat dissipation of the heat sinks 5 and 85.
[0101] When using a cooling insert 132 made of copper, the structures provided for fluidic contact between the heat sinks 5 and 85 are arranged within the cooling insert 132. In this respect, the first flow channel 25, the first fluid port 41, the second flow channel 30, the second fluid port 46, and the further second fluid port 102 are formed within the cooling insert 132. Furthermore, Fig. 6 and Fig. 7 show the pipes 110, which are pressed into the grooves 115 provided for this purpose on the underside of the support unit 21. The pipe wall of the pipes 110 is preferably made of a metal with high thermal conductivity, preferably copper. Further preferably, the pipes 110 are connected to the cooling insert 132 and designed to supply cold coolant to the cooling insert 132 and to discharge the heated coolant.
[0102] Fig. 7 shows the entire support unit 21 from the underside. In addition to the cooling insert 132 and the pipes 110 pressed into the grooves 115, Fig. 7 also shows the coolant connections 120 and 122 for supplying and discharging coolant.
[0103] The features disclosed in the above description, the claims and the drawings may be important both individually and in any combination for the realization of the development in its various forms.
Claims
PATENT CLAIMS 1. Heat sink (5) for cooling a unit (10) to be cooled, in particular an electrical unit, preferably a semiconductor device, wherein the heat sink (5) comprises: - a cooling channel (35), - a first cooling wall (50) arranged on the side of the cooling channel (35) facing the unit (10) to be cooled, - a coolant supply (40) and a coolant discharge (45), both of which are fluidically connected to the cooling channel (35), for supplying and discharging coolant, in particular cooling liquid, preferably cooling water, wherein the cooling body (5) is designed such that - the unit to be cooled (10) is mechanically and thermally connectable to the first cooling wall (50), - the heat sink (5) is detachably attachable to a cooling unit (22) comprising a first fluid port (41) and a second fluid port (46); when the heat sink (5) is attached to the cooling unit (22), a first fluidic connection can be formed between the coolant supply (40) of the heat sink (5) and the first fluid port (41) of the cooling unit (22), and a second fluidic connection can be formed between the coolant discharge (45) of the heat sink (5) and the second fluid port (46) of the cooling unit (22); when the heat sink (5) is attached to the cooling unit (22), a fluid-tight seal between the first fluidic connection and the second fluidic connection is simultaneously formed; - the heat sink (5) can be mechanically firmly connected to the unit (10) to be cooled, which is firmly connected to a printed circuit board (75) by means of a connection.
2. Heat sink (5) according to claim 1, characterized in that the heat sink (5) can be releasably fastened to the cooling unit (22) by means of at least one fastening means (15), preferably at least one screw.
3. Cooling body (5) according to claim 1 or claim 2, characterized in that the fluid-tight seal of the first fluidic connection and the second fluidic connection can be produced with at least one fastening means (15) which is accessible from the side of the first cooling wall (50).
4. Heat sink (5) according to one of the preceding claims, characterized in that the heat sink (5) is designed such that when the heat sink (5) is fastened to the cooling unit (22), a cooling flow (36) can be formed from the first fluid port (41) to the coolant supply (40) via the cooling channel (35) and the coolant discharge (45) to the second fluid port (46).
5. Heat sink (5) according to one of the preceding claims, characterized in that the heat sink (5) consists of metal, preferably of copper.
6. Electronic assembly (24) comprising a heat sink (5) according to one of claims 1 to 5 and a unit (10) to be cooled which is mechanically firmly connected to the heat sink (5) and is designed to be simultaneously firmly connected to a printed circuit board (75) by means of a terminal, in particular by soldering.
7. Electronic assembly (24) according to claim 6, characterized in that the unit to be cooled (10) is connected to the heat sink (5) by at least one of the following: by at least one soldered connection, by at least one welded connection, by sintering.
8. Electronic assembly (24) according to claim 6 or claim 7, further comprising a printed circuit board (75) to which the unit (10) to be cooled has a fixed mechanical connection.
9. Cooling unit (22) for supplying a heat sink (5) having a coolant supply (40) and a coolant discharge (45), with Coolant, in particular cooling liquid, preferably cooling water, wherein the cooling unit (22) comprises: - a first flow channel (25) and a second flow channel (30); - a first fluid port (41) which is fluidically connected to the first flow channel (25), - a second fluid port (46) which is fluidically connected to the second flow channel (30), wherein the cooling unit (22) is designed such that - the heat sink (5) is detachably attachable to the cooling unit (22), when the heat sink (5) is attached to the cooling unit (22), a first fluidic connection can be formed between the coolant supply (40) of the heat sink (5) and the first fluid port (41) of the cooling unit (22) and a second fluidic connection can be formed between the coolant discharge (45) of the heat sink (5) and the second fluid port (46) of the cooling unit (22), when the heat sink (5) is attached to the cooling unit (22), a fluid-tight seal of the first fluidic connection and the second fluidic connection is simultaneously formed - the heat sink (5) can be mechanically firmly connected to the unit (10) to be cooled, which is firmly connected to a printed circuit board (75) by means of a connection.
10. Cooling unit (22) according to claim 9, characterized in that the cooling unit (22) is designed to supply coolant to a plurality of heat sinks (5) and to remove coolant from the plurality of heat sinks (5).
11. Cooling unit (22) according to claim 9 or claim 10, comprising: - a distribution unit (20) comprising the first fluid port (41) and the second fluid port (46).
12. Cooling unit (22) according to claim 11, characterized in that the distribution unit (20) is designed as a cooling insert (132) which, compared to other areas of the cooling unit (22), consists of a material with higher thermal conductivity, preferably of copper.
13. Cooling unit (22) according to one of claims 9 to 12, comprising: - a carrier unit (21).
14. Cooling device which has - a cooling unit (22) according to one of claims 9 to 13, - a cooling body (5) according to one of claims 1 to 5, which is detachably connected to the cooling unit (22).
15. Electrical power converter (4) for an industrial process arrangement (1), preferably a plasma process arrangement or heating arrangement, comprising: - a heat sink (5) according to one of the preceding claims 1 to 5, - a printed circuit board (75), - a unit (10) to be cooled, in particular an electrical unit, preferably a semiconductor device, preferably comprising a power semiconductor component, - further electronic components (8a, 8b, 8c), wherein the further electronic components (8a, 8b, 8c) and the unit to be cooled (10) are arranged on or at a printed circuit board (75) and are connected by electrical contacts, wherein the unit to be cooled (10) has a fixed, in particular material-locking, connection with the heat sink (5) and the unit to be cooled (10) is simultaneously fixedly connected to the printed circuit board (75) by a plurality of connections, in particular by soldering.
16. Electrical power converter (4) according to claim 15, comprising a cooling unit (22) according to one of claims 9 to 13.
17. Electrical power converter (4) according to claim 16, comprising a cooling device according to claim 14.
18. Electrical power converter (4) according to one of the preceding claims 15 to 17, comprising a further heat sink (85), wherein the further heat sink (85) has the features of the heat sink (5) according to one of the preceding claims 1 - 5.
19. Electrical power converter (4) according to one of the preceding claims 15 to 18, comprising a further electronic assembly, wherein the further electronic assembly has the features of the electronic assembly (24) according to one of the preceding claims 6 - 8.
20. Method for assembling a cooling device starting from: - a heat sink (5, 85) for cooling a unit (10, 80) to be cooled, in particular an electrical unit, preferably a semiconductor device, wherein the heat sink (5, 85) comprises a cooling channel (35, 95), a coolant supply (40) fluidically connected to the cooling channel (35, 95) and a coolant discharge (45) fluidically connected to the cooling channel (35, 95), and - a cooling unit (22) comprising a first fluid port (41) and a second fluid port (46), the method comprising: - releasably fastening the heat sink (5, 85) to the cooling unit (22), wherein, when the heat sink (5, 85) is fastened to the cooling unit (22), a first fluidic connection is formed between the coolant supply (40) of the heat sink (5, 85) and the first fluid port (41) of the cooling unit (22), and a second fluidic connection is formed between the coolant discharge (45) of the heat sink (5, 85) and the second fluid port (46) of the cooling unit (22), wherein, when the heat sink (5, 85) is fastened to the cooling unit (22), a fluid-tight seal is simultaneously formed between the first fluidic connection and the second fluidic connection.