Method for processing a substrate for an electrochemical cell

Abstract

The invention relates to a method for processing a substrate for an electrochemical cell (10) by means of a processing device (12) which comprises a processing unit (14), in particular a laser drilling unit, and a cooling unit (16), wherein in at least one processing step (18), thermal energy is transferred into the substrate for an electrochemical cell (10) by means of the processing unit (14), and in at least one cooling step (20) the substrate for an electrochemical cell (10) is cooled after being processed. According to the invention, in the at least one cooling step (20), parts of the substrate for an electrochemical cell (10) are cooled by means of the cooling unit (16).

Description

[0001] Procedure for a a substrate for an electrochemical cell

[0002] State of the art

[0003] A method for processing a substrate for an electrochemical cell by means of a processing device which comprises a processing unit, in particular a laser drilling unit, and a cooling unit, wherein in at least one processing step a thermal energy is transferred into the substrate for an electrochemical cell by means of the processing unit and in at least one cooling step the substrate for an electrochemical cell is cooled after processing, has already been proposed.

[0004] Disclosure of the invention

[0005] The invention is based on a method for processing a substrate for an electrochemical cell by means of a processing device which comprises a processing unit, in particular a laser drilling unit, and a cooling unit, wherein in at least one processing step a thermal energy is transferred into the substrate for an electrochemical cell by means of the processing unit and in at least one cooling step the substrate for an electrochemical cell is cooled after processing.

[0006] It is proposed that in the at least one cooling step, a section-wise cooling of the substrate for an electrochemical cell is carried out by means of the cooling unit.

[0007] In this context, a “processing device” should be understood to mean, in particular, a device which is configured to process a substrate. In particular, the processing device is configured to process a substrate for an electrochemical cell. The processing device is preferably designed in several parts. Preferably, a non-clamping processing method is carried out with the processing device. Furthermore, the processing device preferably has a holder for the substrate for an electrochemical cell. Preferably, direct processing of the substrate is carried out in one operating step. Alternatively, indirect processing of the substrate by the processing device is also conceivable. Particularly preferably, the processing device is configured to carry out all necessary steps, for example a cooling step and / or a processing step.

[0008] In this context, a “substrate for an electrochemical cell” should preferably be understood to mean a substrate intended for use in a fuel cell. The substrate is preferably intended for use in an electrolytic cell. The substrate for an electrochemical cell is particularly preferably used in a solid oxide fuel cell. Alternatively, the substrate is intended for use in a battery. The substrate preferably consists at least partially, in particular entirely, of a metallic material. Alternatively, another, non-shrinking material is also conceivable. Furthermore, a substrate made of a pre-sintered ceramic is conceivable. Furthermore, other materials deemed appropriate by a person skilled in the art are also conceivable.In this context, a non-shrinking material is understood to mean materials which do not shrink further during a shrinking process, for example a sintering process, and / or which have already been shrunk beforehand, for example by a sintering process.

[0009] In this context, a "processing unit" should be understood to mean, in particular, a unit that is configured to process a substrate. The processing unit is preferably provided for creating recesses, in particular through-holes, in the substrate. The processing unit preferably has, in particular, at least one non-clamping tool for creating recesses. The processing unit is preferably designed in several parts. The processing unit is preferably configured to generate a laser pulse. The processing unit is preferably configured to generate a single laser pulse and / or a plurality of consecutive laser pulses. The processing unit is particularly preferably designed as a laser drill.In particular, the processing unit is configured to process at least one surface of the substrate for an electrochemical cell. Preferably, energy is introduced locally by the laser pulse generated by the processing unit. Particularly preferably, the energy is locally so high that the surface of the substrate is at least substantially partially, preferably largely, particularly preferably completely melted and / or evaporated. Alternatively, in particular complete melting with in particular at least substantially partial evaporation is also conceivable. Preferably, by processing the surface of the substrate for an electrochemical cell, at least one recess is created in the substrate for an electrochemical cell.Particularly preferably, by machining the surface of the substrate for an electrochemical cell, a through-hole is formed in the substrate for an electrochemical cell. The through-hole is preferably arranged perpendicular to a main extension plane of the substrate for an electrochemical cell. A "main extension plane" of a structural unit is understood to mean, in particular, a plane that is parallel to a largest side surface of a smallest imaginary cuboid that just completely encloses the structural unit, and in particular, runs through the center of the cuboid. Preferably, the processing unit focuses the laser pulse.

[0010] In this context, a "cooling unit" is to be understood in particular as a unit that is provided for cooling the substrate. The cooling unit is preferably designed in several parts. In particular, the cooling unit is provided for cooling the substrate for an electrochemical cell. Particularly preferably, the cooling unit is provided for cooling a surface of the substrate for an electrochemical cell. Cooling by means of the cooling unit is preferably limited to a section of the substrate for an electrochemical cell. The cooling unit is preferably designed for direct cooling of the substrate for an electrochemical cell.The cooling unit preferably has a heat sink, in particular a heat sink that is cold compared to the substrate and has a high thermal conductivity, wherein the substrate is cooled in particular by means of the heat sink by placing a cooling surface of the heat sink on the surface of the substrate for an electrochemical cell. Alternatively, indirect cooling of the substrate for an electrochemical cell is also conceivable. In particular, the surface of the substrate for an electrochemical cell is cooled by a targeted fluid flow generated by the cooling unit. For example, the fluid flow is formed by an air flow and / or a water flow. Furthermore, another type of cooling by means of a cooling unit that appears appropriate to a person skilled in the art is also conceivable. The cooling unit is preferably designed to carry out section-by-section cooling of the substrate for an electrochemical cell.In this context, “section-by-section cooling” should be understood to mean, in particular, cooling in a portion of the substrate for an electrochemical cell. Preferably, the cooling unit is designed to cool a maximum of one portion of the substrate for an electrochemical cell simultaneously. Preferably, the portion is limited to an area of ​​less than 50%, preferably less than 40%, and particularly preferably less than 30% of the total area of ​​the substrate for an electrochemical cell. Preferably, the substrate for an electrochemical cell is divided into several imaginary portions by a processing unit. Preferably, different portions are cooled sequentially in an operating state. In particular, section-by-section cooling in a portion occurs as a result of thermal energy being introduced into the portion by means of a processing unit.Preferably, targeted cooling is limited to a section of the substrate for an electrochemical cell, with at least 85%, preferably at least 90%, and particularly preferably 95% of the cooling capacity of the cooling unit being limited to that section. Furthermore, in an operating state, the section-by-section cooling is shifted from a first section to a further section. Preferably, the cooling is limited to the further section as a result of the shift. Preferably, all sections of a substrate for an electrochemical cell are cooled sequentially.

[0011] In this context, a "processing step" is understood to mean, in particular, a method step in which processing is carried out by means of the processing unit. Preferably, thermal energy is introduced into the substrate for an electrochemical cell in the processing step. Particularly preferably, a recess is introduced into the substrate for an electrochemical cell in the at least one processing step. Particularly preferably, a through-hole is introduced into the substrate for an electrochemical cell in the at least one processing step.

[0012] In this context, a “cooling step” should be understood to mean, in particular, a method step in which the substrate for an electrochemical cell is cooled. Particularly preferably, the surface of the substrate for an electrochemical cell is cooled in the at least one cooling step. The cooling step is preferably carried out as a result of a processing step. In particular, the cooling step takes place in sections in which, in a processing step, thermal energy was introduced into the substrate for an electrochemical cell by means of the processing unit. In particular, it would also be conceivable for the processing step and the cooling step to be carried out partly in parallel. Preferably, the cooling step can be carried out in parallel to the processing step, in particular in a section of the substrate that differs from the processing step.

[0013] The inventive design of the method for processing a substrate for an electrochemical cell advantageously provides a heat-reduced processing method. In particular, warpage of the substrate for an electrochemical cell can be reduced compared to processing using a prior art method. This allows advantageous, consistent quality to be achieved. In particular, remelting of the through-hole can be avoided. This allows advantageous application quality and time savings in the manufacturing process to be achieved.

[0014] Furthermore, it is proposed that in at least one cooling step, section-wise cooling of the substrate for an electrochemical cell takes place in regions of the substrate for an electrochemical cell in which thermal energy was introduced by a processing unit. In particular, the effective range of the cooling in a cooling step is limited to the region heated by the processing unit. Preferably, the cooling step takes place directly after processing by a processing unit in a processing step. Preferably, in a cooling step, the thermal energy introduced by the processing unit is canceled or at least partially absorbed and dissipated by means of the cooling unit. In this context, “cancelled” is to be understood in particular as meaning a cooling of the substrate to an initial temperature before the processing step.This makes it possible, in particular, to provide an advantageous heat-reduced processing method for a substrate for an electrochemical cell. In particular, advantageous energy savings can be achieved.

[0015] It is further proposed that in at least one cooling step the substrate for an electrochemical cell is divided into a plurality of partial surfaces. Preferably, in a cooling step the substrate for an electrochemical cell is divided into a plurality of regular surfaces. In this context, a “regular surface” is to be understood as a regular surface according to a mathematical understanding, wherein all sides of the surface are of equal length or all interior angles of the surface are of equal size. Alternatively, a plurality of irregular surfaces is also conceivable. In this context, a “partial surface” is to be understood in particular as a surface which represents a part of a general surface of the substrate. In particular, all partial surfaces together make up the surface of the substrate for an electrochemical cell. Furthermore, partial surfaces are arranged at least partially superimposed.As a result, the sum of the areas of the partial areas is larger than the area of ​​the substrate for an electrochemical cell. In particular, the substrate for an electrochemical cell is divided into several partial areas. Preferably, the substrate for an electrochemical cell is divided into at least three partial areas. Preferably, all partial areas have the same dimensions. Alternatively, all partial areas have different dimensions. Preferably, the processing takes place in one processing step using these partial areas. Alternatively, the partial areas are in total smaller than the area of ​​the substrate for an electrochemical cell. This makes it possible, in particular, to provide an advantageous heat-reduced processing method for a substrate for an electrochemical cell. In particular, advantageously coordinated cooling of the substrate for an electrochemical cell can be provided.

[0016] Furthermore, it is proposed that in at least one cooling step the partial surfaces are formed as elongated rectangles arranged in a row perpendicular to the main direction of extension. Preferably, the partial surfaces are arranged on sides at least substantially parallel to a main direction of extension in contact with another partial surface. In particular, the partial surface is formed as a strip, for example. A "main direction of extension" of an object is to be understood in particular as a direction which runs parallel to a longest edge of a smallest geometric cuboid which just completely encloses the object. Alternatively, a spaced-apart arrangement of the rectangles perpendicular to the main direction of extension is also conceivable. Advantageously, all rectangles are congruent. Alternatively, different widths of the individual rectangles are also conceivable.This makes it possible, in particular, to provide an advantageous division of the substrate for an electrochemical cell into partial areas.

[0017] According to a further embodiment, it is proposed that in at least one cooling step the partial areas are formed as quadrants. Preferably, the partial area formed as a quadrant is arranged in contact with at least two and / or more sides of a further partial area. Alternatively, a partial area is arranged at a distance from another partial area on at least one side. Preferably, the partial areas formed as quadrants are polygonal. Particularly preferably, the partial areas formed as quadrants are rectangular. Alternatively, other shapes of the quadrants that appear appropriate to a person skilled in the art are also conceivable. Advantageously, all quadrants are congruent. Alternatively, different sizes and / or shapes of the individual quadrants are also conceivable. This makes it possible, in particular, to provide an advantageous division of the substrate for an electrochemical cell into partial areas.

[0018] Furthermore, it is proposed that in at least one cooling step, the partial surface of the substrate for an electrochemical cell is cooled by the cooling unit from the side facing away from the processing unit. Preferably, in one cooling step, direct cooling takes place from the side facing away from the processing unit via a contact point with the substrate for an electrochemical cell. Alternatively, indirect cooling in a cooling step, for example via a fluid flow, is also acceptable. Preferably, in one cooling step, the cooling unit is transferred from a contacted state to a contacted state with the substrate for an electrochemical cell. Preferably, in one cooling step, the substrate for an electrochemical cell is cooled solely on one side from the side facing away from the processing unit. In this way, an advantageous cooling step can be provided via simplified cooling.

[0019] It is further proposed that, in at least one cooling step, alternating cooling of different heated partial surfaces is carried out. Preferably, in one cooling step, cooling of a partial surface occurs following the processing of a partial surface. Particularly preferably, the cooling step occurs directly after the processing step. Preferably, the cooling unit switches to another partial surface after cooling a first partial surface to an initial temperature before the processing step or after cooling to a threshold temperature. Preferably, sequential cooling of different partial surfaces occurs in one cooling step. This makes it possible, in particular, to provide efficient cooling.

[0020] Furthermore, it is proposed that, in at least one cooling and / or processing step, a section-wise cooling of the substrate for an electrochemical cell takes place in a partial area of ​​the substrate for an electrochemical cell, while a further partial area is subjected to processing by a processing unit. Preferably, in particular, a cooling step of a first partial area takes place as a result of a processing step of a first partial area, wherein the cooling step of the first processing step takes place at least substantially partially simultaneously with a processing step of a further partial area. Alternatively, a time delay is also conceivable, wherein, for example, the cooling step of the first partial area only takes place once a processing step of a third partial area has taken place.Furthermore, a cooling step and a processing step are always performed simultaneously on a substrate for an electrochemical cell, with the processing step and the cooling step each being applied to a different partial area. This makes it possible to provide, in particular, efficient cooling and efficient processing of a substrate for an electrochemical cell.

[0021] It is further proposed that, in at least one cooling step, cooling of different partial surfaces is carried out in an arbitrary or strategic order. Preferably, in at least one cooling step, partial surfaces are cooled in the order in which they were machined. Preferably, in one cooling step, the cooling sequence of the partial surfaces is determined for optimal cooling in order to limit distortion. Preferably, a subsequent cooling of all partial surfaces is carried out in one cooling step. This allows, in particular, efficient cooling to be provided.

[0022] Furthermore, the invention is based on a processing device for carrying out a method according to the invention, having at least one cooling unit which is configured to cool the substrate for an electrochemical cell after processing, and having at least one processing unit which transfers thermal energy to the substrate for an electrochemical cell during processing. It is proposed that the cooling unit be designed as a section-by-section cooling unit. Preferably, the cooling unit is designed only for a partial area of ​​the substrate for an electrochemical cell. Preferably, the cooling unit is only provided for cooling a partial area. Preferably, the cooling unit is designed to be adjustable, as a result of which the cooling unit can be used for a plurality of partial areas. In particular, the cooling unit is designed to be adjustable on a plane of movement.The cooling unit is preferably designed to be freely movable on the plane of movement. In this context, a plane of movement is to be understood as a plane parallel to a main extension plane of the substrate for an electrochemical cell. Alternatively, a movement of the cooling unit perpendicular to a main extension plane of the substrate for an electrochemical cell is also conceivable. The cooling unit is preferably designed to carry out direct cooling in a partial area via a contact surface with the substrate for an electrochemical cell. Alternatively, the cooling unit is designed to carry out indirect cooling limited to a partial area, for example by means of a fluid flow. The cooling unit is preferably arranged on one side of the substrate for an electrochemical cell. In particular, the processing unit is arranged on one side of the substrate.This makes it possible, in particular, to provide an advantageous cooling unit for a processing device. It is further proposed that the cooling unit be formed on the side of the substrate for an electrochemical cell facing away from the processing unit. The cooling unit is preferably formed in contact with the side of the substrate for an electrochemical cell facing away from the processing unit. Particularly preferably, the cooling unit is designed to be able to be movably moved from a contacted state to a contacting state. Alternatively, the cooling unit is formed at a distance from the side of the substrate for an electrochemical cell facing away from the processing unit. This makes it possible, in particular, to achieve advantageous cooling of a substrate of an electrochemical cell.

[0023] Furthermore, a solid fuel cell with a substrate for an electrochemical cell is proposed, produced by means of a method according to the invention and / or a device according to the invention. The solid fuel cell preferably has an anode and a cathode. In particular, an electrolyte is arranged between the anode and the cathode. The substrate for an electrochemical cell is preferably designed to provide a base for the electrolyte. The solid fuel cell is preferably designed to convert chemical reaction energy of a continuously supplied fuel and an oxidizing agent into electrical energy. For example, hydrogen is used as the fuel and oxygen as the oxidizing agent. Alternatively, other fuels deemed appropriate by a person skilled in the art, such as methanol, butane, and / or natural gas, are also conceivable.Preferably, in one process step of the solid-state fuel cell, electrical energy is generated between the anode and the cathode. Preferably, the anode splits the electrons from the fuel. Preferably, the electrons are conducted to the cathode via a connecting element. In particular, this movement of electrons from anode to cathode generates the electrical energy. Preferably, the electrons are transferred to the oxidizing agent in the cathode and split the oxidizing agent. The negatively charged oxidizing agent is attracted to the positively charged protons of the fuel, particularly through the substrate for an electrochemical cell. Preferably, the end product of the chemical reaction is, in particular, water and exhaust air. This makes it possible to provide, in particular, an advantageous solid-state fuel cell.The method according to the invention for processing a substrate for an electrochemical cell is not intended to be limited to the application and embodiment described above. In particular, the method according to the invention for processing a substrate for an electrochemical cell may comprise a number of individual elements, components, and units as well as method steps that differs from the number stated herein in order to fulfill a function described herein. Furthermore, in the value ranges specified in this disclosure, values ​​within the stated limits are also to be considered disclosed and can be used arbitrarily.

[0024] drawing

[0025] Further advantages will become apparent from the following description of the drawings. The drawings illustrate two exemplary embodiments of the invention. The drawings, the description, and the claims contain numerous features in combination. Those skilled in the art will also expediently consider the features individually and combine them into useful further combinations.

[0026] They show:

[0027] Fig. 1 shows a solid fuel cell with a substrate for an electrochemical cell produced by a method according to the invention and / or a device according to the invention in a schematic representation,

[0028] Fig. 2 shows a processing device in a schematic representation,

[0029] Fig. 3 is a schematic flow diagram of a method for operating a processing device according to the invention and

[0030] Fig. 4 shows an embodiment of a division of the partial areas in a schematic representation.

[0031] Description of the Embodiments Fig. 1 shows a solid fuel cell 26a with a substrate for an electrochemical cell 10a produced by means of a method and / or a device according to the invention. The solid fuel cell 26a has an anode 28a and a cathode 30a. An electrolyte 70a is arranged between the anode 28a and the cathode 30a. The substrate for an electrochemical cell 16a is designed to provide a base for the electrolyte 70a. The solid fuel cell 26a is designed to convert chemical reaction energy of a continuously supplied fuel 32a and an oxidizing agent 34a into electrical energy. Hydrogen is used as the fuel 32a and oxygen as the oxidizing agent 32a. Alternatively, other fuels 32a that would be deemed appropriate by a person skilled in the art, for example methanol, butane, and / or natural gas, are also conceivable.In one process step of the solid-state fuel cell 26a, electrical energy is generated between the anode 28a and the cathode 30a. The anode 28a splits off an electron 36a from the fuel 32a. The electrons 36a are conducted to the cathode 30a via a connecting element 38a. This movement of the electrons 36a from the anode 28a to the cathode 30a generates the electrical energy. The electrons 36a in the cathode 30a are transferred to the oxidant 34a and split the oxidant 34a. The negatively charged oxidant 34a is attracted to a positively charged proton 40a of the fuel 32a through the substrate for an electrochemical cell 10a. The end products of the chemical reaction are, in particular, water 42a and exhaust air 44a.

[0032] Fig. 2 shows a processing device 12a for carrying out a method according to the invention. The processing device 12a is configured to process a substrate for an electrochemical cell 10a. The processing device 12a is formed in several parts. A non-clamping processing method is carried out with the processing device 12a. Furthermore, the processing device 12a has a holder for the substrate for an electrochemical cell 10a. In a processing step 18a, the substrate 10a is processed directly. Alternatively, indirect processing of the substrate 10a by the processing device 12a is also conceivable. The processing device 12a is configured to carry out all necessary steps, for example, a cooling step 20a and / or a processing step 18a.

[0033] The processing device 12a has a processing unit 14a, which transfers thermal energy into the substrate for an electrochemical cell 10a during processing. The processing unit 14a has a non-clamping tool. The processing unit 14a is designed in several parts. The processing unit 14a is configured to generate a laser pulse 46a. The processing unit 14a is configured to generate a single laser pulse 46a and / or several consecutive laser pulses 46a. The processing unit 14a is designed as a laser drill. The processing unit 14a is configured to process at least one surface 48a of the substrate for an electrochemical cell 10a. The laser pulse 46a generated by the processing unit 14a locally introduces energy into the substrate for an electrochemical cell 10a.The processing unit 14a forms a recess 50a in the surface 48a of the substrate for an electrochemical cell 10a. The recess 50a is arranged perpendicular to a main extension plane of the substrate for an electrochemical cell 10a. The processing unit 14a focuses the laser pulse 46a.

[0034] The substrate for an electrochemical cell 10a is used for an electrochemical cell in a solid oxide fuel cell 26a. Alternatively, the substrate 10a is intended for use in an electrolytic cell. Furthermore, the substrate 10a is intended for use in a battery. The substrate 10a forms the electrolyte of a solid fuel cell 26a for an electrochemical cell. The substrate for an electrochemical cell 10a is designed to conduct oxygen ions. The substrate for an electrochemical cell 10a has an insulating effect against electrons 36a. The substrate 10a is formed from a metallic material. Alternatively, another, non-shrinking material is also conceivable. Furthermore, a substrate 10a made of a pre-sintered ceramic is conceivable.

[0035] The processing device 12a has a cooling unit 16a, which is configured to cool the substrate for an electrochemical cell 10a after processing. The cooling unit 16a is designed in several parts. Alternatively, the cooling unit 16a is designed in one part. The cooling unit 16a is provided for cooling a substrate for an electrochemical cell 10a. The cooling unit 16a is provided for cooling a surface 54a of a substrate for an electrochemical cell 10a. Cooling by means of the cooling unit 16a is limited to a section 52a of the substrate for an electrochemical cell 10a. The cooling unit 16a is configured for direct cooling of the substrate for an electrochemical cell 10a. The substrate for an electrochemical cell 10a is cooled by placing a cooling surface on the surface 54a of the substrate for an electrochemical cell 10a.Alternatively, indirect cooling of the substrate for an electrochemical cell 10a is also conceivable. Here, the surface 54a of the substrate for an electrochemical cell 10a is cooled by a targeted fluid flow generated by the cooling unit 16a. For example, the fluid flow is formed by air and / or water. The cooling unit 16a is designed as a section-by-section cooling unit 16a. The cooling unit 16a is designed to cool a maximum of one section 52a of the substrate for an electrochemical cell 10a. In an operating state, different sections 52a are cooled sequentially. Section-by-section cooling occurs in a section 52a as a result of thermal energy being introduced into the section by means of a processing unit 14a. Targeted cooling is limited to one section 52a of the substrate for an electrochemical cell 10a.

[0036] The cooling unit 16a is designed only for a partial area 22a of the substrate for an electrochemical cell 10a. The cooling unit 16a is only intended for cooling a partial area 22a. The cooling unit 16a is adjustable, whereby the cooling unit 16a can be used for a plurality of partial areas 22a, 24a. The cooling unit 16a is adjustable on a movement plane 60a. The cooling unit 16a is freely movable on the movement plane 60a. The cooling unit 16a is mounted for movement in a vertical direction 56a and in a parallel direction 58a. The cooling unit 16a can be moved into different positions. The cooling unit 16a is arranged on one side of the substrate for an electrochemical cell 10a. The processing unit 14a is arranged on one side of the substrate 10a.The cooling unit 16a is formed on a side 62a of the substrate for an electrochemical cell 10a facing away from the processing unit 14a. The cooling unit 16a is formed in contact with the side 62a of the substrate for an electrochemical cell 10a facing away from the processing unit 14a. The cooling unit 16a is configured to be movably displaced from a contacted state to a contacting state. Alternatively, the cooling unit 16a is formed at a distance from the side 62a of the substrate for an electrochemical cell 10a facing away from the processing unit 14a.

[0037] Fig. 3 shows a schematic flow diagram of a method for processing a substrate for an electrochemical cell 10a by means of a processing device 12a, which comprises a processing unit 14a, in particular a laser drilling unit, and a cooling unit 16a. In the method, in a processing step 18a, thermal energy is transferred into the substrate for an electrochemical cell 10a by means of the processing unit 14a, and in a cooling step 20a, the substrate for an electrochemical cell 10a is cooled after processing. In the cooling step 20a, the substrate for an electrochemical cell 10a is cooled in sections by means of the cooling unit 16a. In the cooling step 20a, the substrate for an electrochemical cell 10a is cooled in sections in regions of the substrate for an electrochemical cell 10a in which thermal energy was introduced by a processing unit 14a.The effective area of ​​cooling in a cooling step 20a is limited to the area heated by the processing unit 14a. The cooling step 20a takes place directly after processing by a processing unit 16a in a processing step 18a. In a cooling step 20a, the thermal energy introduced by the processing unit 16a is canceled out by the cooling unit 16a. In a cooling step 20a, the substrate for an electrochemical cell 10a is divided into a plurality of partial surfaces 22a, 24a (see Fig. 2B). In a first processing sequence 66a, a processing step 18a and a cooling step 20a of the partial surface 22a are carried out. Furthermore, in a further processing sequence 68a, a processing step 18a and a cooling step 20a of the partial surface 24a are carried out. In a cooling step 20a, the substrate for an electrochemical cell 10a is divided into a plurality of regular surfaces.Alternatively, a plurality of irregular surfaces is also conceivable. In at least one cooling step 20a, the partial surfaces 22a, 24a are formed as elongated rectangles arranged in a row perpendicular to the main extension direction. The partial surface 22a is arranged on a side parallel to a main extension direction, contacting another partial surface 24a. The partial surfaces 22a, 24a are formed as strips (see Fig. 2B). Alternatively, a spaced-apart arrangement of the rectangles perpendicular to the main extension direction is also conceivable. Advantageously, all rectangles are congruent. Alternatively, different widths of the individual rectangles are also conceivable.

[0038] In at least one cooling step 20a, the cooling unit 16a cools the partial surface 22a, 24a of the substrate for an electrochemical cell 10a from the side 62a facing away from the processing unit 16a. In a cooling step 20a, the cooling unit 16a is transferred from a contacted state to a contacted state with the substrate for an electrochemical cell 10a. In a cooling step 20a, the substrate for an electrochemical cell 10a is cooled solely on one side from the side 62a facing away from the processing unit 16a. In a cooling step 20a, alternating cooling of different heated partial surfaces 22a, 24a is carried out. In a cooling step 20a, a partial surface 22a, 24a is cooled following processing of a partial surface 22a, 24a. The cooling step 20a takes place directly after the processing step 18a.The cooling unit 16a switches to a further partial area 24a after cooling a first partial area to an initial temperature before the processing step 18a or after cooling to a threshold temperature. In a cooling step 20a, different partial areas are cooled sequentially. In at least one cooling step 20a and / or processing step 18a, the substrate for an electrochemical cell 10a is cooled in sections in a partial area 22a of the substrate for an electrochemical cell 10a, while a further partial area 24a is subjected to processing by a processing unit 14a. In a cooling step 20a, a first partial area 22a is cooled as a result of a processing step 18a of a first partial area 22a, wherein the cooling step 20a as a result of the first processing step 18a takes place partly simultaneously with a processing step 18a of a further partial area 24a.Alternatively, a time delay is also conceivable, wherein, for example, the cooling step 20a of the first partial region 22a only takes place once a processing step 18a of a third partial region has taken place. Furthermore, a cooling step 20a and a processing step 18a are always carried out simultaneously on a substrate for an electrochemical cell 10a, wherein the processing step 18a and the cooling step 20a are each applied to a different partial area 22a, 24a. In at least one cooling step 20a, cooling of different partial areas 22a, 24a is carried out in an arbitrary or strategic order. In at least one cooling step 20a, partial areas 22a, 24a are cooled in the order in which the partial areas 22a, 24a were processed in a processing step 18a.Alternatively, a strategic sequence of the cooling steps 20a of the partial surfaces 22a 24a is also conceivable for optimized cooling, in which systematic cooling takes place without reference to a processing step 18a.

[0039] Figure 4 shows a further embodiment of a division of the partial surfaces of the invention. The following descriptions and the drawings are essentially limited to the differences between the exemplary embodiments, whereby with regard to components with the same designation, in particular with regard to components with the same reference numerals, reference can in principle also be made to the drawings and / or the description of the other exemplary embodiments, in particular Figures 1 to 3. To distinguish the exemplary embodiments, the letter a is placed after the reference numerals of the exemplary embodiment in Figures 1 to 3. In the exemplary embodiment in Figure 4, the letter a is replaced by the letter b.

[0040] Fig. 4 shows one embodiment of a division of the partial areas in a schematic representation. In a cooling step 20b, the substrate for an electrochemical cell 10b is divided into a plurality of partial areas 22b, 24b. In at least one cooling step 20b, the partial areas 22b, 24b are formed as quadrants 64b (cf. Fig. 3). The partial areas 22b, 24b formed as quadrants 64b are arranged in contact with at least two and / or more sides of a further partial area 22b, 24b. Alternatively, a partial area 22b is arranged at a distance from a further partial area 24b on at least one side. The partial areas 22b, 24b formed as quadrants 64b are polygonal. The partial areas 22b, 24b formed as quadrants 64b are rectangular. Alternatively, other shapes of quadrants 64b that would be deemed appropriate by a specialist are also conceivable. All quadrants 64b are congruent.Alternatively, different sizes and / or shapes of the individual quadrants 64b are also conceivable.

Claims

Claims 1 . Method for processing a substrate for an electrochemical cell (10) by means of a processing device (12) which comprises a processing unit (14), in particular a laser drilling unit, and a cooling unit (16), wherein in at least one processing step (18) thermal energy is transferred into the substrate for an electrochemical cell (10) by means of the processing unit (14) and in at least one cooling step (20) the substrate for an electrochemical cell (10) is cooled after processing, characterized in that in the at least one cooling step (20) section-wise cooling of the substrate for an electrochemical cell (10) is carried out by means of the cooling unit (16).

2. Method according to claim 1, characterized in that in at least one cooling step (20) a section-wise cooling of the substrate for an electrochemical cell (10) takes place in regions of the substrate for an electrochemical cell (10) in which a thermal energy was introduced by a processing unit (14).

3. Method according to claim 1 or 2, characterized in that in at least one cooling step (20) the substrate for an electrochemical cell (10) is divided into a plurality of partial surfaces (22).

4. Method according to one of the preceding claims, characterized in that in at least one cooling step (20) the partial surfaces (22) are formed as elongated rectangles arranged in a row perpendicular to the main extension direction.

5. Method according to claim 3, characterized in that in at least one cooling step (20) the partial surfaces (22) are formed as quadrants (64).

6. Method according to one of the preceding claims, characterized in that in at least one cooling step (20) the partial surface (22) of the substrate for an electrochemical cell (10) is cooled by the cooling unit (16) from the side (62) facing away from the processing unit (14).

7. Method according to one of the preceding claims, characterized in that in at least one cooling step (20) an alternating cooling of different heated partial surfaces (22) is carried out.

8. Method according to one of the preceding claims, characterized in that in at least one cooling (20) and / or processing step (18) a section-wise cooling of the substrate for an electrochemical cell (10) takes place in a partial area (22) of the substrate for an electrochemical cell (10), while a further partial area (24) is subjected to processing by a processing unit (14).

9. Method according to one of the preceding claims, characterized in that in at least one cooling step (20) a cooling of different partial surfaces (22, 24) is carried out in an arbitrary or strategic order.

10. Processing device (12) for carrying out a method according to one of the preceding claims, with at least one cooling unit (16) which is designed to cool the substrate for an electrochemical cell (10) after processing and with at least one processing unit (14) which transfers thermal energy into the substrate for an electrochemical cell (10) during processing, characterized in that the cooling unit (16) is designed as a section-wise cooling unit.

11. Processing device according to claim 10, characterized in that the cooling unit (16) is designed on the side (62) of the substrate for an electrochemical cell (10) facing away from the processing unit (14).

12. A solid fuel cell (26) comprising a substrate for an electrochemical cell (10) produced by a method according to any one of claims 1 to 9 and / or a device according to any one of claims 10 and 11.

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