Fluid cartridge with retention member

Abstract

A fluid cartridge includes a fluid ejection device coupled to a cartridge body, a thin interconnect circuit coupled at a first end to the fluid ejection device and coupled at a second end to an outer surface of the cartridge body, and a retention member extending over a portion of the thin interconnect circuit to retain the thin interconnect circuit against the outer surface.

Description

FLUID CARTRIDGE WITH RETENTION MEMBERBACKGROUND

[0001] Fluidic dies refer to structures through which fluid may move through channels in a layer or layers of a material or a stack of materials. In the context of integrated circuits, a die refers to a block of semiconducting material comprising circuity components, a fluidic die may include fluidic, mechanical, and / or circuitry components. In the context of printing, one type of fluidic die includes fluid ejection dies. Fluid ejection dies may include small channels that carry fluid, such as ink, to ejection chambers, where the fluid is ejected from the die. The die may be molded into or otherwise coupled to a fluid distribution body, which delivers the fluid to the die. There may be other types of fluidic dies. For instance, and without limitation, in the context of lab-on-a-chip, a fluidic die may include circuitry and / or fluidic elements for mixing and separating, fluidic logic blocks, assays, and the like. The fluid ejection die and fluid distribution body may be coupled to a cartridge body of a fluid cartridge. The fluid cartridge may include a fluid reservoir that stores a volume of fluid and delivers fluid to the fluid distribution body. The cartridge may be installed in the body of a fluid-ejecting apparatus, such as an inkjet printer, which may control the ejection of fluid from the die. The fluid ejection die may include or be coupled to a circuit that electrically couples to a corresponding circuit in the body of the fluid-ejecting apparatus to enable communication between the body of the fluid-ejecting apparatus and the fluid ejection die.BRIEF DESCRIPTION OF THE DRAWINGS[0002| FIGS. 1A and IB are cross-sectional side views of an example of a fluid ejection die.

[0003] FIGS. 2A and 2B are cross-sectional side views of an example of a fluid cartridge.

[0004] FIG. 3 is a perspective view of an example of a fluid cartridge.

[0005] FIGS. 4A-4F illustrate an example of a method of assembling a fluid cartridge.

[0006] FIG. 4G is a perspective view of a portion of an example of a fluid cartridge.

[0007] FIG. 5A is a perspective view of an example of a fluid cartridge in a swage device.

[0008] FIG. 5B is a cross-sectional side view of the fluid cartridge in the swage device of FIG. 5 A.

[0009] FIG. 6A is a cross-sectional side view of an example of a fluid cartridge coupled to a body of a fluid-ejecting apparatus.|0010] FIG. 6B is a cross-sectional side view of the fluid cartridge of FIG. 6A being removed from the body of the fluid-ejecting apparatus.

[0011] FIG. 7A is a cross-sectional side view of an example of a fluid cartridge being removed from the body of a fluid-ejecting apparatus.[0012 [ FIG. 7B is a side view of an example of a portion of a fluid cartridge.

[0013] FIG. 8 is a top view of an example of a portion of a fluid cartridge.

[0014] FIG. 9 is a top view of an example of a portion of a fluid cartridge.

[0015] It will be recognized that the Figures are schematic representations for purposes of illustration. The Figures are provided for the purpose of illustrating one or more implementations with the explicit understanding that the Figures will not be used to limit the scope of the meaning of the claims.DETAILED DESCRIPTION

[0016] Referring now to FIGS. 1 A and IB, a cross-sectional side view and a cross-sectional end view of an example of a fluid flow structure 10 are respectively shown, according to some examples. It should be understood that the figures are not to scale, and the sizes of several components have been enlarged for clarity. The fluid flow structure 10 may include a fluidic die 12. The fluidic die 12 of FIGS. 1A and IB is shown as a fluid ejection die, for example, an ink ejection die for an inkjet printer. However, it should be understood that other types of fluidic dies 12, such as labs-on-a-chip or other MEMS devices may be similarly embedded into a fluid flow structure 10. Other fluids that may be ejected from a fluidic die 12 include primers, varnishes, fusing or detailing agents for 3D printers, and biological materials. Thefluidic die 12 may be an elongated sliver with a length more than three times its width. In some examples, the fluidic die 12 may include a substrate 14, which may be made of silicon, and an ejection layer 16. As discussed above, the fluidic die 12 may be molded into or otherwise coupled to a fluid distribution body 18. The fluid distribution body 18 may include a fluid channel 20 (e.g., a slot) that is fluidly coupled with fluid feed holes 22 in the substrate 14. The fluid feed holes 22 extend through the substrate 14 and are further fluidly coupled with the ejection chambers 24 in the ejection layer 16. Fluid may be supplied to the fluid channel 20 and may travel through the fluid feed holes 22 to the ejection chambers 24. When an electrical current is supplied to a resistor 27 positioned near the top of an ejection chamber 24, the resistor may rapidly heat up, causing fluid to be ejected from a nozzle 26 that is fluidly coupled with the ejection chamber 24. The ejection layer 16 may include bond pads 28 at each end to form electrical connections with electrical terminals of a control device, such as an inkjet printer body (e.g., via a connection with a thin interconnect circuit 36, described herein). The fluid flow structure 10 may be referred to as a fluid ejection device when the fluidic die 12 is a fluid ejection die, such as an ink ejection die for an inkjet printer.

[0017] Referring now to FIG. 2A, an example of a fluid cartridge 30 is shown. The fluid cartridge 30 includes a cartridge body 32 including a reservoir 34 stores a volume of fluid and a fluid ejection device 10. The fluid ejection device 10 may include or may be coupled to a thin interconnect circuit 36 electrically coupled to the fluid ejection die 12 at a first end and extending from an end of the fluid ejection die to a second end. The thin interconnect circuit 36 may electrically couple to the body of a fluid-ejecting apparatus and to receive electrical signals from a controller of the body of a fluid-ejecting apparatus causing the resistors 27 to energize and expel fluid from the nozzles 26 at precise times. As shown in FIG. 2A, the fluid ejection device 10 is coupled to a first side 38 of the cartridge body 32. As shown in FIG. 2 A, the thin interconnect circuit 36 extends from the end of the fluid ejection device 10, bends around an edge 40 of the cartridge body 32, and is coupled at its distal end to a second side 42 of the cartridge body 32 (e.g., a front face of the cartridge body 32). The second side 42 of the cartridge body 32 may be orthogonal or substantially orthogonal to the first side 38, as shown in FIG. 2 A. However, in other examples the second side 42 may be non-orthogonal to the first side 38. The thin interconnect circuit 36 should be “thin” so as to sit between the body of the fluid cartridge 30 and a contact array(e.g., the electrical contacts 86, as shown in FIG. 6 A) of the body of a fluid-ejecting apparatus (e.g., a contact array in a fluid cartridge carriage of the fluid-ejecting apparatus). That function can be fulfilled by a flex circuit with contacts and / or a thin printed circuit board (PCB) with contacts, or, in any event, suitably flat connecting circuitry for transmitting signals from the body of a fluid-ejecting apparatus to the fluid ejection die 12 on a thin plastic or compound single or multi-layered substrate. A flexible circuit may be less fragile than a thin PCB and easier to bend, but a PCB or other substrate type may function as well. “Thin,” as used herein refers to a relatively small thickness of the circuit (e.g., substrate layers, cover layers, and connecting circuitry), or, in other words, a flat circuit. While the specific dimension of thickness may vary, a maximum thickness of 3, 2 or 1 mm could be applied (these values are arbitrary), a maximum thickness of 2 or 1 mm could be applied depending on the chosen technology. In some examples, the thin interconnect circuit 36 has a thickness well below those thicknesses. For example, the thin interconnect circuit 36 may have a maximum thickness of approximately 110 microns or less. As discussed above, the thin interconnect circuit 36 may be a flexible circuit (e.g., a flex circuit) or at least a portion of the thin interconnect circuit 36 may be a flexible circuit.

[0018] To assemble the fluid cartridge 30, the fluid ejection device 10 may first be coupled to the first side 38 of the cartridge body 32, with the thin interconnect circuit 36 extending past the edge 40 of the cartridge body 32. An adhesive material (e.g., a pressure-sensitive adhesive) may be applied to the distal end of the thin interconnect circuit 36 and / or to the second side 42 of the cartridge body 32. The thin interconnect circuit 36 may then be bent around the edge 40 of the cartridge body 32, and the distal end of the thin interconnect circuit 36 may be pressed against the second side 42 of the cartridge body 32 to adhere the distal end of the thin interconnect circuit 36 to second side 42 of the cartridge body 32 using the adhesive material.

[0019] The thin interconnect circuit 36 of FIG. 2A is shown in further detail in FIG. 3, includes an interface portion 44 (e.g., a front portion), located around the distal end of the flexible circuit 36, including electrical contacts 54 (e.g., contact columns) to interface with corresponding electrical contacts 54 of the body of a fluid-ejecting apparatus. The portion of the thin interconnect circuit 36 between the interface portion 44 and the fluid ejectiondevice 10 may be referred to as a bend portion 46. The bend portion 46 may include circuitry electrically coupling the electrical contacts 54 of the interface portion 44 with the fluid ejection die 12 (e.g., coupling the first end of the thin interconnect circuit 36 to the second end). The interface portion 44 may have a length LI . To achieve a reliable electrical connection between the thin interconnect circuit 36 and the body of the fluidejecting apparatus, the interface portion 44 should be positioned directly against the second side 42 of the cartridge body 32 along substantially the entire length LI. However, in some examples, the thin interconnect circuit 36 may have a stiffness such that the adhesive force applied by the adhesive material is not sufficient to maintain the entire length LI of the interface portion 44 directly against the second side 42 of the cartridge body 32. It may be desirable to reduce the size of the thin interconnect circuit 36, which may reduce the cost of the fluid cartridge 30. However, a reduction in the surface area of the interface portion 44 may also reduce the adhesive force of the adhesive material. Further, during use, fluid from the reservoir 34 may become aerosolized or vaporized when ejected from the fluid ejection die 12 and may come in contact with the adhesive material. Certain fluids, such as solventbased inks, may interact with and degrade the adhesive material, further reducing the adhesive force. As shown in FIG. 2B, this can result in a portion of the interface portion 44 pulling away from the second side 42 of the cartridge body 32, such that the length L2 of the interface portion 44 positioned against the second side 42 of the cartridge body 32 is less than the length LI of the interface portion 44. This may interfere with the electrical connection between the thin interconnect circuit 36 and the body of the fluid-ejecting apparatus. Over time, the interface portion 44 may come completely decoupled from the second side 42 of the cartridge body 32.[00201 Referring now to FIG. 3, an example of a portion of fluid cartridge 30 is shown. The fluid cartridge 30 of FIG. 3 may be substantially similar to the fluid cartridge 30 of FIGS. 2A and 2B, except as shown and described herein. The fluid cartridge 30 includes a fluid ejection device 10 coupled to a first side 38 of a cartridge body 32. As shown in further detail in FIG. 4C, a thin interconnect circuit 36 extends from the fluid ejection device 10 around an edge 40 of the cartridge body 32, and an interface portion 44 of the thin interconnect circuit 36 is positioned against the second side 42 of the cartridge body 32. In addition to an adhesive material coupling thin interconnect circuit 36 to the second side 42of the cartridge body 32, the fluid cartridge 30 of FIG. 3 includes retention members 50 coupled to or integrally formed with the cartridge body 32. In some examples, the fluid cartridge 30 may include more or fewer retention members 50 than shown in FIG. 3. Each retention member 50 may extend over an edge 48 of the thin interconnect circuit 36 to retain the thin interconnect circuit 36 (e.g., the interface portion 44 of the thin interconnect circuit 36) against the second side 42 of the cartridge body 32. In some examples, the thin interconnect circuit may include an opening, and a retention member 50 may extend through the opening and over an edge of the opening.

[0021] Referring now to FIGS. 4A-4F, an example of a method of assembling the fluid cartridge 30 of FIG. 3 is shown. As shown in FIG. 4A, a cartridge body 32 is formed including protrusions 52 on its second side 42. The protrusions 52 may be integrally formed with at least a portion of the cartridge body 32. For example, the cartridge body 32 may be formed in a molding process (e.g., an injection molding process). Material (e.g., plastic, PET, etc.) may be inserted into a mold having a cavity in the shape of the cartridge body 32 until the material fills the mold, thus forming the cartridge body 32. The mold may include small cavities or divots that may become filled with material to form the protrusions 52. The protrusions may be considered a portion of the outer surface of the cartridge body 32. As shown in FIG. 4B, the fluid ejection device 10 is then coupled to the first side 38 of the cartridge body 32, for example, using a heat-cured adhesive or a pressure-sensitive adhesive. In some cases, the thin interconnect circuit 36 may be coupled to the fluid ejection device 10 before the fluid ejection device 10 is coupled to the cartridge body 32. In some cases, the thin interconnect circuit 36 may be coupled to the fluid ejection device 10 after the fluid ejection device 10 is coupled to the cartridge body 32. As shown in FIG. 4C, the thin interconnect circuit 36 is then bent around the edge 40 of the cartridge body 32, and the interface portion 44 of the thin interconnect circuit 36 is positioned (e.g., pressed) against the second side 42 (e.g., the outer surface of the second side 42). As shown in FIG. 4C, the cartridge body 32 may include two protrusions 52, and the interface portion 44 of the thin interconnect circuit 36 may be positioned between the two protrusions 52. The protrusions 52 may be positioned near the proximal end of the interface portion 44 (e.g., the end of the interface portion 44 nearest the edge 40 of the cartridge body 32), adjacent the bend portion 46. For example, a distance from the protrusions 52 to the edge 40 of thecartridge body 32 may be shorter than a distance from each of the electrical contacts 54 to the edge 40 of the cartridge body 32. For example, as shown in FIG. 4C, the protrusions are positioned a distance DI from the edge 40 of the cartridge body 32, the closest electrical contact 54 to the edge 40 is positioned a distance D2 from the edge, and the distance D2 is larger than the distance D 1.[002 1 FIG. 4D shows the protrusions 52 and the bend portion 46 and interface portion 44 of the thin interconnect circuit 36 from behind, with the rest of the fluid cartridge 30 hidden. FIG. 4D further shows a swage tool 60 (e.g., a swage device) including a stake shoe portion 61 and a swage shoe portion 59. The swage shoe portion 59 includes cavities 62 in the shape of a retention member 50. The swage tool 60 is pressed against the second side 42 of the cartridge body 32, with the cavities 62 positioned to receive the protrusions 52. The stake shoe portion 61 presses the interface portion 44 of the thin interconnect circuit 36 onto the adhesive 67, which may be coupled to one of the interface portion 44 or the second side 42 of the cartridge body 32, bonding the thin interconnect circuit 36 to the second side 42 of the cartridge body 32. The swage shoe portion 59 deforms at least a portion of each retention member 50 and forms the material into the retention member 50. In some examples, the swage tool 60 may be heated to increase the temperature of the protrusions 52 to above the glass transition temperature of the material to allow the material to be more easily deformed. In some examples, the protrusions 52 may be deformed using pressure without heating the material. The swage tool 60 may further include a boss 63 adjacent each cavity 62 in the direction of the distal end of the interface portion 44. The boss 63 may block the flow of the material of the protrusion 52 beyond the boss 63 in the distal direction (e.g., in a direction opposite the fluid ejection device 10; down, as shown), forcing more material toward the proximal end of the interface portion 44 (e.g., up as shown) and over the edge 48 of the thin interconnect circuit 36.

[0023] As shown in FIG. 4E, the retention members 50 are shaped by the swage tool 60 to overlap (e.g., extend over) an edge 48 of the thin interconnect circuit 36 (e.g., an outer edge of the interface portion 44) to hold the thin interconnect circuit 36 against the second side 42 of the cartridge body 32. In some examples, additional protrusions 52 may be positioned at different locations around the periphery of the interface portion 44, for example, adjacentthe distal end of the interface portion 44, and shaped into retention members 50. In some examples, protrusions 52 may be positioned adjacent the bend portion 46, such as at the end of the bend portion 46 adjacent the interface portion 44. This may reduce the force pulling the interface portion 44 away from the cartridge body 32, such that adhesive is sufficient to couple the interface portion 44 to the cartridge body 32 without any additional retention members 50 adjacent the interface portion. As shown in FIG. 4F, in some cases, the protrusions 52 may extend through openings 64 in the thin interconnect circuit 36, and the swage tool 60 may mold the protrusions 52 to form retention members that overlap (e.g., extend over) the edges 65 of the openings 64, which may be considered edges of the thin interconnect circuit 36. In some examples, the stake shoe portion 61 and the swage shoe portion 59 may be parts of separate tools. For example, the interface portion 44 may first be pressed by a first tool including the stake shoe portion 61, and the protrusions 52 may separately be pressed by a second tool including the swage shoe portion 59.

[0024] In some examples, different types of retention members 50 not integrally formed with the cartridge body 32 may be used to secure the interface portion 44 to the cartridge body 32. Retention members 50 may instead be separately coupled to the cartridge body. “Separately coupled” may refer to retention member 50 that are welded, press fit, or adhered by adhesive to the cartridge body 32. For example, retention members 50 that adhesively couple to the cartridge body 32 and extend over a portion of the interface portion 44 or a portion of the bend portion 46 may be used. In other examples, retention members 50 may be threadedly coupled to the cartridge body 32. In other examples, retention members 50 such as inserts may be pressed into (e.g., press-fit) into corresponding holes (e.g., blind holes) in the cartridge body 32 and extend over a portion of the interface portion 44 or a portion of the bend portion 46. The blind holes for receiving the inserts can be molded (e.g., when the cartridge body 32 is molded) or machined into the cartridge body 32. Alternatively, or in addition, adhesive can be used to couple the retention members 50 to the cartridge body 32. For example, adhesive may be applied in holes in the cartridge body 32, or directly attached against the (e.g., flush, flat) wall of the cartridge body 32. Assembly may be faster using press-fit retention members 50 than retention members 50 coupled to the cartridge body 32 using adhesive, which may require hold down and cure times.

[0025] Referring now to FIG. 4G, a portion of an example fluid cartridge 30 is shown. The fluid cartridge 30 includes a retention member 50 that extends across the thin interconnect circuit 36. The retention member 50 includes two end portions 110 and a span portion 112. The two end portions may be coupled to the outer surface of the cartridge body 32 (e.g., to the second side 42 of the cartridge body 32) on either side of the interface portion 44 of the thin interconnect circuit 36. For example, the end portions 110 may be coupled to the cartridge body using an adhesive, such as a pressure-sensitive adhesive or heat-cured adhesive. The span portion 112 extends across the interface portion 44 between the end portions 110. The span portion 112 thus secures part of the interface portion 44 against the outer surface of the cartridge body 32. The retention member 50 may effectively increase the surface area of the adhesive coupling the interface portion 44 to the cartridge body 32 beyond the surface area of the interface portion 44 itself. Additional retention members 50 as shown in FIG. 4G may be used in other locations to secure the interface portion 44 as long as the span portions 112 do not interfere with the contact between the electrical contacts 54 and the corresponding contacts of the body of the fluid-ejecting apparatus. In some examples, the width of the span portion 112 may be smaller than a width of the end portions 11 such that the surface area of the end portions 110, and thus the adhesive force provided by the end portions can be increased without increasing the size of the span portion 112, which extends across the thin interconnect circuit 36. In some examples, the retention member 50 shown in FIG. 4G may span across the bend portion 46 of the thin interconnect circuit 36.|0026[ FIGS. 5 A and 5B show the heat-staking process of FIG. 4D in further detail. The swage tool 60 may be coupled to a press 66, which may include a heating element (e.g., a resistive heating element) to heat the swage tool 60. In the example shown in FIG. 4D, the swage tool 60 includes a swage shoe portion 59 including the cavities 62 to shape the protrusions 52 into the retention members 50, as discussed above. The stake shoe portion 61 of the swage tool 60 presses the remainder of the interface portion 44 of the thin interconnect circuit 36 against the second side 42 of the cartridge body 32. As discussed above, a pressure-sensitive adhesive may be applied to the interface portion 44 or to a portion of the second side 42 of the cartridge body 32. The stake shoe portion 61 of the swage tool 60 may press the interface portion 44 such that the adhesive bonds the interfaceportion 44 to the second side 42 of the cartridge body 32. Further, by pressing the interface portion 44 against the second side 42 of the cartridge body 32 the stake shoe portion 61 may ensure that the interface portion 44 remains in the correct position while the swage shoe portion 59 is molding the protrusions 52 into the retention members 50. FIG. 5B shows a cross-section of the swage shoe portion 59 molding the protrusions 52 into the retention members 50, showing both the protrusions 52 before molding and the retention members 50 after molding. As shown, in FIG. 5B, the protrusions 52 have a height Hl and a width Wl. The swage shoe portion 59 shapes the protrusions 52 into retention members 50 having a larger width W2 and a smaller height H2 than the height Hl and width Wl of the protrusions 52. The swage shoe portion 59 may include a single cavity 62 to receive both protrusions 52 to allow the material to flow freely toward the center of the thin interconnect circuit 36. The swage shoe portion 59 pushes the material of the protrusion 52 over the edge 48 of the thin interconnect circuit 36, forming a retention member 50 with an overlapping portion 72 extending over the edge 48 of the thin interconnect circuit 36.[0027| Referring now to FIGS 6A and 6B, an example fluid cartridge 30 is shown installed in the body 82 of a fluid-ejecting apparatus 80 and being removed from the body 82 of the fluid-ejecting apparatus 80, respectively. As shown in FIG. 6A, the body 82 of the fluidejecting apparatus 80 includes a terminal 84 with electrical contacts 86. When the fluid cartridge 30 is installed in the body 82 of the fluid-ejecting apparatus 80 the electrical contacts 86 of the terminal 84 contact the electrical contacts 54 of the thin interconnect circuit 36, forming the electrical connection between the body 82 and the fluid ejection device 10. The retention members 50 are positioned beyond (e.g., below, as shown) the end 88 of the terminal 84, such that the retention members 50 do not interfere with the connections between the electrical contacts 54, 86. As shown in FIG. 6B, however, the fluid cartridge 30 may be removed from the body 82 of the fluid-ejecting apparatus 80 by rocking or rotating the fluid cartridge 30 (e.g., counterclockwise, as shown).

[0028] Referring now to FIGS. 7A and 7B, an example fluid cartridge 30 is shown in which the retention members 50 each include a chamfer or ramp 51 on the end of the retention member 50. The ramp 51 is shown positioned on the end 53 of the retention member 50 closest to the distal end of the thin interconnect circuit 36 and facing away from (e.g.,opposite) the fluid ejection device 10. As shown in FIG. 7A, when the fluid cartridge 30 is removed from the body 82 of the fluid-ejecting apparatus 80 rocking or rotating the fluid cartridge 30 (e.g., counterclockwise, as shown), the ramp 51 allows the retention members 50 to pass by the end 88 of the terminal 84 without contacting the end 88. The end 53 of the retention member 50 has a height H3 (shown in FIG. 7B) that is smaller than the height H2 of the retention member 50. FIG. 7B shows the fluid cartridge 30 including the retention member 50 with the ramp 51. FIG. 7B also shows a keep-out zone 90 into which the retention member 50 should not extend to avoid interfering with the terminal 84. The design of the ramp 51 allows the length L2 of the overlapping portion 72 of the retention member 50 to be longer than the length L3 of the portion of the retention member 50 having the height H2. This may maximize the structural integrity of the retention member and help ensure that the interface portion of the thin interconnect circuit 36 remains positioned against the second side 42 of the cartridge body 32.

[0029] Referring now to FIG. 8, a portion of an assembled example fluid cartridge 30 is shown. As discussed above with reference to FIG. 4D, the swage tool 60 may include bosses 63 to block the flow of material from the protrusions 52. The bosses 63 may heat deform portions of the second side 42 of the cartridge body 32 to form indentations 92. As can be seen in FIG. 8, the material of the retention member 50 does not extend past the indentations 92, as the bosses 63 have blocked the flow of material in the direction of the distal end of the interface portion 44 of the thin interconnect circuit 36 (e.g., down, as shown).

[0030] Referring now to FIG. 9, a portion of an assembled example fluid cartridge 30 is shown. Due to manufacturing and assembly tolerances, the precise positions of the protrusions 52 and the formed retention members 50 may vary within an acceptable range. FIG. 9 shows two possible locations 94, 96 of a retention member 50 on the second side 42 of the cartridge body 32. The first location 94 is a maximum distance from the centerline of the interface portion 44 of the thin interconnect circuit 36. The second location 96 is a minimum distance from the centerline of the interface portion 44 of the thin interconnect circuit 36. It may be desirable to maintain a gap between the retention member 50 and the electrical lines 98 that run along the thin interconnect circuit 36 to connect the electricalcontacts 54 to the fluid ejection device 10. As shown in FIG. 9, the thin interconnect circuit 36 includes a stiffener 56 that extends outward (e.g., out of the page, as shown) from the primary surface 58 of the thin interconnect circuit 36 (e.g., from the portion of the thin interconnect circuit over which the retention member 50 extends). For example, the primary surface 58 of the thin interconnect circuit 36 may extend a first distance away from the second side 42 of the cartridge body 32, and the stiffener 56 may extend a second distance away from the second side 42 of the cartridge body 32 that is larger than the first distance. In addition to adding strength to the thin interconnect circuit 36, the stiffener 56 may block the flow of material of the protrusion 52 beyond an outer edge 55 of the stiffener 56, such that the material cannot reach the electrical lines 98.[00311 While this specification contains specific implementation details, these should not be construed as limitations on the scope of what may be claimed but rather as descriptions of features specific to particular implementations. Certain features described in this specification in the context of separate implementations can also be implemented in combination in a single implementation. Conversely, various features described in the context of a single implementation can also be implemented in multiple implementations separately or in any suitable sub-combination. Moreover, although features may be described as acting in certain combinations and even initially claimed as such, features from a claimed combination can, in some cases, be excised from the combination, and the claimed combination may be directed to a sub-combination or variation of a sub-combination.[0032| As utilized herein with respect to structural features (e.g., to describe shape, size, orientation, direction, relative position, etc.), the terms “approximately,” “about,” “substantially,” and similar terms are meant to cover minor variations in structure that may result from, for example, the manufacturing or assembly process and are intended to have a broad meaning in harmony with the common and accepted usage by those of ordinary skill in the art to which the subject matter of this disclosure pertains. Accordingly, these terms should be interpreted as indicating that insubstantial or inconsequential modifications or alterations of the subject matter described and claimed are considered to be within the scope of the disclosure as recited in the appended claims.

[0033] The term “coupled” and variations thereof, as used herein, means the joining of two members directly or indirectly to one another. Such joining may be stationary (e.g., permanent or fixed) or moveable (e.g., removable or releasable). Such joining may be achieved with the two members coupled directly to each other, with the two members coupled to each other using a separate intervening member and any additional intermediate members coupled with one another, or with the two members coupled to each other using an intervening member that is integrally formed as a single unitary body with one of the two members. If “coupled” or variations thereof are modified by an additional term (e.g., directly coupled), the generic definition of “coupled” provided above is modified by the plain language meaning of the additional term (e.g., “directly coupled” means the joining of two members without any separate intervening member), resulting in a narrower definition than the generic definition of “coupled” provided above. Such coupling may be mechanical, electrical, or fluidic.

[0034] References herein to the positions of elements (e.g., “top,” “bottom,” “above,” “below”) are merely used to describe the orientation of various elements in the FIGURES. It should be noted that the orientation of various elements may differ according to other examples, and that such variations are intended to be encompassed by the present disclosure.

[0035] With respect to the use of substantially any plural and / or singular terms herein, those having skill in the art can translate from the plural to the singular and / or from the singular to the plural as is appropriate to the context and / or application. The various singular / plural permutations may be expressly set forth herein for sake of clarity.[0036 [ The foregoing description of illustrative examples has been presented for purposes of illustration and of description. It is not intended to be exhaustive or limiting with respect to the precise form disclosed, and modifications and variations are possible considering the above teachings or may be acquired from practice of the disclosed examples. It is intended that the scope of the claimed subject matter be defined by the claims appended hereto and their equivalents.

Claims

WHAT IS CLAIMED IS:

1. A fluid cartridge comprising: a fluid ejection device coupled to a cartridge body; a thin interconnect circuit coupled at a first end to the fluid ejection device and coupled at a second end to an outer surface of the cartridge body; and a retention member extending over a portion of the thin interconnect circuit to retain the thin interconnect circuit against the outer surface.

2. The fluid cartridge of claim 1, wherein at least a portion of the the thin interconnect circuit is a flex circuit.

3. The fluid cartridge of either one of claims 1 or 2, wherein the retention member is integrally formed with the outer surface of the cartridge body.

4. The fluid cartridge of any one of claims 1-2, wherein the retention member extends over an outer edge of the thin interconnect circuit.

5. The fluid cartridge of claim 4, wherein the thin interconnect circuit comprises a stiffener, wherein the portion of the thin interconnect circuit extends a first distance away from the outer surface of the cartridge body and the stiffener extends a second distance away from the outer surface of the cartridge body that is larger than the first distance, wherein the retention member does not extend beyond an outer edge of the stiffener.

6. The fluid cartridge of any one of claims 1-5, wherein the retention member comprises a chamfer on an edge of the retention member facing away from the fluid ejection device.

7. The fluid cartridge of any one of claims 1-3, wherein the retention member extends through an opening in the thin interconnect circuit and over an edge of the opening.

8. The fluid cartridge of any one of claims 1-7, wherein the fluid ejection device is coupled to a first side of the cartridge body, the second end of the thin interconnect circuit is coupled to a second side of the cartridge body orthogonal to the first side, and the thin interconnect circuit further comprises a bend portion extending around an edge of the cartridge body and coupling the first end of the thin interconnect circuit to the second end.

9. The fluid cartridge of claim 1, wherein: a front portion of the thin interconnect circuit is attached to a front face of the cartridge body, the front portion including contact columns to contact corresponding fluid ejection device contacts, the contact columns extending from the second end of the thin interconnect circuit to a bend portion of the thin interconnect circuit where the thin interconnect circuit bends towards the fluid ejection device, and the retention member extends adjacent the bend portion.

10. The fluid cartridge of claim 9, further comprising two opposite retention members at an opposite end of the front portion.

11. The fluid cartridge of any one of claims 1, 2, 9, or 10, wherein the retention member extends across the thin interconnect circuit.

12. The fluid cartridge of any one of claims 1, 2, or 9-11, wherein the retention member is attached to the cartridge body by adhesive.

13. A method of manufacturing a fluid cartridge, the method comprising: coupling a fluid ejection device to a cartridge body, the fluid ejection device having a thin interconnect circuit extending therefrom; pressing an interface portion of the thin interconnect circuit against an outer surface of the cartridge body; andpressing a portion of the outer surface of the cartridge body to form a retention member extending over a section of the interface portion to retain the thin interconnect circuit against the outer surface of the cartridge body.

14. The method of claim 13, wherein the fluid ejection device is coupled to a first side of the cartridge body, and the portion of the thin interconnect circuit is retained against a second side of the cartridge body orthogonal to the first side, wherein pressing the interface portion of the thin interconnect circuit against the outer surface of the cartridge body comprises bending the thin interconnect circuit around an edge of the cartridge body.

15. The method of either one of claims 13 or 14, wherein pressing the portion of the outer surface of the cartridge body comprises forming the retention member over a section of the interface portion proximate an end of the interface portion nearest the edge of the cartridge body.

16. The method of any one of claims 13-15, wherein the portion of the outer surface of the cartridge body is pressed using a swage tool to heat the portion of the outer surface.

17. The method of claim 16, wherein pressing the portion of the outer surface of the cartridge body comprises blocking, using a boss of the swage tool, material of the portion of the outer surface from flowing in a direction opposite the fluid ejection device.

18. The method of either one of claims 16 and 17, wherein pressing the portion of the outer surface of the cartridge body and pressing the interface portion of the thin interconnect circuit are performed simultaneously using the swage tool.

19. A method of manufacturing a fluid cartridge, the method comprising:coupling a fluid ejection device to a first side of a cartridge body, the cartridge body having a protrusion extending from a second side of the cartridge body orthogonal to the first side, the fluid ejection device having a thin interconnect circuit extending therefrom; bending the thin interconnect circuit around an edge of the cartridge body, and pressing an interface portion of the thin interconnect circuit against the second side of the cartridge body; and heat staking the protrusion to form a retention member extending over a portion of the thin interconnect circuit.

20. The method of claim 19, further comprising forming the cartridge body in a mold such that the protrusion is integrally formed with the second side of the cartridge body.

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