Scalable substrate handler apparatus and processing apparatus including the same

Abstract

A linear electrical machine includes: a transport chamber with a level reference plane, the transport chamber having a closable port along a side of the transport chamber; an array of electromagnets forming a drive plane relative to the level reference plane, a series of electromagnets of the array of electromagnets define a drive line within the drive plane, the drive plane having closed bounds that bound the linear electrical machine and at least one of: conform to the sides of the transport chamber, and extend through the closable port; a reaction platen cooperating with the series of electromagnets to controllably levitate and propel the reaction platen; and a controller configured to register presence and pose of each reaction platen, wherein a totality of reaction platens, within the closed bounds of the drive plane, is variable, and wherein the controller is configured to register variance in the totality of reaction platens.

Description

Atty. Docket No.390P017044-WO (PCT) SCALABLE SUBSTRATE HANDLER APPARATUS AND PROCESSING APPARATUS INCLUDING THE SAME CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application is a non-provisional of, and claims the benefit of, United States provisional patent application number 63 / 636,472 filed on April 19, 2024 and United States provisional patent application number 63 / 594,743 filed on October 31, 2023, the disclosures of which are incorporated herein by reference in their entireties. BACKGROUND 1. Field

[0002] The present disclosure generally relates to substrate processing equipment, and more particularly, to substrate transports of the substrate processing equipment. 2. Brief Description of Related Developments

[0003] Semiconductor automation generally comprises a series of building blocks that are required to support the implementation of processes to ultimately achieve predetermined levels of quality and reproducibility in semiconductor chip manufacturing. One component of semiconductor automation is the wafer (also referred to as a substrate) handler that transports the wafer or substrate between load locks and process modules and / or between process modules (e.g., in the case of sequential process tool architectures).

[0004] Conventional wafer handlers employed in semiconductor automation generally comprise multi-link robotic manipulators. The multi-link robotic manipulators have end effectors that holdAtty. Docket No.390P017044-WO (PCT) and transport wafers or substrates from one location to another location. As an alternative to the conventional wafer handlers noted above, magnetically levitated wafer conveyors may be employed where an alternating current magnetic floating apparatus for floating and conveying a conductive floating body or paramagnetic or nonmagnetic metallic material above a line of alternating current electromagnets is provided.

[0005] The above-noted wafer handlers are typically employed within enclosed environments of a processing tool. In such enclosed environments, throughput and cleanliness are desired attributes of the wafer handlers. As noted above, the wafer handlers generally employ end effectors, on which a wafer is supported, to perform the transfer operation for moving the wafer between wafer holding locations. To maintain the throughput and cleanliness of the wafer handlers, scheduled maintenance is generally performed to periodically clean the end-effector contact points or pads (e.g., on which the wafer is seated for passively or actively gripping the wafer) to ensure that the wafer is safely (i.e., substantially without contamination or damage) carried by the end effector. The scheduled maintenance of the wafer handlers generally requires disruption of process tool operation and disruption of an environment within the process tool, which may result in process tool downtime.

[0006] It is also noted that with the end effectors of the wafer handlers in the wafer processing environment, a temperature of the end effectors may increase above or decrease below a temperature of at least some of the wafers being handled by the end effectors. This difference in temperature between the end effectors and wafers may result in undesired thermal stresses being imparted on the wafer by the end effector.

[0007] Accordingly, the present disclosure addresses a number of those issues. BRIEF DESCRIPTION OF THE DRAWINGSAtty. Docket No.390P017044-WO (PCT)

[0008] The foregoing aspects and other features of the present disclosure are explained in the following description, taken in connection with the accompanying drawings, wherein:

[0009] Fig.1 is a schematic illustration of a substrate processing apparatus in accordance with the present disclosure;

[0010] Fig.2 is a schematic illustration of a substrate processing apparatus in accordance with the present disclosure;

[0011] Fig.3 is a schematic illustration of a substrate processing apparatus in accordance with the present disclosure;

[0012] Fig.4 is a schematic illustration of a substrate processing apparatus in accordance with the present disclosure;

[0013] Fig.5 is a schematic illustration of a substrate processing apparatus in accordance with the present disclosure;

[0014] Fig. 5A is a schematic illustration of a portion of a substrate processing apparatus in accordance with the present disclosure;

[0015] Fig.6 is a schematic illustration of a substrate processing apparatus in accordance with the present disclosure;

[0016] Figs. 7A, 7B, and 7C are schematic illustrations of a portion of a substrate processing apparatus in accordance with the present disclosure;

[0017] Fig. 8 is an exemplary graph of a substrate handler heating and / or cooling cycle in accordance with the present disclosure;

[0018] Fig.9 is an exemplary graph of substrate handler temperature cycling in accordance with the present disclosure;Atty. Docket No.390P017044-WO (PCT)

[0019] Fig.10A is a schematic illustration of a substrate processing apparatus in accordance with the present disclosure;

[0020] Fig. 10B is a schematic illustration of the substrate processing apparatus of Fig. 10A in accordance with the present disclosure;

[0021] Fig.11A is a schematic illustration of a substrate processing apparatus in accordance with the present disclosure;

[0022] Fig. 11B is a schematic illustration of the substrate processing apparatus of Fig. 11A in accordance with the present disclosure;

[0023] Fig. 12 is a schematic illustration of a substrate processing apparatus in accordance with the present disclosure;

[0024] Figs.12A-12C are schematic illustrations of portions of the substrate processing apparatus of Fig.12 in accordance with the present disclosure;

[0025] Figs. 13A, 13B, and 13C are respectively exemplary schematic illustrations of a front elevation view, a side elevation view, and a plan view of a substrate handler in accordance with the present disclosure;

[0026] Fig. 14A is a schematic illustration of a substrate handler in accordance with the present disclosure;

[0027] Fig.14B is a schematic illustration of the substrate handler of Fig.14A in accordance with the present disclosure;

[0028] Fig. 14C is a schematic illustration of a portion of a substrate processing apparatus including the substrate handler of Fig.14A in accordance with the present disclosure;Atty. Docket No.390P017044-WO (PCT)

[0029] Fig. 15 is a schematic illustration of an exemplary actuator control system network in accordance with the present disclosure;

[0030] Fig. 16 is a schematic illustration of a portion of a substrate processing apparatus in accordance with the present disclosure;

[0031] Fig.17 is an exemplary schematic of an electric circuit diagram of an electromagnet of a substrate processing apparatus in accordance with the present disclosure;

[0032] Fig. 18 is an exemplary schematic diagram of a drive circuit for electromagnets of a substrate processing apparatus in accordance with the present disclosure;

[0033] Fig. 19A is a schematic illustration of a response of an electromagnet to presence of a substrate handler in a substrate processing apparatus in accordance with the present disclosure;

[0034] Fig. 19B is a schematic illustration of a response of an electromagnet to presence of a substrate handler in a substrate processing apparatus in accordance with the present disclosure;

[0035] Fig. 19C is an exemplary graph illustration electromagnet / substrate handler base inductance versus position of the substrate handler base in accordance with the present disclosure;

[0036] Fig. 20 is a schematic illustration of an electromagnet control system and electromagnet array of a substrate processing system in accordance with the present disclosure;

[0037] Fig.21 is a schematic illustration of power factor patterns / matrices, of the electromagnet array of Fig. 20, corresponding to respective substrate handlers in accordance with the present disclosure;

[0038] Fig.22 is an exemplary illustration of a transformation of electromagnet measurements, of the electromagnetic array of Fig.20, to spatial position of a substrate handler in accordance with the present disclosure;Atty. Docket No.390P017044-WO (PCT)

[0039] Fig.23 is a schematic illustration of a multi-frequency alternating current and alternating current voltage for electromagnets in an array of electromagnets for effecting position determination, levitation, and propulsion of a substrate handler in accordance with the present disclosure;

[0040] Figs.24 and 25 respectively illustrate a base of a substrate handler positioned adjacent an array of electromagnets and a power factor variation of the array of electromagnets based on position of the base in accordance with the present disclosure;

[0041] Fig. 26 is an exemplary block diagram of an induction based position determination in accordance with the present disclosure;

[0042] Fig.27A is a schematic illustration of an exemplary motion control of a substrate handler in accordance with the present disclosure;

[0043] Fig.27B is a schematic perspective illustration of a substrate handler motion in accordance with the present disclosure;

[0044] Fig. 28 is a free-body diagram with respect to a maximum allowed acceleration with a conventional substrate transport apparatus;

[0045] Fig.29 is a free-body force diagram illustrating an effect of pitch angle on acceleration of a substrate handler with respect to substrate slippage in accordance with the present disclosure;

[0046] Fig. 30A is a free-body force diagram of a substrate illustrating effects of pitch angle, without friction, on substrate slippage in accordance with the present disclosure;

[0047] Fig. 30B is an exemplary graph illustrating propulsion acceleration in relation to pitch angle, without friction, with respect to substrate slippage in accordance with the present disclosure;Atty. Docket No.390P017044-WO (PCT)

[0048] Fig.31A is a free body force diagram of a substrate illustrating the effects of pitch angle, with friction, on substrate slippage in accordance with the present disclosure;

[0049] Fig.31B is a free body force diagram of a substrate illustrating the effects of pitch angle, with friction, on substrate slippage in accordance with the present disclosure;

[0050] Fig.32 is an exemplary graph illustrating acceleration limits in relation to pitch angle, with friction, with respect to substrate slippage in accordance with the present disclosure;

[0051] Fig.33 is a schematic elevation view of a substrate handler illustrating pitch control of the substrate handler in accordance with the present disclosure;

[0052] Fig.34 is a schematic elevation view of one substrate handler passing by another substrate handler within a transport chamber in accordance with the present disclosure;

[0053] Fig.35 is a schematic elevation view of one substrate handler passing by another substrate handler within a transport chamber in accordance with the present disclosure;

[0054] Fig. 36 is a schematic illustration of a portion of the actuator control system network showing dynamic phase allocation in accordance with the present disclosure;

[0055] Figs. 37A and 37B illustrate tilt control of a portion of a substrate handler utilizing the actuator control system network with dynamic phase allocation and virtual multiphase actuator units in accordance with the present disclosure;

[0056] Fig.37C illustrates electrical phase angle control with the actuator control system network to effect independent propulsion and lift control of a substrate handler in accordance with the present disclosure;

[0057] Fig.38 is a schematic illustration of a clustered control architecture in accordance with the present disclosure;Atty. Docket No.390P017044-WO (PCT)

[0058] Fig. 39A is a schematic illustration of a PVT frame in accordance with the present disclosure;

[0059] Fig. 39B is a schematic illustration of a PVT-FG frame in accordance with the present disclosure;

[0060] Figs. 40A, 40B, and 40C are schematic illustrations portions of a transport chamber in accordance with the present disclosure;

[0061] Figs.41A, 41B, 41C, and 41D are schematic illustrations of portions of a transport chamber in accordance with the present disclosure;

[0062] Figs.42A and 42B are exemplary graphs illustrating relationships between coil variables in accordance with the present disclosure;

[0063] Fig.43 is an exemplary graph illustrating coil current versus frequency in accordance with the present disclosure;

[0064] Figs.44A and 44B schematically illustrate a substrate alignment apparatus in accordance with the present disclosure;

[0065] Fig. 44C schematically illustrates a substrate handler in accordance with the present disclosure;

[0066] Figs. 45A-45D schematically illustrate a method for substrate alignment in accordance with the present disclosure;

[0067] Fig.46 is a flow diagram of a substrate alignment method in accordance with the present disclosure;

[0068] Fig.47 is a schematic illustration of an exemplary substrate handler station, in accordance with the present disclosure;Atty. Docket No.390P017044-WO (PCT)

[0069] Figs.48 and 49 are flow diagram of methods in accordance with the present disclosure;

[0070] Fig.50 is a schematic diagram of substrate processing apparatus system control software in accordance with the present disclosure;

[0071] Figs. 51-54 are schematic illustrations of portions of a substrate processing apparatus in accordance with the present disclosure;

[0072] Fig. 55 is a flow diagram of an exemplary method in accordance with the present disclosure; and

[0073] Fig. 56 is a flow diagram of an exemplary method in accordance with the present disclosure. DETAILED DESCRIPTION

[0074] The following detailed description is meant to assist the understanding of one skilled in the art, and is not intended in any way to unduly limit claims connected or related to the present disclosure.

[0075] The following detailed description references various figures, where like reference numbers refer to like components and features across various figures, whether specific figures are referenced, or not.

[0076] The word “each” as used herein refers to a single object (i.e., the object) in the case of a single object or each object in the case of multiple objects. The words “a,” “an,” and “the” as used herein are inclusive of “at least one” and “one or more” so as not to limit the object being referred to as being in its “singular” form.Atty. Docket No.390P017044-WO (PCT)

[0077] Figs. 1-6 illustrate exemplary substrate processing apparatus 100, 100A, 100B, 100C in accordance with the present disclosure. Although the present disclosure will be described with reference to the drawings, it should be understood that the present disclosure can be embodied in many forms. In addition, any suitable size, shape or type of elements or materials could be used.

[0078] As will be described herein, the exemplary substrate processing apparatus 100, 100A, 100B, 100C employ one or more substrate handlers 110 (which may generically be referred to herein as reaction platens), one or more of which may have different substrate handling characteristics or features than other ones of the substrate handlers 110, for transport of one or more substrates S between different substrate holding locations of the substrate processing apparatus 100, 100A, 100B, 100C. The substrate processing apparatus 100, 100A, 100B, 100C may be employed for processing substrates in vacuum environments (such as, e.g., a high vacuum that may be 10-5Torr and below or any other suitable vacuum) and / or atmospheric environments (such as, e.g., clean-dry air or nitrogen N2environments or any other suitable atmospheric environment).

[0079] The substrate processing apparatus 100, 100A, 100B, 100C includes one or more substrate handler stations (also referred to herein as platen service modules) 115 that are configured to effect one or more of substrate alignment and maintenance of the one or more substrate handlers 110 substantially without disruption of substrate processing apparatus throughput (i.e., where substrate processing throughput is a number of substrates processed for a predetermined time period) and substantially without disruption of the environment (e.g., a vacuum environment, a clean-dry air (atmospheric) environment, etc.) within the substrate processing apparatus 100. Here, maintenance of the substrate handlers 110 includes, but is not limited to, removal and / or introduction of substrate handlers 110 from and to the substrate processing apparatus 100, 100A, 100B, 100C depending on throughput demands, maintaining the substrate handler 110 at a temperature that maintains energy efficient operation of the substrate handler 110, and replacement of worn or otherwise defective substrate handlers 110.Atty. Docket No.390P017044-WO (PCT)

[0080] The controller 199 is operably coupled to an array of electromagnets 1700 (as described herein) and is configured to register (e.g., such as in registry HREG) presence of each of at least one substrate handler 110 in a linear electrical machine 700 (as described herein, and generally referred to as an electrical machine), and pose of the at least one substrate handler 110 in the transport chamber 118, where a totality of substrate handlers 110TOT that totals each substrate handler 110 in the linear electrical machine 700 (e.g., the totality of substrate handlers includes the substrate handlers in all areas of the linear electrical machine inclusive of all devices that define the bounds of the linear electrical machine (e.g., load locks 116, substrate handler stations 115, aligners 4444, etc.) and all areas within the linear electrical machine which the substrate handler 110 can traverse) represents an open system wherein the totality of substrate handlers 110TOT, within the closed bounds of the drive plane DP, is variable (i.e., changes as substrate handlers are added into the linear electrical machine 700 or removed from the linear electrical machine 700) so as to admit at least one of: introduction inside, from outside the closed bounds, and removal from inside to outside the closed bounds, of the at least one substrate handler 110. The variance in the totality of substrate handlers 110TOT is substantially independent of input and removal (throughput) of substrates or workpieces S through the closed bounds or platen travel space PTS of the linear electrical machine 700. The controller 199 is configured to register variance in the totality of substrate handlers 110TOT from the at least one of the introduction from outside, and removal from inside to outside the closed bounds. The substrate handler 110 introduction and removal to and from the closed bounds or platen travel space PTS is effected via the at least one substrate handler station (also referred to herein as a platen service module) 115.

[0081] As described herein, a totality (i.e., a total number) of substrate handlers 110 in the substrate processing apparatus 100, 100A, 100B, 100C represents an open system (i.e., the total number of substrate handlers is variable so as to increase or decrease) independent of the input or output of substrates to or from (e.g., substrate throughput through) the substrate processing apparatus 100, 100A, 100B, 100C. On input or removal of a substrate handler 110 to or from the substrate processing apparatus 100, 100A, 100B, 100C, a controller 199 of the substrate processingAtty. Docket No.390P017044-WO (PCT) apparatus 100, 100A, 100B, 100C registers (e.g., records at least the presence of the substrate handler in any suitable registry or table HREG stored in a memory 199M of the controller 199 or accessible to the controller 199)) or deregisters (e.g., removes the presence of the substrate handler from the registry or table HREG stored in the memory 199M) a variance in the totality of substrate handlers in the substrate processing apparatus 100, 100A, 100B, 100C. Registering or deregistering the variance in the totality of substrate handlers effects tracking, e.g., such as by the controller 199, of the total number of substrate handlers 110 in the substrate processing apparatus 100, 100A, 100B, 100C.

[0082] Referring also to Fig.47, to effect registration of a substrate handler 110 into the substrate processing apparatus 100, 100A, 100B, 100C and de-registration of a substrate handler 110 from the substrate processing apparatus, the controller 199 is configured to effect such registration based on data received by the controller 199 from one or more handler sensors 4710 and / or a user interface 199UI. The registration or deregistration of substrate handlers by the controller 199 in, for example, registry HREG may be initiated by, for example, data received by the controller 199 from user input to a user interface 199UI of the controller 199 and / or operation of any suitable mechanical interlock disposed on a door 115D of the substrate handler station 115. The substrate handler station 115 is described in greater detail herein. For example, with data received by the controller 199 that the door 115D is opened, the controller 199 may employ the one or more handler sensors 4710 to detect the presence or absence of a substrate handler 110 within the substrate handler station 115. The controller may monitor the presence of substrate handlers 110 within the substrate handler station 115 such that a presence of a substrate hander 110 in the substrate handler station 115 prior to the door 115D being opened and an absence of the substrate handler 110 from the substrate handler station 115 after the door is closed may initiate deregistration of the substrate handler 110 from the registry HREG. Conversely, an absence of a substrate hander 110 in the substrate handler station 115 prior to the door 115D being opened and a presence of the substrate handler 110 from the substrate handler station 115 after the door is closed may initiate registration of the substrate handler 110 from the registry HREG. As anotherAtty. Docket No.390P017044-WO (PCT) example, input from the user interface 199UI may initiate registration or deregistration of a substrate handler 110.

[0083] The one or more handler sensors 4710 may include, but are not limited to any suitable sensor configured to detect a presence of and / or identify a substrate handler 110, such as a vision sensor 4711 (which may be employed as vision sensor 4450 for alignment of substrates), a beam or photoelectric sensor 4712 (e.g., through beam, retroreflective, and / or diffused), a radio sensor 4713 (e.g., a radio frequency identification reader), a distance sensor 4715, and an induction sensor 4714 (which may be formed by an array of electromagnets 1700 as described herein). The one or more handler sensors 4710 may be disposed at any suitable location of the substrate processing apparatus 100, 100A, 100B, 100C to effect registration or deregistration of substrate handlers 110. For exemplary purposes, the one or more handler sensors 4710 are illustrated in Fig.47 as being disposed in or adjacent a substrate handler station 115. The handler sensors may be disposed in or adjacent a floor or bottom portion of the substrate handler station 115, in or adjacent a ceiling (so as to view the substrate handler through a window) of the substrate handler station 115, and / or in a slot valve (such as being disposed at an edge of the slot valve door so as to view / detect the substrate handler 110 as the substrate handler 110 passes through the slot valve opening) of the substrate handler station 115.

[0084] Where, for example, vision sensor 4711, radio sensor 4713, and / or induction sensor 4714 are employed, the handler sensor 4710 may be configured to provide the controller 199 with an identity of the substrate handler 110. For example, as described herein, each substrate handler base 1510 may have a unique shape that identifies the substrate handler 110 (see, e.g., Figs. 20- 22), where the unique shape may be identified by the induction sensor 4714 (as described herein) and / or the vision sensor 4711 (e.g., through any suitable machine vision algorithm). As another example, each substrate handler may include the identifier feature 4700 described herein, where when provided as an RFID tag, the radio sensor 4713 detects the identifier feature and obtains the identity of the substrate handler 110. Where the identifier feature 4700 is provided as an optical indicia the vision sensor 4711 detects the identifier feature 4700 and obtains the identity of theAtty. Docket No.390P017044-WO (PCT) substrate handler 110. As a further example, a user of the substrate processing apparatus 100, 100A, 100B, 100C may enter an identity of a substrate handler 110 into the user interface 199UI. The identity of the substrate handler 110 obtained in any one or more (i.e., more than one identification method may be employed for substrate handler identification) of the identification methods described above is received by the controller 199, where the controller registers (records) or deregisters (removes) the identity of the substrate handler in the registry HREG according to the substrate handler 110 input into or a removal from the substrate processing apparatus 100, 100A, 100B, 100C. The identification of the substrate handler 110 is employed by the controller 199 for issuing movement commands to the substrate handler 110 for substrate processing.

[0085] With the presence of the substrate handler 110 known to the controller 199, the one or more handler sensors 4710 may effect a pose determination (e.g., a location and orientation in one or more of the six degrees of freedom movement) of the substrate handler 110. For example, data from one or more of the induction sensor 4714 (such as described herein with respect to Figs.20- 22), vision sensor 4711 (e.g., with any suitable machine vision algorithm for detecting the base 1510 and or localization tag such as ArUco or April tags), distance sensor 4715 (e.g., positioned for detection along one or more of the X, Y, Z axes of the substrate handler station 115), photoelectric sensor 4712 (e.g., through any suitable optical scanning algorithm) may be employed by the controller to determine the location and pose of the substrate handler 110 within the substrate handler station 115 in any suitable manner. The location and pose determination of the substrate handler 110 provides for what may be referred to as a “cold start” operation of the substrate handler 110 where the substrate handler 110 is placed within the substrate handler station 115 at an unknown (e.g., unknown to the controller) location and pose, and the controller 199 substantially automatically identifies the substrate handler 110 and determines the location and pose of the substrate handler 110 to effect localization and movement of the substrate handler 110 into a transfer chamber 118 for substrate transport operations within the substrate processing apparatus 100, 100A, 100B, 100C.Atty. Docket No.390P017044-WO (PCT)

[0086] The substrate handler stations 115 are configured to maintain and / or adjust a temperature of a substrate handler 110 (e.g., adjust a temperature of one or more of an end effector 110E and base 710 of the substrate handler 110) and / or a substrate S held on the end effector 110E. Here, a temperature of the end effector 110E may be tempered or adjusted (e.g., increased or decreased) so that the temperature of the end effector 110E substantially matches a temperature of a substrate to be picked by the end effector. For example, where the substrate handler 110 is to pick a processed (hot) substrate from a process module, the temperature of the end effector 110E may be increased to substantially match the temperature of the processed substrate. As another example, where the substrate transport 110 is to pick an unprocessed substrate, such as from a substrate carrier 171 (e.g., at room temperature), the temperature of the end effector 110E may be decreased to substantially match the temperature of the unprocessed substrate. Similarly, the substrate handler stations 115 may be employed to temper or adjust the temperature of the substrate S held on the end effector 110E so that the temperature of the substrate S (and the end effector 110E) substantially match a temperature of a substrate holding location (e.g., process module, substrate cassette, etc.) to which the substrate S is to be placed. The tempering of the end effector 110E and / or the substrate S may substantially reduce or eliminate thermal stresses (due to a difference in temperature between the substrate S and an object or process contacting or acting on the substrate) being imparted to a substrate by the end effector, by a manufacturing process performed on the substrate S, or by a support holding the substrate.

[0087] The substrate handler station 115 is configured to cool the base 710 of the substrate handler 110, as described herein, to facilitate energy efficient operation of a transport apparatus 700 (also referred to herein as a linear electric machine) including the substrate handler 110. For example, the base 710 may be thermally managed to maintain a predetermined levitation efficiency. As may be realized, with levitation of the base 710, Eddy currents induced in the base 710 will generate heat and the temperature of the base 710 will increase. An increase in the temperature of the base 710 may increase the electrical resistivity of the base 710, which in turn may reduce the induction of Eddy currents and the levitation force exerted on the base 710 by an array ofAtty. Docket No.390P017044-WO (PCT) electromagnets 1700 of the substrate transport apparatus 700, thereby decreasing operating efficiency of the substrate transport apparatus 700. Maintaining the base 710 within a predetermined temperature range (as described herein) may alleviate any decrease in operating efficiency of the substrate transport apparatus 700.

[0088] Referring to Figs.1, 2, and 3, there is shown a schematic plan view of a substrate processing apparatus 100 incorporating features of the present disclosure. The substrate processing apparatus 100 may be connected to one or more environmental or equipment front end module (EFEM) 114 which has one or more load ports 112 (see Fig.2). The load ports 112 are capable of supporting a number of substrate storage canisters or substrate carriers 171 such as for example conventional FOUP canisters, though any other suitable type may be provided. The EFEM 114 communicates with the processing apparatus 100 through one or more load locks 116 or one or more substrate handler stations 115, which are connected to the processing apparatus 100. The EFEM 114 (which may be open to atmosphere) has a substrate transport apparatus 113 capable of transporting substrates between substrate carriers 171 disposed at the load ports 112 and the load locks 116. The EFEM 114 may further include substrate alignment capability, batch handling capability, substrate and carrier identification capability, and / or otherwise.

[0089] The load locks 116 or substrate handler stations 115 may interface directly with the load ports 112 (see Fig. 3, where the substrate handler stations 115 are interfaced with the load ports 112, noting that the load locks 116 may interface with the load ports 112 in a similar manner) as in the case where the load locks have batch handling capability or in the case where the load locks have the ability to transfer wafers directly from the FOUP to the lock. Some examples of such apparatus are disclosed in US patent numbers 6,071,059, 6,375,403, 6,461,094, 5,588,789, 5,613,821, 5,607,276, 5,644,925, 5,954,472, 6,120,229, and 6,869,263 all of which are incorporated by reference herein in their entirety.

[0090] Other load lock options may be provided. As illustrated in Fig.3, the load ports 112 may interface directly with a transfer chamber 118 of the processing apparatus, where the substrateAtty. Docket No.390P017044-WO (PCT) carrier 171 where a pressure within the substrate carrier 171 is brought down or up to (i.e., equalized) with a pressure of the internal environment of the transfer chamber 118 so that substrate may be transferred directly between the substrate carrier 171 and the transfer chamber 118. The load port 112 may be capable of pumping down and / or venting the interior of the substrate carrier 171 so as to increase or decrease the pressure thereof to match that of the transfer chamber 118 in a manner similar to that described in, for example, United States patent numbers 9,105,673 issued on August 11, 2015 and 10,395,959 issued on August 27, 2019, the disclosures of which are incorporated herein by reference in their entireties.

[0091] The processing apparatus may be configured to transfer substrate between the transfer chamber 118 and a substrate carrier 112 one or more of directly, through a load lock, and / or through an EFEM 114. Examples of apparatus suitable for transferring substrates to and from the processing apparatus, such as directly from the substrate carrier 112 to a load lock 116 are described in United States patent numbers 6,071,059 issued on June 6, 2000; 6,375,403 issued on April 23, 2002; 6,461,094 issued on October 8, 2002; 5,588,789 issued on December 31, 1996; 5,613,821 issued on March 25, 1997; 5,607,276 issued on March 4, 1997; 5,954,472 issued on September 21, 1999; 6,120,229 issued on September 19, 2000; and 6,869,263 issued on March 22, 2005, the disclosures of which are incorporated herein by reference in their entireties.

[0092] Still referring to Figs. 1-3, the processing apparatus 100 may be used for processing semiconductor substrates (e.g.200 mm, 300 mm, 450 mm, or other suitably sized wafers), panels for flat panel displays, or any other desired kind of substrate. The processing apparatus 100 generally comprises transfer chamber 118 (which may hold a sealed atmosphere therein, generally referred to as a chamber), process modules 120, and at least one substrate transport apparatus or linear electrical machine 700 (see also Figs. 7A and 7B). The substrate transport apparatus 700 illustrated may be integrated with the transfer chamber 118 or coupled to the transfer chamber 118 in any suitable manner such as described in, for example, United States patent number 11,476,139 issued on October 18, 2022 and United States patent application number 18 / 050,300 filed on October 27, 2022, the disclosures of which are incorporated herein by reference in their entireties.Atty. Docket No.390P017044-WO (PCT) Still referring to Figs. 1-3, process modules 120 may be mounted on both sides of the transfer chamber 118; however, process modules 120 may be mounted on one side of the chamber 118 as shown for example in Fig.5.

[0093] As shown in Figs.1-3, process modules 120 are mounted opposite each other in rows Y1, Y2, ..., Yn or vertical planes. The process modules 120 may be staggered from each other on the opposite sides of the transfer chamber 118 or stacked in a vertical direction relative to each other. Referring also to Figs. 7A and 7B, the transport apparatus 700 has substrate handler 110 that is moved in the transfer chamber 118 to transport substrates S between substrate holding stations (which include load locks 116, process modules 120, substrate carriers 171 or any other suitable location for holding a substrate that is accessible within or from within the transfer chamber 118). As described herein, any suitable number of substrate handlers 110 may be provided within the transfer chamber 118, where substrate handlers 110 may be input or removed from the transfer chamber 118 by an operator substantially without disrupting operation of the substrate processing apparatus 100.

[0094] As seen in Figs. 1-3, the transfer chamber 118 has a level reference plane 1299 (as described herein – see Figs. 7A and 10B) and may be configured to hold a sealed environment (which is subjected to vacuum or an inert atmosphere or simply a clean room environment or a combination thereof in its interior). As described herein, the transport chamber 118 has at least one closable port 118O along one or more sides of the transport chamber 118.

[0095] The transport chamber 118 has a configuration, and employs the substrate transport apparatus 700 that allows the process modules 120 to be mounted to the chamber 118 in a Cartesian arrangement with process modules 120 arrayed in substantially parallel vertical planes or rows. This results in the processing apparatus 100 having a more compact footprint than a comparable conventional processing apparatus. Moreover, the transfer chambers 118 described herein may be modular and capable of being coupled to each other directly or through one or more of load locks 116 and substrate handler stations 115 to provide a processing apparatus 100, 100A, 100B, 100CAtty. Docket No.390P017044-WO (PCT) having a transfer chamber with any desired length (i.e., the length is scalable – see Fig. 4 where the transfer chambers are coupled to each other by one or more of load locks 116, substrate handler stations 115, or directly to each other) to add any desired number of rows Y1-Yn of process modules 120 in order to increase throughput, such as in a manner similar to that described in United States patent number 11,476,139 issued on October 18, 2022 and United States patent application number 18 / 050,300 filed on October 27, 2022, the disclosures of which are incorporated herein by reference in their entireties.

[0096] The environments of the respective transfer chambers 118 may be atmospheric, vacuum, ultra-high vacuum (e.g., 10-5Torr and below), inert gas, or any other environment that may correspond to the processes performed on the substrates S by the process modules 120 coupled to the respective transfer chambers 118. As can be seen in Fig.4, where load locks 116 or substrate handler stations 115 couple the transfer chambers 118 to each other, the transfer chambers 118 may have the same (atmospheric, vacuum, same cleanliness level, etc.) or different (e.g., one vacuum and one atmospheric, two different vacuum levels, different cleanliness levels, etc.) environments therein where the substrates S are transferred between the different transfer chambers and respective environments thereof through one or more of the load locks 116 and substrate handler stations 115. As may be realized, the substrate handler stations 115 provide for transfer of the substrate handlers 110 (with or without substrate(s) held thereon) between the different environments of the coupled transfer chambers.

[0097] The transfer chamber 118 may also be capable of supporting any desired number of substrate handlers 110 therein and allowing the substrate handlers 110 to reach any desired processing chamber 120 and enter into any desired substrate handler station 115 coupled to the transfer chamber 118 without interfering with each other. This in effect decouples the throughput of the processing apparatus 100 from the handling capacity of the transport apparatus 700, and hence the processing apparatus 100 throughput becomes processing limited rather than handling limited. Accordingly, throughput can be increased as desired by adding process modules 120 and / or substrate handlers 110 on the same platform.Atty. Docket No.390P017044-WO (PCT)

[0098] Still referring to Figs.1-3, the transfer chamber 118 may have a general rectangular shape, although in the chamber may have any other suitable shape. For exemplary purposes only, the transfer chamber 118 has a slender shape (i.e. length much longer than width) and defines a generally linear transport path for the transport apparatus 700 therein. The transfer chamber 118 has side walls 118S that form longitudinal sides (e.g., extending along the length of the transfer chamber 118) and lateral sides (e.g., extending along the width of the transfer chamber 118). The side walls 118S have transport openings or ports 118O (also referred to as substrate pass through openings) formed therethrough. The transport ports 118O are sized large enough to allow substrates S to pass through the ports 118O (which ports can be sealable by slot valves) into and out of the transfer chamber 118. As can be seen in Figs. 1-3, the process modules 120 may be mounted outside the side walls 118S with each process module 120 being aligned with a corresponding transport port 118O in the transfer chamber 118. As can be realized, each process module 120 may be sealed against the sides 118S of the chamber 118 around the periphery of the corresponding transport port 118O to maintain the vacuum (or other atmosphere / environment) in the transfer chamber 118. The slot valve sealing each process module 120 is controlled by any suitable means, such as controller 199, to close the transport port 118O when desired. The transport ports 118O may be located in the same horizontal plane. Accordingly, the process modules 120 on the transfer chamber 118 are also aligned in the same horizontal plane. The transport ports 118O may be disposed in different horizontal planes.

[0099] As seen in Figs.1-3, for exemplary purposes only, the load locks 116 and substrate handler stations 115 may be mounted to the lateral chamber sides 118S. This allows the load locks 116 and substrate handler stations 115 to be adjacent a respective EFEM 14 at opposite ends of the processing apparatus 100 (see Fig. 2). One or more load locks 116 may be located at any other transport ports 118O on the transfer chamber 118 such as shown for example in Fig. 5. The hexahedron shape of the transfer chamber 118 allows the length of the chamber to be selected as desired in order to mount as many process modules 120 as desired (for example see Figs. 1-6Atty. Docket No.390P017044-WO (PCT) showing the transfer chamber 118 length may be such as to accommodate any number of process modules 120).

[0100] As noted before, and referring also to Figs.7A and 7B, the transfer chamber 118 illustrated in Figs.1-6 has a substrate transport apparatus 700 having one or more substrate handler 110. The transport apparatus 700 is integrated with the transfer chamber 118 and each substrate handler station 115 to translate substrate handler 110 throughout the transfer chamber 118 and between the transfer chamber 118 and each of the substrate handler station 115. As can be seen in Figs. 7A and 7B, the substrate handler 110 of the substrate transport apparatus 700 has a platen or base 710 (e.g., that reacts forces imparted on the base by an array of magnets 1700) at least one end effector 110E for holding one or more substrates S. The transfer chamber 118 and each substrate handler station 115 include respective linear tracks 1550 formed by respective arrays of electromagnets 1700 (i.e., the linear tracks 1550 extend from the transfer chamber 118 into each substrate handler station 115 so that substrate handlers 110 traverse or otherwise move from the transfer chamber 118 into the substrate handler station 115 and from the substrate handler station 115 to the transfer chamber 118 through a respective slot valve). The electromagnets 1700 are configured so as to controllably levitate and propel the base 710 (and the substrate handler 110 as a whole) along the at least one drive line DL1-DL8 (see, e.g., Fig. 1 noting that the drive lines are exemplary and there may be more or less drive lines depending on one or more of a width of transfer chamber 118 and a number of process modules / load locks / substrate handling stations arranged along the length and width of the transfer chamber, where generally there is at least one drive line for each process modules / load locks / substrate handling stations that provides substrate handler access to that process modules / load locks / substrate handling stations), in a controlled attitude relative to a drive plane DP of the substrate transport apparatus 700.

[0101] In accordance with the present disclosure, the substrate handlers 110 are capable of transporting substrates S throughout the transfer chamber 118 and substrate handler stations 115 of the processing apparatus 100, 100A, 100B, 100C without constraint from any robotic linkage mechanism (such constrained linkages include, for example, those found in SCARA robots,Atty. Docket No.390P017044-WO (PCT) telescoping robots, frog-leg robots, and other conventional substrate transport robots). The movement of the substrate handlers 110 throughout the transfer chamber 118 and substrate handler stations 115 is effected by a control apparatus, such as controller 199, that enables magnetic levitation of one or more substrate handler 110 without employment of magnets, bonding elements, bearings, or transmissions. It is noted that the present disclosure is described with respect to induction levitation of the one or more substrate handler 110 however, the present disclosure applies equally to other suitable types of electro or electro-magnetic levitation systems or any other suitable types of levitation that may be employed for moving substrate handlers and transporting substrates.

[0102] As can be seen above, the arrangement of the substrate transport apparatus 700 facilitates a high level of scalability of the substrate processing apparatus 100, 100A, 100B, 100C where a variable number of substrate handlers 110 may be added / removed from the substrate processing apparatus 100, 100A, 100B, 100C and independently controlled depending on substrate throughput demands. Here, substrate handlers 110 can be added or removed from the substrate processing apparatus 100, 100A, 100B, 100C in a manner substantially similar to the manner in which substrates S are moved into and out of the substrate processing apparatus 100, 100A, 100B, 100C, e.g., such as through the substrate handler station 115 or carrier SHC. For example, the substrate processing apparatus 100, 100A, 100B, 100C include at least one substrate handler station or platen service module 115 connected to the transport chamber 118 so as to communicate with the sealed environment of the transport chamber 118. The at least one substrate handler station 115 is configured (as described herein) to at least one of introduce inside, from outside a closed bounds or a platen travel space PTS (of the linear electrical machine 700 as described herein), and remove, from inside to outside the closed bounds or platen travel space PTS, the at least one substrate handler 110 substantially independent of input and removal (throughput) of payload units or substrates S to and from the closed bounds or platen travel space PTS. It is noted that the closed bounds and / or the platen travel space PTS at least one of conforms substantially to the one or more sides of the transport chamber 118 and extends through the at least one closable port 118O. TheAtty. Docket No.390P017044-WO (PCT) at least one substrate handler 110 may be introduced inside from outside the platen travel space, and removed from inside to outside the platen travel space is through the at least one closable port 118O.

[0103] As described herein, the at least one substrate handler station 115 (also referred to herein as a platen service module or reaction platen service module) is configured to one or more of: receive the at least one reaction platen or substrate handler 110 therein from the transport chamber, where the at least one substrate handler station 115 is a platen buffer station buffering the at least one reaction platen outside the transport chamber; effect thermal control of the at least one reaction platen, so as to at least one of heat and cool the at least one reaction platen to a predetermined platen temperature (e.g., where the predetermined platen temperature conforms with a thermal management control protocol of the linear electrical machine – any substrates held on the reaction platen may also be heated or cooled, in a manner similar to that of the reaction platen, according to any suitable processing recipe so as to temper the substrate for a subsequent process); and both buffer the at least one reaction platen and introduce and remove the at least one reaction platen from the platen travel space. Where the at least one substrate handler station 115 is employed as a platen buffer station, the substrate handler 110 may carry one or more substrates S into a substrate handler station 115 for buffering the substrate (e.g., with or without thermal processing of the substrate), where the substrate S is subsequently reintroduced into the substrate processing module for subsequent processing according to any suitable processing recipe, the substrate handler 110 being moved within the processing apparatus in a manner substantially similar to that described in United States patent application number 18 / 050,300 filed on October 27, 2022, the disclosure of which is incorporated herein by reference in its entirety. The substrate handler 110 (with or without substrate(s) S thereon) may also be moved out (or into) the platen travel space of the substrate processing system such as with a substrate handler carrier SHC as described herein.

[0104] As described herein, the totality of substrate handlers 110TOT is variable. The totality of substrate handlers 110TOT within the platen travel space PTS is varied (as represented in the registry HREG of the controller 199 and present within the closed bounds or platen travel spaceAtty. Docket No.390P017044-WO (PCT) PTS of the linear electrical machine 700) by: one or more of the at least one substrate handler 110 introduced and the at least one substrate handler 110 removed from the totality of substrate handlers 110TOT respectively by introduction inside the platen travel space PTS, from outside the platen travel space PTS, and removal from inside the platen travel space PTS to outside the platen travel space PTS of the at least one substrate handler 110; and / or the at least one substrate handler 110 being one or more of introduced and removed through the at least one closable port 118O of the transport chamber 118.

[0105] The substrate handler station 115 (and carrier SHC) includes any suitable door 115D shaped and sized for passage of a substrate handler 110 to and from an interior of the substrate handler station 115. It is noted that where the substrate handlers 110 are transported to and from the processing apparatus 100, 100A, 100B, 100C in a carrier SHC (the carrier maintaining at least a cleanliness of the substrate handler), the carrier SHC may be coupled to a slot valve or load port (in a manner similar to that of a substrate carrier 171). The carrier SHC may include electromagnets 1700, in a manner similar to that of the substrate handler stations 115, where the electromagnets of the carrier are coupled to the substrate transport apparatus 700 (for energization and control) with any suitable wired or wireless electrical / control couplings disposed on the transfer chamber 118. Here, the electromagnets 1700 of the carrier SHC may be controlled as described herein so that the substrate handler 110 enters and exits the carrier SHC from and to the transfer chamber 118 (e.g., the carrier SHC may be considered a portable substrate handler station, where substrate handlers 110 loaded or unloaded with one or more substrates S may be introduced to or removed from the substrate processing apparatus 100, 100A, 100B, 100C).

[0106] The scalability of the substrate processing apparatus 100, 100A, 100B, 100C described herein may provide for one or more of: on demand replacement of substrate handlers 110 due to, e.g., wear and tear with substantially no or at least minimized disruption to substrate process apparatus operation; replacement of substrate handlers 110 may be performed without venting the transfer chamber 118; preventative maintenance of the substrate handlers 110 may be performed substantially without substrate processing apparatus down time; the number of substrate handlersAtty. Docket No.390P017044-WO (PCT) 110 within the substrate processing system may be increased or decreased depending on processing throughput demands so as to optimize substrate throughput; and substrate handlers 110 may be deployed in a manner that minimizes levitation duty cycle operation on the base 710 of any given substrate handler 110 so as to maintain energy efficiency of the substrate transport apparatus 700.

[0107] Referring to Figs. 7A and 7B, each of the substrate handler stations 115 is configured to effect at least one or more of substrate handler heating / cooling (i.e., thermal management) of the substrate handlers 110 and substrate handler cleaning. For example, the controller 199 may be configured with any suitable thermal management protocol TMP (in the form of non-transitory computer program code stored therein) and / or cleaning management protocol CMP (in the form of non-transitory computer program code stored therein). The thermal management protocol TMP effects minimization of thermal stress between the end effector 110E and the substrate S as well as maintain energy efficient levitation of the substrate handler 110. The cleaning management protocol CMP effects removal of at least particulate matter and airborne molecular contamination from the substrate handlers.

[0108] For exemplary purposes, the substrate handler station 115 includes a heating element 725 coupled to a frame 115F of the substrate handler station 115. The heating element 725 is disposed so as to heat the end effector 110E and increase a temperature of the end effector 110E to substantially match a temperature of a substrate S to be handled by the end effector 110E. The heating element 725 may also be employed, as described herein, to dry the substrate handler 110 in a cleaning process. The heating element 725 may be any suitable heating element including, but not limited to, infrared (such as laser infrared) heaters, induction heaters, LED (light emitting diode) heaters or any other suitable heating element that emits radiation to effect radiative heating of the end effector. The end effector 110E may be heated through conduction or convection in any suitable manner.

[0109] The frame 115F of the substrate handler station 115 may include a window 115N through which the radiation passes to heat the end effector 110E, where the window 115N maintains theAtty. Docket No.390P017044-WO (PCT) interior of the substrate handler station 115 as a sealed environment. It is noted that while the heating element 725 is illustrated on one end 115E1 of the substrate handler station 115, the heating element 725 may be disposed on the other end 115E2 of the substrate handling station 115, a heating element 725 may be disposed on each end 115E1, 115E2 of the substrate handler station 115, or positioned relative to a substrate handler 110 within the substrate handler station 115 so that the end effector 110E may be heated regardless of substrate handler orientation within the substrate handler station 115.

[0110] The substrate handler station 115 is also configured to cool the substrate handler 110 (e.g., the end effector 110E and the base 710). For example, the substrate handler station 115 includes vent and pump conduits VC, PC that introduce and remove any suitable cooling fluid to and from the interior of the substrate handler station 115. The cooling fluid CF may be any suitable cooling fluid including, but not limited to, nitrogen (N2) gas and clean-dry air. To cool the substrate handler 110, the cooling fluid CF is introduced into the substrate handler station 115 interior so as to flow along and around the end effector 110E and base 710 and convectively cool the end effector 110E and base 710. The vent conduit VC may be operable during venting so as to induce cooling fluid flow within the substrate handler station interior. Where the transfer chamber 118, to which the substrate handler station 115 is coupled, includes a vacuum environment the vent conduit VC may be employed to pump down a pressure within the interior of the substrate handler station to substantially match a vacuum pressure within the transfer chamber 118. The temperature management protocol TMP of the controller 199 is configured to substantially maintain a temperature of the base 710 within a predetermined temperature range (such as below about 100ºC)

[0111] The base 710 of the substrate handler 110 may be cooled to within the predetermined temperature range through conductive heat transfer with a bottom or floor 118L (i.e., isolation wall) of the substrate handler station 115 as shown in Fig.7C. For example, the floor 118L forms a thermal sink. With a substrate handler 110 positioned within the substrate handler station 115, the controller 199 may activate (or deactivate) the array of electromagnets 1700 (or a portion thereof) so that the base 710 lowers to seat on (e.g., lands on) the floor 118L of the substrateAtty. Docket No.390P017044-WO (PCT) handler station 115 where heat is removed from the base 710 by the floor 118L via conduction from the base 710 to the floor 118L towards an atmospheric side of the floor 118L where the electromagnets 1700 are disposed. Here heating of the end effector 110E may occur substantially simultaneously with cooling of the base 710.

[0112] As may be realized, the substrate handler station 115 may not only be employed to temper the substrate handler 110 but also any substrate S held on the substrate handler 110. For example, where a substrate is to be placed in a process station, that substrate S may be pre-heated to the process temperature within the substrate handler station 115 in a manner similar to that of heating the end effector 110E. Similarly, where a hot processed substrate is to be placed in a substrate carrier disposed at room temperature, the substrate may be cooled to room temperature within the substrate handler station 115 in a manner substantially similar to that of cooling the substrate handler 110.

[0113] The substrate handler station 115 includes any suitable thermal sensor 726 positioned on the frame 115F so as to sense a temperature of the end effector 110E. For example, the thermal sensor 726 may be an infrared sensor or any other suitable sensor. The thermal sensor 726 is coupled to the controller 199 and provides temperature signals that are employed by the controller for heating or cooling the end effector 110E according to the thermal management protocol TMP.

[0114] The controller 199 may control the heating element 725, based on the temperature signals, to substantially match a temperature of the end effector 110E to a temperature of a substrate S to be handled by that end effector 110E.

[0115] The heating of the end effector 110E and cooling of the base 710 of the substrate handler 110 may be performed with a pumping and venting cycle of the substrate handler station 115 interior. Fig.8 is an exemplary graph that illustrates heating and cooling of at least a portion (e.g., end effector 110 and / or base 710) of the substrate handler 110 (referred to as a carrier in Fig. 8) performed with the pumping and venting of the substrate handler station 115 interior. ForAtty. Docket No.390P017044-WO (PCT) exemplary purposes only, heating of the end effector 110E may occur with pumping of the substrate handler station 115 interior to a vacuum pressure. Cooling of the base 710 may occur with venting the substrate handler station 115 interior to atmospheric pressure (or above). As may be realized, where conductive heat transfer is employed to cool the base 710, the base may be cooled with pumping or venting of the substrate handler station 115 interior.

[0116] Such as where an EFEM 114 is coupled to a substrate handler station 115, the substrate handler 115 may be employed to transfer substrates to and from the EFEM 114 (or substrate carrier 171 coupled thereto). Here, the cooling of the base 710, heating of the substrate S and / or end effector 110E may be effected opportunistically, such as with the substrate exchange operation at the EFEM 114. For example, where the substrate handler 110 enters the substrate handler station 115 from a transfer chamber with a vacuum environment therein, the substrate handler station 115 is sealed from the transfer chamber 118 by a respective slot valve and the substrate handler station 115 the interior if the substrate handler station 115 is vented to a pressure of the EFEM 114. With venting of the substrate handler station 115 interior, the base 710 of the substrate handler 110 is opportunistically cooled by one or more of convection and conduction as described above. The slot valve to the EFEM 114 is opened and the end effector is extended into the EFEM 114 or substrate carrier 171 so that a substrate is transferred between the end effector 110E and holding station of the EFEM 114. With the substrate picked by (held on) the end effector 110E (or with the end effector not holding a substrate S) and with the end effector retracted into the substrate handler station 115, the interior of the substrate handler station 115 is again isolated by closing the slot valve to the EFEM 114. With the interior of the substrate handler station 115 isolated, the interior is pumped to the vacuum pressure of the transfer chamber 118. With the pumping of the interior, the substrate S and / or end effector 110E is opportunistically heated in the manner described above, the slot valve to the transfer chamber 118 is opened, and the substrate transport 110 is moved out of the substrate handler station 115 to an interior of the transfer chamber 118. A temperature of one or more of the end effector 110E, base 710, and or substrate S may be heated or cooled at any suitable time(s).Atty. Docket No.390P017044-WO (PCT)

[0117] To substantially prevent or minimize heat transfer between the end effector 110E and the base 710, the end effector 110E may be coupled to the base by a stanchion 711 constructed of any suitable material having a low thermal conductivity (such as a suitable stainless steel). Substantially preventing thermal transfer between the end effector 110E and base 710 may at least in part facilitate energy efficient operation of the substrate transport 700 by substantially isolating heating of the end effector 110E from the base 710 (i.e., heating the end effector 110E substantially does not cause an increase in temperature of the base 710). The end effector 110E may be coupled to the base 710 in any suitable manner that promotes or hinders heat transfer between the end effector 110E and base 710.

[0118] It is noted that “spare” substrate handlers 110 may be held otherwise stored in one or more substrate handler stations 115, while other substrate handlers 110 are operational to transfer substrates within the substrate processing apparatus 100, 100A, 100B, 100C. Here, at least a temperature of the substrate handler 110 base(s) 710 may be monitored in any suitable manner (e.g., such as with temperature sensors disposed at predetermined locations of the transfer chamber 118, where the temperature sensors are similar to temperature sensor 726; with temperature sensors mounted to respective bases 710 and in wireless communication with the controller 199; or based on an amount of time in service – duty cycle). With the controller receiving sensor signals indicating a temperature of a base 710 of a substrate handler 110 exceeds an upper limit of the predetermined temperature range (this substrate handler may be referred to for explanation purposes as an “overheated” substrate handler), the controller 199 commands replacement of the “overheated” substrate handler 110 with a “spare” substrate handler. Here, with reference to Fig. 5 (although replacement of substrate handlers may occur in a similar manner with respect to any of substrate processing apparatus 100, 100A, 100B, 10C), the replacement of the “overheated” substrate handler 110H with the spare substrate handler 110R is effected by the controller 199 by commanding movement of the “spare” substrate handler 110R from the substrate handler station 115 in which it is stored to the transfer chamber 118; and by commanding movement of the “overheated” substrate handler 110H from the transfer chamber 118 to an empty substrate handlerAtty. Docket No.390P017044-WO (PCT) station 115 (which may be same as or different than the substrate handler station in which the “spare” substrate handler 110R was stored). As may be realized, commanded movement of the “spare” substrate handler 110R and the “overheated” substrate handler 110H is coordinated by the controller 199 to avoid interference / blockage of movement between the substrate handlers 110H, 110R. With the “overheated” substrate handler 110H within the substrate handler station 115, the “overheated” substrate handler is cooled as described herein while the “spare” substrate handler 110R takes over or resumes the substrate transport operations of the now stored “overheated” substrate handler 110H.

[0119] Fig. 9 illustrates exemplary vacuum temperature transients of the substrate handler 110 base 710 versus time. Fig.9 illustrates that the base 710 (and the substrate handler 110) can operate at over about 90% duty cycle levitation while maintaining the base 710 within the predetermined temperature range of below about 100ºC. For example, Fig. 9 illustrates the temperature range being about 50ºC to about 100ºC, which maintains the levitation (and energy) efficiency within a predetermined range.

[0120] As noted above, and referring to for example Figs. 1-5 and 6-7C, one or more of the substrate handler stations 115 may include a substrate handler cleaner 166 that effects cleaning of the substrate handlers 110 in accordance with a cleaning management protocol CMP. For example, a substrate handler 110 may be commanded to enter the substrate handler station 115 for cleaning of the substrate handler 110 after expiry of a predetermined time period, after a predetermined number of substrate transfers, after detection of particulates on the substrate handler (such as by any suitable vision sensor 781 (with a camera or other vision sensor) coupled to the controller 199 and configured to detect the particulates with any suitable machine vision detection algorithm of the controller 199), or at any other suitable time. For exemplary purposes, the substrate handler cleaner 166 includes one or more of the heater 725, liquid spray nozzles 166A, gas nozzles 166C, an electromagnetic irradiator 166B, contact-cleaning device 166D, purging ports 166E, or any other suitable device configured for cleaning the substrate handler 110. The one or more of the heater 725, liquid spray nozzles 166A, gas nozzles 166C, electromagneticAtty. Docket No.390P017044-WO (PCT) irradiator 166B, contact-cleaning device 166D, purging ports 166E, or any other suitable device configured for cleaning the substrate handler 110 are disposed on, for example, the frame 115F of the substrate handler station 155 so as to communicate with an interior of the substrate handler station 115 (e.g., such as through a window, a sealable port, etc., so that the interior of the substrate handler station 115 maintains the isolated atmosphere (e.g., vacuum, inert, etc.) therein).

[0121] The liquid spray nozzles 166A are disposed on the frame 115F and positioned so as to shower or spray substantially the entirety of the substrate handler 110, or at least a desired part of the substrate handler 110, within the substrate handler station 115 with deionized water (or other suitable liquid cleaning agent). As an example, the liquid spray nozzles 166A may be disposed on the top, sides, and / or bottom of the substrate handler station 115 so that the deionized water wets one or more surfaces of the substrate handler 110.

[0122] The heater 725 is disposed (as described herein) to heat the substrate handler 110 so as to dry the deionized water from the one or more surfaces of the substrate handler 110 and / or dry the interior of the substrate handler station 115.

[0123] The gas nozzles 166C are disposed on the frame 115F and positioned so as to direct a gas (e.g., clean dry air, nitrogen, or any other suitable gas) substantially over the entirety of the substrate handler 110, or at least over a desired part of the substrate handler 110, within the substrate handler station 115. The gas may be heated so as to promote evaporation of any liquid on one or more surfaces of the substrate handler 110. As an example, the gas nozzles 166C may be disposed on the top, sides, and / or bottom of the substrate handler station 115 so that the gas impinges on one or more surfaces of the substrate handler 110. With the introduction of the gas, the pump conduit PC may provide for removal of the gas and any particulates carried thereby by suctioning the gas and particulates from the interior of the substrate handler station 115.

[0124] The electromagnetic irradiator 166B is disposed on the frame 115F and positioned so as to irradiate substantially the entirety of the substrate handler 110, or at least a desired part of theAtty. Docket No.390P017044-WO (PCT) substrate handler 110, within the substrate handler station 115. As an example, the electromagnetic irradiator 166B may be one or more ultraviolet light emitters or any other electromagnetic wave emitter were the electromagnetic wave has a wavelength suitable for decontaminating the substrate handler 115. The electromagnetic irradiator 166B may be disposed on the top, sides, and / or bottom of the substrate handler station 115 so as to irradiate one or more surfaces of the substrate handler 110.

[0125] The contact-cleaning device 166D is disposed on the frame 115F and positioned within the frame so as to physically engage (e.g., contact) the substrate handler 110 for cleaning the substrate handler 110. For example, the contact-cleaning device 166D may be in the form of sponges, brushes, cloths, etc. that engage the substrate handler 110. The contact-cleaning device 166D may be disposed on a track so as to traverse along (i.e., on) one or more surface of the substrate handler 110 with the substrate handler 110 held stationary within the substrate handler station 115. The contact-cleaning device 166D may be stationary within the substrate handler station 115 where the substrate handler 110 is moved relative to and through / against the contact-cleaning device 166D. As an example, the contact-cleaning device 166D may be disposed on the top, sides, and / or bottom of the substrate handler station 115 so that the contact-cleaning device 166D physically engages one or more surfaces of the substrate handler 110.

[0126] The purging ports 166E are disposed on the frame 115 so as to introduce and / or remove gas to and / or from the interior of the substrate handler station 115. As an example, the purging ports 166E include the vent and pump conduits VC, PC. The purging ports 166E may provide for circulation of any suitable gas (e.g., clean dry air, nitrogen, or any other suitable gas) through the interior of the substrate handler station 155 so as to effect drying of the substrate handler 110 and / or drying of the interior of the substrate handler station 115. While the vent and pump conduits VC, PC are illustrated on the top of the substrate handler station 115, the vent and pump conduits VC, PC may be disposed at any suitable location of the substrate handler station 115 (such as on a side of the substrate handling station 115 opposite a nozzle or port that introduces a liquid and / orAtty. Docket No.390P017044-WO (PCT) gas into the substrate handling station 115 so as to effect a substantially uniform flow direction of the liquid and / or gas through the interior of the substrate handling station).

[0127] As may be realized, the one or more of the heater 725, liquid spray nozzles 166A, gas nozzles 166C, an electromagnetic irradiator 166B, contact-cleaning device 166D, purging ports 166E, or any other suitable device configured for cleaning the substrate handler 110 may be employed in any suitable combination and / or sequence to effect cleaning and / or drying of the substrate handler 110 and / or the interior of the substrate handler station 115. For example, the liquid spray nozzles 166A may wet the one or more surface of the substrate handler 110 and one or more of the heater 725, purging ports 166E, and gas nozzles 166C may effect drying and particulate evacuation from the interior of the substrate handler station 115. As another example, the contact-cleaning device 166D may be employed in combination with the liquid spray nozzles 166A, the gas nozzles 166C, and / or the purging ports to effect particulate evacuation from the interior of the substrate handler station 115. As a further example, the electromagnetic irradiator 166B may be employed with any one or more of the heater 725, liquid spray nozzles 166A, gas nozzles 166C, contact-cleaning device 166D, and purging ports 166E.

[0128] As described herein, the array of electromagnets 1700 is connected to the transport chamber 118 to form a drive plane DP at a predetermined height H relative to the level reference plane 1299 (See Figs.7A and 10B). The array of electromagnets 1700 are arranged so that a series of electromagnets 11700A-1700n of the array of electromagnets 1700 define at least one drive line 177-180, DL1-DL8 within the drive plane DP. The drive plane DP has: closed bounds that bound the linear electrical machine 700 and at least one of: conform to the sides of the transport chamber 118, and extend through the at least one closable port 118O; or predetermined bounds that define a platen travel space PTS throughout the linear electrical machine 700.

[0129] As also described herein, the electromagnets 1700 of the substrate transport apparatus 700 extend into the substrate handler stations 115 (and may extend into the carriers SHC) to provide for substrate handler traverse (i.e., movement) into and out of the substrate handler stations 115Atty. Docket No.390P017044-WO (PCT) (and into and out of the carriers SHC such as where the electromagnets 1700 extend into the carriers SHC) from the transfer chamber 118. Exemplary configurations of the electromagnets 1700 will be described below; however, it should be understood that the substrate transport apparatus 700, shown in Fig.1A-7C (also referring to Figs.40A-40C) is a representative transport apparatus and, includes at least one substrate handler 110 (a portion of which is illustrated in Figs. 40B, 40C for clarity) which is magnetically supported from the linear tracks 1550 formed by the array of electromagnets 1700.

[0130] The at least one substrate handler 110 (which is also generically referred to herein as a reaction platen is disposed to cooperate with the series of electromagnets 1700A-1700n of the array of electromagnets 1700 so as to controllably levitate and propel the at least one substrate handler 110 along at least one drive line 177-180, DL1-DL8, in a controlled attitude relative to the drive plane DP, such as for example, throughout the platen travel space PTS. As described herein the at least one substrate handler 110 may have a payload unit holder or end effector 1110E. The transport apparatus 700 will be described in greater detail below.

[0131] The transfer chamber 118 may form a frame 118M (see Fig.1) with a level reference plane 1299 (see Figs. 7A and 10B), e.g., that defines or otherwise corresponds (e.g., is substantially parallel) with a substrate transport plane 1290 (see Figs. 7A and 10B). The linear tracks 1550 formed by array of electromagnets 1700 may be mounted to the side walls 118S or floor 118L of the transfer chamber 118 (where the floor 118L forms a non-magnetic isolation wall between the array of electromagnets 1700 and the substrate handler 110) and may extend the length of the transfer chamber 118. This allows the substrate handler 110 to traverse the length of the transfer chamber 118. As will be described in greater detail below the array of electromagnets 1700 (also referred to herein as actuators 1700) form the linear tracks 1550 of Fig. 1, where each of linear tracks 1550 includes a respective array of electromagnets or actuators 1700A-1700n (see, e.g., Fig. 15). The array of electromagnets or actuators 1700A-1700n are referred to herein as a network of actuators as in Figs. 12A, 13A, 13B, 14B, 14C, 15, and 16 (e.g., that form at least one linear induction motor stator 1560 - noting that in Figs.12A-14C there are two rows of electromagnetsAtty. Docket No.390P017044-WO (PCT) illustrated for each drive line 177-180 (which are substantially similar to drive lines DL1-DL8 described above) for clarity of illustration but it should be understood that more than two rows of electromagnets may be provided per drive line as illustrated in Fig.16 (see also Figs.40A-40C), where one or more electromagnets are common to more than one drive line), connected to the transfer chamber 118 to form the drive plane DP at a predetermined height H relative to the reference plane 1299, the array of electromagnets 1700 (see also Fig.16) being arranged so that a series of the electromagnets 1700A-1700n define at least one drive line within the drive plane DP, and each of the electromagnets 1700A-1700n (see Fig.13B) in the array of electromagnets 1700 being coupled to an alternating current (AC) power source 1585 energizing each electromagnet 1700A-1700n, where the alternating power source is a three phase (or more) alternating current power source. As noted above (see Fig.13A), at least a portion of the substrate handler 110 , such as the base or platen 1510 (which is substantially similar to base 710), is formed of a paramagnetic, diamagnetic, or non-magnetic conductive material disposed to cooperate with the electromagnets 1700A-1700n of the array of electromagnets 1700 so that excitation of the electromagnets 1700A- 1700n with alternating current from the alternating current source 1585 generates levitation forces FZ and propulsion forces FP (see, e.g., Fig.27A) against the base 1510 that controllably levitate and propel the base 1510 along the at least one drive line 177-180, DL1-DL8 (see, e.g., Figs.1-6), in a controlled attitude relative to the drive plane DP (see, e.g., Figs.7A, 13A, and 14B).

[0132] As noted above, the chamber floor 118L forms a non-magnetic isolation wall 4400 (see Figs.40A-40C) between the array of electromagnets 1700 and the substrate handler 110. Here the array of electromagnets 1700 are disposed in an atmospheric environment while the substrate handler 110 is disposed in a vacuum environment of the transfer chamber 118. The non-magnetic isolation wall 4400 (and the chamber floor 118L) is selected so as to have a low electrical conductivity and a high resistivity to minimize the occurrence of Eddy Currents (and minimize magnetic field losses due to the Eddy Currents) while allowing a magnetic field to pass through the non-magnetic isolation wall 4400 to establish a magnetic circuit between the (e.g., coils / poles) of the electromagnets in the array of electromagnets 1700 and the base 1510 of the substrateAtty. Docket No.390P017044-WO (PCT) handler 110. Suitable examples of materials from which the non-magnetic isolation wall 4400 (and the floor 118L) include materials that are vacuum compatible and have a high resistivity, high stiffness, high yield strength, and high thermal conductivity such as, for example, 300-Series Stainless Steel that conforms with the electrical and magnetic (e.g., non-magnetic) properties noted above. A suitable example of the 300-series Stainless Steel includes, but is not limited to, 304 Stainless Steel. The chamber floor 118L may be constructed of a separate (i.e., different) material than that of the frame 118M such as to reduce costs of the transfer chamber 118 structure. For example, the frame 118M may be constructed of aluminum (or other suitable material) while the floor 118L is constructed of stainless steel (or other suitable material). Other suitable examples of material from which the non-magnetic isolation wall 4400 (and the floor 118L) may be constructed includes, but is not limited to, low conductivity aluminum such as a 6061 series aluminum (e.g., 6061-F, 6061-0, 6061-O, 6061-T4, 6061-T6, and 6061-T9).

[0133] With respect to the magnetic circuit formed between the (e.g., coils / poles) of the electromagnets in the array of electromagnets 1700 and the base 1510 of the substrate handler 110, the base 1510 is constructed of any suitable paramagnetic material. The paramagnetic material of the base 1510 has a low resistivity so as maximize induction of Eddy Currents, a low mass density to minimize weight of the base 1510, and be inert so as to be vacuum compatible and resistant at high temperatures (e.g., such as about 100°C or more). Suitable examples of materials from which the base 1510 may be constructed include, but are not limited to, 1100 series Aluminum Alloy (such as the 1100, 1100-O, and 1100-H18 Aluminum Alloys), and 6101 series Aluminum Alloy (such as the 6101-T6, 6101-T61, 6101-T63, 6101-T64, and 6101-T65 Aluminum Alloys). It is noted that for atmospheric applications of the transport described herein, the base 1510 may be constructed of copper or any of the other materials described herein for the base 1510.

[0134] The poles 4500P (see, e.g., Figs.41A-41D) of the electromagnets and the coil base plate are ferromagnetic and have a high magnetic permeability, high magnetic saturation, and high electrical resistivity (e.g., so as to minimize Eddy Currents) so as to maximize levitation efficiency for levitating the base 1510. As described herein, the poles and the coil base plate may beAtty. Docket No.390P017044-WO (PCT) constructed of any suitable soft magnetic composite (SMC) material with a magnetic saturation reaching about 2 Tesla. A suitable example of a soft magnetic composite material being, but not limited to, Hoganas’ 700HR 5P.

[0135] Referring also to Fig.43, an exemplary graph illustrating coil current versus frequency is illustrated with respect to Eddy Current loses. The graph shows finite element electromagnetic model analysis of several materials (e.g., the SMC materials noted above and stainless steel, such as the stainless steels described herein) from which the coil base plate and poles 4500P may be constructed. The graph illustrates modelling conditions where the Eddy Currents are turned off in the poles, the Eddy Currents are turned off in the coil base plate, the Eddy Currents are off in both the poles and the coil base plate, and the Eddy Currents are turned on in both the poles and the coil base plate. The graph illustrates a substantial elimination of Eddy Current loses with both the poles 4500P and the coil base plate constructed of the soft magnetic composite material, e.g., when compared to model conditions with the poles constructed of the SMC material and the coil base plate is constructed of stainless steel and to model conditions with the both the poles and the coil base plate constructed of stainless steel. Here, constructing both the poles and the coil base plate with the soft magnetic composite material provides for maximization of coil current given a predetermined voltage (e.g., in this analysis the peak (maximized) current is about 8.2 A with a voltage of about 43.2V).

[0136] Referring to Figs.41A-41D, the array of electromagnets 1700 may be modular and include array modules 1700M. The array modules 1700M include electromagnetic elements 4500 that are modularly coupled to the coil base plate in any suitable manner (such as, e.g., with any suitable retainers / fasteners) as illustrated in Fig. 41A. The electromagnetic elements 4500 may be integrally formed with the coil base plate. Each electromagnet element 4500 includes a base 4500B, a coil 4500C, and a pole 4500P. The pole 4500P may be monolithic, or constructed of more than one part 4500P1, 4500P2 that are coupled to each other (illustrated in Fig.41D) to form a respective pole 4500P. Electrical continuity may be effected between the electromagnetic elements 4500 through abutting contact between adjacent bases 4500B and / or through the coilAtty. Docket No.390P017044-WO (PCT) base plate. The poles 4500P, the base 4500B, and the coil base plate may be constructed of any suitable material such as any suitable soft magnetic composite (SMC) material. Here, each (or one or more) of the array modules 1700M may be removed from the transfer chamber 118 for maintenance without disruption of the vacuum integrity / environment within the transfer chamber 118 as the array modules are disposed on the atmospheric side of the non-magnetic isolation wall 4400 (e.g., the chamber floor 118L).

[0137] In accordance with the present disclosure, the array of electromagnets 1700 (or at least a portion thereof) may be used as heater for the substrate handler (e.g., so as to control heating of the platen and / or wafer to a desired predetermined temperature and for a desired predetermined time) as in the case where it is desired to eliminate water vapor (e.g., gas) or potentially pre-heat the wafer / substrate picked from, e.g., a load port en route to a process module or alternatively reduce thermal gradient between the wafer at the process module and the substrate handler 110 end effector 110E, 1520 (noting end effector 1520 may be substantially similar to end effector 110). The heating of the substrate handler 110 may be effected with the platen in transit or with the platen held static in a predetermined location / position. Still In accordance with the present disclosure, the array of electromagnets 1700 (or at least a portion thereof) may be used as heaters as in the case where it is desired that the transfer chamber 118 be heated for degas as in the case to eliminate water vapor for example. Controlled heating of the transfer chamber 118 to a predetermined temperature for a predetermined time may be with the platen static.

[0138] Referring now to Figs. 1, 12, and 15A-15C, the controller 199 controls the propulsion forces, generated by the array of electromagnets 1700, across the base 710, 1510 so as to impart a controlled yaw moment on the base, yawing the base 710, 1510 about a yaw axis (e.g., axis of rotation 777), substantially normal to the drive plane DP, from a first predetermined orientation relative to the frame of the chamber 118 (such as where the end effector 1520 is substantially aligned with drive line DL7, 177 – see also Figs. 10A and 14C), to a second different predetermined orientation relative to the frame of the chamber 118 (such as where the end effector is extended into process module 120 – see Figs. 1 and 14C). As may be realized yawing of theAtty. Docket No.390P017044-WO (PCT) base 710, 1510 may be performed in conjunction with propulsion motion of the base 710, 1510 (such as where a single drive line is provided in the chamber 118) or with the base at a predetermined location (such as where the base 1510 is rotated while remaining substantially stationary along the X and Y axes).

[0139] Referring also to Fig. 13C, the controller 199 controls the propulsion forces (e.g., Fxright, Fxleft), generated by the array of electromagnets 1700, so as to impart a moment couple (illustrated in Fig. 13C with movement of the substrate handler 110 along the X axis) on the base 1510 effecting controlled yaw of the base 1510 so as to effect at least one of positioning and centering of a substrate (also referred to as a wafer payload or payload) on the base 1510 relative to a predetermined substrate holding location (such as a load lock, process module, etc.) of the frame of the chamber 118. As may be realized, pitch (rotation about Y axis) and roll (rotation about X axis) (see Figs. 13A and 13B) control may be effected with the controller 199 (controlling lift forces Fz across the platen) simultaneously with yaw motion countering dynamic moment coupling and maintaining substantially flat yaw of the wafer holder / platen in the wafer transfer plane.

[0140] Where a single drive line 177 is provided in each transfer chamber (as illustrated in Fig.5 and 5A, and within the substrate handler stations 115) or where access to a process module 120, such as process module 120A (see Fig. 1) from a drive line DL1 closest to the process module 120A (such as when multiple substantially parallel longitudinal drive lines DL1-DL6, as illustrated in Fig.1, are provided), the controller 199 is configured to drive the base 1510 simultaneously in two or more of yaw, pitch, roll, and in propulsion (as described herein) to pick and place substrates from any suitable substrate holding stations (e.g. load locks 116, process modules 120, etc.). For example, the controller 199 is configured to energize the array of electromagnets 1700 as described herein so that the base moves along the drive line 177 and rotates about a base rotation axis 777 so that a substrate seating surface 1520A (see Figs.13A-13C) of the substrate handler 110 enters a process module 120 or other suitable holding station where the substrate S travels along a substantially straight line path 790 in a predetermined wafer / substrate transfer plane.Atty. Docket No.390P017044-WO (PCT)

[0141] Referring to Figs. 1-4, 6, and 12, where multiple longitudinal drive lines 177, 178, DL7, DL8 are provided in the transfer chamber 118 the base 710, 1510 may be rotated so that the substrate handler 110E, 1520 is aligned with a desired / predetermined substrate holding station prior to entrance into the substrate holding station. For example, the base 710, 1510 may be positioned at an intersection between drive lines 178 and 179A (see also the intersection between drive lines DL1 and DL7), where drive line 179 provides for extension and retraction of the substrate handler into substrate holding station 120BH of process module 120B (see Fig.12), or as illustrated in Fig.1 drive line DL1 provides for extension and retraction of the substrate handler into the substrate holding station of process module 120A (e.g., in a propulsion direction substantially orthogonal (or any suitable angle that enables access to the process module) to the propulsion direction along drive lines 177, 178, DL7, DL8). The base 710, 1510 may be rotated about rotation axis 777 (see Figs.13A-13C) so that the end effector 110E, 1520 is aligned with the substrate holding station and the base may be moved along the respective drive line to move or extend the end effector 110E, 1520 into the substrate holding station for picking / placing a substrate(s).

[0142] Referring to Figs.12 and 12A-12C as well as Figs.44A-45D, while the substrate handler (or as generically referred to herein, the reaction platen) 110 has been described as including an end effector 110E, 1520, one or more substrate handlers 110 may be configured as a cart 110C that is configured to support one or more substrates on the base 1510. For example, as illustrated in Figs. 12B, 12C, 44A-44C, the base 1510 may include one or more substrate supports 1431- 1433, 4431, 4432 configured to stably hold a substrate (e.g., from the bottom or edge grip) so that substrate handlers 110, 110A, 110B or substrate transports within or accessing, e.g., a load lock 116, transfer chamber 118, substrate handler station 115, or other substrate holding station, may transport substrate(s) to and from the substrate supports 1431-1433, 4431, 4432. The substrate supports 1431-1433, 4431, 4432 may be configured to substantially center one or more substrates S on the base 1510 (i.e., the supports are self-centering supports, that are either passive supports or may be actuated (e.g., piezo-electric) from a suitable power source energized on the base) soAtty. Docket No.390P017044-WO (PCT) that a center of the substrate(s) is substantially coincident with the axis of rotation 777 of the base. One or more of the carts 110C may include a substrate support rack 1440 for holding two or more substrates in a stack, where each rack level includes respective substrate supports 1431-1433, 1431A-1433A, 4431A, 4432A, 4431B, 4432B. Referring to Figs.12 and 12A, the carts 110C may provide an interface between the substrate handlers 110A, 110B and the load locks 116 where a transport apparatus 116R (such as a SCARA arm, linear sliding arm, etc.) of the load lock 116 transfers substrate(s) to the cart 110C and the substrate handlers 110A, 110B pick the substrates from the cart and vice versa. Where the process module 120 includes a transport apparatus 120R (or the load lock includes a transport apparatus 116R) (such as a SCARA arm, linear sliding arm, etc.) the carts 110C may be employed to transfer substrate(s) to and from the process module 120. The carts 110C may also traverse the substrate processing apparatus 100, 100A, 100B, 100C in a manner substantially similar to that described herein with respect to the substrate handlers 110A, 110B for effect transport and / or buffering of substrates S to and from any desired locations within the substrate processing apparatus 100, 100A, 100B, 100C.

[0143] While the base 1510 of the carts 110C (and of the substrate handlers 110, 110A, 110B) are illustrated as having a circular shape when viewed from the top (see Fig.12C), the base 1510 may have any suitable shape (e.g., square, rectangular, circular, etc. when viewed from the top) that otherwise interfaces with the array of electromagnets 1700 for effecting one or more of linear propulsion, lift, yaw, pitch, roll, and rotation control of the base 1510. As described herein, one or more of the bases 1510 may have unique shapes or any other suitable identifier feature 4700 (see Fig.47, such as e.g., an RFID tag, optical indicia (ArUco tag, April tag, bar code, etc.) so as to identify a respective substrate handler 110 to the controller 110 (e.g., such as in hander registry HREG, as described herein) for effecting control of the respective substrate handler 110.

[0144] Still referring to Figs.44A and 44B, the carts 110C may effect substrate alignment (e.g., rotational and / or planar alignment) with respect to any suitable substrate holding location (e.g., including, but not limited to, one or more of the end effector of a substrate handler and a processing module). Here a substrate aligner or wafer centering station 4444 is connected to the chamber inAtty. Docket No.390P017044-WO (PCT) communication with at least one closable port (see Figs.1-12 illustrating the closable port(s) and the array of electromagnets 1700). For example, the substrate aligner 4444 is provided within the substrate processing apparatus 100, 100A, 100B, 100C, where the substrate aligner 4444 includes one or more of the carts 110C and a portion of the array of electromagnets 1700. As described herein, the array of electromagnets 1700 is connected to a frame (e.g., of the chamber) to form a drive plane DP that extends at least in part within the wafer centering station 4444 at a predetermined height H relative to the level reference plane 1299 (see, e.g., Fig. 13A). As also described herein, at least one reaction platen 1510, having a wafer holding station (see substrate seating surface 1520A), is provided and disposed to cooperate with the electromagnets of the array of electromagnets 1700 so as to controllably levitate and propel the reaction platen 1510 with a predetermined drive motion along the drive plane DP.

[0145] The controller 199, as described herein, is operably coupled to the array of electromagnets 1700 and configured to excite the electromagnets so as to describe six degrees of freedom reaction platen control of the (at least one) reaction platen 1510, and the (at least one) reaction platen 1510 is levitated and propelled, at the wafer centering station 4444, in the predetermined drive motion with at least two degrees of freedom that effect automatic wafer centering of a wafer or substrate S held at the wafer holding station of the at least one reaction platen 1510.

[0146] In accordance with the present disclosure, the chamber is configured to hold a sealed environment therein; the chamber is a load lock chamber 116 of a wafer processing tool; and / or the automatic wafer centering station 4444 is located inside the chamber (e.g., transfer chamber, load lock chamber, substrate handler station, etc.).

[0147] As described herein, the automatic wafer centering station 4444 may have an imaging or vision sensor 4450 connected to the chamber with a camera imaging the wafer or substrate S held at the wafer holding station (of the reaction platen) with the at least one at least one reaction platen 1510 moved in the predetermined drive motion, imaging data of the wafer S in the predetermined drive motion providing information determining wafer center position and notch (see Fig. 45D)Atty. Docket No.390P017044-WO (PCT) location of the wafer S, and wherein the predetermined drive motion effects yaw and linear translation of the at least one reaction platen 1510 so that yaw rotation of the wafer holding station is about a point variably offset from a center of the wafer holding station (e.g., the rotation of the wafer S may be rotation about the wafer center, a yawing or linear motion about an axis offset from the wafer S center, in other words the rotation of the wafer need not be about the center of the wafer S). The automatic wafer centering station 4444 may have an elevation or distance sensor 4460A-4460C connected to the chamber for detecting an elevation of the at least one reaction platen 1510 being levitated.

[0148] The at least one reaction platen 1510 forms a lift, and the controller 199 is configured to at least one of raise, lower, and change a tilt angle of the wafer S (e.g., held on the reaction platen 1510) with the lift. The lift may effect transfer of the wafer S to and from the wafer holding station and a wafer handler, separate and distinct from the at least one reaction platen, the wafer transferred from the wafer holding station (of the automatic wafer centering station 4444) to the wafer handler 110, 110A, 110B being disposed in a predetermined centered position on the wafer handler 110, 110A, 110B (see, e.g., Figs.45A-45C).

[0149] The at least one reaction platen 1510 may form a shuttle, wherein the array of electromagnets 1700 is configured so that the drive plane DP extends outside the automatic wafer centering station 4444, and the controller is configured to levitated and propel the shuttle in the predetermined motion so that the shuttle exits and enters the wafer centering station 4444 to transport the wafer to and from a wafer holder, separate and distinct from the at least one reaction platen, and the automatic wafer centering station (see, e.g., Figs.44A-44C).

[0150] The substrate aligner 4444, employing the levitated cart 110C, provides for an aligner having hardware that could be leveraged between vacuum and atmospheric environments. For example, the substrate aligner 4444 may be employed in either an atmospheric (i.e., non-vacuum) environment (such as of a vented load lock 116 or other suitable atmospheric portion of the substrate processing apparatus) or a vacuum environment (such as of the transfer chamber 118, aAtty. Docket No.390P017044-WO (PCT) pumped load lock 116, a process module 120, a substrate handler station 115, or any other suitable vacuum portion of the substrate processing apparatus) of the substrate processing apparatus 100, 100A, 100B, 100C.

[0151] The substrate aligner 4444 employing the levitated cart 110 substantially eliminates seals, electronics, greases, and other wear components commonly included in conventional substrate aligners on which a wafer chuck is supported on a drive shaft that is driven in rotation by rotary motor. Further, as the cart 110C is levitated, the pitch of the cart into and out of the X-Y plane may be adjusted so that a plane of the substrate substantially matches a support plane of, for example, the end effector of the substrate transport 110A, 110B to reduce or substantially eliminate handoff leveling planarity issues.

[0152] The substrate aligner 4444 may provide for promotion of auto-teach optimization and metrology of, for example, substrate-processing characteristics (e.g., coating thicknesses, particulate detection, etc.). For example, the substrate aligner 4444 includes sensors (as described herein) that may be employed to measure or otherwise quantify the substrate-processing characteristics of a substrate and / or provide relative pose / location of two or more of a substrate, a cart 110C, and an end effector substrate handler 110, 110A, 110B for teaching the location of one relative to another.

[0153] The above aspects of the substrate aligner 4444 are provided by leveraging the levitated cart 110C and providing the cart with six degrees of freedom motion (as described herein). The sensors of the substrate aligner are employed, as described herein, to measure objects entering the substrate aligner 4444 to effect adjusting substrate location with non-collocated controls communicating with the sensors, based on substrate position measurements.

[0154] As illustrated in Figs. 44A and 44B, the substrate aligner 4444 incudes electromagnets from any suitable portion of the array of electromagnets 1700 (such as electromagnets within any one of the transfer chamber 118, the load lock 116, the process module 120, and the substrateAtty. Docket No.390P017044-WO (PCT) handler station 115 (noting that the substrate processing apparatus may include more than one aligner each being located in a respective one of the transfer chamber 118, the load lock 116, the process module 120, and the substrate handler station 115). The substrate aligner 4444 also includes one or more of the carts 110C, at least one vision sensor 4450, and at least one distance sensors 4460A-4460C.

[0155] The electromagnets of the portion of the array of electromagnets provides for, as described herein, six degree of freedom motion (e.g., X, Y, Z, pitch, and roll) of the cart 110. As described herein, the electromagnets are isolated from an interior of the transfer chamber 118, the load lock 116, the process module 120, or the substrate handler station 115 (each of which, as may be realized, includes a chamber having an internal atmosphere) by a non-magnetic isolation wall (such a floor of the respective chamber) so as to be sealed from the internal atmosphere within the chamber.

[0156] The sensors are non-collated for providing controls feedback to the controller 199. For example, the at least one vision sensor 4450 is positioned for viewing one or more of the substrate S, the cart 110C, the substrate handler 110, 110A, 110B through a window provided in a wall of a respective one of the transfer chamber 118, the load lock 116, the process module 120, and the substrate handler station 115. The at least one vision sensor 4450 provides feedback to the controller 199 for the controller 199 to effect one or more of substrate S centering, substrate edge detection, substrate notch detection (i.e., the substrate includes a notch as known in the art for rotationally orienting the substrate for processing), substrate characteristic detection (e.g., detection of particles disposed on the substrate), cart 110C positioning, and substrate handler end effector positioning. The at least one distance sensor 4460A-4460C provides feedback to the controller 199 with respect to a lift height of the cart 110C and / or substrate S held thereon relative to the drive plane DP (see, e.g., also Fig.14B where the base 1510 is maintained substantially at the predetermined height H of the drive plane DP – see Fig. 14B) and / or a planarity (e.g., pitch and roll angles) of the cart 110C and / or substrate S held thereon. The distance sensors 4460A- 4460C may also effect leveling (i.e., a level (pitch and roll) determination) of the end effector ofAtty. Docket No.390P017044-WO (PCT) the substrate handler 110, 110A, 110B and the vision sensor 4450 may effect position (e.g., X, Y) determination of the end effector. As may be realized, where the position (X, Y, Z) and pose (X, Y, Z, T, pitch, roll) of the end effector and cart 110C are known, the substrate handler 110, 110A, 110B and cart 110C may be controlled relative to each other for effecting substrate handoff therebetween.

[0157] Still referring to Figs.44A-44C and also to Figs. 45A-45C and 46, a substrate alignment process will be described. Controller 199 actuates electromagnets of the array of electromagnets 1700, as described herein, so that the cart 110C is moved to an area of the portion of the array of electromagnets 1700 corresponding to the substrate aligner 4444. The substrate handler 110, 110A, 110B with a substrate S held on the end effector 110E may be commanded (e.g., via actuation of the array of electromagnets as described herein) to transport the substrate S to the cart 110C and place the substrate S on the cart 110C (Fig. 46, Block 4600). The substrate S may be placed on the cart 110C (Fig.46, Block 4600) prior to movement of the cart 110C to the portion of the array of electromagnets 1700 corresponding to the substrate aligner 4444.

[0158] It is noted the controller 199 is configured to synchronize the motions of the substrate handler 110, 110A, 110B and the cart 110C so as to enable what may be referred to as a “high speed alignment” where alignment of the substrate occurs between a substantially continuous Z axis movement of the end effector 110E between placing of the substrate S to the cart 110C and picking of the substrate S from the cart 110C (where stoppage of the end effector 110E when changing direction along the Z axis between place and pick motions is de minimis). Here, as can be seen in Fig.45A, to place the substrate S on the cart 110C the end effector moves in direction ZD. The distance sensors 4460A-4460C may be employed to detect the Z position of the substrate S as the substrate is moved in the Z direction towards the cart 110C. When it is determined by the controller 199, based on data from the distance sensors 4460A-4460C, that the substrate S is no longer moving in the Z direction the vision sensor 4450 is employed to detect at least a peripheral edge of the substrate and / or notch (also referred to as a fiducial or flat – see Fig.45D) so that the controller 199 determines, based on data from the vision sensor 4450 the location / position of theAtty. Docket No.390P017044-WO (PCT) substrate S in the X and Y direction and / or the pose / orientation of the substrate S in the Rz (i.e., T) direction (Fig.46, Block 4610). With the position and pose of the substrate S known, the cart 11C is moved in the X and / or Y direction and / or rotated about the axis 777 to align the substrate in a predetermined position and pose relative to the end effector 110E (Fig.46, Block 4620).

[0159] As noted above, the determination of the substrate position and pose and movement of the substrate S to the aligned position and pose occurs within the end effector 110E place pick movement. As seen in Figs.45A-45C, the end effector 110E is moved in the direction ZD towards the base 1510 to a position adjacent the base 1510, and then reverses direction to move away from the base 1510, in direction ZU, to pick the substrate S so that the aligned substrate S is transferred from the cart 110C to the end effector 110E (Fig. 46, Block 4630). Here, substantially no time overhead (alignment time is de minimis) is added to the substrate processing time as the substrate detection and alignment occurs within the time is takes for the end effector to place and pick the substrate. It is noted, referring to Fig. 45D, that the end effector 110E is configured to allow substantially 360 degree rotation of the substrate S (e.g., to effect rotational Rz alignment of the substrate S), with the substrate S on the cart 110C and the end effector extended between the substrate S and the base 1510 of the cart 110C.

[0160] Referring to Figs.10A, 10B, 11A, 11B, while the transfer chamber 118 has been described above as a longitudinally extended chamber that forms part of a linear processing tool, the transfer chamber may have a cluster tool configuration, where the features of the present disclosure described herein may be applied to the cluster tool configuration. For example, referring to Figs. 10A and 10B the transfer chamber 118T1 has a substantially square configuration (although the transfer chamber may have any suitable shape such as hexagonal, octagonal, etc.). An electrical machine 700R (substantially similar to the linear electrical machine 700) may be configured as a side-by-side transport apparatus that includes at least two side-by-side substrate handlers 110A, 110B that are substantially similar to substrate handler 110 described herein. The array of electromagnets 1700 may be configured to move the substrate handlers 110A, 110B so that the substrate handlers 110A, 110B rotate about common axis of rotation 1277 (such axis being akinAtty. Docket No.390P017044-WO (PCT) to a θ axis of, for example, a conventional SCARA type robot) for changing a direction of “extension and retraction” (the terms extension and retraction are being used herein for convenience noting that the extension and retraction is effected by linear propulsion movement of the substrate handler 110, 110A, 110B along a respective drive line) of the side-by-side transport apparatus. For example, the array of electromagnets 1700 has an arrangement that forms drive lines 177, 178, 179, 180. Here drive lines 177, 178 are spaced from one another and substantially parallel to one other so as to be substantially aligned with a respective transport openings 1180A, 1180F and 1180B, 1180E (at least one of which may have a substrate handling station 115 coupled thereto). The drive lines 179, 180 are substantially orthogonal to drive lines 177, 178 and are spaced from one another and substantially parallel to one other so as to be substantially aligned with a respective transport openings 1180C, 1180H and 1180D, 1180G. The drive lines can be in any suitable pattern (such as arced or curved segments with constant or varying radii) and orientation and the description that follows is for exemplary purposes. The electromagnets 1700A- 1700N (illustrated in Fig.10A but not numbered for clarity of the figure) provide for at least linear propulsion of the substrate handlers 110A, 110B through the transport openings 1180A-1180H. The array of electromagnets 1700 may include rotational electromagnet sub-arrays 1231-1234 that effect, under control of controller 199, with the electromagnets that form the drive lines 177-180 the rotation of the substrate handlers 110A, 110B about the common axis of rotation 1277. Alternatively, the electromagnets may form a dense enough and large enough grid without being specifically designated for propulsion or rotation and can perform that function based on the base’s 1510 position and the control law of the controller 199. As may be realized, while the substrate handlers 110A, 110B may rotate about the common axis of rotation 1277 at the same time, extension and retraction of the substrate handler 110A, 110B may be independent of extension and retraction of the other one of the substrate handler 110A, 110B. In general, the motion of the substrate handler 110A, 110B is independent of each other and the complexity of that motion can range from one degree of freedom to six degrees of freedom.Atty. Docket No.390P017044-WO (PCT)

[0161] Referring to Fig.10B, the electrical machine 700R may include multiple transport levels 1220A, 1220B that are stacked one above the other. Each level 1220A, 1220B is formed by a respective level support 1221 each having a respective reference plane 1299R that is substantially parallel with the level reference plane 1299 of the transfer chamber 118T1 frame. Each level support 1221 includes an array of electromagnets 1700 substantially similar to that illustrated in Fig.10A for linearly driving the side-by-side substrate handlers 110A, 110B along drive lines 177- 180 and rotating the side by side substrate handlers 110A, 110B (e.g., with full six degree of freedom control) about the common axis of rotation 1277. Each level support 1221 is coupled to a common Z axis drive 1211 that moves the level supports 1221 and the substrate handlers 110A, 110B thereon in the Z direction so as to align the end effectors 1520 of the substrate handlers 110A, 110B on the respective level supports 1221 with a substrate transport plane 1290 of the transport openings 1180 of the transfer chamber 118T1. The Z axis drive 1211 may be any suitable linear actuator such as a screw drive, electromagnetic drive, pneumatic drive, hydraulic drive, etc.

[0162] Referring to Figs.11A and 11B the transfer chamber 118T2 has a substantially hexagonal configuration (although in other aspects the transfer chamber may have any suitable shape as noted herein). The electrical machine 700R (substantially similar to the linear electrical machine 700 of Fig.13C) may be configured as a radial transport apparatus that includes a substrate handler 110 having a double ended / sided end effector 1520D, as will be described herein (although a single ended / sided end effector may be employed). The array of electromagnets 1700 may be configured to rotate the substrate handler 110 about axis of rotation 1377 (such axis being akin to a θ axis of, for example, a conventional SCARA type robot) for changing a direction of “extension and retraction” (the terms extension and retraction are being used herein for convenience noting that the extension and retraction is effected by linear propulsion movement of the substrate handler 110 along a respective drive line), and linearly propel the substrate handler 110 so as to extend through the transport openings 1180A-1180F. For example, the array of electromagnets 1700 has an arrangement that forms radially offset drive lines 177, 178, 179, where an angle α between adjacent drive lines depends on the number of sides / facets of the transfer chamber 118T2 on which theAtty. Docket No.390P017044-WO (PCT) transport openings 1180A-1180F are located (again, at least one of the transport openings may have a substrate handler station 15 coupled thereto). The electromagnets 1700A-1700N (illustrated in Fig. 10A but not numbered for clarity of the figure) provide for at least linear propulsion of the substrate handler 110 through the transport openings 1180A-1180H and rotation of the substrate handler 110 about axis of rotation 1377 with full six degree of freedom control so as to maintain linear transport and rotation in a desired attitude in pitch and roll.

[0163] Referring to Fig. 11B, the electrical machine 700R includes multiple transport levels 1320A, 1320B that are stacked one above the other in a manner substantially similar to that described above with respect to Fig.10B. For example, each level 1320A, 1320B is formed by a respective level support 1321 each having a respective reference plane 1299R that is substantially parallel with the level reference plane 1299 of the transfer chamber 118T1 frame. Each level support 1321 includes an array of electromagnets 1700 substantially similar to that illustrated in Fig. 11A for linearly driving (along drive lines 177-179) and rotating (about axis 1377) the substrate handler 110. Each level support 1321 is coupled to a common Z axis drive 1311 (that is substantially similar to Z-axis drive 1211) that moves the level supports 1321 and the substrate handler 110 thereon in the Z direction so as to align each of the end effector 1520D of the substrate hander 110 on the respective level supports 1321 with a substrate transport plane 1390 of the transport openings 1180 of the transfer chamber 118T2.

[0164] Referring to Figs.10B and 11B, the vertical motion provided by the Z actuator 1211 can be used for enabling the substrate handler 1220A or 1220B to perform wafer handoff operations such as pick or place to / from a wafer process station. The supports 1221, 1321 can include a single module (level) with the purpose of providing additional elevation capability to the substrate handler 1220A, 1220B to achieve larger vertical strokes during the wafer handoff operations. For example, in the case of process modules or load locks that have more than one stacked wafer slot, it would be advantageous to have a vertical lift apparatus such as Z-axis actuator 1211, 1311 to be able to reach each of the stacked wafer slots without increase of applied levitation power provided by the electrical machine 700R.Atty. Docket No.390P017044-WO (PCT)

[0165] Referring to Figs. 10A and 10B, the vertical lift apparatus (or Z-axis actuator) 1211 and level 1221 may have dual (or more) separate and independently operable apparatus, e.g., one for each substrate handler 1520. This would give the ability to perform independent vertical strokes for different substrate handlers that can access different slots on at least two independent stations (e.g., process modules, load locks, etc.).

[0166] Referring now to Figs.13A, 13B, 13C, 14A, 14B, 14C, and 16, the linear electrical machine 700 will be described in greater detail (again noting that the electrical machine 700R is substantially similar to the linear electrical machine 700). Generally, the linear electrical machine 700 includes a structure (e.g., substrate handler) 110 without magnets and any moving parts such as bearings, revolute or prismatic joints, metal bands, pulleys, steel cables or belts. As noted above, the structure or substrate handler 110 includes the base 1510, which is formed of a paramagnetic material, diamagnetic material, or a non-magnetic conductive material. The base 1510 may have any suitable shape and size for cooperating with the electromagnets 1700A-1700n of the array of electromagnets 1700 so as to stably transport substrates S in the manner described herein. As will be described herein, such as where multiple substrate handlers 110 are employed, the shape and size of the base 1510 may define a unique identification signature that identifies the substrate handler 110 with respect to absolute position determination of the substrate handler in the manner(s) described herein.

[0167] The base 1510 may have a frusto-conical shape where the tapered side 1510TS of the frustum 1510FR face the array of electromagnets 1700 (although other suitable shapes are operative, such as the octagonal shape illustrated in Fig. 1 which may also have tapered sides similar to those shown in Figs. 13A-14C). Here the tapered side 1510TS of the frusto-conical shape have an angle λ (see Fig.13B) that is between about 50° and about 60° relative to the planar surfaces of the frustum 1510FR; although the angle λ may be greater than about 60° or less than about 50°. The base may have a frusto-pyramidal (i.e., four sides) shape or any other suitable shape having any suitable number of sides, such as, for example, six or eight sides or may be round or have curved sides such as described in United States patent number 11,476,139 issued onAtty. Docket No.390P017044-WO (PCT) October 18, 2022 and United States patent application number 18 / 050,300 filed on October 27, 2022, previously incorporated herein by reference in their entireties. The base 1510 may not have a frusto-conical or frusto-pyramidal shape and it may comprise of a planar shape with suitable and asymmetric contour and size in order to be properly controlled by electromagnets 1700.

[0168] The end-effector 1520, 1520D may be substantially similar to end effector 110E. The end effectors 110E, 1520, 1520D may be substantially similar to conventional end effectors; however, as described herein the end effector may be rigidly coupled to the base 1510. As an example, the end effector may be a single sided / ended (see end effector 1520) with a single substrate holding location 1520A, a double sided / ended (see end effector 1520D) with two longitudinally spaced apart substrate holding locations 1520A, 1520B, a side-by-side configuration where multiple substrate holding locations are arranged side-by-side (e.g., laterally spaced apart) and supported from a common base so as to extend through side-by-side substrate transport openings, a stacked configuration were multiple substrate holding locations are arranged in a stack one above the other and supported from a common base so as to extend through vertically arrayed substrate transport openings, although the end effector may have any suitable configuration. The end effector 1520, 1520D may be made of materials that can one or more of withstand high temperatures, have low mass density, have low thermal expansion, have low thermal conductivity and have low outgassing. A suitable material from which the end effector 1520, 1520D may be constructed is Alumina Oxide (A12O3), although any suitable material may be used.

[0169] The end-effector 1520, 1520D may be coupled to the base 1510 with a substantially rigid and unarticulated stanchion 1510S so as to set the end-effector 1520, 1520D at a suitable nominal height H2 relative to, for example, the level reference plane 1299. The substrate handler 110, as described herein, is moved in space (in at least three degrees of freedom) using electrodynamic levitation principles. The actuation elements (e.g., the array of electromagnets 1700), as shown in Figs. 13A-13C, 14B, 14C, and 16 include independently controlled coils or electromagnetics 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5- 1700n5 (also referred to herein as coil segments) that generate desired magnetic field that inducesAtty. Docket No.390P017044-WO (PCT) thrust and lift force vectors in the base 1510. As will be described herein, the independently controlled coils or electromagnetics 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3- 1700n3, 1700A4-1700n4, 1700A5-1700n5 also effect self-deterministic absolute substrate handler position feedback for each substrate handler(s) 110.

[0170] As described herein linear propulsion of the substrate handler 110 is generally provided by one or more linear tracks 1550 (see, e.g., Figs.1, 5A, 10A, 11A, 12A 13A-13C, 14B, 14C, 16) of independently controlled electromagnets 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5. The number of electromagnets 1700A- 1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5. Where there is more than one linear track 1550 the linear tracks 1550 are substantially parallel to each other and are spaced apart from one another depending on dimensions of the base 1510 so as to control all six degrees of freedom (roll, pitch, yaw (T), and translation in each of the X, Y, Z directions) of the substrate handler in space. For example, as illustrated in Figs.13B and 16, the electromagnets 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4- 1700n4, 1700A5-1700n5 may be spaced apart from each other so that two or more electromagnets 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5- 1700n5 (cooperating so as to form a motor actuator (e.g., the motor primary) 1701 and in combination with the base (e.g., the motor secondary) 1510 the motor) of each parallel linear track 1550 are disposed underneath the base 1510 at all times in the direction of motion of the base 1510 so as to stably levitate and propel the base 1510 (as may be realized, Figs. 13A, 13B, and 16 schematically illustrate a representative configuration of the system, and are provided to show generally an exemplary representation of the interrelationship between the base 1510 and the electromagnets 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4- 1700n4, 1700A5-1700n5, and is not intended as limiting in any way.

[0171] The size, numbers, and spacing (e.g., pitch – see for example Fig.5A) of the electromagnets 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3. 1700A4-1700n4, 1700A5- 1700n5 in both the X and Y axes may vary, as may the size and shape of the base 1510 in relationAtty. Docket No.390P017044-WO (PCT) to the electromagnets 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5. For example, referring to Figs.5A and 16, the spacing between the electromagnets 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4- 1700n4, 1700A5-1700n5 may vary between pitch PX1 and pitch PX2 where the pitch PX2 is smaller than pitch PX1 and provides for greater definition of movement of the base 1510 and substrate handler 110. Here, the larger pitch (or greater distance between electromagnets) such as pitch PX1 is employed for long movements of the substrate handler 110 where position location of the substrate handler 110 is to be grossly known. In areas where picking and placing of substrates S occurs (or other areas where substrate handler position is to be known with increased position definition / accuracy), such as at the process module 120, the spacing or pitch PX2 between the electromagnets is decreased to provide a higher electromagnet density that effects greater definition of position location of the substrate handler 110 (compared to the definition of position location provided by electromagnets spaced apart by the larger pitch PX1) so that the substrate handler 110 picks and places substrates S at the process module 120 with sub-micron position accuracy. In the examples illustrated the pitch PX of the electromagnets 1700A-1700n, 1700A1- 1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 is shown as varying in the X direction along the longitudinal length of the transfer chamber 118 to provide varying degrees of substrate handler position accuracy; however, the pitch of the electromagnets 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5- 1700n5 may also vary in the Y direction (see pitches PX3 and PX4) along a lateral width of the transfer chamber 118 so as to provide increased accuracy with respect to substrate handler 110 rotations and / or Z axis height movements. For example, in the areas where picking and placing of substrates S occurs (or other areas where substrate handler position is to be known with increased position definition / accuracy) the pitch between electromagnets may be a decreased pitch PX3 compared to a pitch between the electromagnets in the areas of long motions (e.g., motions between substrate holding stations) where substrate handler rotations and Z height motions are not desired.Atty. Docket No.390P017044-WO (PCT)

[0172] As illustrated in Figs. 5A and 16, the array of electromagnets 1700 may include stabilization tracks 1550S disposed laterally outward of the tracks 1550. In Fig.16 the stabilization tracks 1550S may be formed by one or more rows of the electromagnets 1700A-1700n, 1700A1- 1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5. The stabilization tracks 1550S may be substantially similar to the tracks 1550 and are configured to provide additional stabilization of the base 1510 through the generation of additional lift and / or propulsion forces (e.g., in addition to the lift and propulsion forces generated by electromagnets of the parallel linear tracks 1550) that act on the base 1510. The result is a substrate handler 110 that can move along a direction of the tracks 1550 (i.e., the propulsion direction) while changing orientation in one or more of roll, pitch and yaw. According to magnetic induction principles where the electromagnets 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4- 1700n4, 1700A5-1700n5 are akin to the “primary” and the base 1510 corresponds to the “secondary” where electrical currents are induced by means of Eddy current effects.

[0173] Figs.15 and 18 illustrate an actuator control system network 1799 (which may be part of or communicably coupled to controller 199), in accordance with the present disclosure, configured to effect individual control of each electromagnet 1700A-1700n, 1700A1-1700n1, 1700A2- 1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 to provide the desired force components and degrees of freedom described and illustrated with respect to Figs.13A-14C. The actuator control system may be configured so that the electromagnets 1700A-1700n, 1700A1- 1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 form motor actuator units (collectively referred to as the motor actuator), each motor actuator unit having m number of electromagnets / coils cooperating to form the motor (where m is a dynamically selectable number of two or more electromagnets forming one or more of the motor actuator units as will be described further below). The actuator control system network 1799 is thus a scalable motion control system that has a clustered architecture with at least a master controller 1760 and distributed local drive controllers 1750A-1750n as will be described in greater detail below. Groups of electromagnets 1700G1-1700Gn are coupled to a respective local drive controllerAtty. Docket No.390P017044-WO (PCT) 1750A-1750n that is configured to control the electrical currents on electromagnets 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 within the respective group of electromagnets 1700G1-1700Gn. The local drive controller 1750A-1750n can be a “slave” in a network that is connected to a master controller 1760 that is configured to specify the desired forces (e.g., thrust and lift) for each individual electromagnet 1700A-1700n, 1700A1- 1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 to effect the desired motion of the substrate handler 110 in space. The drive controllers 1750A-1750n, illustrated generally as drive controller 1750 in Fig.18 (where Fig.18 illustrates a drive controller and its respective group of electromagnets 1700G1-1700Gn) are coupled to the respective electromagnets 1700A-1700n by an amplifier drive circuit 2010 as will be described herein.

[0174] As will also be described herein, the electromagnets 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 can be physical electromagnets / coils that can be dynamically configured when it comes to the respective “phase” definitions of each coil with respect to “phase” definitions of the other electromagnets / coils of the given motor actuator unit so that the position of the given motor actuator unit (formed of cooperative excitation phases of the motor under propulsion) may be deemed as moving virtually in unison with the base propulsion, though the physical electromagnets / coils are fixed (e.g., static) as will be described further below. This provides continuity in the desired force vectors for motion control of the substrate handler.

[0175] In accordance with the present disclosure, and referring to Figs.16 and 17, the controller 199 may be operably coupled to the array of electromagnets 1700 and the alternating current power source 1585 and configured to sequentially excite the electromagnets 1700A-1700n, 1700A1- 1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5with multiphase alternating current with a predetermined excitation characteristic (such as, e.g., inductance, a phase lag / amplitude, and / or power factor as will be described herein – see also Figs.21 and 25) so that each platen or base 1510 (of the substrate handler 110 or cart 110C) is levitated and propelled with up to six degrees of freedom. Here, as will be described in greater detail herein, the controller 199Atty. Docket No.390P017044-WO (PCT) is configured so as to determine reaction platen position feedback, in at least one degree of freedom from the up to six degrees of freedom, from variance in the predetermined excitation characteristic of the alternating current of at least one electromagnet 1700A-1700n, 1700A1-1700n1, 1700A2- 1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 effecting levitation or propulsion of the base 1510. The variance in the predetermined excitation characteristic defines self- deterministic reaction platen position feedback of each of the at least one electromagnet 1700A- 1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5, of the array of electromagnets 1700, effecting levitation or propulsion of the base 1510.

[0176] As described herein, the array of electromagnets 1700 includes electromagnets 1700A- 1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 configured to produce levitation and propulsion forces that drive, under control of controller 199, the substrate handler 110 along a predetermined trajectory through the transfer chamber 118. To drive the substrate handler 110 along the predetermined trajectory the controller 199 is configured to determine a real time spatial position (e.g., in one or more of the up to six degrees of freedom X, Y, Z, Rx (roll or pitch), Ry (roll or pitch), Rz (T or rotation in the X-Y plane)) of the substrate handler 110. Here absolute position feedback of the substrate handler 110 is determined by the controller 199 (or any other suitable controller such as included in the actuator control system network 1799) based on the effects of magnetic induction on the interaction between the base 1510 of the substrate handler 110 (or cart 110C) and each electromagnet (e.g., actuator) 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5. For example, as can be seen in Fig.17, the base 1510 and each electromagnet create a magnetic circuit 1910 (only electromagnet 1700A is shown in Fig.17 for illustrative purposes only and a similar circuit is formed with the other electromagnets 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 when the base 1510 passes over and is driven by the other electromagnets) that effects the levitation and propulsion of the base 1510 by the electromagnet 1700A. Each electromagnet 1700A (again noting electromagnet 1700A is used for exemplary purposes only and that the other electromagnets 1700A-1700n, 1700A1-1700n1,Atty. Docket No.390P017044-WO (PCT) 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 are substantially similar) has a resistance R and an inductance L. An input voltage V of the electromagnet 1700A is, as described herein, a multiphase alternating current voltage with a predetermined amplitude and frequency that is applied to a predetermined electromagnet 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 for driving the base 1510 as described herein, where the predetermined electromagnet 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 has a known location within the transfer chamber 118. As may be realized, the resulting current I through electromagnet 1700A is determined by a dynamic response of the circuit 1910 to the input voltage. For a given input voltage V at a given time t, the respective current I in the electromagnet 1700A can be determined with the following equation:

[0177] V(t) = R I(t) + L dI(t) / dt [eq.1]

[0178] where, R is the resistance of the electromagnet 1700A and L is the inductance of the electromagnet 1700A.

[0179] Referring to FIGS.51-54, a linear electrical machine 5000 (also referred to as a levitation tool coil drive module, which is substantially similar to the linear electrical machines 700 and 700R except for as described hereafter) includes a structural support frame 5010 for supporting an array of electromagnets 1700 and passive ferromagnetic elements 5050 surrounding the electromagnets 1700. For exemplary purposes, the linear electrical machine includes: a transport chamber 118 with a level reference plane 1299 and configured to hold a sealed environment, the transport chamber 118 has at least one closable port 118O along one or more sides of the transport chamber 118; an array of electromagnets 1700 is connected to (a frame of) the transport chamber 118 to form a drive plane DP at a predetermined height H relative to the level reference plane 1299 (see, e.g., Fig. 13A), the array of electromagnets 1700 being arranged so that a series of electromagnets of the array of electromagnets define at least one drive line within the drive plane DP, where the drive plane DP has predetermined bounds that define platen travel space throughoutAtty. Docket No.390P017044-WO (PCT) the linear electrical machine; and a framework (see, e.g., Figs. 51-53) with longitudinal and transverse members joined to each other in a configuration that frames the array of electromagnets 1700 within the frame work, the frame work being connected to and disposed outside the transport chamber 118 below the level reference plane 1299; wherein the array of electromagnets 1700 includes at least one array module 5090 of a partial series of the series of electromagnets being held in the array module 5090 so as to be removably mounted and unmounted to the framework as a unit via mounting and unmounting of the array module 5090. As described herein, perimetrical poles 5051 may be disposed on the framework surrounding the array of electromagnets 1700 so that each perimetrical pole 5051, along each side of the framework, is juxtaposed adjacent a corresponding outermost electromagnet along a proximate side, of the array of electromagnets, proximate to the side of the framework.

[0180] As noted above, the array is connected to the transport chamber 118 to form a drive plane DP (Figs. 7A, 14A, etc.) at a predetermined height H relative to the level reference plane 1299 (Fig.7A). The electromagnets 1700 are arranged so that a series of electromagnets 1700A-1700n define at least one drive line 177-180, DL1-DL8 (Figs. 4, 10A, etc.) within the drive plane DP. The electromagnets 1700 includes electromagnets 1700A-1700n, 1700A1-1700n1, 1700A2- 1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 configured to produce levitation and propulsion forces that drive, under control of controller 199, the substrate handler 110 along a predetermined trajectory through the transfer chamber 118. The electromagnets 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 can be physical electromagnets / coils that can be dynamically configured when it comes to the respective “phase” definitions of each coil with respect to “phase” definitions of the other electromagnets / coils of the given motor actuator unit so that the position of the given motor actuator unit (formed of cooperative excitation phases of the motor under propulsion) may be deemed as moving virtually in unison with the base propulsion, though the physical electromagnets / coils are fixed (e.g., static). This provides continuity in the desired force vectors for motion control of the substrate handler 110.Atty. Docket No.390P017044-WO (PCT)

[0181] The passive ferromagnetic elements 5050 are disposed so as to surround the electromagnets 1700 and include a pole 5051 and base 5052 without coils installed (i.e., the passive ferromagnetic elements 5050 bound the linear electrical machine 5000). The passive ferromagnetic elements 5050 are formed from materials such as, e.g., soft magnetic composite or any other suitable material to allow the magnetic circuit to be “closed” at the perimeter of the machine 5000 (i.e., allows for the magnetic flux 5040 to flow from the “last active” electromagnets 1700 to the edge of the machine 5000 (see, Fig. 54). For example, as seen in Fig. 52, a Coil Drive Module 5090 (populated with an array of electromagnets 1700) is installed relative to the surrounding frame 5010. The machine 5000 populated with the Coil drive Modules 5090 is surrounded with passive ferromagnetic elements 5050. Fig. 54 shows the magnetic flux path between the “last active” electromagnets 1700 and the passive ferromagnetic elements 5050 (i.e., perimetrical Pole 5051 / Base 5052 without the coils). Thus, a magnetic flux path is maintained in the periphery of the tool without the need to consume copper from coils that would not need to be energized. For example, the array of electromagnets 1700 includes independently controlled coils or electromagnetics 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4- 1700n4, 1700A5-1700n5 and the passive ferromagnetic elements 5050 surround the electromagnets 1700. The electromagnets 1700 generate a desired magnetic field that induces thrust and lift force vectors in the substrate handler 110 and maintains a magnetic flux path in the periphery elements 5050.

[0182] The passive ferromagnetic elements 5050 and electromagnets 1700A-1700n, 1700A1- 1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 may be spaced apart from each other and disposed underneath the floor 118L of the transfer chamber 118 so as to stably levitate and propel the substrate handler 110 (see, Figs.13A, 13B, and 16 that schematically illustrate a representative configuration of the system, and are provided to show generally an exemplary representation of the interrelationship between the substrate handler 110 and the electromagnets 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4- 1700n4, 1700A5-1700n5, and is not intended as limiting in any way). As described previously,Atty. Docket No.390P017044-WO (PCT) the size, numbers, and spacing (e.g., pitch – see for example Fig. 5A) of both the passive ferromagnetic elements 5050 and the electromagnets 1700A-1700n, 1700A1-1700n1, 1700A2- 1700N2, 1700A3-1700n3.1700A4-1700n4, 1700A5-1700n5 in both the X and Y axes may vary, with a smaller pitch providing for greater definition of movement of the substrate handler 110 and a larger pitch providing for long movements of the substrate handler 110.

[0183] Referring also to Fig. 18, each of the electromagnets 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 of the array of electromagnets 1700 is communicably coupled to an amplifier driver circuit 2010. The amplifier driver circuit 2010 includes a field-effect transistor 2011 and is configured to provide feedback of the respective electric current I flowing through a respective electromagnet 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5.

[0184] As, may be realized, the current I flowing through the electromagnet 1700A lags (in time) the input voltage V (e.g., phase lag). The phase lag can be expressed in the voltage drop across the inductor L of the electromagnet 1700A as:

[0185] dI(t) / dt [eq.2]

[0186] Referring to Figs. 16, 17, and 19A-19C, the amount of phase lag (e.g., between the excitation voltage V and the current I of the electromagnet 1700A) depends on the resistance R and the inductance L of the magnetic circuit 1910. An electric circuit representation of the electromagnet 1700A is illustrated in Fig.19A with the electromagnet 1700A under an alternating input voltage excitation without the base disposed adjacent the electromagnet 1700A (i.e., the left side of Fig.19A) and with the base 1510 disposed adjacent the electromagnet 1700A (i.e., the right side of Fig.19A). It is noted that the base 1510 is disposed above the electromagnet 1700A with a predetermined air gap distance for exemplary purposes, although the base 1510 may be magnetically suspended by the electromagnets in any suitable manner. Here, the alternating current voltage V generates a respective alternating current I with a lagged response (e.g., laggedAtty. Docket No.390P017044-WO (PCT) behind the voltage V in time) as a function of the inductance L of the electromagnet 1700A. The periodic voltage V(t) through the electromagnet 1700A can be expressed as follows:

[0187] V(t) = V0sin(ωt) [eq.3]

[0188] where V0is the voltage amplitude and ω is the angular frequency. The periodic current I(t) can be expressed as follows without the presence of the base 1510 adjacent the electromagnet 1700A:

[0189] I1(t) = I01 sin(ωt + ϕ1) [eq.4]

[0190] and as follows with the base 1510 present adjacent the electromagnet 1700:

[0191] I2(t) = I02 sin(ωt + ϕ2) [eq.5]

[0192] where I0is the current amplitude and ϕ1 and ϕ1 are the respective magnetic fluxes. As may be realized, the current I responses between the electric circuit on the left side of Fig. 19A (e.g., without the base 1510 adjacent the electromagnet 1700A) and the electric circuit on the right side of Fig. 19A (e.g., with the base 1510 adjacent the electromagnet 1700A) are substantially different because the inductance L is affected by the presence of the base 1510 due to the induction of Eddy currents that impact the magnetic field generated by the electromagnet 1700A.

[0193] Referring to Figs.15 and 18, the local controller 1750, 1750A-1750n commands excitation of the electromagnet 1700A with an input voltage V and is configured to determine the resultant electromagnet current I in any suitable manner (such as by being programmed to execute equations 4 and 5 above or by being configured to measure the current in the electromagnet 1700A in any suitable manner). Knowing the input voltage V and the resultant electromagnet current I the local controller 1750, 1750A-1750n determines the phase lag between the voltage V and current I; and based on the phase lag the local controller 1750 determines if the base 1510 or any portion thereof is located adjacent the electromagnet 1700A. Here, the amount of phase lag is employed toAtty. Docket No.390P017044-WO (PCT) quantify the relative position of the base 1510 with each of the electromagnets 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5.

[0194] Fig.19B is an exemplary illustration of the base at different locations X1-X4 relative to, e.g., electromagnet 1700A along a unidimensional path 2110 (although the path may be multidimensional). An equation representing the current I1(t), I2(t), I3(t), I4(t) for each respective location 1-X4 is provided in Fig. 19B. For exemplary purposes, the input voltage V may be considered substantially constant. As the base 1510 moves relative to the electromagnet 1700A, the respective current I response changes at least in phase (and may also change in amplitude). Based on the change in phase of the current I, the measured current I response and the given input voltage V are correlated with the position X1-X4 of the base 1510 along the path 2110. For example, the correlation of the measured current I response and the given input voltage V with the position X1-X4 of the base 1510 may be expressed in terms of a change in the mutual inductance L of the electromagnet 1700A. The mutual inductance L between the electromagnet 1700A and the base 1710 can be expressed as follows:

[0195] ^^^^(^^^^)= ^^^^ ^^^^ +1 ^^^^^^^^2 ∫− ^^^^ ^^^^ ^^^^ ∫^^^^−^^^^ ^^^^ ^^^^ ^^^^ ^^^^(^^^^, ^^^^)^^^^( ^^^^, ^^^^) [eq. 6]is the 1510 half-length, b is the base 1510 half-width, x and y are the base 1510 location in space, Bcis the magnetic flux density at the electromagnet, and T(x, y) is a linear combination of basic functions.

[0197] With reference to Fig. 19B, the relationship between the mutual inductance L and the position X of the base 1510 is illustrated in Fig.19C. It is noted that the location X=3 in Fig.19B (with the base 1510 located substantially directly over or fully covers the electromagnet 1700A) is illustrated as location X=0 in Fig.19C. As the location of the base 1510 changes from X3 to X1 (the base is moving along path 2111 in Fig.19B) the base 1510 moves out of alignment with the electromagnet 1700A causing the mutual inductance L to increase. The mutual inductance LAtty. Docket No.390P017044-WO (PCT) reaches a maximum value when the base 1510 completely clears the electromagnet 1700A, such as when the base is at location X1 (see Fig.19B) relative to the electromagnet 1700A.

[0198] As described above, inductance is utilized to identify the location of the base 1510 in space for exemplary purposes only. Referring also to Figs.17, 42A and 42B, any suitable variables may be employed to identify the location of the base 1510 in space. For example, the circuit 1910 in Fig.17 has an inherent characteristic that may be leveraged to provide a self-deterministic position feedback solution of the reaction platen. Here, the relationship between the voltage and the current may be out of phase due to the reactive load caused by the inductor (coil). The power (e.g., apparent power) to drive current through the coil 4500C is higher than the power (e.g., the real power) dissipated through the coil 4500C itself as illustrated in Fig.42A. The apparent power is supplied by the power supply (such as current amplification power supply units 3011 or any other suitable power supply) to drive a predetermined alternating current through the coil 4500C. The real power shown in Fig. 42A is dissipated through the coil resistance and the reactive power is the load resulting from the inductive reactance of the coil 4500C.

[0199] The relationship between the coil resistance and the inductive reactance is illustrated in Fig. 42B. The impedance Z is the equivalent load on the power supply (such as current amplification power supply units 3011 or any other suitable power supply). The angle ɸ is the phase difference between the coil AC voltage and the respective AC current. Where the impedance reactance is larger than the coil resistance, the angle ɸ may be close to or approached about 90° in which case substantially no current passes through the coil 4500C, resulting in a lack of levitation of the base 1510. The measure of such efficiency is called the power factor (PF), which is defined as the cosine of the angle ɸ (i.e.PF = cos ɸ).

[0200] To maximize the levitation efficiency, the power factor is maximized to be or approaches about 1 (e.g., as close to 1 as possible), where the angle ɸ is (or approaches) zero. To maximize the power factor, a capacitor CAP may be added in series with the coil 4500C. The capacitor CAP has a reactance effect that may negate the inductive reactance imposed by the coil 4500C. TheAtty. Docket No.390P017044-WO (PCT) reactance of each of the capacitor CAP and coil 4500C is a function of the AC frequency imposed by the voltage. Here reactance of the capacitor CAP is substantially the same in magnitude as the respective inductive reactance of the coil 4500C to maximize the levitation efficiency of the base 1510. The relationship between the inductive reactance XLand capacitance reactance XCis as follows:

[0201] ^^^^^^^^= 2 ^^^^ ^^^^ ^^^^ [eq.7]

[0202] ^^^^^^^^=12^^^^ ^^^^ ^^^^[eq.8]

[0203] noting that F is the frequency and due to capacitance selection XC=XL, where

[0204] 2 ^^^^ ^^^^ ^^^^ =12 ^^^^ ^^^^ ^^^^ [eq.9]of each coil 4500C may be used to identify the absolute position of the base 1510. Another example of a coil variable that may be employed for absolute position decoding of the base 1510 is the coil impedance Z (see Fig. 42B) where the impedance can be determined as the RMS (root mean square) ratios of the of the AC voltage and AC current at each respective coil 4500C, where

[0207] ^^^^ =^^^^ ^^^^ ^^^^( ^^^^)^^^^ ^^^^ ^^^^[eq.11]can seen power PF, and impedance Z are examples of metrics (e.g., excitation characteristics) that determine the position of the base 1510 and define the self-deterministic reaction platen or base 1510 pose feedback. Other metrics may also be used such as those defined by machine learning and data analytics techniques, such as the neural network 199N.Atty. Docket No.390P017044-WO (PCT)

[0209] Still referring to Figs.19A-19C, the present disclosure employs the array of electromagnets 1700 to magnetically levitate the substrate handler 110 with electromagnetic induction. As described herein, the present disclosure separates the array of electromagnets 1700 from the substrate handler 110 with a non-magnetic isolation wall (such as the floor 118L of the transfer chamber 118, or where the array of electromagnets 1700 are located on lateral sides of the transfer chamber 118 the side walls form the non-magnetic isolation wall). Examples of suitable materials from which the non-magnetic isolation wall is constructed include, but are not limited to, the 300- series stainless steel (as described herein), the low conductivity aluminum such as an 6061 series aluminum (as described herein), or any other suitable non-magnetic material). Here, the non- magnetic isolation wall facilitates the induction of Eddy currents on the base 1510 (located within the sealed environment of the transfer chamber 118) from the alternating magnetic field generated by the array of electromagnets 1700. The voltage V applied to the electromagnets 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 and the respective currents I are employed by the local controllers 1750A-1750n (or the controller 199) to determine the absolute position of the substrate handler 1700 in a reference frame (X, Y, Z – see, e.g., Fig.1A) of the transfer chamber 118 without employing additional sensing technology (e.g., dedicated position sensors) that increase both the size and cost of the transfer chamber 118. As described herein, and also referring to Fig. 18, the local controllers 1750 are coupled to the respective electromagnets 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 by the amplifier drive circuit 2010. This amplifier drive circuit includes a current sensor (such as in the field-effect transistor 2011) that effects measurement of the current I in the respective electromagnet 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5. Accordingly, the voltage V and the current I are known and the local controllers 1750A-1750n (or controller 199) can effect absolute position determination of the substrate handler 110 as described herein without integration of dedicated position sensors, associated hardware, and controls in (or on) the transfer chamber 118. Here, the the present disclosure supports absolute position detection of the substrate handler 110 over longAtty. Docket No.390P017044-WO (PCT) motions of the substrate handler 110 within a linear tool (or cluster tool) with the cost savings obtained from exclusion of dedicated substrate handler position sensors.

[0210] Referring to Fig. 26, as well as Figs. 20-22, the local controllers 1750A-1750n (or the controller 199, such as where the local controller conveys the voltage V and current I to the controller 199 for position determination) are configured with any suitable strategy for position determination of the substrate handler 110 within the transfer chamber 118. As an exemplary position determination strategy, the controller 199 or controllers 1750A-1750n include a finite element (FEA) model configured to provide a matrix of coil inductances based on the position of the substrate handler 1510 within the transfer chamber 118. Here, a multidimensional table (referred to as a forward position-inductance table and represented as FEA model 2810 in Fig.26) is generated that relates each substrate handler 1510 spatial position in the array of electromagnets 1700 to the respective inductances of the electromagnets in the array of electromagnets 1700. The respective inductances of the electromagnets in the array of electromagnets 1700 may be referred to as a coil inductance matrix that is associated with a given six degree of freedom position of the base 1510 of the substrate handler 110. An inverse position inductance table (represented in Fig. 26 as inverse FEA model 2820) is generated from the forward position-inductance table 2810. The inverse position inductance table 2820 is configured to effect determination of the substrate handler 110 position based on the coil induction matrix. As described above, other variables or their combinations can be employed in addition to the coil inductance, such as the power factor PF and impedance Z.

[0211] To determine the position of the substrate handler 110 in the transfer chamber 118, the controller 199 (or local controllers 1750A-1750n) includes an inductance estimator 2830 configured to estimate the real time inductances of the elements of the coil induction matrix based on the voltages and currents of the electromagnets in the array of electromagnets 1700. The inductance estimator 2830 is configured to estimate the real time inductances L of the electromagnets in the array of electromagnets 1700 based on the alternating current voltages V and currents I (as determined / measured by the amplifier drive circuit as described herein). As anAtty. Docket No.390P017044-WO (PCT) example, to determine the real time inductances L, the voltage V and current I in each electromagnet in the array of electromagnets 1700 can be expressed as in equation 1 above; however, it may be more practical to express the relationship between the voltage V and current I in terms of the Root-Mean-Square (RMS) values of the voltage V and current I flowing through any given electromagnet in the array of electromagnets 1700 as follows:

[0212] VRMS= Z IRMS[eq.12]

[0213] where VRMSis the RMS of the alternating current voltage at the electromagnet terminals imposed by the local controller 1750, 1750A-1750n; IRMSis the RMS of the alternating current measured by the local controller 1750, 1750A-1750n (such as by the amplifier drive circuit 2010 – see Fig.18) at the respective electromagnet; Z is the electromagnet impedance in ohms; R is the resistance of the electromagnet in ohms; XLis equal to 2πfL and is the inductive reactance of the electromagnet in ohms; f is the frequency of the alternating current signals in Hertz; and L is the inductance of the electromagnet. Accordingly, the inductance of any given electromagnet can be measured or estimated as: � ^^^^ 2^^^^ ^^^^ ^^^^� − ^^ 2^^^^ ^^ �

[0214] ^^^^ =^^^^ ^^^^ ^^^^2 ^^^^ ^^^^ [eq.13]

[0215] Referring still to Figs.20-22, as described herein, the features of the present disclosure may be employed to locate the position of multiple substrate handlers 110A, 110B in the same or common transfer chamber 118. As described with respect to Figs. 15 and 18 herein, each local controller 1750A-1750n is communicably coupled to a respective group 1700G1-1700Gn (only a portion of each group is illustrated in the Figs.) of electromagnets 1700A-1700n, , 1700A1- 1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 in the array of electromagnets 1700. The locations of each of the electromagnets 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 are known relative to the reference frame REF (X, Y, Z) of the transfer chamber 118 (or of the processing tool including theAtty. Docket No.390P017044-WO (PCT) transfer chamber 118). As noted herein, the local controllers 1750A-1750n are communicably coupled to (master / central) controller 199 in any suitable manner (e.g. wired connection or wireless connection), where the controller 199 (or the master distributed controller 1760) is configured to monitor and control the condition (e.g., energization state) of each electromagnet 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 of the array of electromagnets 1700.

[0216] As an example, the controller 199 (or master distributed controller 1760) defines the alternating current voltage V excitation for the electromagnets of the array of electromagnets 1700 while requesting, from the local controllers 1750A-1750n, the voltage-current phase measurements from each electromagnet of the array of electromagnets 1700. The controller 199 determines from the voltage-current phase measurements the position of the base 1510 of the substrate handler 110 within the transfer chamber 118 in the manner described above as well as determines control commands to effect a desired level of levitation and propulsion of the substrate handler 110 along a predetermined trajectory. Here, the local controller 1750A-1750n substantially continuously measures at least the voltage-current phase, and may continuously measure the amplitude ratio, of the respective electromagnets 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5. The measured voltage- current phase, and in some aspects the amplitude ratio are transmitted from the local controllers 1750A-1750n to the controller 199 so that the controller 199 builds a feedback matrix that can be input into a matrix transformation whose output can be the six degrees of freedom spatial position of the substrate handler 110 within the transfer chamber 118.

[0217] As noted herein, the base 1510 of each substrate handler 110 may have a unique size and shape that effects a unique electromagnet measurement matrix for a given unique position within the transfer chamber 118 relative to the entire array of electromagnets 1700. For example, the base 1510 of the substrate handler 110A may have one fiducial 2210 while the base 1510 of the substrate handler 110B has two fiducials 2210A, 2210B. The different number of fiducials (and the locations of the fiducials) provide for unique identification of each substrate handler 110A,Atty. Docket No.390P017044-WO (PCT) 110B along, for example, the drive plane DP (see at least Figs. 13A and 14B) as well as for a respective yaw angle orientation relative to the array of electromagnets 1700, based on the phase lag of each electromagnet 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 interacting with the base 1510. Here, to effect the unique identification of each substrate handler 110A, 110B the base 1510 overlaps a suitable number of electromagnets such that a unique pattern of electromagnet measurements (e.g., voltage and / or current magnitude and / or phases) is obtained for each substrate handler 110A, 110B and associated with the unique position of the respective substrate handler 110A, 110B. For exemplary purposes only, at least six electromagnets sense the position of the base 1510 so as to provide a predetermined overlap with the base 1510 so as to unique identify the base 1510 and to provide motion continuity along the (multidimensional) drive plane DP (see at least Figs. 7A, 13A, and 14B). It should be understood that more or less than six electromagnets may sense the position of the base 1510 so as to provide a predetermined overlap with the base 1510 and to provide motion continuity along the (multidimensional) drive plane DP.

[0218] Still referring to Figs.20-22 and also to Fig.26, the transformation of the measured phase lag (and in some aspects the amplitude) of each electromagnet 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 to the position of the substrate handler 110 may be effected by a machine learning algorithm such as a neural network that is designed and trained with any suitable machine learning techniques. For example, as described herein, the mutual inductance for each electromagnet 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 can be measured as described herein. The neural network 199N is trained to uniquely correlate the coil inductance matrix (see Fig.26) with the position of the substrate handler 110 within the transfer chamber 118. Fig.22 is an exemplary illustration of the implementation of the neural network to transform the coil inductance matrix (which may include a coil magnitude matrix and coil phase matrix) to the position of the substrate handler 110.Atty. Docket No.390P017044-WO (PCT)

[0219] Referring to Fig. 21, in addition to or in lieu of employment of the phase lag to effect position determination of the substrate handler 110, 110A, 110B, a power factor for each electromagnet in the array of electromagnets 1700 may be employed for position determination of the substrate handler 110, 110A, 110B. The power factor is a measure of efficiency of an inductive load in alternating current circuits, such as the circuit created between the electromagnets in the array of electromagnets 1700 and the base 1510 of the substrate handler 110A, 110B. As described herein, as the base 1510 approaches an electromagnet 1700A-1700n, 1700A1-1700n1, 1700A2- 1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5, the respective inductance L of that electromagnet 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4- 1700n4, 1700A5-1700n5 changes as a result of, e.g., the induction of Eddy currents on the base 1510. The change in the electromagnet inductance L effects a change in the associated reactance and the resultant overall impedance of the circuit formed between the electromagnet and the base 1510. This change in impedance directly affects the respective power factor (or efficiency) associated with the electromagnet.

[0220] Referring to Fig.21, the controller 199 is configured to monitor at least the power factors of the electromagnets 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 in the array of electromagnets 1700 to generate a real time power factor matrix that represents a spatial efficiency of the entire array of electromagnets 1700. As above, the shape / size of the base 1510 of each substrate handler 110A, 110B provides for uniquely identifying (e.g., through a respective unique power factor signature, e.g., a unique electromagnet power factor pattern) the location of the substrate handler 110A, 110B relative to the array of electromagnets 1700 within the transfer chamber 118. As can be seen in Fig.21, each electromagnet in the array of electromagnets has a power factor where a respective matrix of power factors (e.g., a respective power factor matrix) is employed by the controller 199 as an input to a position decoding algorithm (e.g., of the controller 199, such as the neural network described herein) to determine the location of the substrate handler(s) 110A, 110A in a manner similar to that described above, where the variance in a power factor of any given electromagnet of the arrayAtty. Docket No.390P017044-WO (PCT) of electromagnets is indicative of a proximity of the base 1510 relative to the given electromagnet. For exemplary purposes only, as can be seen in Fig. 21, the power factor matrix for substrate handler 110A includes the power factors (e.g., CXX where XX is the identity of an electromagnet where as a non-limiting example, C22 is the power factor for electromagnet 22) C22-C25, C31- C36, C41-C45, and C52-C55 corresponding to electromagnets 22-25, 31-36, 42-45, and 52-55 of the array of electromagnets 1700 interacting with the base 1510 of substrate handler 110A. The power factor matrix for substrate handler 110B includes the power factors C63-C67, C73-C77, C83-C87, and C93-C97 corresponding to electromagnets 63-67, 73-77, 83-87, and 93-97 of the array of electromagnets 1700 interacting with the base 1510 of substrate handler 110B. In a manner similar to that noted above, the neural network 199N is trained to correlate the power factors for the electromagnets of the array of electromagnets 1700 with a position of the respective substrate handler 110A, 110B relative to the array of electromagnets so as to determine the absolute position of the respective substrate handler 110A, 110B within the transfer chamber 118.

[0221] Referring to Figs.20 and 23, in accordance with the present disclosure, the predetermined excitation characteristic (such as, e.g., inductance, phase lag / amplitude, and / or power factor as described herein) may be obtained by the controller from a unique and substantially constant alternating current frequency that does not match a fundamental alternating current frequency that effects generation of the levitation and propulsion forces of the array of electromagnets 1700. For exemplary purposes only, the electromagnets of the array of electromagnets 1700 operate at a substantially fixed alternating current frequency of about 80 Hz to effect levitation and propulsion of the substrate handler 110A, 110B. The controller 199 may be configured to determine the position / location of the substrate handlers 110A, 110B based on one or more of the inductance, phase lag / amplitude, and / or power factor as determined with the alternating current voltage and alternating current at the about 80 Hz frequency; although, the controller effects superimposing of a second frequency (such as for example a voltage and current at about 1 KHz) to the fundamental frequency of about 80 Hz as illustrated in Fig. 23, where the controller 199 is configured to determine the position / location of the substrate handlers 110A, 110B based on one or more of theAtty. Docket No.390P017044-WO (PCT) inductance, phase lag / amplitude, and / or power factor as determined with the alternating current voltage and alternating current at the about 1 KHz frequency; although, the controller 199 is configured to determine the position / location of the substrate handlers 110A, 110B based on one or more of the inductance, phase lag / amplitude, and / or power factor as determined with the alternating current voltage and alternating current at both the about 80 Hz frequency and the about 1 KHz frequency (e.g., where determinations made at one of the frequencies is used to verify determinations made at another of the frequencies). The second frequency is separate and distinct from the fundamental frequency so as to decouple position feedback determination from levitation and propulsion of at least one platen or base 1510 (of a respective reaction platen 110) as described herein.

[0222] As can be seen in Fig. 23, exemplary power factor determinations are provided for both the about 80 Hz frequency and the about 1 KHz frequency. Here, the power factor (PF1) at the about 80 Hz frequency is expressed as:

[0223] PF1= cos(ϕ1) [eq.14]

[0224] and the power factor (PF2) at the about 1 KHz frequency is expressed as:

[0225] PF2= cos(ϕ2) [eq.15]

[0226] where ϕ1and ϕ2are the phase lag for the about 80 Hz and the about 1 KHz frequencies respectively. It is noted that any suitable frequencies may be employed for levitation / propulsion of the substrate handler 110A, 110B and position determinations of the substrate handler 110A, 110B. The superimposing of the second frequency on the fundamental frequency for position determination / feedback of the substrate handler 110A, 110B decouples the position determination / feedback from the fundamental frequency (i.e., decouples position determination / feedback from levitation and propulsion). The position determination frequency (e.g., the superimposed frequency) may be chosen to be a frequency that is high enough such that the frequency provides for position feedback determination (e.g., via determination of the power factor, inductance, and / orAtty. Docket No.390P017044-WO (PCT) phase lag / amplitude) with a smaller latency / delay compared to that of the fundamental frequency. Using the examples of an about 80 Hz fundamental frequency and an about 1 KHz second frequency the power factor calculation (see equations 9 and 10 above) latency would be about 0.0125 sec (e.g., 1 / 80 Hz) and 0.001 sec (1 / 1000 Hz) respectively.

[0227] Referring to Fig. 24 and 25, an experimental data set is provided and illustrates a dependency between the position of the base 1510 of the substrate handler 110 and the respective power factors of the electromagnets in the array of electromagnets 1700. Here, the electromagnets are identified as M1C0-M1C2, M2C0-M2C2, and M3C0-M3C2 but are otherwise substantially similar to the electromagnets 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 described herein. Also, the array of electromagnets 1700 is illustrated as having nine electromagnets for exemplary purposes only and may have more (or less) than nine electromagnets. As can be seen in Figs.24 and 25, at each X position of the base 1510, there is a unique set of power factors that uniquely correlate with the X position of the base 1510. For example, as the base 1510 moves towards the positive X direction indicated in Fig. 24, the front (or leading) row of power factors (e.g., corresponding to electromagnets M1C0-M1C2 in the X position illustrated in Fig. 24) decrease while the rear (or trailing) row of power factors (e.g., corresponding to electromagnets M3C0-M3C2 in the X position illustrated in Fig. 24) increase. The decrease in the leading row of power factors and the increase in the trailing row power factors occurs based on changes in the electromagnet M1C0-M1C2, M3C0-M3C2 that result from the changes in the magnetic circuit that, where the changes in the magnetic circuit are effected by the presence and position of the base 1510. The controller 199 (or one or more of controllers 1750, 1750A-1750n, 1760) is configured to determine / decode the location of the base 1510 (and of the substrate handler 110) along the X axis based on the vector of power factors from the electromagnets in the array of electromagnets 1700. As may be realized, vectors of power factors may also be employed for determination of the base 1510 (and substrate handler 110) location along the Y axis in addition to or in lieu of the determining the location along the X axis (e.., suchAtty. Docket No.390P017044-WO (PCT) as where the array of electromagnets 1700 provides for multidimensional X-Y movement of the base 1510).

[0228] In a manner similar to that described herein, the controller 199 (or one or more of controllers 1750, 1750A-1750n, 1760) is configured to determine the Z position (e.g., amount of levitation or lift) of the base 1510 (and the substrate handler 110) based on the changes in inductance, a phase lag / amplitude, and / or power factor. For example, the values for the inductance, a phase lag / amplitude, and / or power factor are known the controller with the base 1510 travelling along the drive plane. As the lift of the base 1510 increases (the distance between the base 1510 and the electromagnets in the Z direction increases) the affect the base 1510 has on the inductance, a phase lag / amplitude, and / or power factor may decrease. Likewise, as the lift of the base 1510 decreases (the distance between the base 1510 and the electromagnets in the Z direction decreases) the affect the base 1510 has on the inductance, a phase lag / amplitude, and / or power factor may increase.

[0229] The controller 199 may be configured, in a manner similar to that described herein, to correlate the increase or decrease in the inductance, a phase lag / amplitude, and / or power factor with the Z position of the base 1510 (and the substrate handler 110) so as to determine the Z position of the base 1510 in the Z direction. In a manner similar to that described herein, as the base 1510 moves further away in the Z direction from any given electromagnet the power factor of the given electromagnet increases, and the closer the base 1510 moves in the Z direction towards the given electromagnet the power factor of the given electromagnet decreases. These changes in the power factor with respect to the movement of the base 1510 towards and away from the electromagnets in the array of electromagnets may be correlated with the height of the base 1510 above the drive plane DP in the controller 199 (and / or other controllers described herein) in a manner similar to that described above with respect to movement of the base 1510 along the X (or Y) axis. With reference to Fig. 16, it is noted that the electromagnets between the edges of the base 1510 (i.e., the electromagnets substantially covered by the base 1510 and not affected by changes induced by base edge transition over the electromagnet) may be employed for Z axisAtty. Docket No.390P017044-WO (PCT) position determination while the leading and trailing electromagnets may be employed for X-Y position determination (see also Fig. 24 where electromagnet M2C1 is substantially completely covered by the base 1510 so as to have a known power factor, inductance, and / or phase lag with the base travelling at the predetermined height H of the drive plane DP, which known power factor, inductance, and / or phase lag is employed as a reference for Z height determination; however, any of the electromagnets may provide for a combined determination of X and / or Y positioning as well as Z positioning where the controller 199 is programmed to correlate the increase or decrease in the inductance, a phase lag / amplitude, and / or power factor that effects the Z position of the base 1510 with the increase or decrease in the inductance, phase lag / amplitude, and / or power factor with the X and / or Y position of the base 1510.

[0230] As can be seen above, the features of the present disclosure provide for self-deterministic base (or reaction platen) absolute position feedback / determination of the base 1510 (and substrate handler 110) in the X, Y, and / or Z directions by employing the electromagnets of the array of electromagnets 1700 for position determination. The features of the present disclosure provide for the yaw / angular position determination of the base 1510 (and substrate handler 110) with the electromagnets of the array of electromagnets 1700. Here, the position determination structure / features of the present disclosure are in situ with (e.g., are one and the same with) the levitation and drive electromagnets so as to form a self-deterministic reaction platen (absolute) position feedback system that provides a more compact transfer chamber 118 compared to substrate / wafer transport systems employing dedicated sensors for position determination of the substrate handler.

[0231] Referring to Fig. 38, a control system network 3999 that has a clustered architecture representative of the actuator control system network 1799 will be described. In the example illustrated in Fig.38, there are three drive lines 177, 179A, 179B, each having respective array of electromagnets forming respective tracks 1550A-1550F (though shown as linear, may be arcuate). For example, drive line 177 is formed by tracks 1550A and 1550B having electromagnets 177ER1- 177ERn and 177EL1-177ELn. Drive line 179A is formed by tracks 1550C and 1550D havingAtty. Docket No.390P017044-WO (PCT) electromagnets 179AER1-179AERn and 179AEL1-179AELn. Drive line 179B is formed by tracks 1550E and 1550F having electromagnets 179BER1-179BERn and 179BEL1-179BELn. The configuration of the electrical machine illustrated in Fig.38 is exemplary and may have any other suitable configuration.

[0232] In Fig. 38 the control system network includes the master controller 1760, cluster controllers 3950A-3950C and local controllers 1750DL, 1750DLA, 1750DLB. Local controller 1750DL corresponds to drive line 177, local controller 1750DLA corresponds to drive line 179A, and local controller 1750DLB corresponds to drive line 179B. Each of the local controller(s) 1750DL, 1750DLA, 1750DLB is substantially similar to distributed local drive controllers 1750A- 1750n so that each drive line 177, 179A, 179B includes a distributed arrangement of local drive controllers 1750A-1750n as described above with respect to Fig. 15 for controlling respective groups 1700G1-1700Gn of electromagnets 1700A-1700n.

[0233] As shown in Fig.38 each of the local controllers 1750DL, 1750DLA, 1750DLB may be connected (e.g., through a wireless and / or wired connection) to a respective cluster controller 3950A-3950C. For example, each of the local controllers 1750DL of drive line 177 are coupled to cluster controller 3950B, each of the local controllers 1750DLA of drive line 179A are coupled to cluster controller 3950A, and each of the local controllers 1750DLB of drive line 179B are coupled to cluster controller 3950C. The local controllers may be connected (e.g., through a wireless or wired connection) directly to the master controller 1760 as shown in Fig. 15). The local controllers may be connected (e.g., through a wireless or wired connection) to both the master controller 1760 and the respective cluster controller 3950A-3950C to provide redundant substantially failsafe control of the local controllers.

[0234] Each of the cluster controllers 3950A-3950C are connected (e.g., through a wireless or wired connection) to the master controller 1760. Each of the master controller 1760, cluster controllers 3950A-3950C, and local controllers 1750DL, 1750DLA, 1750DLB includes any suitable processors and non-transitory computer program code to effect motion control and / orAtty. Docket No.390P017044-WO (PCT) position determination of the substrate handlers 110 as described herein. The master controller 1760 supervises the overall operation of the control system network 3999, each of the cluster controllers 3950A-3950C supervises the operations of the respective local controllers 1750DL, 1750DLA, 1750DLB, and each local controller 1750DL, 1750DLA, 1750DLB is utilized to drive the electromagnets and / or provide position feedback (of a substrate handler 110) corresponding to the respective drive lines 177, 179A, 179B.

[0235] The clustered architecture provides the features of a centralized control network and the features of a distributed control network where required, within the network topology. The architecture as disclosed herein is advantageous because clusters may be distributed where required within the network, and each cluster controller 3950A-3950C is capable of providing highly centralized control within the cluster it manages. Network traffic associated with highly centralized control is generally confined within each cluster and local controllers 1750DL, 1750DLA, 1750DLB, where the cluster and local controllers 1750DL, 1750DLA, 1750DLB may be located close to electromagnets to which they control, reducing problems associated with power and signal cabling. In addition, the clustered architecture allows for direct control of the local controllers 1750DL, 1750DLA, 1750DLB by the master controller 1760 where required. Furthermore, because intense network traffic is generally confined within the clusters, and the clusters are capable of a high level of control, the architecture may accommodate a large number of clusters. Thus, the architecture provides a high level of scalability and allows for an efficient distribution of controllers. It is noted that while a clustered control architecture is described above, clustered architecture is merely an example of a suitable control architecture, although any suitable control architecture may be employed.

[0236] The local controllers 1750DL, 1750DLA, 1750DLB shown in Fig. 38 can be directly connected to the master controller 1760. The master controller software is responsible for (e.g., the master controller is configured to control) several aspects of the real time control of the substrate handler’s motion and the local controllers would be responsible (e.g., configured for) all low level feedback and actuation aspects of the control architecture.Atty. Docket No.390P017044-WO (PCT)

[0237] Still referring to Fig. 38 and also to Figs. 13A-14C, in accordance with the present disclosure, the processor 3901 of the master controller 1760 is programmed with a dynamic model 3910 of the base 1510 (e.g., the dynamic model is stored in any suitable memory 3902 accessible by the processor 3901) with a payload (e.g., substrate(s) S) thereon and without a payload. The processor 3901 is also programmed with a dynamic model 3911 of frictional forces µ between the substrate S and the end effector 1520. A form factor 3912 of the machine electronics (e.g., number of electromagnets, spacing between electromagnets, number of drive lines and their respective orientations, propulsion to lift relationship, etc.) relative to the base 1510 may also be stored in memory 3902 and accessible by the processor 3901.

[0238] The master controller 1760 is programmed or otherwise configured to determine kinematic motion of the base 1510 from an initial substrate handler pose to a final substrate handler pose. The master controller 1760 is also programmed or otherwise configured to determine the kinematics of attitude / yaw control (in three degrees of freedom – pitch, roll, yaw) related to the determined kinematic motion. The kinematic motion and the kinematics of attitude / yaw may be determined e.g., using one or more of dynamic model 3910, dynamic model 3911 and form factor 3912 in combination with a predetermined substrate process recipe (e.g., where and when the substrate is to be transferred and what process is to be performed on the substrate).

[0239] One method for controlling a machine such as the electrical machines described herein is to calculate a trajectory for each of propulsion (along the X and / or Y axes), lift (along the Z axis), roll, pitch, yaw. Such trajectories can be conveniently defined by a series of position, velocity and time values grouped into frames, referred to as PVT frames.

[0240] Fig. 39A shows an exemplary PVT frame 4005. The PVT frame 4005 includes position data 4010 (which may include start location (X, Y, Z), end location (X, Y, Z), and attitude (roll, pitch, yaw), velocity data 4015, and time data 4020. The data may be in binary format grouped together in one or more bytes. Each of the position data 4010, velocity data 4015, and time data 4020 may occupy four bytes (although each of the position data 4010, velocity data 4015, and timeAtty. Docket No.390P017044-WO (PCT) data 4020 may occupy more or less than four bytes). PVT frame 4005 may optionally include header information 4025 and trailing information 4030, both of which may include identification, parity, error correction, or other types of data. PVT frame 4005 may include additional data of varying lengths or amounts between or among the header, position, velocity, time, and trailing data. It should be noted that the PVT frame 4005 is not limited to any particular length. The PVT frame may be either reduced to a PT frame or a P frame only. The communication from the master controller 1760 to the cluster / local controllers 1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, 1850DLB may include different sets of values, which are peripherally related to the desired motion, for example, these values could be frequencies, phase offsets, current values and / or voltage values of the electromagnets / coil under control. The master controller 1760 implements the desired algorithmic transformation, calculates and streams via the motion network such quantities (effectively to every coil through an hierarchical scheme of cluster and local controllers).

[0241] It is a feature of the present disclosure to use these series of values as inputs for the dynamic models 3910, 3911 of the controlled electrical machine to calculate theoretical lift forces and propulsion forces to be applied by predetermined electromagnets 1700A-1700n so that the base 1510 follows the desired trajectory. It is also a feature of the present disclosure to use elements of the dynamic models 3910, 3911 to scale feedback control signals used by the local controllers 1750DL, 1750DLA, 1750DLB for each electromagnet under their control.

[0242] The lift forces, propulsion forces, and scaling terms may advantageously account for non- linearities and dynamic cross coupling among individual drive lines 177, 179A, 179B. The lift forces, propulsion forces may be referred to herein as feedforward terms and the scaling term may be referred to as a gain term.

[0243] Using the electrical machine 700 shown in Fig.38 (also referring to Figs.13A-14C) as an example, the master controller 1760 may generate a trajectory for each drive line 177, 179A, 179B, along which a substrate handler 110 is to travel, in terms of a commanded position, velocity and acceleration. Using an inverse kinematic model of one or more of the base 1510 and / or frictionalAtty. Docket No.390P017044-WO (PCT) forces µ, the master controller 1760 may utilize the trajectory information to generate corresponding feedforward, and gain terms. These terms may be grouped together with the trajectory information in frames specific to each drive line 177, 179A, 179B, referred to as PVT- FG frames. Fig.39B illustrates an exemplary PVT-FG frame 4095. PVT-FG frame 4095 includes optional header 4025, position data 4010, velocity data 4015, time data 4020, and optional trailing information 4030, similar to PVT frame 4005. In addition, PVT-FG frame 4095 includes at least one feedforward term 4050 and at least one gain term 4060. The data may be in binary format grouped together in one or more bytes. The PVT-FG frame 4095, the position data 4010, velocity data 4015, time data 4020, feedforward term 4050, and gain term 460 may each occupy four bytes (although they may each occupy more or less than four bytes). Similar to PVT frame 4005, PVT- FG frame 4095 may include other data of varying lengths or amounts, distributed among or between the various terms.

[0244] The PVT-FG frames may (or in other aspects the PVT frames) then be distributed over the control system network 3999. The cluster controllers 3950A-3950C, receive the data, and may interpolate between two consecutive frames to obtain an instantaneous position, velocity, feedforward term and gain value, and utilize this information to effect control of the substrate handler 110. For example, each cluster controller 3950A-3950C employs the PVT-FG frames (or in some aspects the PVT frames), or other suitable information / commands, from the master controller 1760 to generate the propulsion forces Fx (propulsion force along the X axis), Fy (propulsion force along the Y axis), and lift force Fz (along the Z axis) to effect one or more of levelling, propulsion, and three degree of freedom attitude control (e.g., roll, pitch, yaw) of the substrate handler 110 and base 1510 thereof. The form factor 3912 of the machine electronics may be programmed at the cluster controller 3950A-3950C level, rather than or in addition to being programmed in the master controller 1760, where the form factor is used to establish the lift to propulsion relationship(s), and with the data provided by the master controller 1760 to generate the lift and propulsion forces noted above. The cluster controllers 3950A-3950C and local controllers 1750DL, 1750DLA, 1750DLB may receive corresponding data from the masterAtty. Docket No.390P017044-WO (PCT) controller 1760, and utilize the data to control the electromagnets 1700A-1700n and movement of the substrate handler 110 along one of more of the drive lines 177, 179A, 179B.

[0245] The cluster controllers 3950A-3950C (or alternatively the local controllers 1750DL, 1750DLA, 1750DLB) command electromagnet 1700A-1700n modulation, which commands are sent to and received by the respective local controllers 1750DL, 1750DLA, 1750DLB, to effect one or more of dynamic phase allocation and the creation of virtual multiphase motor actuator / position units as described in greater detail herein.

[0246] Fig. 27A illustrates an exemplary controlled motion(s) of the substrate handler 110 in accordance with the present disclosure with respect to increased substrate handler throughput while carrying a substrate S. Here, the controller 199 controls the levitation forces (e.g., FZT, FZL), generated by the array of electromagnets 1700, so as to impart differential levitation forces (illustrated in Fig. 21) across the base 1510 that effect a controlled inclination (e.g., e+ or e-) of the base 1510, relative to the drive plane DP, that controls a predetermined reaction platen attitude in at least one of pitch (shown in Figs. 13B, 27A and 33) and roll (shown in Figs.13A and 35). The controller 199 may control the levitation forces (e.g., FZT, FZL), generated by the array of electromagnets 1700 of the motor actuator units (that are virtually moving), so as to effect a predetermined bias attitude BA+ or BA- of the base 1510, relative to the drive plane DP, that imparts a bias reaction force F2 (Fig. 29), from a base payload seating surface (e.g., such as a substrate seating surface 1520SS (Figs.29, 31A, 31B) of the end effector 1520 or a seating surface defined by substrate supports of cart 1431-1433 of cart 110C) on a substrate S supported by the base seating surface, in a direction countering payload inertial force arising from acceleration of the reaction platen along the drive plane DP. The controller 199 is configured to determine acceleration of the base 1510 (and the substrate handler thereof) along the drive plane DP at least from changes in the position of the base 1510 as determined based on changes in predetermined excitation characteristic (such as, e.g., inductance, phase lag / amplitude, and / or power factor – as described herein), and in response to the acceleration determine, control the bias attitude of the base 1510 to provide the predetermined bias attitude countering the payload inertial force arisingAtty. Docket No.390P017044-WO (PCT) from the acceleration of the base 1510. The controller 199 may apply a predefined acceleration from commanded trajectory for bias attitude control. Here, the controller 199 controls excitation of the electromagnets 1700A-1700n of the virtually moving motor actuator units of the array of electromagnets 1700 so as to set the bias attitude BA+ or BA- to bias the base 1510 against inertial forces tending to displace a substrate S, seated against the base 1510 (e.g., on an end effector 1520 thereof or substrate supports 1431-1433 thereof), relative to the base 1510 along a seat between the substrate S and the base 1510 (see, e.g., Fig.21).

[0247] As an example of countering payload inertial forces, starting at the left-hand side of Fig. 27A, a substrate handler 110 (which may be any of the substrate handlers described herein) is depicted at a starting point of a motion in direction 2122 in Fig. 27A. As the substrate handler begins to move, a set of propulsion force vectors FP and lift force vectors FZ are generated by the Control System (e.g., the actuator control system network 1799which may be part of controller 199) so as to cause the substrate handler 110 to accelerate in the motion direction with an increased Pitch angle e+ (e.g., the end effector 1520 is tilted in, e.g., a clockwise direction). To effect the increased pitch angle e+ the lift force vectors FZ are generated so that a magnitude of a trailing lift force vector FZTis larger than a magnitude of a leading lift force vector FZL(where leading and trailing are in reference to the motion direction). As the substrate handler reaches approximately its halfway point towards the end of the motion (e.g., such as where there is substantially zero acceleration of the substrate handler 110), the pitch angle e+ is reduced in magnitude so that the tilted orientation of the end effector 1520 is reversed from the clockwise orientation to zero (e.g., substantially parallel with the level reference plane 1299 – the trailing lift force vector FZTand the leading lift force vector FZLare substantially equal). At this point in the trajectory, the substrate handler 110 motion begins a deceleration stage where the pitch angle e- is decreased so that the end effector 1520 pitches to a counter clockwise orientation. To effect the decreased pitch angle e- the lift force vectors FZ are generated so that the magnitude of the trailing lift force vector FZTis less than a magnitude of the leading lift force vector FZL). As the substrate handler 110 reaches its final destination, the pitch angle e- is increased to zero so that the tilted orientation of the endAtty. Docket No.390P017044-WO (PCT) effector 1520 is substantially parallel with the level reference plane 1299, as in the start of the motion.

[0248] As may be realized, while the pitch of the end effector is increased or decreased to account for acceleration and deceleration of the substrate handler 110 substantially without slippage of the substrate S relative to the end effector while travelling along a substantially straight / linear path (such as along drive lines 177-180), the roll r and / or pitch e of the substrate handler 110 may be increased or decreased to provide for higher rotational accelerations of the substrate handler 110 (such as about one or more of axes 777, 1277, 1377 in a manner substantially similar to that described above with respect to the linear motion (see Fig.27B, which illustrates rolling of the end effector in rotation direction with roll control as shown in Fig.13A where lift force vector FZleftis greater than lift force vector FZright).

[0249] The motion control illustrated in Fig. 27A effects a substantially faster substrate motion transport (e.g., provides for higher accelerations substantially without substrate slippage relative to the end effector) when compared to conventional substrate transport where the end effector is parallel with the wafer transfer plane throughout end effector motion. As an example, if the pitch angle e of Fig.27A is set to be zero (as with conventional substrate transports) during the entire motion then the maximum allowable propulsion acceleration is limited to the static coefficient of friction (μ) between the substrate S and a contact surface of the end effector 1520. This is illustrated in Fig. 28, which constitutes the typical use case in a conventional substrate transport where the substrate S is held by its back side in contact with the end-effector. As it can be seen in Fig.28, the maximum acceleration imposed to the substrate S is μg before wafer slippage takes place. Where “g” is the acceleration of gravity (about 9.8 m / S2), μ is the coefficient of friction, M is the mass of the substrate, W is the weight of the substrate, and N is the normal force.

[0250] Fig.29 illustrates the case where the substrate S (having a mass m) is carried by substrate handler 110 (having a mass M) with a pitch angle e while the substrate handler 110 is accelerated in the X direction. The force diagrams in Fig. 29 illustrate the dynamics of the motion of theAtty. Docket No.390P017044-WO (PCT) substrate S and substrate handler 110. In Fig.29, the substrate hander 110 is accelerated along the propulsion direction X with acceleration a. As a result, the force at the substrate handler is represented by the variable Fl. The acceleration a along the X direction, impacts the reaction (normal) force N on the substrate S in a way that once added to the weight of the substrate W yields a resultant wafer force F2. It is possible to relate the angle e and the acceleration a in such a way that the substrate S substantially does not slip relative to the end effector 1520 of the substrate handler 110. To substantially prevent wafer slippage, two situations can be considered for the sake of clarity. First, it is assumed that there is no friction between the substrate and the end effector 1520. Fig.30A illustrates a free body diagram of the substrate S on the end effector 1520 in the absence of friction μ. As can be seen in Fig.30A, despite the absence of friction μ, an acceleration a can be determined in terms of the pitch angle e such that the substrate mass m is traveling along the X direction. This relation is expressed by equation 16 below:

[0251] a = g tan e [eq.16]

[0252] where g is the acceleration of gravity (9.8m / s2). Fig.30B illustrates wafer slippage regions in terms of the pitch angle e. It is noted that the substrate S will slip relative to the end effector 1520 without friction μ if the pitch angle e is substantially zero. The curve illustrated in Fig.30B represents the desired pitch angle “e” to keep the substrate S moving at an acceleration “a” along the X direction without slippage. Alternatively, the same curve of Fig.30B can be interpreted as the demanded acceleration “a” of the substrate handler 110 to prevent the substrate S from slipping while moving along the X direction with the pitch angle “e”. Deviation from the curve illustrated in Fig. 30B will cause the substrate S to slide either “downhill” or “uphill” (where the terms downhill and uphill are used for convenience relative to the pitch) relative to the end effector 1520 depending on the acceleration value.

[0253] Figs.31A and 31B show the effect of a non-zero static friction coefficient μ on the relation between acceleration a and pitch angle e. For example, Fig.31A illustrates a minimum propulsion acceleration before slippage of the substrate S relative to the end effector 1520 takes place. In thisAtty. Docket No.390P017044-WO (PCT) case, the friction force direction points “uphill” to substantially prevent the wafer mass m from sliding “downhill” (again relative to the direction of pitch). Here, the “slowest” expected acceleration to prevent wafer slippage is calculated as:

[0254] amin= [-μ + tan e] / [l + μ tan e] [eq.17]

[0255] Fig. 31B, illustrates the case for the maximum (e.g., fastest) expected propulsion acceleration a before slippage of the substrate S relative to the end effector 1520. In this case, the friction force direction points “downhill” to substantially prevent the wafer mass m from sliding “uphill” (again relative to the direction of pitch). Here, the “fastest” expected acceleration a is calculated as:

[0256] amax= [μ + tan e] / [1 - μ tan e] [eq.18]

[0257] Consequently, in the presence of a non-zero static friction coefficient μ the propulsion acceleration a should stay within the limits below in order to prevent substrate S slippage, for a given pitch angle:

[0258] amin< a < amax[eq.19]angle e for a static coefficient of μ that is about 0.1, which is a typical value for substrate handlers used in high temperature applications. The curve of Fig. 30B is repeated in Fig. 32 under the case of μ equal to about 0. The region between the top and bottom curves (μ equal to about 0.1) represents a non-slippage region (e.g., a region of acceleration for a given pitch angle where the substrate slippage relative to the end effector substantially does not occur). The areas outside this region may have wafer slippage either in the upwards of downwards direction relative to the substrate handler inclination (i.e., pitch angle e). In the example of Fig.32, the maximum acceleration with a substantially zero pitch angle is about 0.l g which is the fastest acceleration that conventional substrate handlers can provide for typical high temperature applications. If the pitch angle e is setAtty. Docket No.390P017044-WO (PCT) to about 16 degrees of inclination, the substrate can be transported at accelerations as high as 0.4 g using the same end effector material (as in conventional substrate handlers) which constitutes a substantial throughput improvement compared to the conventional substrate handlers. The pitch angle e can be set according to a predetermined acceleration in order to maximize throughput such as depicted in Fig.27A.

[0260] Fig.33 illustrates active control of the substrate handler 110 orientation in roll, pitch, and yaw with respect to leveling of the substrate handler 110 relative to a substrate station, such as process module 120. Mechanical deflection imposes challenges on entering and exiting process module openings 2780, which are becoming increasingly smaller in height H3 due to the need of optimizing process module 120 process times. Conventional substrate transports generally suffer from the inherent potential of mechanical deflection due to the presence of articulated links with bearings that add weight and decrease stiffness, noting that compensating for the end-effector orientation as the wafer goes through the process module opening 2780 may not be practical. In these cases, it is becoming increasingly difficult to be able to comply with more restrictive mechanical deflection constraints. The features of the present disclosure provide a solution to mechanical deflection that dynamically compensates for any mechanical deflection by controlling the substrate handler orientation in space, relative to the level reference plane (e.g., by adjusting the roll, pitch and yaw angles as described herein) such that a substrate passes through the process module opening 2780 substantially without contact between the substrate S and the opening 2780 and substantially without contact between the end effector 1520 and the opening 2780.

[0261] Figs.13A-14C illustrate the controlled adjustment, by the local drive controller(s) 1750A- 1750n (and based on the position determination of the substrate handler 110 as described herein), of the roll and yaw angles of the substrate handler 110 in addition to the pitch angle. Referring also to Fig. 33, the controlled adjustment of each of the roll, yaw, and pitch angles (e.g., by differentially varying at least the lift force vectors acting on the base 1510 as described herein) effects leveling a position of the substrate handler 110 at any suitable substrate holding station such as a process module 120 so that a plane 2770 of the substrate S (and end effector 1520 onAtty. Docket No.390P017044-WO (PCT) which the substrate S is supported) is substantially the same as a plane 2771 defined by the substrate holding station 120 substrate support surface 2760. The roll, yaw, and pitch angles may be adjusted independent of each other. The controlled adjustment of the substrate handler 110 orientation angles (e.g., roll, pitch, and yaw) also provides for compensation of mechanical deflection of the end effector 1520 due to, for example, the substrate loading as well as the weight of the substrate handler 110 structure.

[0262] Referring to Figs. 8-11 and 34 and 35, as described above, multiple drive lines 177, 178 may be provided so as to extend longitudinally along a length of the transfer chamber 118 to provide passage of one substrate handler 110 by another substrate handler along the longitudinal direction of the transfer chamber 118. Fig.34 illustrates passage of two substrate handlers 110A, 110B past one another with substrate handler 110A traveling along an inbound track 1550A and with substrate handler 110B travelling along an outbound track 1550B. Here each of the substrate handlers 110A, 110B have roll, pith, and yaw angles so that the plane 2770 of the end effector 1520 (and substrate s held thereon) is substantially parallel (i.e., level) with the level reference plane 1299. Here, with the end effectors 1520 level, the transfer chamber 118 has a lateral width W1. However, the width of the transfer chamber 118 may be minimized or otherwise reduced from lateral width W1 to lateral width W2 by adjusting one or more of the roll, the pitch, and the yaw of the substrate handlers 110A, 110B as they pass one another along the length of the transfer chamber 118. For example, as illustrated in Fig.35 the roll angle of each substrate handler 110A, 110B may be adjusted to a predetermined angle β relative to the level reference plane 1299 to avoid contact between the substrate handlers 110A, 110B as they move past one another during a period of time that both substrate handlers 110A, 110B would otherwise occupy the same space. The predetermined roll angle β may depend on end effector configuration (e.g., so that the substrate S does not slip relative to the end effector). As may be realized it advantageous to have control of the roll, pitch, and / or yaw angles of each substrate handler 110 in order to reduce a footprint of the transfer chamber 118 that houses the wafer handling automation, where the reduced footprint atAtty. Docket No.390P017044-WO (PCT) least increases tool density on the fabrication facility floor and decreases pump down times of the transfer chamber which may result in increased throughput.

[0263] Referring now to Figs.15 and 36, an exemplary control of the array of electromagnets 1700 will be described where dynamic phase allocation is employed. As described herein, the controller 199 (which may be a clustered or master controller as described herein – see Fig.38) is operably coupled to the array of electromagnets 1700 and the alternating current power source 1585 (the power source may be any suitable type and can be direct current in which case the controller driving circuit will modulate that to desired frequency / phase for as many alternating current power phases as desired) and configured so as to sequentially excite the electromagnets 1700A-1700n with multiphase alternating current so that the base 1510 of a substrate handler 110 is levitated and propelled with at least one of attitude control and yaw control with a common set of the electromagnets 1700A-1700n (such as those electromagnets of a respective drive line 177-180). As noted above, the controller 199 is configured to sequentially excite the electromagnets 1700A- 1700n cooperating in multi-phase alternating current excitation that form motor actuator units 1701 corresponding to the position of the base 1510 as determined based on the changes in the excitation characteristic (e.g., inductance, a phase lag / amplitude, and / or power factor) as described herein. The number n (an integer in the example of three or more, though in other aspects may be two or more) of electromagnets 1700A-1700n of each motor actuator unit 1701 as well as the location (static) of the respective n electromagnets 1700A-1700n of each motor actuator unit 1701 are dynamically selectable by the controller 199 in effecting lift and propulsion of the base (secondary) 1510 at any given time throughout operation of the motor actuator. Each of the electromagnets 1700A-1700n generates, from excitation with common multiphase alternating current having a single common frequency per phase, both the separately controllable levitation and the propulsion forces against the base 1510 so as to control the base 1510 with up to six independent degrees of freedom including at least one of attitude and yaw at least with the base 1510 levitated. The common single frequency per phase of each phase (here respective phases A, B, C) may be selectably variable from different desired excitation frequencies so that levitationAtty. Docket No.390P017044-WO (PCT) and propulsion forces generated by the motor actuation unit 1701 enable substantially independent control of the base 1510 in each of the up to six independent degrees of freedom. The controller 199 may control the roll, pitch, and yaw angles generated by the array of electromagnets 1700A- 1700n arranged in the respective motor actuator units 1701, including at least the attitude with the base 1510 levitated and propelled so as to move relative to the array of electromagnets 1700 along the at least one drive line 177-180, DL1-DL8 from a first predetermined position P1 (see Fig.1) with respect to the frame of the chamber 118 to a second different predetermined position P2 (see Fig. 1) with respect to the frame of the chamber 118. The controller 199 may control the roll, pitch, and yaw angles generated by the array of electromagnets 1700, including at least the base 1510 attitude and the base 1510 yaw with the base 1510 levitated and stationary relative to the array of electromagnets 1700 in a predetermined position (such as position P2 in Fig.1) along the at least one drive line 177-180, DL1-DL8 with respect to the frame of the chamber 118.

[0264] Figs.37A and 37B illustrate an example where each electromagnet (or coil unit) 1700A- 1700n is grouped so as to define a motor actuator unit 1701 having a dynamically selected number of electromagnets, for example three electromagnets (n=3) and three corresponding phases (m=3) with an electrical angle between the phases of 120° (see also Fig.15) is also dynamically associated with the three different phases A, B, C so that association of each phase A, B, C with the corresponding static electromagnet 1700A-1700n comports with the dynamic state of the motor actuation unit 1701. Accordingly, with the electromagnets of the motor actuator unit 1701 propelling the base 1510 (and sensing the position of the base 1510) (e.g., along direction 3100) each phase A, B, C respectively changes or moves from one static electromagnet to another (i.e., rolling the designation or allocation of the respective phases to consecutive electromagnets 1700A- 1700n so as to generate a virtual (motion) multi-phase actuator / position sensing unit 3000, 3000tP1, 3000tP2of each of the linear electrical machine 700 and the electrical machine 700R proceeding in the direction of motion 3100 commensurate with motion of the base 1510 generated by the excitation of the electromagnets 1700A-1700n corresponding to the virtual motion multi- phase actuation unit 3000, 3000tP1, 3000tP2. This dynamic relationship or association producingAtty. Docket No.390P017044-WO (PCT) the virtual motion multi-phase actuator unit 3000, 3000tP1, 3000tP2between coil units and phase will be referred to here for convenience as “dynamic phase allocation” wherein the virtual motion of the representative virtual motion multi-phase actuator unit 3000, 3000tP1, 3000tP2effecting propulsion of the base 1510 is illustrated schematically in Fig. 36 (see also Fig. 15). Here the virtual motion multi-phase actuator / position sensing unit (or “MAU” in Fig. 15) 3000 has dynamically selected three electromagnets and associated phases A, B, C, shown in an initial (representative) position P=0 at time t=t0. The respective excitation of the virtual motion multi- phase actuator unit 3000 electromagnets generate propulsion forces that move the platen / base 1510 between t1 and t2 (see also Figs.37A and 37B). Here, as shown, at P=0 and t=t0, electromagnets 1700A-1700C are grouped to form virtual motion multi-phase actuator unit 3000, and are respectively associated with phases A, B, C. Coincident with generation of propulsion forces Fx, respective excitation of virtual motion multi-phase actuator unit 3000 electromagnets 1700A- 1700C generate separately controllable lift forces Fy with a controlled variable height relative to the platen / base 1510, that simultaneously lifts and effect tilt adjustment of the platen / base 1510 simultaneously with propulsion (see Figs.37A and 37B). As may be realized, under effect of the lift Fy and propulsion Fx forces imparted by the respective electromagnets 1700A-1700C of the virtual motion multi-phase actuator unit 3000 at time t=t0 and position P=0 the platen / base 1510 moves (relative to the transfer chamber and hence the static electromagnets 1700A-1700C) with a predetermined lift and tilt. To maintain steady state tilt of the platen / base 1510 during motion away from the group of electromagnets 1700A-1700C (defining virtual motion multi-phase actuator unit 3000 at P=0 and T=T0) the controller 199 and circuitry 3050, of the respective electromagnets of the electromagnet array 1700A-1700n, are configured to dynamically “move” (or “change”) the allocation of the respective phases A, B, C (from the initial virtual motion multi- phase actuator unit 3000 at P=0 and t=t0) commensurate with the travel of the platen / base 1510 at time t=t1 and position P=1 to corresponding electromagnets 1700B-1700D that now define virtual motion multi-phase actuator unit 3000tP1 disposed at position P=1 at time t=t1, and subsequently allocation of the respective phases A, B, C (from the virtual motion multi-phase actuator unit 3000tP1 at P=1 and t=t1) commensurate with the travel of the platen / base 1510 at time t=t2 andAtty. Docket No.390P017044-WO (PCT) position P=2 to corresponding electromagnets 1700C-1700E that now define virtual motion multi- phase actuator unit 3000tP2 disposed at position P=2 at time t=t2, and so on. Dynamic phase allocation is repeated throughout platen / base 1510 motion so that the phase distribution with respect to the platen, and excitation by respective phases (here A, B, C) of the platen / base 1510 remain substantially steady state throughout motion of the platen / base 1510.

[0265] The virtual multi-phase actuator / position sensing unit 3000, 3000tP1, 3000tP2may comprise a series of electromagnets 1700A-1700n of the array of electromagnets 1700 coupled to at least the multiphase alternating current power source 1585 that define at least one drive line 177-180 (which as noted herein are substantially similar to drive lines DL1-DL8) within the drive plane DP, where electromagnets 1700A-1700n in the series of electromagnets 1700A-1700n are dynamically grouped into at least one multiphase actuator unit DLIM1, DLIM2, DLIM3, and each of the at least one multiphase actuator unit DLIM1, DLIM2, DLIM3 being coupled to at least the multiphase alternating current power source 1585. In this case, on initiating propulsion (effecting motion of the base / secondary) by excitation of corresponding electromagnet groups of the motor actuation unit at an initial position (P=0, t=0) the definition of phases A, B, C and the associated "motors" (e.g., DLIM1, DLIM2, DLIM3) are changing in space and time (Pi, ti), as described above, in order to maintain substantially steady state force vectors FZ1, FZ2, FX1, FX2 imparted on the base 1510 throughout the range of motion, that provide a desired substantially steady state or constant tilt orientation of the substrate handler 110 throughout the range of motion. As noted herein, an exemplary actuator control system network 1799 configured to effect dynamic phase allocation is described with respect to Fig.15. As can be seen in Figs.37A and 37B, the dynamic phase allocation is controlled by the controller 199 so that the respective electromagnets 1700A- 1700n grouped into corresponding motor actuation units (such as described herein) energized by the multiphase alternating current A, B, C present, with respect to the base 1510 (represented by the front portion 3110 and rear portion 3111), a substantially steady state multiphase distribution across respective electromagnets 1700A-1700n of the virtually moving at least one multiphase actuator unit DLIM1, DLIM2, DLIM3. It is noted that the phase currents A, B, C are illustratedAtty. Docket No.390P017044-WO (PCT) within respective electromagnets 1700A-1700n and the phase current distribution across the at least one multiphase actuator unit DLIM1, DLIM2, DLIM3 remains constant or steady state with respect to the base 1510 (e.g., as an example of steady state note phase current A remains at the trailing end of the rear portion 3111, phase current C remains at the leading end of the rear portion 3111, and phase current B remains in the center of the rear portion 3111 throughout movement of the base 1510 and the at least one (virtually moving) multiphase actuator unit DLIM1, DLIM2, DLIM3 in the direction 3100).

[0266] In greater detail of dynamic phase allocation, Fig. 36 depicts at time t1 electromagnets 1700A, 1700B, 1700C which are respectively defined as phases A, B, C (Figs.36 and 37A) which generate a spatial force vector(s) that provides separately controllable lift and propulsion forces of a predetermined substrate handler 110 (i.e., a substrate handler identified by its unique signature as determined by the predetermined excitation characteristic (such as, e.g., a phase lag) of the electromagnets and selected for movement by the controller 199). As the substrate handler 110 moves in space (e.g., along the drive line associated with the array of electromagnets 1700), at time t2 electromagnets 1700B, 1700C, 1700D respectively become phases A, B, C (Figs.36 and 37B). As the substrate handler 110 continues to travel along the drive line (which in this example is in direction 3100 as shown in Figs.37A, 37B, and 37C), at time t3 phases A, B, C are associated with electromagnets 1700C, 1700D, 1700E, respectively. This dynamic phase allocation effects continuous spatial and time control of the force vectors that maintain propulsion, lift, and orientation of the predetermined substrate handler 110. The alternating current power source 1585 may be coupled to each of the electromagnets 1700A-1700n of the array of electromagnets 1700 through any suitable signal conditioning circuitry 3050 which may include current amplification power supply units 3011 or any other suitable signal processing. The phase A, B, C currents are transmitted to each of the local drive controllers 1750A-1750n which, under control of or in response to instruction from, master controller 1760 provide a specified one of the phase A, B, C currents to the respective electromagnets in the manner noted above to effect dynamic phase allocation.Atty. Docket No.390P017044-WO (PCT)

[0267] As described herein, the base 1510 (Fig. 14B) of a substrate handler cooperates with the electromagnets 1700A-1700n of the at least one multiphase actuator unit (Fig. 37A) DLIM, DLIM2, DLIM3 so that excitation of the electromagnets 1700A-1700n with alternating current generates levitation and propulsion forces against the base 1510 that controllably levitate and propel the base 1510 along the at least one drive line 177-180, in a controlled attitude relative to the drive plane DP. The controller 199 (which may include at least the master controller 1760 and any controller subordinate to the master controller such as the local drive controllers 1750A-1750n; however the controller may have any suitable configuration), is operable coupled to the alternating current power source 1585 and the array of electromagnets 1700. The alternating current power source 1585 may include any suitable associated circuitry 3050 through which the alternating current power source 1585 is connected to the array of electromagnets 1700. The alternating current power source 1585 is controlled by the local drive controllers or any other suitable controller such as the master controller 1760. Typical control parameters for the alternating current power source comprise of signal amplitude, signal frequency, and phase shift relative to a reference coil unit. Other types of control parameters may be defined. As used herein the “phase” A, B, C as illustrated in Fig. 36 is similar to a particular coil in a multi-phase electrical motor; however, the each of the phase definitions (such as A, B, C in Fig.36) is not physically tied to any particular coil.

[0268] As described before, and now referring to Fig.37C, controlling propulsion and levitation simultaneously and separately (so that propulsion forces and lift forces are separately controllable in full, so that control of each may be deemed independent of one another though both forces are effected by excitation with common multiphase alternating current having a single common frequency per phase, the common frequency per phase is selectably variable from different desired frequencies) may be effected by a variant of the dynamic phase allocation described herein, where one or more dynamic linear motor (DLIM) may include a selectable n number of phases associated with electromagnets defining the virtual motion multi-phase actuator unit, where n can be an integer larger than three. The number n of electromagnets defining the virtual motion multi-phaseAtty. Docket No.390P017044-WO (PCT) actuator unit may be dynamically selected, for example, for effecting different moves of the platen / base 1510 depending on kinematic characteristics of the desired move. Here the excitation frequency commonly applied per phase of the virtual motion multi-phase actuator unit is selected by the controller 199 so as to generate desired kinematic performance and control of the platen / base 1510. Here, the phase control algorithm maintains the same electrical phase angle difference between the phases (e.g., electromagnets of the motor), as shown in Fig. 37C. The electrical phase difference is calculated relative to a reference phase or relative to each phase. The electrical phase angle difference φ between phases may have a range so as to produce positive and negative values of propulsion forces while maintaining levitation. Depending on the value of the electrical phase angle difference φ the number of electromagnets within a respective dynamic linear motor varies. Here, the boundary between DLIM1 (illustrated for exemplary purposes with 6 electromagnets) and DLIM2 as shown in Fig.32C is dynamic. In another aspect of the dynamic linear motor electromagnet / phase allocation, not all electromagnets of a dynamic linear motor need to be energized at the same time. Referring to DLIM 1, only m (in this example m = 4) electromagnets out of all n (in this example n = 6) electromagnets of dynamic linear motor DLIM1 (where m is the number of electromagnets covered by the base (or secondary)) are energized to effect lift and propulsion of the base 1510, while the other electromagnets of the n electromagnets of the dynamic linear motor DLIM1 can be turned off.

[0269] Referring to Figs.1-6, 12, and 50, processing apparatus, such as the substrate processing apparatus 100, 100A, 100B, 100C (and their components) as described herein, may be controlled by a configurable scalable software stored in the controller 199. A manufacturing execution system software (“MES”) 50000 (see Fig. 50) may be provided in the controller 199, which as described herein is communicably connected to the processing apparatus 100, 100A, 100B, 100C. One or more of the substrate processing apparatus 100, 100A, 100B, 100C may be disposed in any suitable fabrication facility. The MES 50000 includes software modules 50002-50016 or options that enhance the capabilities of the MES 50000. The software modules include, but are not limited to, a material control system (“MCS”) 50002, a real time dispatcher (“RTD”) 50004, a workflowAtty. Docket No.390P017044-WO (PCT) or activity manager (“AM”) 50006, an engineering data manager (“EDA”) 50008, a computer maintenance management system (“CMMS”) 50010, and the thermal management protocol (“TMP” – described herein) 50012. The MES 50000 allows manufacturers to configure their factory resources and process plans, track inventory and orders, collect and analyze production data, monitor equipment, dispatch work orders to manufacturing operators, and trace consumption of components into finished products. The MCS software module 50002 allows the manufacturer to efficiently schedule individual substrate handlers 110, 110A, 110B, 110C to arrive at the process modules 120, substrate handler stations 115, load locks 116, other suitable substrate holding stations of the substrate processing apparatus, and / or position themselves relative to one another to maximize overall substrate processing apparatus 100, 100A, 100B, 100C efficiency.

[0270] The MCS software module 50002 schedules when substrate handlers 110, 110A, 110B, 110C will arrive at, and depart from, specified process modules 120, substrate handler stations 115, load locks 116, other suitable substrate holding stations of the substrate processing apparatus, and / or other substrate handlers 110, 110A, 110B, 110C. The MCS software module 50002 manages any queuing and routing requirements at each of the specified process modules 120, substrate handler stations 115, load locks 116, other suitable substrate holding stations of the substrate processing apparatus, and / or other substrate handlers 110, 110A, 110B, 110C, and optimizes the substrate processing apparatus yield (i.e., optimizes the amount or quantity of product produced) while minimizing substrate handler 110, 110A, 110B, 110C transport / cycle time.

[0271] In what may be referred to as a mixed substrate holder processing system (e.g., a substrate processing system having both carts 110C and substrate handlers 110, 110A, 110B with end effectors 110 in the same / common operating space), the MES 50000 is configured to (e.g., through the MCS software module 50002, any other suitable software modules, or a combination of software modules) effect interfacing between the carts 110 and the substrate handlers 110, 110A, 110B so that one or more substrates are transferred between the carts 110C and substrate handlers 110, 110A, 110B in a manner similar to that described with respect to Figs.44A-46. For example,Atty. Docket No.390P017044-WO (PCT) to transfer a substrate between a substrate handler 110, 110A, 110B end effector 110E and a cart 110C (e.g., to effect substrate alignment and / or transfer of the substrate by either the cart 110C or substrate handler 110, 110A, 110B end effector 110E) the MES determines a transfer location within the substrate processing apparatus 100, 100A, 100B, 100C, schedules a transfer time, and effects interfacing (e.g., alignment of the transport paths, positions, and poses of the cart 110C and substrate handler 110, 110A, 110B in the respective six degrees of freedom movement to effect the transfer of substrate(s)) between the cart 110C and the substrate handler 110, 110A, 110B. Here, the mixed substrate holder processing system provides for reducing the workload of the substrate handlers 110, 110A, 110B with end effectors 110E and increases processing throughput by one or more of employing X and / or Y axis (or any one or more of the six degrees of freedom) movement of the cart 110C in cooperation with movement (e.g., in any one or more of the six degrees of freedom) of the substrate handlers 110, 110A, 110B with end effectors 110E; and transferring substrates from one location to another with the cart 110C such as where the substrate processing recipe provides for such direct transfer with the cart 110C. The RTD software module 50004 allows manufacturers to make substrate handler 110, 110A, 110B, 110C routing decisions, in real time, based on feedback from the health of the substrate processing apparatus components. Additionally, substrate handler 110, 110A, 110B, 110C routing decisions may be made by the MES 50000 operator. The MES 50000 operator may change the priority in which specific products need to be manufactured. The AM software module 50006 allows manufacturers to monitor the progress of any given substrate handler 110, 110A, 110B, 110C holding or otherwise transporting one or more substrates S through the entire manufacturing process undergone by the substrate S. If, for example, a process module 120 (or other component of the substrate processing apparatus) generates an error, the AM software module 50006 determines the best remaining route for all the substrates being processes as the substrate processing apparatus 100, 100A, 100B, 100C. The EDA software module 50008 allows manufacturers to analyze the manufacturing data and execute statistical process control algorithms on that data in an effort to improve the efficiency of the substrate processing apparatus. The CMMS software module allows the manufacturer to predict when maintenance is required on individual components (e.g., process modules, load locks,Atty. Docket No.390P017044-WO (PCT) substrate handler stations, slot valves, substrate handlers, etc.) of the substrate processing apparatus. Variances in the individual components are monitored and compared against known process results and changes to the manufacturing process and / or scheduled repairs to the individual components is / are predicted. The TMP software module 50012, as described herein, manages the thermal properties (e.g., schedules heating / cooling) of the substrate handler(s) 110, 110A, 110B, 110C as described herein to maintain energy efficient levitation of the substrate handler(s) and / or to substantially match a temperature of the substrate handler substrate holder (e.g., end effector 110E, supports 1431-1433, substrate support rack 1440, etc.) with a temperature of a substrate to be handled by the substrate handler.

[0272] Referring to Figs. 1-22, 27A, 33-37B, 40-41D, 44A-45D and 47 (e.g., for reference to structural features, noting the method described hereafter applies to all aspects of the present disclosure), as well as to Fig.48, an exemplary method will be described. In the method, the linear electrical machine 700 is provided (Fig.48, Block 4800) and includes the transport chamber 118, the array of electromagnets 1700, and at least one substrate handler 110 (e.g., generically referred to herein as a reaction platen). The transport chamber 118 has a level reference plane 1299 (see Figs.7A and 10B) and is configured to hold a sealed environment. The transport chamber 118 has at least one closable port 118O along one or more sides of the transport chamber 118. The array of electromagnets 1700 is connected to the transport chamber 118 to form a drive plane DP at a predetermined height H relative to the level reference plane 1299. The array of electromagnets 1700 is arranged so that a series of electromagnets 1700A-1700n of the array of electromagnets 1700 define at least one drive line 177-180, DL1-DL8 within the drive plane DP. The drive plane DP has closed bounds that bound the linear electrical machine 700 and at least one of: conform to the sides of the transport chamber 118, and extend through the at least one closable port 118O. The least one substrate handler 110 is disposed to cooperate with the series of electromagnets 1700A-1700n of the array of electromagnets 1700 so as to controllably levitate and propel the at least one substrate handler 110 along the at least one drive line 177-180, DL1-DL8, in a controlled attitude relative to the drive plane DP. The method also includes registering with the controllerAtty. Docket No.390P017044-WO (PCT) 199, which is operably coupled to the array of electromagnets 1700 as described herein) a presence of each of the at least one substrate handler 110 in the linear electrical machine 700, and a pose of the at least one substrate handler 110 in the transport chamber 118 (Fig.48, Block 4810), where a totality of substrate handlers 110TOT that totals each substrate handler 110 in the linear electrical machine 700 represents an open system wherein the totality of substrate handlers 110TOT, within the closed bounds of the drive plane is variable so as to admit at least one of: introduction inside, from outside the closed bounds, and removal from inside to outside the closed bounds, of the at least one substrate handler 110 (e.g., the variability admits at least one substrate handler 110 into the closed bounds from outside the closed bounds, and removal of the at least one substrate handler 110 from inside the closed bounds to outside the closed bounds); and where the controller 199 registers the variance in the totality of substrate handlers 110TOT.

[0273] In the method: the variance is substantially independent of input and removal (throughput) of substrates (also referred to as workpieces) S through the closed bounds of the linear electrical machine 700; the at least one substrate handler 110 (or a portion thereof) is formed of a paramagnetic, a diamagnetic, or a non-magnetic conductive material (as described herein); each electromagnet of the array of electromagnets 1700 is coupled to an alternating current power source 1585 energizing each electromagnet; the totality of substrate handlers 110TOT is varied by one or more of the at least one substrate handler 110 introduced and the at least one substrate hander 110 removed from the totality of substrate handlers 110TOT respectively by introduction inside, from outside, and removal from inside to outside of the at least one substrate handler 110; the totality of reaction platens 110TOT is varied by the at least one substrate handler 110 being one or more of introduced and removed through the at least one closable port 118O; the at least one substrate handler 110 introduction inside from outside, and removal from inside to outside is through the at least one closable port 118O; and / or the at least one substrate handler 110 has a payload unit holder or end effector 110E. The method, in addition to or in lieu of one or more of the above, further includes providing the linear electrical machine 700 with at least one platen service module or substrate handler station 115 connected to the transport chamber 118 so as toAtty. Docket No.390P017044-WO (PCT) communicate with the sealed environment, where one or more of: substrate handler 110 introduction and removal is effected via the at least one platen service module 115; the method further includes receiving, with the at least one platen service module 115, the at least one substrate handler 110 therein from the transport chamber 118, where the at least one platen service module 115 forms a platen buffer station buffering the at least one substrate handler 110 outside the transport chamber 118; the method further includes effecting, with the at least one platen service module 115, thermal control of the at least one substrate handler 110, so as to at least one of heat and cool the at least one substrate handler to a predetermined platen temperature; the predetermined platen temperature conforms with a thermal management control protocol TMP of the linear electrical machine 700; and the method further includes, with the at least one platen service module 115, both buffering the at least one substrate handler 110 and introducing and removing the at least one substrate handler 110 from the closed bounds that bound the linear electrical machine 700.

[0274] Referring to Figs. 1-22, 27A, 33-37B, 40-41D, 44A-45D and 47 (e.g., for reference to structural features, noting the method described hereafter applies to all aspects of the present disclosure), as well as to Fig.49, an exemplary method will be described. In the method, the linear electrical machine 700 is provided (Fig.49, Block 4900) and includes the transport chamber 118, the array of electromagnets 1700, and at least one substrate handler 110 (e.g., generically referred to herein as a reaction platen). The transport chamber 118 has a level reference plane 1299 (see Figs.7A and 10B) and is configured to hold a sealed environment. The transport chamber 118 has at least one closable port 118O along one or more sides of the transport chamber 118. The array of electromagnets 1700 is connected to the transport chamber 118 to form a drive plane DP at a predetermined height H relative to the level reference plane 1299. The array of electromagnets 1700 is arranged so that a series of electromagnets 1700A-1700n of the array of electromagnets 1700 define at least one drive line 177-180, DL1-DL8 within the drive plane DP. The drive plane DP has predetermined bounds that define a platen travel space PTS throughout the linear electrical machine 700. The at least one substrate handler 110, has a payload unit holder or end effectorAtty. Docket No.390P017044-WO (PCT) 110E, and is disposed to cooperate with the series of electromagnets 1700A-1700n of the array of electromagnets 1700 so as to controllably levitate and propel the at least one substrate holder 110 along the at least one drive line 177-180, DL1-DL8, in a controlled attitude relative to the drive plane DP throughout the platen travel space PTS. With at least one platen service module 115 connected to the transport chamber 118 so as to communicate with the sealed environment, the method further includes at least one of introducing inside, from outside the platen travel space PTS (Fig.49, Block 4910), and removing, from inside to outside the platen travel space PTS (Fig.49, Block 4920), the at least one substrate handler 110 substantially independent of input and removal (throughput) of substrates (also referred to herein as payload units) S to and from the platen travel space PTS.

[0275] In the method one or more of: the platen travel space PTS at least one of conforms substantially to the one or more sides of the transport chamber 118 and extends through the at least one closable port 118O; the method further includes, with the at least one platen service module 115, receiving the at least one substrate handler 110 therein from the transport chamber 118O, where the at least one platen service module 115 forms a platen buffer station buffering the at least one substrate handler 110 outside the transport chamber 118; the method further includes effecting, with the at least one platen service module 115, thermal control of the at least one substrate handler 110, so as to at least one of heat and cool the at least one substrate handler 110 to a predetermined platen temperature; the predetermined platen temperature conforms with a thermal management control protocol TMP of the linear electrical machine 700; the method further includes, with the at least one platen service module 115, both buffering the at least one substrate handler 110 and introducing and removing the at least one substrate hander 110 from the platen travel space PTS; the at least one substrate handler 110 is formed of a paramagnetic, a diamagnetic, or a non- magnetic conductive material; each electromagnet of the array of electromagnets 1700 is coupled to an alternating current power source 1585 energizing each electromagnet; a totality of substrate handlers 110TOT within the platen travel space PTS is varied by one or more of the at least one substrate handler 110 introduced and the at least one substrate handler 110 removed from theAtty. Docket No.390P017044-WO (PCT) totality of substrate handlers 110TOT respectively by introduction inside the platen travel space PTS, from outside the platen travel space PTS, and removal from inside the platen travel space PTS to outside the platen travel space PTS of the at least one substrate handler 110; the totality of substrate handlers 110TOT is varied by the at least one substrate handler 110 being one or more of introduced and removed through the at least one closable port 118O; and the at least one substrate handler 110 introduction inside from outside the platen travel space PTS, and removal from inside to outside the platen travel space PTS is through the at least one closable port 118O.

[0276] Referring to, at least, Figs.1-12, 44A-45D, and 55 an exemplary method will be described. The method includes providing an electric machine (as described herein) (Fig. 55, Block 5500) having: a chamber (e.g., transfer chamber, load lock chamber, substrate handler station, etc.) with a level reference plane 1299, the chamber having at least one closable port (such as port 118O) along one or more sides of the chamber; an automatic wafer centering station 4444 connected to the chamber in communication with the at least one closable port; an array of electromagnets 1700, connected to a frame (e.g., of the chamber) to form a drive plane DP that extends at least in part within the wafer centering station 4444 at a predetermined height H relative to the level reference plane 1299; and at least one reaction platen 1510, having a wafer holding station (see substrate seating surface 1520A), and disposed to cooperate with the electromagnets of the array of electromagnets 1700 so as to controllably levitate and propel the reaction platen 1510 with a predetermined drive motion along the drive plane DP. The method includes exciting the electromagnets 1700, with a controller 199 operably coupled to the array of electromagnets 1700, so as to describe six degrees of freedom reaction platen control of the at least one reaction platen 1510 (Fig.55, Block 5510), and the at least one reaction platen 1510 is levitated and propelled, at the wafer centering station 4444, in the predetermined drive motion with at least two degrees of freedom that effect automatic wafer centering of a wafer or substrate S held at the wafer holding station of the at least one reaction platen 1510.

[0277] The method may include one or more of the following, individually, in any combination thereof, or in any combination with the features described herein: the chamber is configured toAtty. Docket No.390P017044-WO (PCT) hold a sealed environment therein; the chamber is a load lock chamber 116 of a wafer processing tool (such as described herein); the automatic wafer centering station 4444 is located inside the chamber; the automatic wafer centering station has a imaging or vision sensor 4450 connected to the chamber with a camera imaging the wafer S held at the wafer holding station (of the reaction platen) with the at least one at least one reaction platen 1510 moved in the predetermined drive motion, imaging data of the wafer S in the predetermined drive motion providing information determining wafer center position and notch (see Fig.45D) location of the wafer S, and wherein the predetermined drive motion effects yaw and linear translation of the at least one reaction platen so that yaw rotation of the wafer holding station is about a point variably offset from a center of the wafer holding station (e.g., the rotation of the wafer S may be rotation about the wafer center, a yawing or linear motion about an axis offset from the wafer S center, in other words the rotation of the wafer need not be about the center of the wafer S); the automatic wafer centering station 4444 has an elevation or distance sensor 4460A-4460C connected to the chamber for detecting an elevation of the at least one reaction platen 1510 being levitated; the at least one reaction platen 1510 forms a lift, and the controller 199 is configured to at least one of raise, lower, and change a tilt angle of the wafer S (e.g., held on the reaction platen 1510) with the lift; the lift effects transfer of the wafer S to and from the wafer holding station (of the reaction platen 1510) and a wafer handler 110, 110A, 110B, separate and distinct from the at least one reaction platen 1510, the wafer transferred from the wafer holding station to the wafer handler being disposed in a predetermined centered position on the wafer handler 110, 110A, 110B (see, e.g., Figs.45A-45C); and the at least one reaction platen 1510 may form a shuttle, wherein the array of electromagnets 1700 is configured so that the drive plane DP extends outside the automatic wafer centering station 4444, and the controller is configured to levitated and propel the shuttle in the predetermined motion so that the shuttle exits and enters the wafer centering station 4444 to transport the wafer to and from a wafer holder, separate and distinct from the at least one reaction platen, and the automatic wafer centering station (see, e.g., Figs.44A-44C).Atty. Docket No.390P017044-WO (PCT)

[0278] Referring to, at least, Figs. 1-12, 51-54, and 56 an exemplary method will be described. The method includes providing a linear electrical machine (as described herein) (Fig. 56, Block 5600) having: a transport chamber 118 with a level reference plane 1299 and configured to hold a sealed environment, the transport chamber 118 has at least one closable port 118O along one or more sides of the transport chamber 118; an array of electromagnets 1700 is connected to (a frame of) the transport chamber 118 to form a drive plane DP at a predetermined height H relative to the level reference plane 1299 (see, e.g., Fig.13A), the array of electromagnets 1700 being arranged so that a series of electromagnets of the array of electromagnets define at least one drive line within the drive plane DP, where the drive plane DP has predetermined bounds that define platen travel space throughout the linear electrical machine; and a framework (see, e.g., Figs. 51-53) with longitudinal and transverse members joined to each other in a configuration that frames the array of electromagnets 1700 within the frame work, the frame work being connected to and disposed outside the transport chamber 118 below the level reference plane 1299; wherein the array of electromagnets 1700 includes at least one array module 5090 of a partial series of the series of electromagnets being held in the array module 5090. The method includes removably mounting and unmounting the at least one array module 5090 to the framework as a unit (Fig. 56, Block 5610).

[0279] The method may include providing perimetrical poles, disposed on the framework surrounding the array of electromagnets so that each perimetrical pole, along each side of the framework, is juxtaposed adjacent a corresponding outermost electromagnet along a proximate side, of the array of electromagnets, proximate to the side of the framework.

[0280] The following are provided in accordance with the present disclosure and may be employed individually, in any combination with each other, and / or in any combination with the features described above:

[0281] In accordance with the present disclosure a linear electrical machine includes: a transport chamber with a level reference plane and configured to hold a sealed environment, the transportAtty. Docket No.390P017044-WO (PCT) chamber having at least one closable port along one or more sides of the transport chamber; an array of electromagnets, connected to the transport chamber to form a drive plane at a predetermined height relative to the level reference plane, the array of electromagnets being arranged so that a series of electromagnets of the array of electromagnets define at least one drive line within the drive plane, the drive plane having closed bounds that bound the linear electrical machine and at least one of: conform to the sides of the transport chamber, and extend through the at least one closable port; at least one reaction platen disposed to cooperate with the series of electromagnets of the array of electromagnets so as to controllably levitate and propel the at least one reaction platen along the at least one drive line, in a controlled attitude relative to the drive plane; and a controller operably coupled to the array of electromagnets and configured to register: presence of each of the at least one reaction platen in the linear electrical machine, and pose of the at least one reaction platen in the transport chamber, wherein a totality of reaction platens that totals each reaction platen in the linear electrical machine represents an open system wherein the totality of reaction platens, within the closed bounds of the drive plane, is variable so as to admit at least one of: introduction inside, from outside the closed bounds, and removal from inside to outside the closed bounds, of the at least one reaction platen, and wherein the controller is configured to register variance in the totality of reaction platens.

[0282] In accordance with the present disclosure, the linear electric machine may include one or more of the following individually, in any combination thereof, and / or in any combination with the features described herein:

[0283] the variance is substantially independent of input and removal of workpieces through the closed bounds of the linear electrical machine;

[0284] the at least one reaction platen is formed of a paramagnetic, a diamagnetic, or a non- magnetic conductive material;Atty. Docket No.390P017044-WO (PCT)

[0285] each electromagnet of the array of electromagnets is coupled to an alternating current power source energizing each electromagnet;

[0286] the totality of reaction platens is varied by one or more of the at least one reaction platen introduced and the at least one reaction platen removed from the totality of reaction platens respectively by introduction inside, from outside, and removal from inside to outside of the at least one reaction platen;

[0287] the totality of reaction platens is varied by the at least one reaction platen being one or more of introduced and removed through the at least one closable port;

[0288] the at least one reaction platen introduction inside from outside, and removal from inside to outside is through the at least one closable port;

[0289] the linear electrical machine further includes at least one platen service module connected to the transport chamber so as to communicate with the sealed environment;

[0290] reaction platen introduction and removal is effected via the at least one platen service module;

[0291] the at least one platen service module is configured to receive the at least one reaction platen therein from the transport chamber, where the at least one platen service module is a platen buffer station buffering the at least one reaction platen outside the transport chamber;

[0292] the at least one platen service module is configured to effect thermal control of the at least one reaction platen, so as to at least one of heat and cool the at least one reaction platen to a predetermined platen temperature;

[0293] the predetermined platen temperature conforms with a thermal management control protocol of the linear electrical machine;Atty. Docket No.390P017044-WO (PCT)

[0294] the at least one platen service module is configured to both buffer the at least one reaction platen and introduce and remove the at least one reaction platen from the closed bounds that bound the linear electrical machine; and

[0295] the at least one reaction platen has a payload unit holder.

[0296] In accordance with the present disclosure a linear electrical machine includes: a transport chamber with a level reference plane and configured to hold a sealed environment, the transport chamber having at least one closable port along one or more sides of the transport chamber; an array of electromagnets, connected to the transport chamber to form a drive plane at a predetermined height relative to the level reference plane, the array of electromagnets being arranged so that a series of electromagnets of the array of electromagnets define at least one drive line within the drive plane, the drive plane has predetermined bounds that define a platen travel space throughout the linear electrical machine; at least one reaction platen, having a payload unit holder, and disposed to cooperate with the series of electromagnets of the array of electromagnets so as to controllably levitate and propel the at least one reaction platen along the at least one drive line, in a controlled attitude relative to the drive plane throughout the platen travel space; and at least one platen service module connected to the transport chamber so as to communicate with the sealed environment, the at least one platen service module being configured to at least one of introduce inside, from outside the platen travel space, and remove, from inside to outside the platen travel space, the at least one reaction platen substantially independent of input and removal of payload units to and from the platen travel space.

[0297] In accordance with the present disclosure, the linear electric machine may include one or more of the following individually, in any combination thereof, and / or in any combination with the features described herein:

[0298] the platen travel space at least one of conforms substantially to the one or more sides of the transport chamber and extends through the at least one closable port.Atty. Docket No.390P017044-WO (PCT)

[0299] the at least one platen service module is configured to receive the at least one reaction platen therein from the transport chamber, where the at least one platen service module is a platen buffer station buffering the at least one reaction platen outside the transport chamber;

[0300] the at least one platen service module is configured to effect thermal control of the at least one reaction platen, so as to at least one of heat and cool the at least one reaction platen to a predetermined platen temperature;

[0301] the predetermined platen temperature conforms with a thermal management control protocol of the linear electrical machine;

[0302] the at least one platen service module is configured to both buffer the at least one reaction platen and introduce and remove the at least one reaction platen from the platen travel space;

[0303] the at least one reaction platen is formed of a paramagnetic, a diamagnetic, or a non- magnetic conductive material;

[0304] each electromagnet of the array of electromagnets is coupled to an alternating current power source energizing each electromagnet;

[0305] a totality of reaction platens within the platen travel space is varied by one or more of the at least one reaction platen introduced and the at least one reaction platen removed from the totality of reaction platens respectively by introduction inside the platen travel space, from outside the platen travel space, and removal from inside the platen travel space to outside the platen travel space of the at least one reaction platen;

[0306] the totality of reaction platens is varied by the at least one reaction platen being one or more of introduced and removed through the at least one closable port; and

[0307] the at least one reaction platen introduction inside from outside the platen travel space, and removal from inside to outside the platen travel space is through the at least one closable port.Atty. Docket No.390P017044-WO (PCT)

[0308] In accordance with the present disclosure a method includes: providing a linear electrical machine comprising: a transport chamber with a level reference plane and configured to hold a sealed environment, the transport chamber having at least one closable port along one or more sides of the transport chamber; an array of electromagnets, connected to the transport chamber to form a drive plane at a predetermined height relative to the level reference plane, the array of electromagnets being arranged so that a series of electromagnets of the array of electromagnets define at least one drive line within the drive plane, the drive plane having closed bounds that bound the linear electrical machine and at least one of: conform to the sides of the transport chamber, and extend through the at least one closable port; at least one reaction platen disposed to cooperate with the series of electromagnets of the array of electromagnets so as to controllably levitate and propel the at least one reaction platen along the at least one drive line, in a controlled attitude relative to the drive plane; and registering, with a controller operably coupled to the array of electromagnets: presence of each of the at least one reaction platen in the linear electrical machine, and pose of the at least one reaction platen in the transport chamber, wherein a totality of reaction platens that totals each reaction platen in the linear electrical machine represents an open system wherein the totality of reaction platens, within the closed bounds of the drive plane, is variable so as to admit at least one of: introduction inside, from outside the closed bounds, and removal from inside to outside the closed bounds, of the at least one reaction platen, and wherein the controller registers variance in the totality of reaction platens.

[0309] In accordance with the present disclosure, the method may include one or more of the following individually, in any combination thereof, and / or in any combination with the features described herein:

[0310] the variance is substantially independent of input and removal of workpieces through the closed bounds of the linear electrical machine;

[0311] the at least one reaction platen is formed of a paramagnetic, a diamagnetic, or a non- magnetic conductive material;Atty. Docket No.390P017044-WO (PCT)

[0312] each electromagnet of the array of electromagnets is coupled to an alternating current power source energizing each electromagnet;

[0313] the totality of reaction platens is varied by one or more of the at least one reaction platen introduced and the at least one reaction platen removed from the totality of reaction platens respectively by introduction inside, from outside, and removal from inside to outside of the at least one reaction platen;

[0314] the totality of reaction platens is varied by the at least one reaction platen being one or more of introduced and removed through the at least one closable port;

[0315] the at least one reaction platen introduction inside from outside, and removal from inside to outside is through the at least one closable port;

[0316] the method further includes providing the linear electrical machine with at least one platen service module connected to the transport chamber so as to communicate with the sealed environment;

[0317] reaction platen introduction and removal is effected via the at least one platen service module;

[0318] the method further includes receiving, with the at least one platen service module, the at least one reaction platen therein from the transport chamber, where the at least one platen service module forms a platen buffer station buffering the at least one reaction platen outside the transport chamber;

[0319] the method further includes, effecting, with the at least one platen service module, thermal control of the at least one reaction platen, so as to at least one of heat and cool the at least one reaction platen to a predetermined platen temperature;Atty. Docket No.390P017044-WO (PCT)

[0320] the predetermined platen temperature conforms with a thermal management control protocol of the linear electrical machine;

[0321] the method further includes, with the at least one platen service module, both buffering the at least one reaction platen and introducing and removing the at least one reaction platen from the closed bounds that bound the linear electrical machine; and

[0322] the at least one reaction platen has a payload unit holder.

[0323] In accordance with the present disclosure a method includes: providing a linear electrical machine comprising: a transport chamber with a level reference plane and configured to hold a sealed environment, the transport chamber having at least one closable port along one or more sides of the transport chamber; an array of electromagnets, connected to the transport chamber to form a drive plane at a predetermined height relative to the level reference plane, the array of electromagnets being arranged so that a series of electromagnets of the array of electromagnets define at least one drive line within the drive plane, the drive plane has predetermined bounds that define a platen travel space throughout the linear electrical machine; at least one reaction platen, having a payload unit holder, and disposed to cooperate with the series of electromagnets of the array of electromagnets so as to controllably levitate and propel the at least one reaction platen along the at least one drive line, in a controlled attitude relative to the drive plane throughout the platen travel space; and with at least one platen service module connected to the transport chamber so as to communicate with the sealed environment, at least one of introducing inside, from outside the platen travel space, and removing, from inside to outside the platen travel space, the at least one reaction platen substantially independent of input and removal of payload units to and from the platen travel space.

[0324] In accordance with the present disclosure, the method may include one or more of the following individually, in any combination thereof, and / or in any combination with the features described herein:Atty. Docket No.390P017044-WO (PCT)

[0325] the platen travel space at least one of conforms substantially to the one or more sides of the transport chamber and extends through the at least one closable port;

[0326] the method further includes, with the at least one platen service module, receiving the at least one reaction platen therein from the transport chamber, where the at least one reaction platen module forms a platen buffer station buffering the at least one reaction platen outside the transport chamber;

[0327] the method further includes effecting, with the at least one platen service module, thermal control of the at least one reaction platen, so as to at least one of heat and cool the at least one reaction platen to a predetermined platen temperature;

[0328] the predetermined platen temperature conforms with a thermal management control protocol of the linear electrical machine;

[0329] the method further includes, with the at least one platen service module, both buffering the at least one reaction platen and introducing and removing the at least one reaction platen from the platen travel space;

[0330] the at least one reaction platen is formed of a paramagnetic, a diamagnetic, or a non- magnetic conductive material;

[0331] each electromagnet of the array of electromagnets is coupled to an alternating current power source energizing each electromagnet;

[0332] a totality of reaction platens within the platen travel space is varied by one or more of the at least one reaction platen introduced and the at least one reaction platen removed from the totality of reaction platens respectively by introduction inside the platen travel space, from outside the platen travel space, and removal from inside the platen travel space to outside the platen travel space of the at least one reaction platen;Atty. Docket No.390P017044-WO (PCT)

[0333] the totality of reaction platens is varied by the at least one reaction platen being one or more of introduced and removed through the at least one closable port; and

[0334] the at least one reaction platen introduction inside from outside the platen travel space, and removal from inside to outside the platen travel space is through the at least one closable port.

[0335] In accordance with the present disclosure, an electrical machine comprises: a chamber with a level reference plane, the chamber having at least one closable port along one or more sides of the chamber; an automatic wafer centering station connected to the chamber in communication with the at least one closable port; an array of electromagnets, connected to the frame to form a drive plane that extends at least in part within the wafer centering station at a predetermined height relative to the level reference plane; at least one reaction platen, having a wafer holding station, and disposed to cooperate with the electromagnets of the array of electromagnets so as to controllably levitate and propel the reaction platen with a predetermined drive motion along the drive plane; and a controller operably coupled to the array of electromagnets and configured to excite the electromagnets so as to describe six degrees of freedom reaction platen control of the at least one reaction platen, and the at least one reaction platen is levitated and propelled, at the wafer centering station, in the predetermined drive motion with at least two degrees of freedom that effect automatic wafer centering of a wafer held at the wafer holding station of the at least one reaction platen.

[0336] The electrical machine may include one or more of the following individually, in any suitable combination thereof, and / or in any combination with the features described herein: the chamber is configured to hold a sealed environment therein; the chamber is a load lock chamber of a wafer processing tool; the automatic wafer centering station is located inside the chamber; the automatic wafer centering station has a imaging sensor connected to the chamber with a camera imaging the wafer held at the wafer holding station with the at least one at least one reaction platen moved in the predetermined drive motion, imaging data of the wafer in the predetermined drive motion providing information determining wafer center position and notch location of the wafer,Atty. Docket No.390P017044-WO (PCT) and wherein the predetermined drive motion effects yaw and linear translation of the at least one reaction platen so that yaw rotation of the wafer holding station is about a point variably offset from a center of the wafer holding station; the automatic wafer centering station has an elevation sensor connected to the chamber for detecting an elevation of the at least one reaction platen being levitated; the at least one reaction platen forms a lift, and the controller is configured to at least one of raise, lower, and change a tilt angle of the wafer with the lift; the lift effects transfer of the wafer to and from the wafer holding station and a wafer handler, separate and distinct from the at least one reaction platen, the wafer transferred from the wafer holding station to the wafer handler being disposed in a predetermined centered position on the wafer handler; and the at least one reaction platen forms a shuttle, wherein the array of electromagnets is configured so that the drive plane extends outside the automatic wafer centering station, and the controller is configured to levitated and propel the shuttle in the predetermined motion so that the shuttle exits and enters the wafer centering station to transport the wafer to and from a wafer holder, separate and distinct from the at least one reaction platen, and the automatic wafer centering station.

[0337] In accordance with the present disclosure a method includes: providing an electric machine having: a chamber with a level reference plane, the chamber having at least one closable port along one or more sides of the chamber, an automatic wafer centering station connected to the chamber in communication with the at least one closable port, an array of electromagnets, connected to the chamber to form a drive plane that extends at least in part within the wafer centering station at a predetermined height relative to the level reference plane, and at least one reaction platen, having a wafer holding station, and disposed to cooperate with the electromagnets of the array of electromagnets so as to controllably levitate and propel the reaction platen with a predetermined drive motion along the drive plane; and exciting the electromagnets, with a controller operably coupled to the array of electromagnets, so as to describe six degrees of freedom reaction platen control of the at least one reaction platen, and the at least one reaction platen is levitated and propelled, at the wafer centering station, in the predetermined drive motion with at least twoAtty. Docket No.390P017044-WO (PCT) degrees of freedom that effect automatic wafer centering of a wafer held at the wafer holding station of the at least one reaction platen.

[0338] The method may include one or more of the following individually, in any suitable combination thereof, and / or in any combination with the features described herein: the chamber is configured to hold a sealed environment therein; the chamber is a load lock chamber of a wafer processing tool; the automatic wafer centering station is located inside the chamber; the automatic wafer centering station has a imaging sensor connected to the chamber with a camera imaging the wafer held at the wafer holding station with the at least one at least one reaction platen moved in the predetermined drive motion, imaging data of the wafer in the predetermined drive motion providing information determining wafer center position and notch location of the wafer, and wherein the predetermined drive motion effects yaw and linear translation of the at least one reaction platen so that yaw rotation of the wafer holding station is about a point variably offset from a center of the wafer holding station; the automatic wafer centering station has an elevation sensor connected to the chamber for detecting an elevation of the at least one reaction platen being levitated; the at least one reaction platen forms a lift, and the controller is configured to at least one of raise, lower, and change a tilt angle of the wafer with the lift; the lift effects transfer of the wafer to and from the wafer holding station and a wafer handler, separate and distinct from the at least one reaction platen, the wafer transferred from the wafer holding station to the wafer handler being disposed in a predetermined centered position on the wafer handler; and the at least one reaction platen forms a shuttle, wherein the array of electromagnets is configured so that drive plane extends outside the automatic wafer centering station, and the controller is configured to levitated and propel the shuttle in the predetermined motion so that the shuttle exits and enters the wafer centering station to transport the wafer to and from a wafer holder, separate and distinct from the at least one reaction platen, and the automatic wafer centering station.

[0339] In accordance with the present disclosure, a linear electrical machine includes: a transport chamber with a level reference plane and configured to hold a sealed environment, the transport chamber having at least one closable port along one or more sides of the transport chamber; anAtty. Docket No.390P017044-WO (PCT) array of electromagnets, connected to the transport chamber to form a drive plane at a predetermined height relative to the level reference plane, the array of electromagnets being arranged so that a series of electromagnets of the array of electromagnets define at least one drive line within the drive plane, the drive plane has predetermined bounds that define platen travel space throughout the linear electrical machine; and a framework with longitudinal and transverse members joined to each other in a configuration that frames the array of electromagnets within the frame work, the frame work being connected to and disposed outside the transport chamber below the level reference plane; wherein the array of electromagnets includes at least one array module of a partial series of the series of electromagnets being held in the array module so as to be removably mounted and unmounted to the framework as a unit via mounting and unmounting of the array module.

[0340] The linear electrical machine may include perimetrical poles, disposed on the framework surrounding the array of electromagnets so that each perimetrical pole, along each side of the framework, is juxtaposed adjacent a corresponding outermost electromagnet along a proximate side, of the array of electromagnets, proximate to the side of the framework.

[0341] In accordance with the present disclosure. a method includes: providing a linear electrical machine having: a transport chamber with a level reference plane and configured to hold a sealed environment, the transport chamber having at least one closable port along one or more sides of the transport chamber, an array of electromagnets, connected to the transport chamber to form a drive plane at a predetermined height relative to the level reference plane, the array of electromagnets being arranged so that a series of electromagnets of the array of electromagnets define at least one drive line within the drive plane, the drive plane has predetermined bounds that define platen travel space throughout the linear electrical machine, and a framework with longitudinal and transverse members joined to each other in a configuration that frames the array of electromagnets within the frame work, the frame work being connected to and disposed outside the transport chamber below the level reference plane, wherein the array of electromagnets includes at least one array module of a partial series of the series of electromagnets being held inAtty. Docket No.390P017044-WO (PCT) the array module; and removably mounting and unmounting the at least one array module to the framework as a unit.

[0342] The method may include providing perimetrical poles, disposed on the framework surrounding the array of electromagnets so that each perimetrical pole, along each side of the framework, is juxtaposed adjacent a corresponding outermost electromagnet along a proximate side, of the array of electromagnets, proximate to the side of the framework.

[0343] It should be understood that the foregoing description is only illustrative of the aspects of the present disclosure. Various alternatives and modifications can be devised by those skilled in the art without departing from the aspects of the present disclosure. Accordingly, the aspects of the present disclosure are intended to embrace all such alternatives, modifications and variances that fall within the scope of any claims appended hereto. Further, the mere fact that different features are recited in mutually different dependent or independent claims does not indicate that a combination of these features cannot be advantageously used, such a combination remaining within the scope of the aspects of the present disclosure.

[0344] What is claimed is:

Claims

Atty. Docket No.390P017044-WO (PCT) CLAIMS 1. A linear electrical machine comprising: a transport chamber with a level reference plane and configured to hold a sealed environment, the transport chamber having at least one closable port along one or more sides of the transport chamber; an array of electromagnets, connected to the transport chamber to form a drive plane at a predetermined height relative to the level reference plane, the array of electromagnets being arranged so that a series of electromagnets of the array of electromagnets define at least one drive line within the drive plane, the drive plane having closed bounds that bound the linear electrical machine and at least one of: conform to the sides of the transport chamber, and extend through the at least one closable port; at least one reaction platen disposed to cooperate with the series of electromagnets of the array of electromagnets so as to controllably levitate and propel the at least one reaction platen along the at least one drive line, in a controlled attitude relative to the drive plane; and a controller operably coupled to the array of electromagnets and configured to register: presence of each of the at least one reaction platen in the linear electrical machine, and pose of the at least one reaction platen in the transport chamber, wherein a totality of reaction platens that totals each reaction platen in the linear electrical machine represents an open system wherein the totality of reaction platens, within the closed bounds of the drive plane, is variable so as to admit at least one of:Atty. Docket No.390P017044-WO (PCT) introduction inside, from outside the closed bounds, and removal from inside to outside the closed bounds, of the at least one reaction platen, and wherein the controller is configured to register variance in the totality of reaction platens.

2. The linear electrical machine of claim 1, wherein the variance is substantially independent of input and removal of workpieces through the closed bounds of the linear electrical machine.

3. The linear electrical machine of claim 1, wherein the at least one reaction platen is formed of a paramagnetic, a diamagnetic, or a non-magnetic conductive material.

4. The linear electrical machine of claim 1, wherein each electromagnet of the array of electromagnets is coupled to an alternating current power source energizing each electromagnet.

5. The linear electrical machine of claim 1, wherein the totality of reaction platens is varied by one or more of the at least one reaction platen introduced and the at least one reaction platen removed from the totality of reaction platens respectively by introduction inside, from outside, and removal from inside to outside of the at least one reaction platen.

6. The linear electrical machine of claim 1, wherein the totality of reaction platens is varied by the at least one reaction platen being one or more of introduced and removed through the at least one closable port.

7. The linear electrical machine of claim 1, wherein the at least one reaction platen introduction inside from outside, and removal from inside to outside is through the at least one closable port.

8. The linear electrical machine of claim 1, further comprising at least one platen service module connected to the transport chamber so as to communicate with the sealed environment.Atty. Docket No.390P017044-WO (PCT) 9. The linear electrical machine of claim 1, wherein the at least one reaction platen has a payload unit holder.

10. A linear electrical machine comprising: a transport chamber with a level reference plane and configured to hold a sealed environment, the transport chamber having at least one closable port along one or more sides of the transport chamber; an array of electromagnets, connected to the transport chamber to form a drive plane at a predetermined height relative to the level reference plane, the array of electromagnets being arranged so that a series of electromagnets of the array of electromagnets define at least one drive line within the drive plane, the drive plane has predetermined bounds that define a platen travel space throughout the linear electrical machine; at least one reaction platen, having a payload unit holder, and disposed to cooperate with the series of electromagnets of the array of electromagnets so as to controllably levitate and propel the at least one reaction platen along the at least one drive line, in a controlled attitude relative to the drive plane throughout the platen travel space; and at least one platen service module connected to the transport chamber so as to communicate with the sealed environment, the at least one platen service module being configured to at least one of introduce inside, from outside the platen travel space, and remove, from inside to outside the platen travel space, the at least one reaction platen substantially independent of input and removal of payload units to and from the platen travel space.

11. The linear electrical machine of claim 10, wherein the platen travel space at least one of conforms substantially to the one or more sides of the transport chamber and extends through the at least one closable port.Atty. Docket No.390P017044-WO (PCT) 12. The linear electrical machine of claim 10, wherein the at least one reaction platen service module is configured to receive the at least one reaction platen therein from the transport chamber, where the at least one reaction platen module is a platen buffer station buffering the at least one reaction platen outside the transport chamber.

13. The linear electrical machine of claim 10, wherein the at least one platen service module is configured to effect thermal control of the at least one reaction platen, so as to at least one of heat and cool the at least one reaction platen to a predetermined platen temperature.

14. The linear electrical machine of claim 10, wherein the at least one platen service module is configured to both buffer the at least one reaction platen and introduce and remove the at least one reaction platen from the platen travel space.

15. The linear electrical machine of claim 10, wherein the at least one reaction platen is formed of a paramagnetic, a diamagnetic, or a non-magnetic conductive material.

16. The linear electrical machine of claim 10, wherein each electromagnet of the array of electromagnets is coupled to an alternating current power source energizing each electromagnet.

17. The linear electrical machine of claim 10, wherein a totality of reaction platens within the platen travel space is varied by one or more of the at least one reaction platen introduced and the at least one reaction platen removed from the totality of reaction platens respectively by introduction inside the platen travel space, from outside the platen travel space, and removal from inside the platen travel space to outside the platen travel space of the at least one reaction platen.

18. A method comprising: providing a linear electrical machine comprising:Atty. Docket No.390P017044-WO (PCT) a transport chamber with a level reference plane and configured to hold a sealed environment, the transport chamber having at least one closable port along one or more sides of the transport chamber; an array of electromagnets, connected to the transport chamber to form a drive plane at a predetermined height relative to the level reference plane, the array of electromagnets being arranged so that a series of electromagnets of the array of electromagnets define at least one drive line within the drive plane, the drive plane having closed bounds that bound the linear electrical machine and at least one of: conform to the sides of the transport chamber, and extend through the at least one closable port; at least one reaction platen disposed to cooperate with the series of electromagnets of the array of electromagnets so as to controllably levitate and propel the at least one reaction platen along the at least one drive line, in a controlled attitude relative to the drive plane; and registering, with a controller operably coupled to the array of electromagnets: presence of each of the at least one reaction platen in the linear electrical machine, and pose of the at least one reaction platen in the transport chamber, wherein a totality of reaction platens that totals each reaction platen in the linear electrical machine represents an open system wherein the totality of reaction platens, within the closed bounds of the drive plane, is variable so as to admit at least one of: introduction inside, from outside the closed bounds, and removal from inside to outside the closed bounds,Atty. Docket No.390P017044-WO (PCT) of the at least one reaction platen, and wherein the controller registers variance in the totality of reaction platens.

19. The method of claim 18, wherein the variance is substantially independent of input and removal of workpieces through the closed bounds of the linear electrical machine.

20. The method of claim 18, wherein the totality of reaction platens: is varied by one or more of the at least one reaction platen introduced and the at least one reaction platen removed from the totality of reaction platens respectively by introduction inside, from outside, and removal from inside to outside of the at least one reaction platen; or is varied by the at least one reaction platen being one or more of introduced and removed through the at least one closable port.

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