Manufacturing procedures for DOEL panels with an inorganic pixel encapsulation barrier

ES3073469T3Undetermined Publication Date: 2026-07-13
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Patent Information

Authority / Receiving Office
ES · ES
Patent Type
Patents
Filing Date
2021-03-05
Publication Date
2026-07-13

AI Technical Summary

Technical Problem

Current OLED pixel patterning processes restrict panel size, pixel resolution, and substrate size, and leave behind organic material particles that disrupt OLED performance.

Method used

The use of inorganic overhang structures in sub-pixel circuits, combined with evaporation deposition, to form sub-pixels without the need for a lift-off process, ensuring precise deposition of OLED materials and cathodes while maintaining the inorganic overhang structures in place.

Benefits of technology

This method increases pixel-per-inch density and improves OLED performance by eliminating particle issues and enhancing throughput.

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Abstract

The embodiments described herein relate to subpixel circuits and methods for forming such circuits, which can be used in displays such as organic light-emitting diode (OLED) displays. The device includes several subpixels, each defined by adjacent pixel-defining layer (PDL) structures with protruding inorganic structures arranged on the PDLs. Each subpixel has an anode, organic light-emitting diode (OLED) material disposed on the anode, and a cathode disposed on the OLED material. The device is fabricated by a process that includes the following steps: evaporation deposition of the OLED material and the cathode, and deposition of an encapsulation layer on the cathode.
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