Bonding structure, photonic integrated circuit, and method for active alignment of optical axis of semiconductor optical device with optical axis of optical circuit on substrate

Abstract

A bonding structure (100) and a method for active alignment of an optical axis (OAX1) of a semiconductor optical device (20) with an optical axis (OAX2) of an optical circuit (30) on a substrate (10), and a photonic integrated circuit (110). The bonding structure (100) comprises at least one first bonding member (11) on the substrate (10) for first bonding the semiconductor optical device (20) to the substrate (10), wherein the first bonding member (11) is made of material exhibiting plastic deformation to allow deforming of the at least one first bonding member (11) during the active alignment. Furthermore, the bonding structure (100) comprises at least one second bonding member (12) on the substrate (10) for second bonding the semiconductor optical device (20) to the substrate (10) upon completion or after the active alignment.