MODULE HYPERFREQUENCE

Abstract

The invention relates to a microwave module comprising a microwave chip having a substrate, an active layer comprising passive and active components on a first face of the chip, an electrical ground layer on a second face opposite to the first face, the active layer comprising microstrip guide transmission lines; a package encapsulating the microwave chip, said package having a redistribution layer (RDL) covering the active layer of the microwave chip and comprising electrical connection traces for a link between the active layer and electrical interfaces of the microwave module;the active layer comprising at least one ground terminal connected to the ground layer of the microwave chip, said ground terminal being connected to at least one of the electrical interfaces, referred to as the "ground interface", via at least one of the electrical connection traces, referred to as the "ground trace", said ground interface being configured to be connected to an electrical ground of an electronic board, said ground interface and said ground trace being opposite the active layer...;

Description

Title of the invention: MICROFREQUENCY MODULE

[0001] The invention relates to a microwave module comprising a microwave chip. The invention further relates to an assembly comprising a microwave module according to the invention and an electronic board.

[0002] Microwave chips or MMICs (for "Monolithic Microwave Integrated Circuit") are circuits manufactured using microelectronic techniques. They are used, for example, in radars to increase the power of the signal emitted by the antenna, for example from a few mW to approximately 100W.

[0003] Figure 1 shows a partial bottom view of an example of a known microwave module 1 mounted on a circuit board 3, the circuit board being shown in transparency. The microwave module 1 comprises a microwave chip 110 encapsulated in a package 120. The chip 110 comprises a substrate, a first face comprising an active layer 111, and a ground layer on a second face opposite the first face. The active layer 111 includes active components (not shown) of the microwave chip 110, such as a transistor, for example, and passive components (not shown) of the microwave chip 110, such as capacitors or inductors. The active layer 111 also includes transmission lines (not shown) allowing the propagation of microwave signals to and from the components of the active layer 111.The transmission lines can form microstrip waveguide transmission lines allowing the propagation of a positive polarity of the microwave signal, while the ground layer allows the propagation of a negative polarity of the microwave signal.

[0004] After its manufacture, the microwave chip 110 is encapsulated in the package 120 using a wafer-level packaging (FOWLP) technique, which is known per se. The package 120 includes, in particular, a plastic molding covering the second face and the sides of the microwave chip 110, specifically for mechanical protection of the microwave chip 110. The package 120 further includes a redistribution layer (RDL) 124. The RDL 124 covers the active layer 111 and allows the connections of terminals 115, 116, and 113 of the microwave chip 110 to external components. For this purpose, the RDL 124 layer includes electrical connection traces 125, 126, 123. These electrical connection traces 125, 126, 123 lead to interfaces 135, 136, 133 of the box 120, which are notably balls (or “bump” in English).Typically, in the FOWLP conditioning technique, the electrical connection interfaces. 135, 136, 133 are located at the periphery of the active layer 111. The terminals 115, 116, 113 of the chip 110 are at the edge of the active layer 111, the electrical connection traces extending from the edges of the chip to the electrical interfaces 135, 136, 133. In other words, the electrical connection interfaces 135, 136, 133 are not opposite the electronic board 3, but at its periphery, as illustrated for example in [Fig.1].

[0005] Typically, the microwave chip 110 includes microwave signal input terminals 115 connected to respective input interfaces 135 via respective electrical connection traces 125; and microwave signal output terminals 116 connected to respective output interfaces 136 via respective electrical connection traces 126.

[0006] Typically, the microwave module 1 is mounted on the electronic board 3 so that the first face of the microwave chip 110 is oriented towards the electronic board 3. The interfaces 135, 136, 133 allow the connection traces 125, 126, 123 of the RDL layer 124 to be connected with traces of the electronic board 3.

[0007] The microwave transition between the electronic board 3 and the microwave chip 110, that is, the transmission of microwave signals between the electronic board 3 and the microwave chip 110, is typically characterized by parameters [S]. The parameters [S] describe the input-output relationship of the power levels reflected or transmitted between ports of the microwave module 1-electronic board 3 assembly. Thus, the electronic board 3 includes a first port P1 delivering a microwave signal to the microwave chip 110, and a second port P2 receiving a microwave signal from the microwave chip 110. The input terminals 115 of the microwave chip 110 form a third port P3; and the output terminals 116 of the microwave chip 110 form a fourth port P4.Parameters S31 and S24 represent the power transferred from the first PI port to the third P3 port and the power transferred from the fourth P4 port to the second P2 port, respectively. In other words, parameters S31 and S24 represent the transmission losses between the first PI port and the third P3 port, and between the fourth P4 port and the second P2 port, respectively. Therefore, they should be as close to zero as possible when expressed in decibels (dB) or to one when expressed on a linear scale. Parameters SU, S33, S22, and S44 represent the reflection losses at the first PI port, the third P3 port, the second P2 port, and the fourth P4 port, respectively. They should have the lowest possible negative values ​​when expressed in decibels (dB). Parameter S34 represents the isolation between the fourth P4 port and the third P3 port.It must have the lowest possible negative value when expressed in decibels (dB). For a function... efficient operation of the microwave module, we seek to minimize losses in microwave transitions, resulting in an improvement of the parameters [S].

[0008] US patent publication US 11557545 B2 discloses an MMIC mounted on a circuit board such that the active layer faces the circuit board. This circuit is associated with a FOWLP technology package in which the connection interfaces are located on the periphery of the microwave chip. The microwave chip includes an additional ground layer between the active layer and the RDL layer of the package, which complicates the fabrication of the assembly consisting of the MMIC and the package.

[0009] It is therefore sought a microwave module allowing mounting on an electronic board with the active layer oriented towards said electronic board, and obtaining in a simple way reduced losses in microwave transitions.

[0010] To this end, the invention proposes a microwave module comprising: • a microwave chip comprising a substrate, an active layer including passive and active components on a first face of the chip, an electrical ground layer on a second face opposite the first face, the active layer including microstrip guide transmission lines; • a package encapsulating the microwave chip, said package comprising a redistribution layer (RDL) covering the active layer of the microwave chip and including traces of electrical connection for a link between the active layer and electrical interfaces of the microwave module; the active layer comprising at least one ground terminal connected to the ground layer of the microwave chip, said ground terminal being connected to at least one of the electrical interfaces, referred to as "ground interface", via at least one of the electrical connection traces, referred to as "ground trace", said ground interface being configured to be connected to an electrical ground of an electronic board, said ground interface and said ground trace being opposite the active layer.

[0011] By providing ground interfaces and ground traces opposite the first face of the chip, the electrical path between the ground interface and the chip's ground layer is shorter than if the interfaces had been positioned at the chip's periphery. This allows for an improvement in the chip's [S] parameters.

[0012] According to one embodiment, at least one ground terminal is connected to the ground layer via an electrical connection via through the substrate, a distance between said via and the ground interface being equal to a minimum distance defined by a manufacturing method of the microwave module.

[0013] According to one variant, said minimum distance is less than or equal to 200pm, 150pm or 100pm, or equal to zero.

[0014] According to one embodiment, the microwave chip includes first terminals located in a peripheral area of ​​the active layer, at least one ground terminal being located in a central area of ​​the active layer delimited by said peripheral area, at least one ground trace and at least one ground interface, being opposite said central area of ​​the active layer.

[0015] According to one embodiment, said active layer comprises input terminals configured to receive a microwave signal entering the microwave chip and output terminals configured to deliver a microwave signal emitted by the microwave chip; the active layer comprising at least one ground terminal, referred to as the "side ground terminal", located near the input terminals or the output terminals.

[0016] According to one variant, at least one lateral ground terminal is located at a distance from the input terminals or output terminals less than or equal to 700pm or 400pm, or even 300pm.

[0017] According to one variant, the microwave module includes two lateral ground terminals located on either side of the input terminals and / or two lateral ground terminals located on either side of the output terminals.

[0018] According to one embodiment, the microwave module comprises a plurality of said ground terminals, called "internal ground terminals", forming a mesh in the active layer of the microwave chip.

[0019] According to one variant, at least one internal ground terminal is located between active or passive components of the microwave chip.

[0020] The invention also relates to an assembly comprising: • a microwave module according to the invention, • an electronic board comprising an electrical ground layer, said microwave module being mounted on the electronic board so that the active layer of the chip is oriented towards said electronic board, at least one ground interface being electrically connected to the ground of the electronic board.

[0021] According to one embodiment, at least one ground interface comes against a respective terminal of the electronic board, said ground interface, said terminal of the electronic board and a via connecting the terminal of the electronic board to the electrical ground of the electronic board, being aligned in a transverse direction with respect to the first face of the microwave chip.

[0022] Other features and advantages of the present invention will become more apparent upon reading the following description in relation to the following accompanying figures:

[0023] [Fig-1]: [Fig.1], already described, illustrates a microwave module of the prior art mounted on an electronic board;

[0024] [Fig.2]: [Fig.2] illustrates an example of a microwave module according to the invention mounted on an electronic board;

[0025] [Fig.3a]: [Fig.3a] illustrates an example of a microwave module according to the invention mounted on an electronic board, shown without its microwave chip;

[0026] [Fig.3b]: [Fig.3b] illustrates the example of the microwave module of [Fig.3a], shown with its microwave chip;

[0027] [Fig.4]: [Fig.4] represents the shapes of the parameter S31 with a hypermodule frequency according to the prior art and an example of a microwave module according to the invention;

[0028] [Fig.5] : [Fig.5] represents the shapes of the parameter S24 with a microwave module according to the prior art and an example of a microwave module according to the invention;

[0029] [Fig.6] : [Fig.6] represents the shapes of the SU parameter with a microwave module according to the prior art and an example of a microwave module according to the invention;

[0030] [Fig.7]: [Fig.7] represents the shapes of the parameter S22 with a hypermodule frequency according to the prior art and an example of a microwave module according to the invention;

[0031] [Fig.8] : [Fig.8] represents the shapes of the parameter S34 with a microwave module according to the prior art and an example of a microwave module according to the invention.

[0032] Figure 2 shows a cross-sectional view of an example of a microwave module 200 according to the invention. The microwave module 200 comprises a microwave chip 210 or MMIC circuit. The microwave chip 210 comprises an active layer 211 on one of its faces, a substrate S, and an electrical ground layer 212 on a second face opposite the first. In particular, the active layer 211, the substrate S, and the ground layer 212 form a stack in which the layers are superimposed in that order. The active layer 211 comprises the active components of the microwave chip 210, such as a transistor 214, for example. Source electrodes of the transistor 214 are, for example, connected to the ground layer 212 of the chip 210 via electrical connection vias. The active layer 211 includes passive components of the microwave chip 210, such as capacitors or inductors.Active layer 211 also includes transmission lines allowing, in particular, the propagation of microwave signals from or to the components of active layer 211. The transmission lines form microstrip waveguide transmission lines allowing the propagation of a positive polarity of the signal. microwave, while the 212 mass layer allows the propagation of a negative polarity of the microwave signal.

[0033] A package 220 encapsulates the microwave chip 210. The package 220 includes a redistribution layer ("RDL layer" in what follows) 224 which covers the active layer 211, in particular by coming into direct contact with the active layer 211. The RDL layer 224 allows in particular the connection of terminals of the microwave chip 210, in particular of the active layer 211, with external components. The RDL layer 224 includes electrical connection traces 223, 225, 226, 227 for a link between the active layer 211 and electrical interfaces 233, 235, 236, 237 of the microwave module 200. In particular, the electrical interfaces 233, 235, 236, 237 are on one face of the microwave module 200 which is parallel to the first face of the microwave chip 210.

[0034] In the active layer 211, a ground terminal 217 is connected to the ground layer 212. A connection trace 227 of the RDL layer 224, called the ground trace, connects the ground terminal 217 to an electrical interface 237, called the ground interface. The ground interface 237 is configured to be connected to a ground 322 of an electronic board 300. The microwave module 200 is special in that the ground interface 237 and the ground trace 227 are opposite the active layer 211. In other words, along a direction perpendicular to the first face of the active layer 211, going from the outside to the inside of the chip 210, the ground trace 227 and the ground interface 237 are located above the active layer 211.

[0035] In particular, the microwave module 200 is mounted on the electronic board 300 so that the active layer 211 of the chip 210 is oriented towards the electronic board 300. The ground interface 237 can then be electrically connected to the ground 322 of the electronic board 300.

[0036] To this end, the electronic board 300 includes, in particular, a terminal 327, specifically an electrical trace, on its face oriented towards the microwave module 200, against which the ground interface 237 makes contact. In particular, the electrical ground 322 of the electronic board 300 is on an opposite face of the electronic board 300. The terminal 327, specifically the electrical trace, can then be in electrical contact with the electrical ground 322 of the electronic board 300 via an electrical connection via V.

[0037] By being positioned opposite the active layer 211, the ground trace 227 and the ground interface 237 allow a connection between the ground 212 of the microwave chip 210 and the ground 322 of the electronic board 300, which is closest to the active layer 211. This connection between the grounds 212 and 322, due to its location near the active layer 211, limits the radiation induced by the circulation of a microwave signal in the chip 210 and thus provides better guidance of the microwave signal in the transmission lines. This reduces losses in the microwave module 200. In the prior art, the ground terminal of the chip 210 is connected to a connection interface located on the periphery of the microwave chip.

[0038] The ground terminal 217 is connected to the ground layer 212 by an electrical connection via V, for example a plated-through hole, passing through the substrate S. To minimize resistances and inductances, and therefore losses, the electrical path between the ground layer 212 of the chip 210 and the ground interface 237 is preferably as short as possible. In particular, the distance between the via V connecting the ground terminal 217 to the ground layer 212 and the ground interface 231 is chosen to be equal to a minimum distance defined by the manufacturing process of the microwave module 200. For example, the distance between the via V and the ground interface 237 is measured between a central axis of the via V and a central axis of the ground interface 237.Such a minimum distance is determined, for example, by the precision of a lithography or etching used in the manufacturing process, or by an uncertainty in the placement of components in the chip 210 or the package 220, in particular vias and / or connection interfaces.

[0039] For example, such a minimum distance may be equal to 200 pm, or even 100 pm, or have an intermediate value such as 150 pm, for example. Preferably, the minimum distance is equal to zero, which allows for alignment of the via V, the ground terminal 217, the ground trace 227, and the ground interface 237. The electrical path between the ground 212 of the chip 210 and the ground interface 237 is then as direct as possible, which further minimizes the resistances and inductances in the electrical path.

[0040] Preferably, when the microwave module 200 is mounted on the circuit board 300, the ground interface 237, the terminal 327 of the circuit board 300, and the via V connecting the terminal 327 of the circuit board 300 to the electrical ground 322 of the circuit board 300 are aligned. In particular, they are aligned in a transverse direction, specifically perpendicular, with respect to the first face of the microwave chip 210. This further improves the microwave transitions between the circuit board 300 and the microwave chip 210.

[0041] According to one embodiment, the package 220 is of the FOWLP type. The microwave chip 210 comprises first terminals 213 located in a peripheral region of the active layer 211. The ground terminal 217 is then located in a central region of the active layer 211 delimited by the peripheral region. The ground terminal 217 is therefore distinct from the first terminals 213. The ground trace 227 and the ground interface 237 are then opposite the central region of the active layer 211.

[0042] This is particularly visible in figures 3a and 3b showing a view from below Partial view of the microwave module example 200 mounted on the electronic board 300, the electronic board being shown in transparency. In [Fig. 3a], the microwave chip is not shown. The first terminals 213 are visible at the edge of the active layer 211. The first terminals 213 are connected to electrical connection interfaces 233 located at the periphery of the active layer 211. In particular, electrical connection traces 223 connect the first terminals 213 from the edges of the active layer 211 to the electrical interfaces 233. In other words, the electrical connection interfaces 233 connected to the first terminals 213 of the active layer 211 are not directly opposite the active layer 211, but are located at its periphery.

[0043] The chip 210 is manufactured, in particular, using microelectronic processes. In particular, after its fabrication, the first and second faces of the chip 210 each form an external face of the chip 210. After its fabrication, the microwave chip 210 is encapsulated in the package 220 using a FOWLP technique. Referring again to [Fig. 2], the package 220 includes, in particular, a plastic molding 222 covering the second face and the sides of the microwave chip 210, specifically for mechanical protection of the microwave chip 210. The plastic molding 222 may be made of an epoxy material. In particular, the RDL layer 224 forms a layer abutting the active layer 211, and rests by its edges against a portion of the plastic molding 222.The RDL 224 layer may include a first passivation sublayer, notably against the active layer 211; a second sublayer comprising the electrical connection traces 223, 225, 226, 227; and a third passivation sublayer. The passivation sublayers are, for example, made of an electrically insulating material. The first passivation sublayer may include windows allowing contact between the electrical terminals 213, 215, 216, 217 of the active layer 211 and the electrical connection traces 223, 225, 226, 227. The third passivation sublayer may include windows allowing contact between the electrical connection traces 223, 225, 226, 227 and the interfaces 233, 235, 236, 237. The interfaces 233, 235, 236, 237 of the package 220 allow, in particular, the electrical connection of the microwave module 200, specifically the active layer 211 of the microwave chip 210, with its environment.Interfaces 233, 235, 236, 237 are, for example, bumps. Interfaces 233, 235, 236, 237 are located on one face of the microwave module 200, which is parallel to the first face of the microwave chip 210. In particular, interfaces 233, 235, 236, 237 come against the surface of the electronic board 300 when the microwave module 200 is mounted on the electronic board 300, so that the active layer 211 of the microwave chip 210 is oriented towards the electronic board 300.

[0044] In particular, the active layer 211 includes input terminals 215 through which the microwave chip receives a microwave signal, notably from the electronic board 300. Specifically, the active layer includes output terminals 216 that output a microwave signal from the microwave chip 210, notably to the electronic board 300. The input terminals 215 of the active layer 211 may include three electrodes. A central electrode receives a positive polarity from the microwave signal. Two electrodes, located on either side of the central electrode, receive a negative polarity from the microwave signal and are connected to ground 212 of the chip 210, notably via vias through the substrate S. Similarly, the output terminals 216 may include three electrodes.Input terminals 215 and output terminals 216 are located at the edge of the active layer 211. Connection traces 225 and 226 link input terminals 215 and output terminals 216 to respective input interfaces 235 and output interfaces 236. Input interfaces 235 and output interfaces 236 are located at the periphery of chip 210.

[0045] According to one embodiment, at least one ground terminal 217L, referred to as the "side ground terminal," is located near the input terminals 215 or the output terminals 216. The side ground terminal 217L notably reduces losses in microwave transitions for low frequencies of the microwave signal and eliminates resonances. The side ground terminal 217L is preferably located as close as possible to the input terminals 215 or the output terminals 216. For example, the ground terminal 217L is at a distance from these terminals that is less than or equal to 700 pm or 400 pm, or even 300 pm. Preferably, a lateral ground terminal 217L is located on each side of the input terminals 215 or the output terminals 216. The effects of the lateral ground terminals 217L on the microwave transitions are then symmetrical, which further reduces the losses on the microwave transitions.

[0046] According to one embodiment, the active layer 211 comprises a plurality of ground terminals 217i, referred to as "internal ground terminals," which form a mesh within the active layer 211 of the microwave chip 210. The internal ground terminals 217i are distributed throughout the active layer 211. In particular, the internal ground terminals 217i are distributed in the central area of ​​the active layer 211. The internal ground terminals 217i are preferably positioned within the active layer 211 as soon as the footprint of the active layer 211 allows, that is, when there is sufficient space between the components of the active layer 211. The internal ground terminals 217i make it possible, in particular, to reduce losses in microwave transitions for medium or high frequencies of the microwave signal.In particular, the internal ground terminals 217i also improve the enclosure's insulation, as will be better understood with [Fig. 8] described later. In this regard, it... It is particularly advantageous to place the internal ground terminals 217i between active or passive components of the active layer 211. In addition, the greater the number of internal ground terminals 217i in the mesh, the greater the frequencies for which losses can be reduced.

[0047] As illustrated for example in figures 3a, 3b, the electronic card 300 includes in particular a first port PI delivering a microwave signal to the microwave chip 210, and a second port P2 receiving a microwave signal from the microwave chip 210. In particular, the input terminals 215 of the microwave chip 210 form a third port P3; and the output terminals 216 of the microwave chip 210 form a fourth port P4.

[0048] The advantages of the ground terminals 217, 217L, 217i on microwave transitions will be better understood by referring to Figures 4 to 8, which represent the shape of the parameters S as a function of the microwave signal frequency. In these figures, graph G1 corresponds to a microwave modulus according to the prior art, and graph G2 corresponds to an example of a microwave modulus according to the invention.

[0049] Figure 4 represents the parameter S31 corresponding to the transmission losses between the first port P1 and the third port P3. Figure 5 represents the parameter S24 corresponding to the transmission losses between the fourth port P4 and the second port P2. It can be seen that with the microwave module according to the invention, the transmission losses remain close to zero for higher frequencies than in the prior art, and are also less prone to resonance.

[0050] Figure 6 represents the parameter SI1 corresponding to the reflection losses at the first port PL. Figure 7 represents the parameter S22 corresponding to the reflection losses at the second port P2. It can be seen that with the microwave module according to the invention, the reflection losses have a more regular pattern and are less prone to resonances.

[0051] Figure 8 represents the parameter S34 corresponding to the isolation between the fourth port P4 and the third port P3. It can be seen that with the microwave module according to the invention, the transmission losses from port P4 to port P3 (sometimes called isolation) have lower negative values ​​than in the prior art, and are also less subject to resonance.

[0052] The invention has been described with a microwave module 200 comprising a microwave chip 210. But the microwave module 200 could comprise several, in particular connected together.

Claims

Demands

1. Microwave module (200) comprising: • a microwave chip (210) having a substrate (S), an active layer (211) comprising passive and active components on a first face of the chip, an electrical ground layer (212) on a second face opposite the first face, the active layer (211) comprising microstrip guide transmission lines; • a package (220) encapsulating the microwave chip (210), said package (220) having a redistribution layer (224) covering the active layer (211) of the microwave chip (210) and comprising electrical connection traces (223, 225, 226, 227) for a link between the active layer (211) and electrical interfaces (233, 235, 236, 237) of the microwave module (200);the active layer (211) comprising at least one ground terminal (217, 217L, 217i) connected to the ground layer (212) of the microwave chip (210), said ground terminal (217, 217L, 217i) being connected to at least one of the electrical interfaces, referred to as the "ground interface" (237), via at least one of the electrical connection traces, referred to as the "ground trace" (227), said ground interface (237) being configured to be connected to an electrical ground (322) of an electronic board (300), said ground interface (237) and said ground trace (227) being opposite the active layer (211).

2. Microwave module (200) according to claim 1, wherein at least one ground terminal (217, 217L, 217i) is connected to the ground layer (212) via an electrical connection via (V) through the substrate (S), a distance between said via (V) and the ground interface (237) being equal to a minimum distance defined by a method of manufacturing the microwave module (200).

3. Microwave module (200) according to the preceding claim, wherein said minimum distance is less than or equal to 200pm, 150pm or 100pm, or equal to zero.

4. Microwave module (200) according to any one of the preceding claims preceding, in which the microwave chip (210) includes first terminals (213) located in a peripheral area of ​​the active layer (211), at least one ground terminal (217, 217L, 217i) being located in a central area of ​​the active layer (211) delimited by said peripheral area, at least one ground trace (227) and at least one ground interface (237), being opposite said central area of ​​the active layer (211).

5. Microwave module (200) according to any one of the preceding claims, wherein said active layer (211) comprises input terminals (215) configured to receive a microwave signal entering the microwave chip (210) and output terminals (216) configured to deliver a microwave signal emitted by the microwave chip (210); the active layer (211) comprising at least one ground terminal, referred to as the "side ground terminal" (217L), located in close proximity to the input terminals (215) or the output terminals (216).

6. Microwave module (200) according to the preceding claim, wherein at least one side ground terminal (217L) is located at a distance from the input terminals (215) or output terminals (216) less than or equal to 700pm or 400pm, or even 300pm.

7. Microwave module (200) according to claim 5 or 6, comprising two lateral ground terminals (217L) located on either side of the input terminals (215) and / or two lateral ground terminals (217L) located on either side of the output terminals (216).

8. Microwave module (200) according to any one of the preceding claims, comprising a plurality of said ground terminal, referred to as "internal ground terminals" (217i), forming a mesh in the active layer (211) of the microwave chip (210).

9. Microwave module (200) according to the preceding claim, wherein at least one internal ground terminal (217i) is located between active or passive components of the microwave chip (210).

10. Assembly comprising: • a microwave module (200) according to one of the preceding claims, • an electronic board (300) comprising an electrical ground layer (322), said microwave module (200) being mounted on the electronic board (300) so that the active layer (211) of the chip (210) is oriented towards said electronic card (300), at least one ground interface (237) being electrically connected to the ground (322) of the electronic card (300).

11. Assembly according to the preceding claim, wherein at least one ground interface (237) comes against a respective terminal (327) of the electronic board (300), said ground interface (237), said terminal (327) of the electronic board (300) and a via (V) connecting the terminal (327) of the electronic board (300) to the electrical ground (322) of the electronic board (300), being aligned in a transverse direction with respect to the first face of the microwave chip (210).

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