FERROELECTRIC STORAGE DEVICE AND METHOD FOR MANUFACTURING SUCH A DEVICE

Abstract

The invention relates to a method for manufacturing a ferroelectric storage device (1) comprising: - depositing a first layer (2), - depositing a first layer of ferroelectric material, - depositing an intermediate layer on the first layer of ferroelectric material, - removing a first part of the intermediate layer so as to expose a part (6A) of the first layer of ferroelectric material, - depositing a second layer of ferroelectric material on the intermediate layer and on the exposed part of the first layer of ferroelectric material, - removing a second part of the intermediate layer so as to form a layer of ferroelectric material (5) comprising a first part (5A) of first thickness (e1) and a second part (6) of second thickness (e2), the first and second thicknesses being distinct, - depositing a second layer (7),the layer of ferroelectric material extending between the first layer and the second layer. Figure to be published with the abstract: Fig. 2,

Description

Title of the invention: FERROELECTRIC STORAGE DEVICE AND METHOD FOR MANUFACTURING SUCH A DEVICE Technical field

[0001] The present invention relates generally to the field of microelectronics. It relates more particularly to the field of non-volatile memories.

[0002] In particular, the invention relates to a ferroelectric storage device. It also relates to a method of manufacturing such a ferroelectric storage device. STATE OF THE ART

[0003] The main quality of ferroelectric memories of the FeRAM type (for "Ferroelectric Random Access Memory" according to the commonly used acronym of Anglo-Saxon origin) is that they are non-volatile, that is to say, they retain the stored information even when the voltage is cut off. They also have the advantages of consuming little energy and having short writing and reading times compared to other types of non-volatile memories such as FLASH memories.

[0004] FeRAM type ferroelectric memories are generally in the form of a stack in which a layer of ferroelectric material is positioned between two metal electrodes. Ferroelectric memories are capacitive type memories having two remanent polarization states +Pr and -Pr. The operation of these ferroelectric memories is based on the ferroelectric properties of the ferroelectric material placed between two metal electrodes.

[0005] More particularly, concerning the operation of FeRAM type ferroelectric memories, by applying a potential difference between the two electrodes creating an electric field of a value greater than a positive coercive field +Ec, the ferroelectric memory is placed in a state of high remanent polarization +Pr and by applying a potential difference creating an electric field of a value lower than the negative coercive field -Ec, the ferroelectric memory is placed in a state of low remanent polarization -Pr.

[0006] The high remanent polarization state +Pr then corresponds to the binary logic state '0' and the low remanent polarization state -Pr to the binary logic state '1', which allows the storage of information.

[0007] Furthermore, when the application of the potential difference between the two metal electrodes is stopped, the state of remanent polarization remains: this then explains the non-volatile nature of ferroelectric memories.

[0008] For reading, it is assumed that the memory is in a given state and a voltage is applied. This voltage is for example positive, greater than the voltage creating an electric field of a value greater than the positive coercive field +Ec. Thus, if the memory was already in the high remanent polarization state +Pr, this polarization state is unchanged and no current peak is observed (or a very low current peak may be observed). Conversely, if the memory was in the low remanent polarization state -Pr, a much larger current peak is observed.

[0009] The consequence of this reading operation is that it is destructive of the polarization state.

[0010] Ferroelectric tunnel junction (FTJ) memories are also known. FTJ ferroelectric memories are generally in the form of a stack in which a layer of ferroelectric material is positioned between two metal electrodes. FTJ ferroelectric memories are resistive type memories having two opposite polarization states for the layer of ferroelectric material. The operation of these ferroelectric memories is based on the ferroelectric properties of the ferroelectric material placed between two metal electrodes.

[0011] More particularly, concerning the operation of FTJ type ferroelectric memories, the two polarization states correspond respectively to two different resistance levels: a highly resistive level, corresponding for example to a high polarization state +Pr and a weakly resistive level, corresponding to a low polarization state -Pr. By way of example, the weakly resistive level has an electrical resistance approximately a thousand times lower than that of the highly resistive level.

[0012] In the case of FTJ type ferroelectric memories, the reading operation comprises the application of a reading voltage -Vr. The reading voltage -Vr is for example negative and lower in absolute value than a voltage Vc associated with the coercive field. This then makes it possible to carry out a non-destructive reading by means of the measurement of a tunnel current.

[0013] In order to increase memory density, it is known to implement so-called “multi-level” storage. This “multi-level” storage is associated with different polarization states, on which it will be possible to store information.

[0014] The document "Multilevel data storage memory using deterministic polarization control.", by Lee, Daesu et al., in Advanced materials, vol. 24(3), 2012, 402-406, doi: 10.1002 / adma.201103679 describes a ferroelectric memory of the FeRAM type having several storage levels. In this example, as shown in [Fig.l] (representing the evolution of the polarization P as a function of the applied voltage V), the memory can be placed in several intermediate remanent polarization states Pri, Pr2, Pr3, Pr4, Pr5, Pr6, Pr7 (Pr0 corresponding to the low polarization state 0). It will therefore be possible to store the information at different levels. Thanks to this “multi-level” storage, it is therefore possible to code several states per memory (here, in the example, eight states are coded), whereas in a standard cell only two states are accessible (states 0 or 1 only). Thus, the information contained in a memory with “multi-level” storage is equivalent to that contained in several standard type memories.

[0015] In practice, in this example, to implement this storage on the different intermediate levels, each intermediate polarization state Prb Pr2, Pr3, Pr4, Pr5, Pr6, Pr7 is associated with a corresponding current. Thus, when a voltage is applied between the electrodes, an associated ferroelectric current is read. This current then makes it possible to identify the intermediate polarization state Pri, Pr2, Pr3, Pr4, Pr5, Pr6, Pr7 concerned and therefore to go back to the information initially stored in this intermediate polarization state Prh Pr2, Pr3, Pr4, Pr5, Pr6, Pr7 of the ferroelectric memory.

[0016] However, certain drawbacks are observed in such high-density memories. For example, it may be difficult to distinguish two intermediate polarization states that are close. Indeed, an overlap between the different intermediate polarization states may be encountered. In such a case, the application of a voltage (between the electrodes) of this overlap zone does not make it possible to deduce with certainty the associated current, and therefore the intermediate remanent polarization state concerned. Summary of the invention

[0017] The present invention therefore aims to improve high-density ferroelectric storage devices by allowing unambiguous distinction of the different polarization states.

[0018] The invention then relates to a method of manufacturing a ferroelectric storage device comprising steps of: - provision of a support layer,

[0019] - depositing a first layer,

[0020] - deposition of a first layer of ferroelectric material, then

[0021] - depositing an intermediate layer on the first layer of ferro-material electric, then

[0022] - removing a first portion of the intermediate layer so as to expose a part of the first layer of ferroelectric material, then

[0023] - deposition of a second layer of ferroelectric material on the interlayer medial and on the exposed part of the first layer of ferroelectric material, then

[0024] - removal of a second part of the intermediate layer so as to form, from the first layer of ferroelectric material and a portion of the second layer of ferroelectric material, a layer of ferroelectric material comprising a first portion having a first thickness and a second portion having a second thickness, the first thickness and the second thickness being distinct, and

[0025] - deposition of a second layer, the layer of ferroelectric material extending between the first layer and the second layer.

[0026] Thus, according to the manufacturing method according to the invention, the layer of ferroelectric material of the ferroelectric storage device has a non-uniform thickness. This variability in thickness results in a non-uniformity in the ferroelectric properties of the ferroelectric storage device. This non-uniformity of properties makes it possible in particular to increase the differences between the voltage ranges to be applied to store the information in the different intermediate polarization states.

[0027] Indeed, the different thicknesses then imply that, for a given (write) voltage, the electric field is greater in the regions of lower thickness. In other words, to write information in an intermediate polarization state associated with a low thickness, a greater voltage must be applied. The differences in thickness therefore lead to differences in voltages to be applied to encode the information in the different intermediate polarization states.

[0028] The different thicknesses used are therefore associated with different intermediate polarization states in the ferroelectric storage device.

[0029] In other words, due to the non-uniformity created in the ferroelectric material layer (due to the variability of thicknesses), the differences between the intermediate polarization states are created.

[0030] In addition to the characteristics which have just been mentioned in the preceding paragraphs, the method of manufacturing the ferroelectric storage device according to one aspect of the invention may have one or more complementary characteristics among the following, considered individually or according to all technically possible combinations:

[0031] - the deposition of the first layer of ferroelectric material is carried out in in a compliant manner; - the deposition of the intermediate layer is implemented in a compliant manner; - the intermediate layer comprises a nitride or an oxide; - the step of removing the first part of the intermediate layer is implemented by anisotropic etching; - the deposition of the second layer of ferroelectric material is carried out in a compliant manner; - the step of removing the second part of the intermediate layer is implemented by isotropic etching; - the ferroelectric material layer comprises hafnium dioxide or hafnium dioxide doped with a doping element or an HfxZri XO2 alloy, with 0 <x<l ; et - il est prévu, avant l’étape de dépôt de la première couche, une étape de formation d’une cavité dans la couche support, la cavité comprenant une paroi de fond et une paroi latérale, la paroi latérale formant un angle d’inclinaison par rapport à une direction normale à la paroi de fond,

[0032] le dépôt de la première couche, de la couche de matériau ferroélectrique et de la deuxième couche étant mis en œuvre dans la cavité formée,

[0033] the second part of the layer of ferroelectric material being positioned on the bottom wall of the cavity and the first part of the layer of ferroelectric material being positioned on the side wall of the cavity.

[0034] The invention also relates to a ferroelectric storage device comprising: comprising a first layer, a second layer and a layer of ferroelectric material extending between the first layer and the second layer,

[0035] the layer of ferroelectric material comprising a first portion having a first thickness and a second portion having a second thickness, the first thickness and the second thickness being distinct,

[0036] the second part of the layer of ferroelectric material comprising a first portion extending in the extension of the first part and a second portion extending in projection relative to the first portion of the second part of the layer of ferroelectric material. BRIEF DESCRIPTION OF THE FIGURES

[0037] Other characteristics and advantages of the invention will emerge clearly from the description given below, for information purposes only and in no way limiting, with reference to the appended figures, among which:

[0038] [Fig.l] illustrates the different intermediate polarization states operating in the case of a FeRAM type ferroelectric memory having several storage levels,

[0039] [Fig.2] represents, in schematic form, an example of a storage device ferroelectric according to the invention,

[0040] [Fig.3] represents, in the form of a flowchart, an example of the manufacturing process of the ferroelectric storage device of [Fig.2],

[0041] [Fig.4] illustrates step E102 of the manufacturing method shown in [Fig.3],

[0042] [Fig.5] illustrates step E104 of the manufacturing method shown in [Fig.3],

[0043] [Fig.6] illustrates step E106 of the manufacturing method shown in [Fig.3],

[0044] [Fig.7] illustrates step E108 of the manufacturing method shown in [Fig.3],

[0045] [Fig.8] illustrates step El 10 of the manufacturing process shown in [Fig.3],

[0046] [Fig.9] illustrates step El 12 of the manufacturing process shown in [Fig.3],

[0047] [Fig. 10] illustrates step El 14 of the manufacturing process shown in [Fig.3], and

[0048] [Fig. 11] illustrates step El 16 of the manufacturing process shown in [Fig.3].

[0049] For clarity, identical or similar elements are identified by identical reference signs throughout the figures.

[0050] DETAILED DESCRIPTION OF AT LEAST ONE EMBODIMENT

[0051] The present invention aims to improve the manufacture of ferroelectric storage devices. In particular, the present invention relates to a high-density storage device in which several polarization states are used to store information. The present invention then aims to improve the definition of the polarization states in order to be able to clearly distinguish them in order to then be able to read the information stored and associated with each of the polarization states.

[0052] [Fig. 2] represents a ferroelectric storage device 1 according to the invention. As can be seen in this figure, the ferroelectric storage device 1 comprises a first layer 2, a second layer 7 and a layer of ferroelectric material 5 which is arranged between the first layer 2 and the second layer 7.

[0053] The ferroelectric storage device 100 is in the form of a stack of layers. The first layer 2, the layer of ferroelectric material 5 and the second layer 7 form the different layers of this stack.

[0054] As will be described in more detail below with the associated manufacturing method, the ferroelectric storage device 1 is formed in a cavity 50 (visible in FIGS. 4 to 11).

[0055] This cavity 50 is for example formed in a support layer 10. In other words, the cavity 50 forms a part of the support layer 10 which has a generally “U”-shaped profile (as will be seen later, the lateral branches of the “U” shape are here inclined relative to the base of the “U” shape). Here, the different layers of the ferroelectric storage device 1 have a shape profile similar to the part 50 with a “U”-shaped profile of the support layer 10.

[0056] This support layer 10 is for example formed from a dielectric material. For example, the support layer 10 comprises silicon oxide SiO2.

[0057] The support layer may comprise a plurality of sub-layers. For example, the support layer may comprise another layer of dielectric material formed under the layer comprising silicon oxide SiO2. This other layer comprises for example silicon nitride SiN or silicon carbonitride SiCN.

[0058] The cavity 50 comprises a bottom wall 52 and a side wall 55. The bottom wall 52 corresponds to the base of the “U” shape and the side wall 55 corresponds to the lateral branches of the “U” shape. The side wall 55 forms an angle of inclination α relative to an axis z, corresponding to a direction normal to the bottom wall 52. Preferably, this angle of inclination α is non-zero. Alternatively, this angle of inclination may be zero (the side wall is therefore vertical).

[0059] The stack forming the ferroelectric storage device 1 extends from the bottom wall 52 and the side wall 55. This stack then comprises several parts (one extending from the bottom wall 52) and another extending from the side wall 55. For the part formed on the bottom wall 52, the different layers of the stack extend parallel to each other. The same is true for the part extending from the side wall 55 (the different layers of the stack also extend parallel to each other on this side wall 55).

[0060] Alternatively, the side wall of the cavity could comprise several portions forming distinct angles relative to a direction normal to the bottom wall. In other words, the side wall of the cavity could have a plurality of slope breaks.

[0061] Each of the layers forming the ferroelectric storage device 1 is now described.

[0062] The first layer 2 is formed from an inert conductive material. This first layer 2 comprises, for example, a metallic material.

[0063] According to a first example (not shown), the first layer comprises a single layer. The conductive material of this single layer comprises, for example, titanium nitride TiN. Alternatively, the conductive material may be tantalum nitride TaN or tungsten W. As a further variant, other conductive materials may be used (and in particular, metal nitride more generally).

[0064] As can be seen in the example shown in [Fig.2], the first layer 2 is here in the form of a two-layer structure. Here it comprises a first sub-layer 20 and a second sub-layer 22.

[0065] The second sub-layer 22 is arranged on the first sub-layer 20.

[0066] The first sub-layer 20 comprises a metallic conductive material. Preferably, it comprises titanium Ti or tantalum nitride TaN.

[0067] The first sub-layer 20 has a thickness of between 3 and 20 nanometers (nm). Preferably, this thickness is between 5 and 10 nm.

[0068] This first sub-layer 20 plays both the role of a protective layer and the role of a contact layer allowing the device 1 to be electrically connected to its electronic control and reading circuit.

[0069] The second sub-layer 22 is arranged on the first sub-layer 20. It is in direct contact with the layer of ferroelectric material 5. In other words, the second sub-layer 22 extends between the first sub-layer 20 and the layer of ferroelectric material 5.

[0070] The second sub-layer 22 is formed from a conductive material comprising a transition metal. This conductive material is for example titanium nitride TiN. Alternatively, it may be other conductive materials such as tantalum Ta or tungsten W.

[0071] For example, when the second sub-layer 22 comprises titanium nitride, the first sub-layer 20 is formed from a conductive material such as titanium Ti.

[0072] Alternatively, when the second sub-layer 22 comprises tantalum, the first sub-layer 20 is formed for example from tantalum nitride TaN.

[0073] As a further variant, when the second sub-layer 22 comprises tungsten, the first sub-layer 20 is formed from a conductive titanium Ti material.

[0074] Here, the thickness of the second sub-layer 22 is between 10 and 100 nm. Preferably, this thickness is between 5 and 10 nm.

[0075] Alternatively, the first layer may comprise a semiconductor material. This semiconductor material comprises, for example, silicon.

[0076] The layer of ferroelectric material 5 is arranged on the first layer 2. Alternatively, the layer of ferroelectric material can be deposited on another layer formed, beforehand, on the first layer.

[0077] This layer of ferroelectric material 5 comprises an active material of variable resistance. This layer of ferroelectric material 5 is for example based on hafnium dioxide HfO2. In the present description, the expression "based on" means that the layer concerned comprises more than 50% of the element mentioned after this expression (for example here, this means that the layer of ferroelectric material 5 comprises more than 50% of hafnium dioxide).

[0078] Alternatively, the hafnium dioxide may be doped with a doping element. In the present description, the expression "doping" of a layer corresponds to the introduction into the material of the layer concerned of atoms of another material called "doping element".

[0079] Here, the doping element preferably used is silicon Si. In the case of silicon, the layer of ferroelectric material based on hafnium dioxide is for example exposed to a dose of dopant of between 1.1014 cm 2 and 1.1015 cm 2 in order to obtain a presence of between 0.7 and 7% of silicon atoms in the layer of ferroelectric material. Preferably, the dopant dose is between 0.3.1015 cm 2 and 1.1015 cm 2.

[0080] Alternatively, other doping elements may be used such as aluminum Al, germanium Ge, gadolinium Gd, yttrium Y, lanthanum La or scandium Sc or nitrogen N.

[0081] As a further variant, the layer of ferroelectric material may comprise an alloy of the form HfxZri XO2, with 0 <x<l. Par exemple, il est possible d’utiliser un alliage ternaire HfZrO2 (par exemple du Hf0.5Zro.502) en tant que matériau ferroélectrique. En variante encore, la couche de matériau ferroélectrique peut être en nitrure d’aluminium scandium (AIScN).

[0082] As can be seen in [Fig.2], the layer of ferroelectric material 5 comprises at least a first part 5A and a second part 6. Here (visible in [Fig. 10]), the first part 5A extends at the level of the side wall 55 of the cavity 50 while the second part 6 extends at the level of the bottom wall 52 of the cavity 50.

[0083] Advantageously according to the invention, the first part 5A has a first thickness ei and the second part 6 has a second thickness e2. In the present invention, the thickness of a part of a layer is defined as the distance separating the two faces of the part of the layer concerned. In other words, the thickness corresponds to the characteristic dimension of the layer concerned in a direction parallel to a direction normal to the faces of the part of the layer concerned.

[0084] Here, the first thickness ei and the second thickness e2 are distinct. In other words, the layer of ferroelectric material 5 has a non-uniform thickness. In other words, the layer of ferroelectric material 5 has a variable thickness.

[0085] The thickness differences form essential characteristics of the ferroelectric storage device to obtain the different polarization states.

[0086] Thus, thanks to the invention, the differences in thickness used for the layer of ferroelectric material introduce a non-uniformity in the ferroelectric properties of the layer of ferroelectric material. This non-uniformity of the properties makes it possible in particular to increase the differences between the voltage ranges to be applied to encode the information in the different intermediate polarization states. This then makes it possible to avoid overlap between the voltage ranges concerned and therefore to unambiguously identify the intermediate polarization states concerned by the stored information.

[0087] In order to obtain very distinct polarization states (i.e. without overlap between the voltage ranges to be applied to achieve them), the ratio between the second thickness e2 and the first thickness ei is preferably between 2 and 4.

[0088] In practice, the first thickness ei is for example between 3 and 7 nm. Preferably, this first thickness ei is of the order of 4 nm.

[0089] The second thickness e2 is for example between 8 and 17 nm. Preferably, this second thickness e2 is of the order of 10 nm.

[0090] Here, the second thickness e2 is therefore greater than the first thickness eb. This then implies that it will be necessary to apply a higher voltage to allow the encoding of the information stored in the intermediate polarization state associated with the second thickness e2 (in comparison with the first thickness ej.

[0091] The thickness ranges considered in the invention make it possible to accentuate the non-uniformities of the ferroelectric properties of the layer of ferroelectric material, so as to allow the storage of information on different intermediate polarization states and to allow the encoding of this information by distinctly distinguishing these different states.

[0092] More particularly here, as shown in [Fig.2], the second part 6 of the layer of ferroelectric material 5 comprises a first portion 6A and a second portion 6B.

[0093] The first portion 6A extends, at the level of the bottom wall 52 of the cavity 50, in the extension of the first part 5A of the layer of ferroelectric material 5. This first portion 6A has for example here the same thickness ei as the first part 5A of the layer of ferroelectric material 5.

[0094] As seen in [Fig.2], the second portion 6B projects from the first portion 6A of the ferroelectric material layer 5. In other words, the second portion 6B forms a protrusion of ferroelectric material on the first portion 6A of the ferroelectric material layer 5.

[0095] Here, the second portion 6B has a trapezoidal (sectional) shape, with a contact surface 6C with the first portion 6A of smaller dimension than the opposite (free) surface 6D.

[0096] Advantageously according to the invention, the contact surface 6C represents, horizontally (in a plane parallel to the bottom wall 52 of the cavity 50), at least 75% of the total surface area S of the second part 6 of the layer of ferroelectric material 5. As can be seen in [Fig. 2], the total surface area S of the second part 6 of the layer 5 of ferroelectric material corresponds to the (horizontal) surface area of ​​the first portion 6A of thickness ep

[0097] Thus, advantageously according to the invention, the non-uniformities (associated with the thickness differences) of the layer of ferroelectric material are not manufacturing artifacts. The fact that the parts associated with the different thicknesses have substantial surfaces makes it possible to ensure well-defined polarization states. distinct (and therefore an absence of overlap between the voltage ranges to be applied to reach the different polarization states).

[0098] As shown in [Fig.2], the ferroelectric storage device 1 also comprises the second layer 7. This second layer 7 is arranged on the layer of ferroelectric material 5.

[0099] This second layer 7 comprises for example a conductive material. This is in particular a metallic material.

[0100] According to a first example (not shown), the second layer comprises a single layer. The conductive material of this single layer comprises, for example, titanium nitride TiN. Alternatively, the conductive material may be tantalum nitride TaN or tungsten W. As a further variant, other conductive materials may be used (and in particular, metal nitride more generally).

[0101] As can be seen in [Fig.2], the second layer 7 is here in the form of a two-layer structure. Here it comprises a first sub-layer 70 and a second sub-layer 72.

[0102] The second sub-layer 72 of the second layer 7 is arranged on the associated first sub-layer 70.

[0103] The second sub-layer 72 is formed from a conductive material comprising a transition metal. This conductive material is for example titanium nitride TiN. Alternatively, it may be other conductive materials such as tantalum nitride TaN or tungsten W.

[0104] The second sub-layer 72 has a thickness of between 10 and 200 nm.

[0105] This second sub-layer 72 plays both the role of a protective layer and the role of a contact layer allowing the device 1 to be electrically connected to its electronic control and reading circuit.

[0106] The first sub-layer 70 is arranged on the layer of ferroelectric material 5. It is in direct contact with the layer of ferroelectric material 5. In other words, the first sub-layer 70 of the second layer 7 extends between the second sub-layer 72 and the layer of ferroelectric material 5.

[0107] The second sub-layer 72 comprises a metallic conductive material. Preferably, it comprises titanium Ti or tantalum Ta.

[0108] For example, when the second sub-layer 72 comprises titanium nitride, the first sub-layer 70 is formed from a conductive material such as titanium Ti.

[0109] Alternatively, when the second sub-layer 72 comprises tantalum nitride, the first sub-layer 70 is formed from a conductive material such as tantalum Ta.

[0110] As a further variant, when the second sub-layer 72 comprises tungsten, the first sub-layer 70 is formed from a conductive material chosen from titanium Ti or tantalum Ta.

[0111] Here, the thickness of the first sub-layer 70 is between 3 and 20 nm.

[0112] In practice, in the case of an OxRAM type memory (for “Oxide Resistive RAM”), when this bilayer structure is used for the second layer 7, the first sub-layer 70 also has the particularity of being a layer which will allow the creation of oxygen vacancies in the layer of ferroelectric material 5 (when this first sub-layer 70 is in contact with the layer of ferroelectric material 5). In this case, the first sub-layer 70 comprises a conductive material chosen from titanium Ti or tantalum Ta and the second sub-layer 72 comprises a titanium nitride TiN or a tantalum nitride TaN (so as to form a protective layer). The creation of these oxygen vacancies then makes it possible to improve the performance of the ferroelectric storage device by facilitating the exchange of oxygen with the layer of ferroelectric material.

[0113] In the case of a FeRAM type memory, the second layer 7 comprises for example a metal nitride or a metal which does not oxidize (such as tungsten W or ruthenium Ru.

[0114] In the case of an FTJ type memory, the structure used is that of a FeRAM type memory with the introduction of a layer comprising a dielectric material between the layer of ferroelectric material 5 and the second layer 7. The dielectric material is for example a dielectric oxide such as aluminum oxide A12O3 or silicon dioxide SiO2.

[0115] Alternatively, the second layer may comprise a semiconductor material. This semiconductor material comprises, for example, silicon.

[0116] Advantageously according to the invention, the ferroelectric storage device comprises a layer of ferroelectric material whose thickness is variable. This variability in thickness results in non-uniformity in the ferroelectric properties of the ferroelectric storage device. This non-uniformity of properties makes it possible in particular to increase the differences between the voltage ranges to be applied to encode the information in the different intermediate polarization states.

[0117] In other words, due to the non-uniformity created in the ferroelectric material layer (due to the variability of thicknesses), differences between the intermediate polarization states are created.

[0118] Alternatively, the layer of ferroelectric material may comprise more than two distinct thicknesses. This may in particular be a continuous variation in thickness.

[0119] The present invention also relates to a method of manufacturing a ferroelectric storage device 1. Figures 3 to 11 relate to this manufacturing method.

[0120] [Fig. 3] represents, in the form of a flowchart, an example of the manufacturing method according to an exemplary embodiment.

[0121] As can be seen in this figure, the manufacturing process comprises all first a step El00 of providing a support layer 10 on which the ferroelectric storage device 1 will be formed. In practice, this support layer 10 is provided with at least one logic component associated with a metallic interconnection element (not shown) intended to connect the ferroelectric storage device 1 to lower metallic levels.

[0122] Then, the manufacturing method continues to step E102, during which the cavity 50 (in which the ferroelectric storage device 1 will be formed) is formed. [Fig.4] illustrates this step E102.

[0123] In practice, this step E102 is implemented by anisotropic etching so as to form the bottom wall 52 and the side wall 55 of the cavity 50. This is for example a dry chemical etching.

[0124] As described previously, the side wall 55 of the cavity 50 is made in such a way as to form the angle of inclination α relative to the axis z parallel to a direction normal to the bottom wall 52. The side wall 55 therefore forms a non-zero angle of inclination α relative to an axis z, corresponding to a direction normal to the bottom wall 52.

[0125] As can be seen in [Fig.3], the manufacturing process continues, at step E104, with the deposition of the first layer 2. [Fig.5] illustrates this step E104.

[0126] This first layer 2 is deposited in the cavity 50. More particularly, the first layer 2 is deposited along the bottom wall 52 and the side wall 55 of the cavity 50. The first layer 2 therefore lines and matches the shape of the cavity 50.

[0127] The deposition of the first layer 2 is carried out here in a conformal manner. In this description, the term "conformal deposition" means a deposition carried out in such a way that the layer has a substantially constant thickness at all points. In this description, the term "substantially constant" means a thickness not varying by more than 20%, preferably by more than 10%, and more preferably by more than 5%. For example, the first layer 2 may be formed by an atomic layer deposition method (or ALD for "Atomic Layer Deposition" according to the commonly used acronym of English origin).

[0128] As indicated previously, the first layer 2 here comprises a first sub-layer 20 and a second sub-layer 22.

[0129] Step E104 of depositing the first layer 2 therefore comprises two sub-steps here: a first sub-step E104a of depositing the first sub-layer 20 and a second sub-step E104b of depositing the second sub-layer 22.

[0130] The first sub-layer 20 is therefore first of all deposited, in a conformal manner, in the cavity 50 (step E104a). In practice, the first sub-layer 20 is for example formed by an atomic layer deposition (or ALD) method or by chemical vapor deposition.

[0131] Alternatively, the first sub-layer 20 may be formed by cathode sputtering in a vacuum deposition chamber. In the case where the first sub-layer 20 is formed from titanium nitride, it is a reactive cathode sputtering.

[0132] Then, the second sub-layer 22 of the first layer 2 is deposited, in a conformal manner, on the first sub-layer 20 (step E104b). The second sub-layer 22 is for example formed by cathode sputtering in a vacuum deposition chamber. In practice, the second sub-layer 22 of the first layer 2 is formed in the same deposition chamber as the first sub-layer 20 of the first layer 2.

[0133] In the case where the second sub-layer 22 is formed from titanium nitride, it is a reactive cathode sputtering.

[0134] Then, the manufacturing method continues at step E106 of depositing a first layer of ferroelectric material 15A on the first layer 2. More particularly, the first layer of ferroelectric material 15A is deposited on the second sub-layer 22 of the first layer 2. This step E106 is shown in [Fig.6].

[0135] This is a conformal deposition of the first layer of ferroelectric material 15A on the first layer 2.

[0136] Here, the deposition step E106 is for example implemented in such a way that the first layer of ferroelectric material 15A has a thickness ep

[0137] In practice, the first layer of ferroelectric material 15A is deposited by an atomic layer deposition (or ALD) method.

[0138] Alternatively, the first layer of ferroelectric material may be deposited by sputtering. Alternatively, the first layer of ferroelectric material may be deposited by a physical vapor deposition (PVD) method. Alternatively, the first layer of ferroelectric material may be deposited by an ion beam deposition (IBD) method.

[0139] The method then continues, in step E108, by the deposition of an intermediate layer 17. This intermediate layer 17 is formed on the first layer of ferroelectric material 15A. This step E108 is shown in [Fig.7].

[0140] This involves a conformal deposition of the intermediate layer 17 on the first layer of ferroelectric material 15A. The intermediate layer 17 is therefore deposited uniformly (on the first layer of ferroelectric material 15A) along the side wall 55 and the bottom wall 52 of the cavity 50.

[0141] As shown in [Fig.7], the intermediate layer 17 comprises a first portion 17A extending along the bottom wall 52 of the cavity 50 and a second portion 17B extending along the side wall 55 of the cavity 50.

[0142] The intermediate layer 17 comprises for example here a nitride or an oxide. It This is for example silicon nitride SiN or silicon carbonitride SiCN. Alternatively, the intermediate layer may comprise silicon dioxide SiO2.

[0143] In practice, the intermediate layer 17 is deposited by an atomic layer deposition (or ALD) method.

[0144] Alternatively, the intermediate layer may be deposited by sputtering. Alternatively, the intermediate layer may be deposited by a physical vapor deposition (PVD) method. Alternatively, the intermediate layer may be deposited by an ion beam deposition (IBD) method.

[0145] Alternatively, the intermediate layer may be formed according to a non-conformal deposition.

[0146] The thickness of the intermediate layer 17 is for example associated with the width 1 (illustrated in [Fig.7]) of the first portion 6A of the first layer of ferroelectric material 15A. More particularly, the thickness of the intermediate layer 17 is here less than 10% of the width 1 of the first portion 6A. Preferably, the thickness of the intermediate layer 17 is less than 7.5% of the width 1 of the first portion 6A.

[0147] As shown in [Fig. 3], the method continues with a step El 10 of removing the first horizontal portion 17A of the intermediate layer 17 so as to expose a portion of the first layer of ferroelectric material 15A. This step El 10 is shown in [Fig. 8].

[0148] More particularly here, the removal step El 10 aims to remove the part of the intermediate layer 17 deposited at the bottom wall 52 of the cavity 50. The part of the first layer of ferroelectric material 15A exposed is therefore located at the bottom wall 52. In other words, at the end of the removal step El 10, the intermediate layer 17 comprises a remaining part present at the side wall 55. This remaining part corresponds to the second part 17B of the intermediate layer 17 introduced previously.

[0149] In practice, this removal step E1 10 is implemented by anisotropic etching. This anisotropic etching therefore makes it possible to remove only the first part 17 A of the intermediate layer 17.

[0150] This anisotropic etching is for example a plasma etching. Alternatively, the anisotropic etching can be a reactive ion etching (or RIE for “Reactive Ion Etching” according to the commonly used acronym of Anglo-Saxon origin).

[0151] At the end of step El 10, along the bottom wall 52, the first portion 6A of the first layer of ferroelectric material 15A is therefore exposed. In other words, at the end of step El 10, along the bottom wall 52 of the cavity 50, the first layer of ferroelectric material 15A is the last layer deposited. elsewhere, along the side wall 55 of the cavity, the intermediate layer 17 (and more particularly the second part 17B of the intermediate layer 17) is the last layer formed.

[0152] The manufacturing method then comprises a step El 12 of depositing a second layer of ferroelectric material 15B. More particularly, this second layer of ferroelectric material 15B is formed on the second portion 17B of the intermediate layer 17 and on the exposed portion of the first layer of ferroelectric material 15A. In other words, the second layer of ferroelectric material 15B is formed on the second portion 17B of the intermediate layer 17 and on the first portion 6A of the first layer of ferroelectric material 15A formed at the bottom wall 52. This step El 12 is shown in [Fig.9]

[0153] This involves a conformal deposition of the second layer of ferroelectric material 15B on the second part 17B of the intermediate layer 17 and on the first portion 6A of the first layer of ferroelectric material 15A.

[0154] Here, the deposition step E1 12 is for example implemented in such a way that the second layer of ferroelectric material 15B has a thickness e3. This thickness e3 is such that, at the level of the bottom wall 52 of the cavity 50, the total thickness of ferroelectric material is of the order of the second thickness e2.

[0155] In practice, the second layer of ferroelectric material 15B is deposited by an atomic layer deposition method (or ALD for “Atomic Layer Deposition” according to the commonly used acronym of Anglo-Saxon origin).

[0156] Alternatively, the second layer of ferroelectric material may be deposited by sputtering. Alternatively, the second layer of ferroelectric material may be deposited by a physical vapor deposition (PVD) method. Alternatively, the second layer of ferroelectric material may be deposited by an ion beam deposition (IBD) method.

[0157] The second layer of ferroelectric material is for example formed here from the same material as the first layer of ferroelectric material.

[0158] As can be seen in [Fig.9], the intermediate layer 17 acts as a “spacer” between the first layer of ferroelectric material 15A and the second layer of ferroelectric material 15B.

[0159] As can be seen in [Fig. 3], the manufacturing process continues with a step E1 14 (shown in [Fig. 10]). During this step, the second part 17B of the intermediate layer 17 is removed from the stack.

[0160] This step specifically aims to remove the remaining part of the intermediate layer 17. As in step E1 12 described previously, the second layer of ferroelectric material 15B has been deposited in part on the second part 17B of the intermediate layer 17, the step E1 14 of removing this second part 17B from the intermediate layer 17 also results in the removal of this part of the second layer of ferroelectric material 15B positioned on the second part 17B of the intermediate layer 17.

[0161] In other words, during this removal step E1 14, everything that is above the second part 17B of the intermediate layer 17 is removed at the same time as this second part 17B.

[0162] In practice, this removal step E1 14 is implemented by isotropic etching. This involves, for example, wet chemical etching. This etching is, for example, implemented with hot orthophosphoric acid.

[0163] Thus, at the end of step E1 14, the intermediate layer 17 has been completely removed from the stack. With regard to the ferroelectric material, a single layer of ferroelectric material 5 is formed from the first layer of ferroelectric material 15A and the portion of the second layer of ferroelectric material 15B deposited at the bottom wall 52 of the cavity 50. The portion of the first layer of ferroelectric material 15A extending along the side wall 55 of the cavity 50 corresponds to the first portion 5A of the ferroelectric storage device 1 introduced previously.The first portion 6A of the first layer of ferroelectric material 15A extending along the bottom wall 52 of the cavity as well as the part of the second layer of ferroelectric material 15B deposited at the bottom wall 52 of the cavity 50 form the second part 6 of the ferroelectric storage device 1 introduced previously.

[0164] This step El 14 in fact corresponds to a so-called “lift-off” process which aims to specifically remove the second part 17B of the intermediate layer 17 so as to obtain a specific shape for the layer of ferroelectric material 5 obtained (here with a protruding portion formed on the first portion 6A of the first layer of ferroelectric material 15A). The intermediate layer 17 therefore forms here a sacrificial layer which makes it possible, thanks to the manufacturing method according to the invention, to obtain a layer of ferroelectric material with a desired shape and a variable thickness by using only (in this manufacturing method) conformal deposits for the different layers involved.

[0165] Furthermore, the condition on the thickness of the intermediate layer mentioned above makes it possible to ensure substantial surfaces associated with each part of the layer of ferroelectric material of different thicknesses. This then makes it possible to ensure very distinct polarization states (and therefore an absence of overlap between the voltage ranges to be applied to go back to the different polarization states).

[0166] As shown in [Fig.3], the manufacturing process ends with step El 16. In this step, illustrated in [Fig. 11], the second layer 7 is formed.

[0167] The second layer 7 is formed on the layer of ferroelectric material 5 obtained at the end of step El 14.

[0168] The deposition of the second layer 7 is carried out here in a compliant manner.

[0169] As indicated previously, the second layer 7 may here comprise a first sub-layer 70 and a second sub-layer 72.

[0170] Step El 16 of depositing the second layer 7 therefore here comprises two sub-steps: a first sub-step El 16a of depositing the first sub-layer 70 and a second sub-step 116b of depositing the second sub-layer 72.

[0171] The first sub-layer 70 is therefore first deposited, in a conformal manner, on the layer of ferroelectric material 5 (step E1 16a). In practice, the first sub-layer 70 is for example formed by cathode sputtering in a vacuum deposition chamber. In the case where the first sub-layer 70 is formed from titanium nitride, this is reactive cathode sputtering.

[0172] Alternatively, the first sub-layer may be formed by chemical vapor deposition.

[0173] Then, the second sub-layer 72 of the second layer 7 is deposited, in a conforming manner, on the first sub-layer 70 (step E1 16b). As can be seen in [Fig. 1 1], the second sub-layer 72 is formed so as to fill all the remaining space in the cavity 50. This then makes it possible to obtain a ferroelectric storage device 1 completely integrated in the cavity 50 and without any projection or recession formed relative to the surface of the support layer 10. The assembly formed by the support layer 10 in which the ferroelectric storage device 1 is integrated therefore has a uniform surface.

[0174] In practice, the second sub-layer 72 is for example formed by cathode sputtering in a vacuum deposition chamber. In practice, the second sub-layer 72 of the second layer 7 is formed in the same deposition chamber as the first sub-layer 70 of the second layer 7.

[0175] In the case where the second sub-layer 72 is formed from titanium nitride, it is a reactive cathode sputtering.

[0176] In practice, although this is not visible in the attached figures, it is not excluded that the different layers of the ferroelectric storage device 1 are also deposited on the front face (free surface opposite the bottom wall 52) of the support layer 10. Thus, optionally, in order to ensure the flatness and uniformity of the ferroelectric storage device 1 (and in particular of the free surface of the device 1), a planarization step may be provided, after the step El 16. This planarization step is for example implemented by chemical mechanical polishing (or CMP for "Chemical mechanical polishing" according to the commonly used acronym of Anglo-Saxon origin). Any other suitable method can be used (in particular masking methods).

[0177] This planarization step is particularly advantageous because, thanks to the standardization of the surface of the device 1, it makes it possible to improve the electrical performance of the ferroelectric storage device and to guarantee better quality of the interconnections.

[0178] Alternatively, an encapsulation step may be provided after this planarization step. Finally, a connection to the second layer 7 may be implemented.

[0179] Thus, at the end of the manufacturing method according to this second embodiment, the ferroelectric storage device 1 obtained comprises a layer of ferroelectric material with variable thickness. As indicated previously, the variability of thicknesses makes it possible to introduce non-uniformities into the ferroelectric properties of the layer of ferroelectric material. This non-uniformity of properties makes it possible in particular to increase the differences between the voltage ranges to be applied to encode the information in the different intermediate polarization states.

[0180] This then makes it possible to avoid overlap between the voltage ranges concerned and therefore to unambiguously identify the intermediate polarization states concerned by the stored information.

[0181] In addition, the manufacturing method according to this second embodiment makes it possible to obtain an architecture of the ferroelectric storage device 1 in three dimensions. This makes it possible in particular to increase the surface area of ​​the capacity of the ferroelectric storage device 1.

[0182] The manufacturing method proposed according to the invention is particularly simple to implement because it only involves conformal deposits to form each of the layers forming the ferroelectric storage device 1.

[0183] According to an alternative implementation of this embodiment, the manufacturing method may comprise, between step E106 of depositing the first layer of ferroelectric material and step E108 of depositing the intermediate layer, a step of implanting a doping element in the first layer of ferroelectric material formed in step E106. This step then makes it possible to dope the layer of ferroelectric material with the doping element.

[0184] In practice, the implantation step is for example implemented in a reactor different from the deposition chamber of the first layer and the first layer of ferroelectric material.

[0185] Here, it is for example a step of ionic implantation of silicon (which is the doping element) in the layer of ferroelectric material. The implantation doses are for example between 1.1014 cm 2 and 1.1015 cm 2. Preferably, the implantation dose is between 0.3.1014 cm 2 and 1.1015 cm2.

[0186] According to another alternative embodiment, the manufacturing method may also comprise, after step E1 14 of removing the second part of the intermediate layer and before the step of depositing the second layer, a step of implanting a doping element in the second portion 6B of the layer of ferroelectric material (obtained at the end of step E1 14). This step then makes it possible to dope the second portion 6B of the layer of ferroelectric material with the doping element.

[0187] Here, for example, it is a step of ionic implantation of silicon (which is the doping element) in the second portion 6B of the layer of ferroelectric material. The implantation doses are for example between 1.1014 cm2 and 1.1015 cm 2. Preferably, the implantation dose is between 0.3.1014 cm 2 and 1.1015 cm 2.

[0188] Thus, as a variant, the layer of ferroelectric material may be completely or only partly doped by the doping element.

[0189] Applications

[0190] The ferroelectric storage device according to the invention finds a preferred application in the context of resistive memories of the FeRAM type (for “Ferroelectric Random Access Memory” according to the commonly used acronym of Anglo-Saxon origin).

[0191] It also finds a particular application in the context of transistors, for example of the FeMFET type (for “Ferroelectric-metal field effect transistor” according to the acronym of Anglo-Saxon origin commonly used).

[0192] The ferroelectric storage device according to the invention can also be used in the context of ferroelectric tunnel junctions (or FTJ for "Ferroelectric tunnel junction" according to the commonly used acronym of Anglo-Saxon origin). In this case, an additional layer is added between the layer of ferroelectric material and the second layer. This additional layer comprises a dielectric material. This dielectric material is for example an aluminum oxide A12O3.

[0193] In the case of certain applications mentioned (for example FeRAM or FTJ type memories), the first layer forms a first electrode (for example a lower electrode), the second layer forms a second electrode (for example an upper electrode) and the layer of ferroelectric material forms a memory layer.

Claims

Claims

1. A method of manufacturing a ferroelectric storage device (1) comprising steps of: - providing a support layer (10), - depositing a first layer (2), - depositing a first layer of ferroelectric material (15A), then - depositing an intermediate layer (17) on the first layer of ferroelectric material (15A), then - removing a first portion (17A) of the intermediate layer (17) so as to expose a portion (6A) of the first layer of ferroelectric material (15A), then - depositing a second layer of ferroelectric material (15B) on the intermediate layer (17) and on the exposed portion (6A) of the first layer of ferroelectric material (15A), then - removing a second portion (17B) of the intermediate layer (17) so as to form, from the first layer of ferroelectric material (15A) and a portion of the second layer of ferroelectric material (15B),a layer of ferroelectric material (5) comprising a first part (5A) having a first thickness (ej and a second part (6) having a second thickness (e2), the first thickness (ej and the second thickness (e2) being distinct, and - deposition of a second layer (7), the layer of ferroelectric material (5) extending between the first layer (2) and the second layer (7).,

2. The manufacturing method according to claim 1, wherein the deposition of the first layer of ferroelectric material (15A) is carried out in a conformal manner.

3. A manufacturing method according to claim 1 or 2, wherein the deposition of the intermediate layer (17) is carried out in a conformal manner.

4. A manufacturing method according to any one of claims 1 to 3, wherein the intermediate layer (17) comprises a nitride or an oxide.

5. A manufacturing method according to any one of claims 1 to 4, wherein the step of removing the first portion (17A) of the intermediate layer (17) is carried out by anisotropic etching.

6. A manufacturing method according to any one of claims 1 to 5, wherein the deposition of the second layer of ferroelectric material (15B) is carried out in a conformal manner.

7. A manufacturing method according to any one of claims 1 to 6, wherein the step of removing the second portion (17B) of the intermediate layer (17) is carried out by isotropic etching.

8. A manufacturing method according to any one of claims 1 to 7, wherein the ferroelectric material layer (5) comprises hafnium dioxide or hafnium dioxide doped with a doping element or an HfxZri XO2 alloy, with 0 <x<l.

9. A manufacturing method according to any one of claims 1 to 8, wherein, before the step of depositing the first layer (2), a step of forming a cavity (50) in the support layer (10) is provided, the cavity (50) comprising a bottom wall (52) and a side wall (55), the side wall (55) forming an angle of inclination (a) relative to a direction normal to the bottom wall (52), the deposition of the first layer (2), the layer of ferroelectric material (5) and the second layer (7) being carried out in the formed cavity (50), the second part (6) of the layer of ferroelectric material (5) being positioned on the bottom wall (52) of the cavity (5) and the first part (5A) of the layer of ferroelectric material (5) being positioned on the side wall (55) of the cavity (50).

10. A ferroelectric storage device (1) comprising a first layer (2), a second layer (7) and a layer of ferroelectric material (5) which extends between the first layer (2) and the second layer (7), the layer of ferroelectric material (5) comprising a first portion (5A) having a first thickness (ej and a second portion (6) having a second thickness (e2), the first thickness (e0 and the second thickness (e2) being distinct, the second portion (6) of the layer of ferroelectric material (5) comprising a first portion (6A) extending in the extension of the first portion (5A) and a second portion (6B) extending projecting relative to the first portion (6A) of the second portion (6) of the layer of ferroelectric material (5).

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