Electrical connection device

The electrical connection device with a semiconductor component addresses partial discharges at the triple point by distributing electric field lines, enhancing reliability and safety in aeronautical applications.

FR3158840A1Pending Publication Date: 2025-08-01SAFRAN ELECTRICAL COMPONENTS
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Patent Information

Application Number
FR2024000849
Authority / Receiving Office
FR · FR
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-01-29
Publication Date
2025-08-01

AI Technical Summary

Technical Problem

Existing electrical connection solutions for coaxial structure cables in the aeronautical field suffer from partial discharges due to electric field reinforcement at the triple point, exacerbated by altitude, temperature, and humidity variations, leading to premature component degradation and fire risks.

Method used

An electrical connection device with a coaxial structure cable that includes a semiconductor component covering the triple point area, distributing electric field lines to prevent partial discharges, using an elastomeric material with conductive fillers to cover the interface between the cable and connector.

Benefits of technology

The semiconductor component effectively prevents partial discharges, reducing premature component degradation and fire risks, ensuring reliable electrical connections under high voltage and varying environmental conditions.

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Abstract

One aspect of the invention relates to an electrical connection device comprising a cable (10) and an electrical connector (30) connected to one end of the cable (10), wherein the cable is a coaxial structure cable comprising a conductive core (11) surrounded successively by a first semiconducting layer (12), an insulating layer (13) and a second semiconducting layer (14). Figure to be published with the abstract: Figure 3
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Description

Title of the invention: Electrical connection device TECHNICAL FIELD OF THE INVENTION

[0001] The technical field of the invention is that of electrical connection devices, in particular intended for use in aircraft.

[0002] In particular, the invention relates to an electrical connection device making it possible to avoid the occurrence of damage to installations due to areas of electric field reinforcement (such as partial discharges, dielectric breakdown or even damage due to space charges). TECHNOLOGICAL BACKGROUND OF THE INVENTION

[0003] Climate change is a major concern for many legislative and regulatory bodies around the world. Indeed, various restrictions on carbon emissions have been, are being, or will be adopted by various states. In particular, an ambitious standard applies both to new types of aircraft and those currently in circulation, requiring the implementation of technological solutions to make them compliant with current regulations. Civil aviation has been mobilizing for several years now to make a contribution to the fight against climate change.

[0004] Technological research efforts have already made it possible to significantly improve the environmental performance of aircraft. The Applicant takes into consideration the impact factors in all phases of design and development to obtain less energy-intensive, more environmentally friendly aeronautical components and products whose integration and use in civil aviation have moderate environmental impacts with the aim of improving the energy efficiency of aircraft.

[0005] Consequently, the Applicant is constantly working to reduce its climate impact by using methods and operating virtuous development and manufacturing processes and minimizing greenhouse gas emissions to the minimum possible in order to reduce the environmental footprint of its activity.

[0006] This sustained research and development work covers new generations of aircraft engines, the lightening of aircraft, particularly through the materials used and lighter on-board equipment, the development of the use of electrical technologies to ensure propulsion, and, as essential complements to technological progress, aeronautical biofuels.

[0007] In particular, the present invention can be used in the context of electric or hybrid propulsion.

[0008] More and more electrical systems must be able to support values of very high voltages, in direct current, alternating current or PWM. For example, electrical equipment can be subjected to voltages of up to 1000 V to 1600 V, currents of 300 A and electrical frequencies of up to 1500 Hz. The extreme values of voltages can reach 3000 V while the extreme values of currents and frequencies can reach 1000 A and 3000 Hz respectively.

[0009] This is particularly the case in the field of aeronautics, for example in the context of the development of new hybrid or fully electric propulsion systems.

[0010] In the terrestrial domain, it is known to use coaxial structure cables, such as those shown in Figures 1a and 1b, to conduct high electrical voltages. In particular, [Fig. 1a] represents such a cable 10 with a coaxial structure in the lengthwise direction, and [Fig. 1b] represents a front view of the cable.The cable 10 thus comprises a conductive core 11 (in an electrically conductive material), covered with successive layers: a layer 12 (called the internal semi-conductive layer) of semi-conductive material, a layer 13 of insulating (or “dielectric”) material, a layer 14 (called the external semi-conductive layer) of semi-conductive material, a connecting layer 15 of conductive material (for example a grounding braid) for connection to the reference potential of the layer 14 of semi-conductive material - commonly called the shielding layer for its electromagnetic shielding (EMI) function, and finally a layer 16 of mechanical and / or hermetic protection (sheath). The material of the internal 12 and external 14 semi-conductive layers is typically an electrically insulating material charged with conductive particles, for example particles of carbon black, strontium titanate or titanium dioxide.The coaxial structure cables are then combined into an electrical harness, to transmit electrical power from one electrical equipment to another via connection systems such as electrical connectors.

[0011] When connecting the cable 10 to an electrical connector, the outer semiconducting layer 14 must be removed over a certain length. The interface between the insulating layer 13, the outer semiconducting layer 14 and the ambient air is called the "triple point", and corresponds to an area in which an electric field reinforcement is formed. This electric field reinforcement leads to the occurrence of electric discharges, in particular partial discharges, which can damage the insulating layers of the components and cause premature aging of the components.

[0012] It is recalled that partial discharges are surface discharges, which occur when a solid insulator is placed in an insulating gas in contact with a conductor, and which develop on the surface of the solid insulator. They start at level of a “triple point” (air / conductor / insulator interface) by local reinforcement of the electric field.

[0013] The electric field strengthening in the triple point region is amplified when the system is used at altitude. In addition, high temperatures and / or high humidity further amplifies the phenomenon.

[0014] Thus, existing solutions in the terrestrial domain cannot be used in the aeronautical field, which is subject to a certain number of constraints, in particular:

[0015] - the altitude can vary very quickly over a very large range of values, going from example from 0 to 55000 feet;

[0016] - the temperature in electrical systems can also vary very quickly and reach very high values, being able to go down to -55°C or even -65°C and go up to 200°C or even 260°C;

[0017] - humidity values may be high.

[0018] Furthermore, the electric field reinforcement is amplified when the thickness of the insulating layer 13 is small, which is generally the case in the aeronautical field, for reasons of mass saving and flexibility of the cable. It is also noted that, when the external semi-conducting layer 14 is removed, this may have the undesired consequence that a portion of the insulator may also be removed, for example due to poorly adjusted tooling, concentricity of the insulators, ovalization, etc., which has the effect of amplifying the reinforcement of the electric field.

[0019] There is therefore a need for electrical connection solutions which limit the occurrence of partial discharges during use at high altitude (which results in pressure, temperature and humidity constraints), with high voltage values. Summary of the invention

[0020] The invention provides a solution to the problems mentioned above, by proposing an electrical connection device comprising a cable with a coaxial structure similar to that described above connected to an electrical connector. The electrical connection device comprises a semiconductor component which makes it possible to limit the occurrence of partial discharges in the connection zone between the cable and the connector.

[0021] One aspect of the invention thus relates to an electrical connection device comprising a cable and an electrical connector connected to one end of the cable, in which the cable is a coaxial structure cable comprising a conductive core surrounded successively by a first semi-conductive layer, an insulating layer and a second semi-conductive layer,

[0022] wherein the cable comprises a first cable portion, a second cable portion adjacent to the first cable portion and a third cable portion adjacent to the second cable portion, the second cable portion being located between the first cable portion and the third cable portion, the third cable portion comprising the end of the cable connected to the electrical connector,

[0023] wherein the second cable portion is devoid of a second semiconducting layer and the third cable portion is devoid of an insulating layer and a first semiconducting layer,

[0024] wherein the third cable portion is inserted at least partially into a cavity of a conductive part of the electrical connector, the conductive core of the third cable portion being in electrical contact with the conductive part of the electrical connector,

[0025] in which a layer of insulating material at least partially covers the conductive part of the electrical connector and extends over part of the second cable portion,

[0026] in which a layer of semiconductor material at least partially covers the first portion of cable, and extends over a portion of the second portion of cable not covered by the layer of insulating material and over at least a portion of the layer of insulating material.

[0027] In the following, the first semiconductor layer is also called the inner semiconductor layer, and the second semiconductor layer is also called the outer semiconductor layer.

[0028] By "electrical connector" is meant a component or a set of components intended to connect several electrical cables of a circuit, in order to supply several electrical devices or equipment.

[0029] The first, second and third portions correspond to successive parts of the cable not having the same layers. For example, these different portions can be obtained by successively removing from the coaxial structure cable outer layers at different locations of the cable: first the second semiconductor layer, then the insulating layer and the first semiconductor layer.

[0030] The term “semiconductor layer” (resp. “insulating layer”) is understood to mean a layer of the cable made of semiconductor material (resp. of insulating material).

[0031] “Insulating material” means an electrically insulating material (or dielectric material), and “conductive material” means an electrically conductive material.

[0032] By "conductive part of the connector" is meant a part of the connector in a conductive material, to which the conductive part of the cable (the conductive core) is connected to allow the passage of current from the cable to the connector.

[0033] The layer of semiconductor material covers the interface area between the first portion of cable and the second portion of cable, thus covering a so-called triple point zone, which is the site of partial discharges when a voltage passes through the connection device. This layer of semiconductor material advantageously rises above the layer of insulating material, to prevent the appearance of a new triple point zone, and to better distribute the electric field lines when the connection device is powered up.

[0034] The layer of semiconductor material advantageously makes it possible to avoid the occurrence of partial discharges by distributing the field lines to evacuate them towards the outside and not inject them directly inside the conductive part of the connector.

[0035] In embodiments, the layer of semiconductor material is in an elastomeric material comprising conductive fillers.

[0036] An elastomeric material has elastic properties which advantageously allow it to conform to the shape of the component (or set of components) to which it is applied. It can advantageously be pressurized during its application to avoid the trapping of air zones between the layer of semiconductor material and the component to which it is applied.

[0037] For example, the elastomeric material may be a silicone.

[0038] For example, the conductive fillers may be particles of carbon black, strontium titanate, titanium dioxide, silicon carbide, zinc oxide, or antimony / tin oxide.

[0039] In one or more embodiments, the cable comprises a fourth portion adjacent to the first portion, the first portion being located between the second portion and the fourth portion, wherein the fourth cable portion is covered with a connection layer, wherein the connection layer is at least partially covered with a protective sheath which extends to the connector, such that there is an air zone between the protective sheath and the layer of semiconductor material.

[0040] Another aspect of the invention relates to an electrical installation comprising at least one device as defined above.

[0041] Another aspect of the invention relates to an aircraft comprising an electrical installation as defined above.

[0042] Another aspect of the invention relates to a method of manufacturing a device as above, the method comprising:

[0043] - obtain a cable with a coaxial structure comprising a conductive core surrounded by comprising a first semiconductor layer, an insulating layer and a second semiconductor layer;

[0044] - removing the second semiconducting layer on a portion of cable adjacent to one end of the cable intended to be connected to a connector;

[0045] - removing the insulating layer and the first semiconducting layer on a part of the portion of cable on which the second semiconducting layer has been removed, said portion being adjacent to said end of the cable intended to be connected to the connector, said portion being called third portion of cable, a portion of the cable on which the second semiconducting layer has been removed and on which the insulating layer and the first semiconducting layer have not been removed being called second portion of cable and a portion of cable on which the second semiconducting layer has not been removed being called first portion of cable;

[0046] - inserting the third portion of cable into a cavity of a conductive part of the electrical connector, such that the conductive core of the third cable portion is in electrical contact with the conductive part of the electrical connector;

[0047] - at least partially cover the conductive part of the electrical connector of a layer of insulating material, the layer of insulating material extending over the second portion of cable;

[0048] - at least partially covering the first portion of cable with a layer of semiconductor material, layer of semiconductor material extending over a part of the second portion of cable not covered by the layer of insulating material and over at least a part of the layer of insulating material.

[0049] In some embodiments, pressure is applied to the layer of semiconductor material upon covering by said layer of semiconductor material.

[0050] This makes it possible to avoid trapping air bubbles between the layer of semiconductor material and the component(s) on which it is deposited, and thus to avoid the formation of new triple point zones.

[0051] In one or more embodiments, the coaxial structure cable further comprises a connection layer surrounding the second semiconductor layer, and the method further comprises:

[0052] - remove the connection layer on a part of the cable adjacent to the end of the cable intended to be connected to a connector;

[0053] wherein the portion of cable on which the second semiconducting layer is removed is included in the portion of the cable on which the connection layer has been removed;

[0054] the method further comprising:

[0055] - cover a part of the cable on which the connection layer has not been removed from a protective sheath, the protective sheath extending to the connector, so that there is an air gap between the protective sheath and the layer of semiconductor material.

[0056] The invention and its various applications will be better understood upon reading the following description and examining the accompanying figures. BRIEF DESCRIPTION OF THE FIGURES

[0057] Other characteristics and advantages of the invention will appear on reading the description, which can be read in conjunction with the figures. These figures are presented for information purposes only and in no way limit the invention.

[0058] [Fig. la] and [Fig. lb] represent a coaxial structure cable according to two different views.

[0059] [Fig.2] illustrates the occurrence of partial discharges when connecting a coaxial structure cable with an electrical connector.

[0060] [Fig.3] illustrates an electrical connection device according to one embodiment of the invention.

[0061] [Fig.4] represents a flowchart of a method of manufacturing an electrical connection device according to an embodiment of the invention. DETAILED DESCRIPTION

[0062] [Fig. 2] illustrates the occurrence of partial discharges when connecting a coaxial structure cable with an electrical connector. More specifically, [Fig. 2] illustrates a wiring conventionally used with so-called "bilayer" cables (comprising a conductive core topped with a semiconducting layer and a sheath), but used this time with a coaxial structure cable as shown above.

[0063] It is noted that the shapes of the components shown in [Fig.2] correspond to a particular example, but that the components could have other shapes than those shown.

[0064] In [Fig. 2], the electrical connector 20 comprises a body 21, a first rear connector (or “backshell” in English) 22a and a second rear connector 22b. In this example, the second rear connector 22b is located between the first rear connector 22a and the body 21. It is understood that the example of [Fig. 2] is provided by way of illustration and in a non-limiting manner, and that the electrical connector may comprise a number of rear connector(s) other than two. In particular, it may be considered that the two rear connectors 22a, 22b form a single rear connector. Furthermore, the rear connector(s) 22a, 22b may be part of the connector itself or be external components to which the body 21 of the connector 20 is connected.It is recalled that, in a known manner, a rear connector is a mechanical component, for example screwed to the rear of a connector, which makes it possible to protect and guarantee the integrity, in particular the sealing (against humidity, water) of the electrical connector 20 and the connection with the cable 10, subjected to physical pressures (shocks, vibration, tearing),. as well as electromagnetic interference that can occur, for example, when lightning strikes an aircraft. Rear connections can be, for example, force take-ups, EMI / RFI ("electromagnetic interference / radio frequency interference") shields or adapters.

[0065] The electrical connector 20 of [Fig. 2] also comprises a first insulating portion 23a and a second insulating portion 23b, both made of a respective insulating material. The insulating materials of the first insulating portion 23a and the second insulating portion 23b may be the same material or two distinct materials.

[0066] The first insulating part 23a is included in a cavity passing through the first rear connection 22a and the second rear connection 22b, and extends beyond the end of the first rear connection into which the cable 10 enters. The first insulating part 23a comprises a recess intended to receive the cable 10, and more precisely an end of the cable on which the external semi-conducting sheath 14 has been removed. Thus, the portion of the cable which is inserted into the recess of the first insulating part 23a is a portion of the cable for which only the conductive core 11, the internal semi-conducting layer 12 and the insulating layer 13 remain.

[0067] The second insulating part 23b is included in a cavity located in the body 21 of the electrical connector.

[0068] Here again, it is understood that the example of [Fig. 2] is provided by way of illustration and in a non-limiting manner. In particular, there may be only one insulating part (joining of parts 23a and 23b) located in a cavity opening onto the face of the first connector 22a through which the cable 10 enters, and passing through the first connector 22a, the second connector 22b and a part of the body 21 of the electrical connector 20.

[0069] The electrical connector further comprises a conductive portion 24 housed in a recess passing through the body 21, the second rear connection 22b and possibly a portion of the first rear connection 22a. The conductive portion 24 is electrically separated from the second rear connection 22b and, where appropriate, from the first rear connection 22a by the first insulating portion 23a. It is electrically separated from a portion of the body 21 adjacent to the second rear connection 22b by the second insulating portion 23b. The conductive portion 24 comprises a recess intended to receive one end of the cable 10, the recess being adjacent to a recess of the first insulating portion 23a, so that the cable can be inserted into the first insulating portion 23a, pass through the first insulating portion 23a and a portion of the conductive portion 24.

[0070] In [Fig. 2], the sheath 16 of the cable 10 extends to the second rear connection 22b of the connector 20, so as to protect the wiring. Alternatively, another sheath can be used to protect the connector, this other sheath extending for example over the sheath 16 of the cable 10 to provide protection over the entire wiring. The connection layer 15 is removed over a portion of the cable 10 intended to be connected to the connector 20, at the interface 40 between the layers 16 and 14 in [Fig. 2]. It is noted that the connection layer 15 may "overflow" onto the portion of the cable 10 adjacent to the interface 40 located towards the connector 20. In other words, there may be a portion of the cable on which the connection layer is "bare" (i.e. it does not include a cable layer above it), located between a portion of the cable 10 on which the sheath 16 is present and a portion of the cable 10 on which the outer semiconducting layer 14 is bare.

[0071] To connect the cable 10 to the connector 30, the outer semiconducting layer 14 is removed from a portion of the cable located at the end of the cable 10 intended to be connected to the connector 30. In addition, the insulating layer 13 and the inner semiconducting layer 12 are also removed from a part of this portion on which the outer semiconducting layer 14 has been removed, near the end of the cable intended to be connected to the connector 30. In other words, the cable thus prepared comprises a plurality of adjacent portions: a portion on which all the layers of the cable 10 are present (the portion of the cable 10 opposite the end intended to be connected to the connector 20), a portion on which the outer semiconducting layer 14 is exposed, a portion on which the insulating layer 13 is exposed, and a portion on which the conductive core 11 is exposed (at the end intended to be connected to the connector 30). 20).

[0072] The cable thus prepared is then inserted into the recess passing through the first insulating part 23a and extending inside the conductive part 24, so that the portion located at the end of the cable on which the conductive core 11 is exposed penetrates a portion of the conductive part 24 of the connector 20 so as to establish an electrical contact between the cable 10 and the connector 20. The portion of the cable on which the insulating layer 13 is exposed is “almost entirely” covered with the first insulating part 23a. By “almost entirely”, it is understood that there is, due to the preparation of the cable, a portion, which may be of very short length (a few tens of μm to a few mm), on which the insulating layer 13 is not covered by the first insulating part 23a.

[0073] At the interface between the portion on which the outer semiconductor layer 14 is exposed and the portion on which the insulating layer 13 is exposed, there is therefore an air gap (which can be very small as mentioned above). Thus, at this interface, a solid insulator (the insulating layer 13 of the cable 10), a conductor (the semiconductor layer 14 of the cable) and a gaseous insulator (the air) are in contact. The area 30 located around this interface is therefore a triple point area.

[0074] Thus, when energized, partial discharges appear at this zone 30, even for air gaps of very short length as here (work has shown that the phenomenon of partial discharges appears as soon as the cavity has a size greater than 17 pm).

[0075] The energy released by these partial discharges creates intense heat which accelerates the degradation of the external semi-conductor layer 14 until the loss of the electrical insulation function, by the appearance of an electric arc path. There is therefore a risk of premature wear of the insulation by erosion. In addition, with the high voltage and current values applied in the connectors, the risk of fire is significant.

[0076] [Fig.3] illustrates an electrical connection device according to one embodiment of the invention.

[0077] All references in [Fig.3] identical to those in [Fig.2] correspond to the same components, and the above description of these components is unchanged.

[0078] To prevent the occurrence of partial discharges in the triple point area 30, a semiconductor component 25 is placed around the interface between the portion on which the outer semiconductor layer 14 is exposed and the portion on which the insulating layer 13 is exposed. Thus, the semiconductor component 25 at least partially covers the portion of the cable on which the outer semiconductor layer 14 is exposed by extending over the portion of the cable on which the insulating layer 13 is exposed. The semiconductor component 25 may further extend over the first insulating portion 23a and extend to the first rear connection 22a.

[0079] The semiconductor component 25 may for example be in an elastomer, for example a silicone elastomer, in which conductive fillers are added. The silicone elastomer has the advantage of having a resistance to temperatures which can cover a very wide range of values and reach high temperatures, in particular compatible with the temperature range of the environment of the electrical systems indicated previously, for example between -65°C and +260°C. In addition, the elastic properties of an elastomer advantageously make it possible to limit as much as possible air gaps during the deposition of the component 25, which could be the site of the appearance of partial discharges.

[0080] The conductive fillers may be, for example, carbon black particles, for example with a diameter of between 1 and 100 nm. Alternatively, the fillers may be strontium titanate (SrTiO3) or titanium dioxide (TiO2) particles. The electrical conductivity and dielectric permittivity of the semiconductor material thus obtained may be controlled by the concentration of carbon black particles.

[0081] Of course, other conductive fillers can be used, for example particles of silicon carbide (SiC), zinc oxide (ZnO), antimony / tin oxide (SnO2 / Sb2O3). For such fillers, the level of conductivity of the semiconductor material thus obtained is determined by the properties of the filler. In Using these properties, it is possible to provide a self-adaptive terrain grading system.

[0082] Carbon nanotubes can also be used to load the material of the semiconductor component 25.

[0083] It is understood that the components 21, 23b of the connector 20 are components which can be conventionally used in electrical connectors, but which are not necessarily part of the invention.

[0084] [Fig.4] represents a flowchart of a method of manufacturing an electrical connection device according to one embodiment of the invention.

[0085] During a first step 410, the protective sheath 16 and the connection layer are removed on a portion of the cable comprising an end intended to be connected to the connector (in certain embodiments, the portion on which the connection layer 15 is removed is of shorter length than the portion on which the protective sheath 16 is removed, so that on a part of the cable, the connection layer 15 is exposed). At the end of this step 410, the external semi-conductor layer 14 is exposed on a portion of the cable comprising the end intended to be connected to the connector.

[0086] The protective sheath 16 can for example be folded back along the cable 10 in an opposite direction relative to the end of the cable intended to be connected to the connector 20 to then be reassembled on the “cable - connector” assembly in step 470. Alternatively, it can be completely removed, and during step 470, another protective sheath is deposited, the new protective sheath for example partially covering the protective sheath 16 of the cable, so that the “cable - connector” assembly is covered with protection without discontinuities.

[0087] In certain embodiments, the cable does not include a protective sheath, and this is added to the “cable - connector” assembly during step 470.

[0088] During a step 420, the external semi-conductor layer 14 is removed from a portion of the cable from which the connection layer 15 has been removed, said portion comprising the end intended to be connected to the connector 20.

[0089] During a step 430, the insulating layer 13 and the internal semi-conductor layer 12 are removed from a portion of the cable from which the external semi-conductor layer 14 has been removed, said portion comprising the end intended to be connected to the connector 20.

[0090] At the end of step 430, the cable therefore comprises: a first portion of cable on which the external semi-conducting layer 14 is exposed, a second portion, adjacent to the first, on which the insulating layer 13 is exposed, and a third portion, adjacent to the second and comprising the end of the cable intended to be connected to the connector 20, on which the conductive core 11 is exposed.

[0091] During a step 440, the third portion of cable (on which the conductive core is exposed) is inserted into a cavity (or recess) of the conductive part 24 of the connector 20, so that the conductive core of the third portion of cable is in electrical contact with the conductive part of the electrical connector.

[0092] During a step 450, a layer of insulating material is deposited on at least a portion of the conductive portion 24 of the electrical connector so as to overflow onto the second portion of the cable, to form the first insulating portion 23a described above.

[0093] During a step 460, a layer of semiconductor material is deposited on at least a portion of the first portion of cable so as to overflow onto a portion of the second portion of cable not covered by the layer of insulating material and onto at least a portion of the layer of insulating material, to form the semiconductor component 25 described above. This layer of semiconductor material may advantageously be applied by applying pressure, for example by mechanical compression or by vacuum, to avoid or minimize the risk of air zones appearing between the cable 14, 13 and the semiconductor component 25.

[0094] During a step 470, a protective sheath 16 is deposited so as to cover the entire portion of the cable located upstream (relative to the end of the cable connected to the connector) of the interface 40, and a portion of the connector. There is thus an air zone between the protective sheath 16 and the semiconductor component 25.

[0095] As described above, the cable may not initially include a protective sheath 16, and this may be deposited on the cable and the connector during step 470. Alternatively, the cable may already include a protective sheath, and this may, for example, be folded down during step 410, then unrolled so as to cover a portion of the connector. According to another alternative, the cable may already include a protective sheath, and this may be removed during step 410. In this case, during step 470, a new protective sheath may be applied to extend from a portion of the remaining protective sheath of the cable to the connector.

[0096] Of course, the present invention is not limited to the embodiments described above as examples. It extends to other variants. It is noted that, if the present invention makes it possible to transport electrical power under high electrical voltages in the aeronautical field, it can also be used in other fields, in particular railway, medical, maritime or automotive, or even within production plants, for example nuclear power plants.

Claims

Claims

1. An electrical connection device comprising a cable (10) and an electrical connector (20) connected to one end of the cable, wherein the cable is a coaxial structure cable comprising a conductive core (11) surrounded successively by a first semiconducting layer (12), an insulating layer (13) and a second semiconducting layer (14), wherein the cable (10) comprises a first cable portion, a second cable portion adjacent to the first cable portion and a third cable portion adjacent to the second cable portion, the second cable portion being located between the first cable portion and the third cable portion, the third cable portion comprising the end of the cable connected to the electrical connector,wherein the second cable portion is devoid of a second semiconducting layer (14) and the third cable portion is devoid of an insulating layer (13) and a first semiconducting layer (12), wherein the third cable portion is inserted at least partially into a cavity of a conductive part (24) of the electrical connector (20), the conductive core (11) of the third cable portion being in electrical contact with the conductive part (24) of the electrical connector, wherein a layer of insulating material (23a) at least partially covers the conductive part (24) of the electrical connector (20) and overflows onto a part of the second cable portion (10), wherein a layer of semiconducting material (25) at least partially covers the first cable portion (10),and extends over a part of the second portion of cable not covered by the layer of insulating material (23a) and over at least a part of the layer of insulating material (23a).,

2. Device according to claim 1, in which the layer of semiconductor material (25) is in an elastomeric material comprising conductive fillers.

3. A device according to claim 2, wherein the elastomeric material is a silicone.

4. A device according to claim 2 or 3, wherein the conductive fillers are particles of carbon black, titanium dioxide, strontium, titanium dioxide, silicon carbide, zinc oxide or antimony / tin oxide.

5. Device according to one of the preceding claims, wherein the cable comprises a fourth portion adjacent to the first portion, the first portion being located between the second portion and the fourth portion, wherein the fourth portion of cable is covered with a connection layer (15), wherein the connection layer (15) is at least partially covered with a protective sheath (16) which extends to the connector (20), so that there is an air zone between the protective sheath and the layer of semiconductor material (25).

6. Electrical installation comprising at least one device according to one of claims 1 to 5.

7. Aircraft comprising an electrical installation according to the preceding claim.

8. Method for manufacturing a device according to one of claims 1 to 5, the method comprising: - obtaining a cable with a coaxial structure comprising a conductive core surrounded successively by a first semi-conductive layer, an insulating layer and a second semi-conductive layer; - removing (420) the second semi-conductive layer on a portion of cable adjacent to one end of the cable intended to be connected to a connector;- removing (430) the insulating layer and the first semiconducting layer on a part of the cable portion on which the second semiconducting layer has been removed, said part being adjacent to said end of the cable intended to be connected to the connector, said part being called third cable portion, a portion of the cable on which the second semiconducting layer has been removed and on which the insulating layer and the first semiconducting layer have not been removed being called second cable portion and a cable portion on which the second semiconducting layer has not been removed being called first cable portion; - inserting (440) the third cable portion into a cavity of a conductive part of the electrical connector, so that the conductive core of the third cable portion is in electrical contact with the conductive part of the electrical connector;- cover (450) at least partially the conductive part of the; electrical connector of a layer of insulating material, the layer of insulating material extending onto the second portion of cable; - covering (460) at least partially the first portion of cable with a layer of semiconducting material, said layer of semiconducting material extending over a portion of the second portion of cable not covered by the layer of insulating material and over at least a portion of the layer of insulating material.

9. Method according to the preceding claim, in which pressure is applied to the layer of semiconductor material during covering by said layer of semiconductor material.

10. The method of claim 8 or 9, wherein the coaxial structure cable further comprises a connection layer surrounding the second semiconducting layer, the method further comprising: - removing (410) the connection layer on a portion of the cable adjacent the end of the cable intended to be connected to a connector; wherein the portion of cable on which the second semiconducting layer is removed is included in the portion of the cable on which the connection layer has been removed; the method further comprising: - covering (470) a portion of the cable on which the connection layer has not been removed with a protective sheath, the protective sheath extending to the connector, so that there is an air zone between the protective sheath and the layer of semiconductor material.

Citation Information

Patent Citations

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