A method for preparing a product comprising a flexible substrate with at least one patterned layer
The method of pre-printing relief patterns on flexible multilayer films and milling the conductive layer addresses the complexity and inefficiency of traditional methods, achieving precise and efficient pattern creation on flexible multilayer films with improved mechanical strength.
FR3162657A1Pending Publication Date: 2025-12-05INKJET ENGINE TECHNOLOGY
Patent Information
- Application Number
- FR2024005638
- Authority / Receiving Office
- FR · FR
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-05-30
- Publication Date
- 2025-12-05
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Abstract
A patterned multilayer film is prepared from a flexible multilayer film comprising a backing layer and at least one conductive layer. In the preparation process, the backing layer of the multilayer film is pre-printed in relief with the desired patterns, and the conductive layer of the pre-printed multilayer film is subjected to a milling step to selectively remove predetermined portions of this conductive layer, said predetermined portions having a structure corresponding to the pre-printed relief patterns. Figure 1
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Citation Information
Patent Citations
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