Cooling system for an electronic component

Abstract

Title: Cooling System for an Electronic Component. A cooling system comprising a housing configured to receive one or more electronic components to be thermally regulated and a cooling fluid in which the electronic component(s) are at least partially immersed. The system also comprises a cooling fluid circuit, a means for circulating the fluid, such as at least one pump connected to the cooling fluid circuit, a heat exchanger configured to be traversed by the cooling fluid, and at least one fan configured to cool the heat exchanger. Said means for circulating the fluid, the heat exchanger, and the fan are external to the housing and are connected so as to form a rigid assembly fixed relative to the housing and attached to said housing. Figure for the abstract: Fig. 1

Claims

4. Cooling system according to any one of claims 2 or 3, wherein the protective structure including the heat exchanger is in line with the largest surfaces of the plane formed by the housing.

5. Cooling system according to any one of claims 2 to 4, wherein the housing is fixed to the protective structure, the structure is fixed to a plate forming the base of the system, the system being configured to be arranged vertically during its operation, with said plate supporting the system.

6. Cooling system according to any one of claims 2 to 5, wherein at least one fan is configured to be detachable from the protective structure during system operation, in particular the electrical connections of each fan are configured to be detachable from the protective structure during system operation.

7. Cooling system according to any one of the preceding claims, wherein the cooling fluid circuit comprises a fluid manifold disposed outside the housing, the means for circulating the fluid being fixed and connected to said manifold, the manifold further comprising in particular a fluid filter, the filter preferably being metallic.

8. Cooling system according to the preceding claim, wherein the manifold includes a temperature sensor configured to measure the temperature of the fluid circulating in the fluid circuit, in particular the means for circulating the fluid includes two pumps, the temperature sensor being located between the two pumps so as to measure the temperature of the fluid circulating in the circuit at a point between the two pumps.

9. Cooling system according to any one of claims 3 to 8, wherein the manifold, the means for circulating the fluid, the structure and the fluid circuit all extend from the largest surfaces of the plane formed by the housing.

10. Electronic assembly comprising the cooling system according to any one of the preceding claims, and at least one server, the system housing comprising said server, the server being immersed in a dielectric cooling fluid circulating in the cooling fluid circuit. [Fig. 2] 1 [Fig. 3] [Fig. 4] 10 3